CN104684280B - A kind of preparation method of the PCB provided with bottomless copper metallization blind hole - Google Patents
A kind of preparation method of the PCB provided with bottomless copper metallization blind hole Download PDFInfo
- Publication number
- CN104684280B CN104684280B CN201510104626.1A CN201510104626A CN104684280B CN 104684280 B CN104684280 B CN 104684280B CN 201510104626 A CN201510104626 A CN 201510104626A CN 104684280 B CN104684280 B CN 104684280B
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- Prior art keywords
- copper
- milling
- bottomless
- hole
- blind hole
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to PCB manufacture technology fields, specially a kind of preparation method of the PCB provided with bottomless copper metallization blind hole.The present invention is by first making metalized blind vias, then bottom hole layers of copper is removed by the way of controlled depth milling after graphic plating and before outer layer etching, etched away so as to etch the copper bound for remaining metalized blind vias bottom by outer layer, and milling edge can be made round and smooth, the copper bound area that avoids bottomless copper metallization blind via bottom residual is big, it is crude the problem of, significantly improve the quality of bottomless copper metallization blind hole.The vertical range for setting milling edge and the hole wall of metalized blind vias is 0.01 0.02mm, and milling edge can be substantially flush after being etched through outer layer with hole wall；Set controlled depth milling depth ratio metalized blind vias big 0.1 0.11mm of depth, it is ensured that bottom hole layers of copper is completely removed, will not because layers of copper it is uneven be affected.
Description
Technical field
The present invention relates to PCB manufacture technology fields, more particularly to a kind of making of the PCB provided with bottomless copper metallization blind hole
Method.
Background technology
PCB (Printed Circuit Board) is one of important component of electronics industry, is the support of electronic component
Body, the carrier of electrical connection.Increase along with electronic product function and volume reduction, promote PCB constantly to variation, high
Densification, miniaturization development.Designed on PCB bottomless copper metallization blind hole (i.e. the hole wall of blind hole have copper and bottom hole without
Copper), for installing and fixing device thereon so as to realize some specific functions, this is the diversified embodiments of PCB.However,
According to existing technology, it is difficult to non-metallic blind hole directly is fabricated directly into bottomless copper metallization blind hole, existing way is
Non-metallic blind hole is first fabricated to metalized blind vias, outer-layer circuit is then made, made after outer-layer circuit again by milling bottom
The mode of copper is by the copper mill off of metalized blind vias bottom, so as to form bottomless copper metallization blind hole on PCB.Existing making side
Method needs the length and width of pre- small milling bottom copper to prevent hole wall copper facing to be damaged, therefore by after the copper mill off of bottom, bottom hole portion and hole wall are close
Place can remain the copper of larger area, and the copper bound of incision can also be very crude, have a strong impact on the product of bottomless copper metallization blind hole
Matter.
The content of the invention
The present invention makes the PCB provided with bottomless copper metallization blind hole, bottomless copper metallization blind via bottom for prior art
Remain copper bound area big, crude, the problem of quality of metalized blind vias is in urgent need to be improved, by improving Making programme, there is provided one kind
The preparation method of PCB provided with bottomless copper metallization blind hole.
To achieve the above object, the present invention uses following technical scheme, a kind of PCB's provided with bottomless copper metallization blind hole
Preparation method, comprises the following steps：
S1, on multilayer boards drilling blind hole, then carry out heavy copper and electric plating of whole board, the blind hole are made successively to multi-layer sheet
Into metalized blind vias；Then outer graphics transfer and graphic plating are carried out on multilayer boards；
The multi-layer sheet is pressed together by prepreg by core material and outer copper foil and constituted.
S2, by way of controlled depth milling the layers of copper of the bottom hole of metalized blind vias removed, metalized blind vias is fabricated to nothing
Bottom copper metallization blind hole.
It is preferred that, the milling area of controlled depth milling is less than the cross-sectional area of metalized blind vias, and milling edge is blind with metallizing
The vertical range of the hole wall in hole is 0.01-0.02mm.It is furthermore preferred that the vertical range of milling edge and the hole wall of metalized blind vias
For 0.02mm.
It is preferred that, the big 0.1-0.11mm of depth of the depth ratio metalized blind vias of controlled depth milling.It is furthermore preferred that the depth of controlled depth milling
Spend the big 0.105mm of depth than metalized blind vias.
S3, carry out outer layer etching successively to multi-layer sheet and move back tin processing, form outer-layer circuit on multilayer boards.
