CN104284520A - PCB surface treatment method - Google Patents
PCB surface treatment method Download PDFInfo
- Publication number
- CN104284520A CN104284520A CN201410522453.0A CN201410522453A CN104284520A CN 104284520 A CN104284520 A CN 104284520A CN 201410522453 A CN201410522453 A CN 201410522453A CN 104284520 A CN104284520 A CN 104284520A
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- Prior art keywords
- gold
- pcb
- golden finger
- surface treatment
- treatment method
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Links
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000004381 surface treatment Methods 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 claims abstract description 37
- 239000010931 gold Substances 0.000 claims abstract description 34
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 31
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052737 gold Inorganic materials 0.000 claims abstract description 28
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 39
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 235000003392 Curcuma domestica Nutrition 0.000 claims description 12
- 235000003373 curcuma longa Nutrition 0.000 claims description 12
- 235000013976 turmeric Nutrition 0.000 claims description 12
- 244000008991 Curcuma longa Species 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract 5
- 239000010949 copper Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 241001657258 Pachycare flavogriseum Species 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 244000163122 Curcuma domestica Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of producing circuit boards, in particular to a PCB surface treatment method. The method includes the steps that nickel gold immersion treatment is carried out on a golden finger position and a welding position at the same time, blue glue is pressed on a PCB, and then electric thick gold treatment is carried out on the golden finger position. The technological process can be reduced, the existing working procedure of pasting dry films or coating electricity-resisting gold ink can be omitted, and therefore the problems that the dry films fall off to contaminate a gold face, film withdrawing and developing are not thorough, electricity-resisting gold ink falls off and gold throwing occurs can be avoided. The content of phosphorus in a used chemical solution in the nickel gold immersion treatment process and electroplate liquid in the electric thick gold treatment are controlled, and therefore it can be ensured that the hardness of a golden finger is over 142 HVN, and the golden finger is intact after being plugged for over twenty thousand times. By controlling the temperature of the blue glue, the blue glue and an immersion gold layer at the welding position can be attached tightly, it is prevented that gold is electroplated on the immersion gold layer, it can be ensured that the immersion gold layer is not contaminated by the blue glue, and the good weldability can be ensured.
Description
Technical field
The present invention relates to PCB production technical field, particularly relate to a kind of PCB surface treatment method.
Background technology
PCB is the carrier of the supporter of electronic devices and components, electrical connection, is one of vitals of electronics industry, is applied to almost in often kind of electronic equipment, little of electronic watch, calculator, arrives greatly computer, communication electronic device, military issue weapons system etc.In the production of PCB, surface treatment is last procedure in PCB manufacture process, for the protection of PCB copper face, to ensure the solderability that PCB is excellent.Existing surface treatment method has hot blast to spray tin, chemical nickel and gold, chemistry silver, chemical tin etc. usually, and on golden finger position gold-plated finger.In existing PCB production technology, a production unit (PNL) requires simultaneously gold-plated finger and welding position sink nickel gold two kinds of different process of surface treatment time, the making of golden finger and welding position sink nickel gold separately carry out, namely nickel gold is sunk in welding position again after first making golden finger completely, or first start again to make golden finger after welding position sinks nickel gold, existing flow process has following four kinds: 1, silk-screen welding resistance (character) → make outer graphics → heavy nickel gold → move back film → electric golden finger → shaping with dry film; 2, silk-screen welding resistance (character) → silk-screen anti-ization bronze ink → heavy nickel gold → move back film → electric golden finger → shaping; 3, silk-screen welding resistance (character) → electric golden finger → silk-screen anti-ization bronze ink → heavy nickel gold → move back film → shaping; 4. silk-screen welding resistance (character) → outer graphics → electric golden finger → move back film → make outer graphics → heavy nickel gold → move back film → shaping with dry film.There is dry film and pollute golden face, occur that double layer nickel gold gets rid of gold in above four kinds of flow processs, move back film not to the utmost, development is clean, fall the quality problem such as anti-ization bronze ink, and the spacing between welding position and golden finger position need be greater than the impact on welding position or golden finger position when 0.3mm just can prevent electric golden finger or heavy nickel gold.In addition, technological process is long, and production cost is high.
Summary of the invention
The present invention is directed in existing PCB making, electricity golden finger and the two kinds of surface treatments of heavy nickel gold need independently to carry out completely, thus cause falling dry film to pollute golden face, the problem such as development is clean, and technological process is long, provide a kind of and improve PCB quality and the short PCB surface treatment method of technological process.
For achieving the above object, by the following technical solutions, a kind of PCB surface treatment method, comprises the following steps in the present invention:
S1, the golden finger position on PCB and welding position carried out simultaneously to the process of heavy nickel gold.
Preferably, in the process of heavy nickel gold, the Ni in heavy nickel liquid medicine
2+concentration be 4.6-5.2g/L, NaH
2pO
2concentration be 21-27g/L, pH=4.1-4.5; In turmeric liquid medicine, the concentration of Au is 0.5-0.8g/L, Ni
2+concentration < 1000ppm, Cu
2+concentration < 5ppm, pH=5.5-6.5.
Preferably, by the THICKNESS CONTROL of heavy nickel dam at 4-6 μm, the THICKNESS CONTROL of turmeric layer is being more than or equal to 0.05 μm.
S2, on PCB, press blue glue, and window at golden finger position, make golden finger position out exposed.
Preferably, when PCB presses blue glue, the temperature of blue glue is pressed to be 10-30 DEG C; Transfer rate is 0.8-0.9m/min, and air pressure is 0.5-0.8MPa.
S3, electric thick gold process is carried out to the golden finger position on PCB.
Preferably, in electric thick gold process, in electroplate liquid, the concentration of Au is 2.0-6g/L, Ni
2+concentration≤200ppm, Cu
+concentration≤20ppm, pH are 4.6-4.8, temperature is 33-37 DEG C.Preferably, the layer gold THICKNESS CONTROL on golden finger position is being more than or equal to 0.76 μm.
S4, the blue glue torn on PCB.
Also comprise before described step S1: on PCB, make solder mask, and window at golden finger position and welding position respectively, make golden finger position and welding position out exposed.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by carrying out the process of heavy nickel gold simultaneously at golden finger position and welding position, electric thick gold is continued again on golden finger position, technological process can be reduced, and the operation of pasting dry film or being coated with anti-electric bronze ink can be saved in existing procedure, thus dry film can be avoided to pollute golden face, move back film is clean, development is clean, fall the phenomenons such as anti-electric bronze ink appearance and get rid of golden problem.By controlling the content of phosphorus in liquid medicine used in heavy nickel gold processing procedure, and control the electroplate liquid in electric thick gold process, can the hardness of guarantee fund's finger at more than 142HVN, grafting still stands intact for more than 20,000 times.By controlling the temperature of the blue glue of pressure, the turmeric layer in blue glue and welding position can be made to fit tightly, preventing gold on the turmeric layer of welding position powers on, can ensure that again the turmeric layer of welding position is not by blue glue stain, keeps good solderability.On same PCB, carry out electric golden finger and the process of heavy nickel gold by the inventive method, the spacing between golden finger position and welding position can be equal to or less than 0.3mm.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment 1
A kind of PCB surface treatment method that the present embodiment provides, comprising heavy nickel gold and the two kinds of surface treatments of electric golden finger, the method specifically comprises the following steps:
(1) according to existing PCB production technology, before this to sheet material sawing sheet, then each PCB production unit (PNL) was carried out to painting wet film, exposure, development successively, etched and moved back film process, thus made each inner plating.The each inner plating of pressing makes formation multi-layer sheet, then makes outer-layer circuit on multilayer boards, forms PCB half-finished product plate.Specific as follows:
Sawing sheet: output central layer by jigsaw size 520mm*620mm, core thickness 0.5mm H/H.
Internal layer: produce with vertical application machine, film thickness monitoring 8 μm, adopts Full-automatic exposure machine, completes internal layer circuit exposure with 5-6 lattice exposure guide rule (21 lattice exposure guide rule), and development after etching goes out line pattern, and internal layer live width measures as 3miL.
Internal layer AOI: what check internal layer opens short circuit, line with the defect such as breach, circuit pin hole, and defectiveness scraps process, flawless product introduction downstream.
Pressing: brown speed carries out brown according to copper at the bottom of the thick HOZ of copper, after brown lamination, select suitable lamination to carry out pressing according to plate Tg, after pressing, thickness is 1.47mm.
Outer boring: utilize borehole data to carry out Drilling operation.
Outer heavy copper: make hole metallization, backlight tests 10 grades.
Electric plating of whole board (negative film technique): with the current density electric plating of whole board 150min of 10ASF, hole more than copper thickness 25um.
Outer graphics: adopt Full-automatic exposure machine, completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), and develops.Outer graphics comprises the figure of golden finger position and the figure of welding position.
Outer etching: acid etching, etching speed etches by the end copper of 1OZ, and having etched rear wire width measuring is 4.0miL, obtains outer-layer circuit; Outer-layer circuit comprises golden finger position and welding position; Form PCB half-finished product plate.
Outer AOI: what check internal layer opens short circuit, line with the defect such as breach, circuit pin hole, and defectiveness scraps process, flawless product introduction downstream.
(2) according to existing solder mask manufacturing technology, PCB half-finished product plate makes solder mask, and make by windowing golden finger position and welding position completely out exposed, treat follow-uply on golden finger position and welding position, to carry out surface treatment.
Adopt white reticulated printing TOP face solder mask, TOP face character adds " UL " mark.
(3) according to the operation of existing heavy nickel gold, the process of heavy nickel gold is carried out to golden finger position and welding position; Wherein, the heavy nickel liquid medicine in nickel cylinder: Ni
2+4.6-5.2g/L, NaH
2pO
421-27g/L, pH=4.1-4.5.Heavy nickel temperature is 78-84 DEG C.
Turmeric liquid medicine in gold cylinder: Au 0.5-0.8g/L, Ni
2+≤ 1000ppm, Cu
2+≤ 5ppm, pH=5.5-6.5, turmeric temperature is 76-86 DEG C.