S4, solder mask being made on multilayer boards, then multi-layer sheet being surface-treated and processing and forming, PCB is made.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is by first making metalized blind vias, then in figure
Bottom hole layers of copper is removed by the way of controlled depth milling after shape plating and before outer layer etching, so as to be metallized by outer layer etching
The copper bound of blind via bottom residual is etched away, and milling edge can be made round and smooth, it is to avoid bottomless copper metallization blind via bottom residual
Copper bound area is big, it is crude the problem of, significantly improve the quality of bottomless copper metallization blind hole.Set milling edge blind with metallizing
The vertical range of the hole wall in hole is 0.01-0.02mm, and milling edge can be substantially flush after being etched through outer layer with hole wall；Set control deep
The big 0.1-0.11mm of depth of the depth ratio metalized blind vias of milling, it is ensured that bottom hole layers of copper is completely removed, will not be because of layers of copper
It is uneven and be affected.
Brief description of the drawings
Fig. 1 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 1；
Fig. 2 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 2；
Fig. 3 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 3.
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is made with reference to specific embodiment
It is further described and illustrates.
Embodiment 1
The present embodiment provides a kind of preparation method of the PCB provided with bottomless copper metallization blind hole, and specific making step is such as
Under：
(1) pressing forms multi-layer sheet
First such as the PCB production processes of prior art, the raw material progress sawing sheet to PCB obtains core plate, is then adopted on core plate
Internal layer circuit is made with negative film technique.Detected by internal layer AOI, check that internal layer circuit whether there is and open short circuit, circuit breach, line
The defects such as road pin hole, flawless product enters pressing flow.
Brown processing is carried out to core plate, core plate, prepreg and outer copper foil are then subjected to lamination by design data, connect
And appropriate pressing condition is selected according to the Tg of plate, folded plate pressing is integrated, multi-layer sheet is formed.
(2) metal blind hole is made
Bore the blind hole for making bottomless copper metallization blind hole, and other slotted eyes on multilayer boards according to borehole data.
Then copper-coating and electric plating of whole board are carried out to multi-layer sheet successively to handle, makes hole metallization, metalized blind vias is made and other sets
Metallization slotted eye needed for meter.
Then, using positive blade technolgy on multilayer boards successively carry out outer graphics transfer and graphic plating (respectively copper facing and
It is tin plating).
(3) bottomless copper metallization blind hole is made
The layers of copper of the bottom hole of metalized blind vias is removed by way of controlled depth milling, metalized blind vias is fabricated to bottomless copper
Metalized blind vias.Wherein, the milling area of controlled depth milling is less than the cross-sectional area of metalized blind vias, and milling edge and bottomless copper gold
When the vertical range of the hole wall of categoryization blind hole is 0.02mm, i.e. milling bottom hole copper, milling edge is inside contracted compared to hole wall is unilateral
0.02mm.The big 0.105mm of depth of the depth ratio metalized blind vias of controlled depth milling.
(4) outer layer etching is carried out to multi-layer sheet, removed the layers of copper outside outer-layer circuit by outer layer etching, only left outer
Sandwich circuit, so as to form outer-layer circuit on multilayer boards.And when carrying out outer layer etching, in the lump by bottomless copper metallization blind hole
The copper bound of bottom residual is etched away, and makes milling edge round and smooth, it is to avoid bottomless copper metallization blind via bottom residual copper bound area
Greatly, crude the problem of, the quality of bottomless copper metallization blind hole is significantly improved.Then decorporate tin layers, make outer-layer circuit completely naked
Expose.
Wherein, the cross-sectional view of bottomless copper metallization blind hole 10 is as shown in Figure 1.After milling edge is etched through outer layer
It can be substantially flush with hole wall 11, and milling edge is round and smooth so that the copper bound area of the bottomless bottom of copper metallization blind hole 10 residual is small,
It is round and smooth；Under the double shield that the deep-controlled and outer layer of controlled depth milling is etched, the copper of the bottomless bottom of copper metallization blind hole 10 is removed
Totally, noresidue；Significantly improve the quality of bottomless copper metallization blind hole 10.
By outer layer AOI, check that outer-layer circuit whether there is and open the defects, zero defect such as short circuit, circuit breach, circuit pin hole
Product enter downstream.
(5) in multiple-plate surface silk-screen welding resistance, character (using the solder mask in white wire mark brush TOP faces, the word in TOP faces
Symbol addition " UL marks "), make solder mask.Then according to product design needs, multi-layer sheet is surface-treated, such as heavy nickel gold
Surface treatment (nickel thickness control 3-5UM, the thick control of gold is in >=0.05UM).PCB is made.
After being surface-treated, then gong profile, electrical testing and inspection eventually are carried out successively, qualified product can shipment.
Embodiment 2
The present embodiment provides a kind of preparation method of the PCB provided with bottomless copper metallization blind hole, specific making step and
Embodiment 1 it is essentially identical, difference is：The layers of copper of the bottom hole of metalized blind vias is removed by way of controlled depth milling
When, when the vertical range of the hole wall of milling edge and metalized blind vias is 0.03mm, i.e. milling bottom hole copper, hole is compared at milling edge
Wall is unilateral to inside contract 0.03mm.
The cross-sectional view of made bottomless copper metallization blind hole 20 is as shown in Figure 2.Lost through outer layer at milling edge
Become round and smooth after quarter, but milling edge substantially protrudes hole wall 21 so that the copper bound area of the bottomless bottom of copper metallization blind hole 20 residual
It is larger.
Embodiment 3
The present embodiment provides a kind of preparation method of the PCB provided with bottomless copper metallization blind hole, specific making step and
Embodiment 1 it is essentially identical, difference is：The layers of copper of the bottom hole of metalized blind vias is removed by way of controlled depth milling
When, when the vertical range of the hole wall of milling edge and metalized blind vias is 0.005mm, i.e. milling bottom hole copper, milling edge is compared
Hole wall is unilateral to inside contract 0.005mm.
The cross-sectional view of made bottomless copper metallization blind hole 30 is as shown in Figure 3.Lost through outer layer at milling edge
Become round and smooth after quarter, but the obvious recessed hole wall 31 in milling edge.
In other embodiments, when the layers of copper of the bottom hole of metalized blind vias is removed by way of controlled depth milling, milling
The vertical range of edge and the hole wall of metalized blind vias can also be 0.01-0.02mm；The depth ratio metalized blind vias of controlled depth milling
Depth can also be 0.1-0.11mm on a large scale.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, and is sent out by this
Bright protection.
Claims (5)
1. a kind of preparation method of the PCB provided with bottomless copper metallization blind hole, it is characterised in that comprise the following steps：
S1, on multilayer boards drilling blind hole, then carry out heavy copper and electric plating of whole board, the blind hole are fabricated into gold successively to multi-layer sheet
Categoryization blind hole；Then outer graphics transfer and graphic plating are carried out on multilayer boards；
The multi-layer sheet is pressed together by prepreg by core material and outer copper foil and constituted；
S2, by way of controlled depth milling the layers of copper of the bottom hole of metalized blind vias removed, metalized blind vias is fabricated to bottomless copper
Metalized blind vias；
S3, carry out outer layer etching successively to multi-layer sheet and move back tin processing, form outer-layer circuit on multilayer boards；
S4, solder mask being made on multilayer boards, then multi-layer sheet being surface-treated and processing and forming, PCB is made.
2. a kind of preparation method of the PCB provided with bottomless copper metallization blind hole according to claim 1, it is characterised in that institute
State in step S2, the milling area of controlled depth milling is less than the cross-sectional area of metalized blind vias, and milling edge and metalized blind vias
The vertical range of hole wall is 0.01-0.02mm.
3. a kind of preparation method of the PCB provided with bottomless copper metallization blind hole according to claim 2, it is characterised in that institute
State in step S2, the vertical range of the hole wall of milling edge and metalized blind vias is 0.02mm.
4. a kind of preparation method of the PCB provided with bottomless copper metallization blind hole according to claim 1, it is characterised in that institute
State in step S2, the big 0.1-0.11mm of depth of the depth ratio metalized blind vias of controlled depth milling.
5. a kind of preparation method of the PCB provided with bottomless copper metallization blind hole according to claim 4, it is characterised in that institute
State in step S2, the big 0.105mm of depth of the depth ratio metalized blind vias of controlled depth milling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104626.1A CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104626.1A CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104684280A CN104684280A (en) | 2015-06-03 |
| CN104684280B true CN104684280B (en) | 2017-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510104626.1A Expired - Fee Related CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
-
2015
- 2015-03-10 CN CN201510104626.1A patent/CN104684280B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
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| CN104684280A (en) | 2015-06-03 |
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