In the process of heavy nickel gold, by controlling the time of heavy nickel gold, controlling the thickness of heavy nickel dam and turmeric layer, making the thickness of heavy nickel dam be thickness >=0.05 μm of 4-6 μm, turmeric layer; The thickness of heavy nickel dam and turmeric layer in golden finger position and welding position is measured respectively with X-Ray.
(4) by the blue glue machine of pressure, blue glue is fitted tightly on PCB, and window at golden finger position, make golden finger position out exposed;
Press blue adhesive process parameter: transfer rate is 0.8-0.9m/min, temperature is 25 DEG C, and air pressure is 0.5-0.8MPa.
(5) electric thick gold process is carried out to the golden finger position on PCB; Electroplate liquid in gold cylinder: Au=2-6g/L, Ni
2+≤ 200ppm, Cu
+≤ 20ppm, pH=4.6-4.8, temperature is 33-37 DEG C.Circuit: 0.6-1.2Adm
2.
In electric thick gold process, by controlling electroplating time, controlling the layer gold thickness on golden finger position, making layer gold thickness >=0.76 μm on golden finger position.
(6) the manual blue glue torn on PCB, then, carry out the rear operation such as excision forming, quality testing to PCB, obtained program communication block mask is P1.Be specially:
External form: gong external form, external form tolerance +/-0.05mm.
Electrical testing: the electric property of test-based examination production board.
Inspection eventually: check that the aesthetic appearance of production board is bad.
FQA: again take a sample test outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thick etc.
Embodiment 2
The present embodiment provides a kind of PCB surface treatment method, and comprising heavy nickel gold and the two kinds of surface treatments of electric golden finger, the method is substantially identical with embodiment 1, and difference is: change the temperature in the blue adhesive process parameter of pressure into 30 DEG C.
Obtained program communication block mask is P2.
Comparative example 1
This comparative example provides a kind of PCB surface treatment method, comprising heavy nickel gold and the two kinds of surface treatments of electric golden finger, the method is substantially identical with embodiment 1, and difference is: in the heavy nickel gold process of step (3), by the NaH in the heavy nickel liquid medicine in nickel cylinder
2pO
4concentration be adjusted to 29-32g/L.
Obtained program communication block mask is P3.
In other embodiments, when pressing blue glue by pressing blue glue machine on PCB, the temperature in blue adhesive process parameter is pressed also can be set between 10-30 DEG C.
Comparative example 2
This comparative example provides a kind of PCB surface treatment method, comprising heavy nickel gold and the two kinds of surface treatments of electric golden finger, the method is substantially identical with embodiment 1, and difference is: in the heavy nickel gold process of step (3), by the NaH in the heavy nickel liquid medicine in nickel cylinder
2pO
4concentration be adjusted to 18-21g/L.
Obtained program communication block mask is P4.
Comparative example 3
This comparative example provides a kind of PCB surface treatment method, and comprising heavy nickel gold and the two kinds of surface treatments of electric golden finger, the method is substantially identical with embodiment 1, and difference is: change the temperature in the blue adhesive process parameter of pressure into 35 DEG C.
Obtained program communication block mask is P5.
According to standard " J-STD-003B " requirement, the mode of simulation welding (pb-free solder technique-edge immersed solder test) is adopted to test the solderability of welding position on above-mentioned obtained PCB; And according to engineering golden electrodeposited coating specification " ASTM-B-488 " requirement, detect the golden hardness of golden finger and golden purity.Test result is as shown in the table.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (10)
1. a PCB surface treatment method, is characterized in that, comprises the following steps:
S1, the golden finger position on PCB and welding position carried out simultaneously to the process of heavy nickel gold;
S2, on PCB, press blue glue, and window at golden finger position, make golden finger position out exposed;
S3, electric thick gold process is carried out to the golden finger position on PCB.
2. a kind of PCB surface treatment method according to claim 1, is characterized in that, in the heavy nickel gold process of described step S1, in heavy nickel liquid medicine, and Ni
2+concentration be 4.6-5.2g/L, NaH
2pO
2concentration be 21-27g/L, pH=4.1-4.5.
3. a kind of PCB surface treatment method according to claim 1, is characterized in that, in the heavy nickel gold process of described step S1, in turmeric liquid medicine, the concentration of Au is 0.5-0.8g/L, Ni
2+concentration≤1000ppm, Cu
2+concentration≤5ppm, pH=5.5-6.5.
4. a kind of PCB surface treatment method according to claim 1, is characterized in that, described step S2, when PCB presses blue glue, presses the temperature of blue glue to be 10-30 DEG C.
5. a kind of PCB surface treatment method according to claim 4, it is characterized in that, described step S2, when PCB presses blue glue, transfer rate is 0.8-0.9m/min, and air pressure is 0.5-0.8MPa.
6. a kind of PCB surface treatment method according to claim 1, it is characterized in that, in the electric thick gold process of described step S3, in electroplate liquid, the concentration of Au is 2.0-6g/L, Ni
2+concentration≤200ppm, Cu
+concentration≤20ppm, pH are 4.6-4.8.
7. a kind of PCB surface treatment method according to any one of claim 1-6, is characterized in that, comprise: on PCB, make solder mask before described step S1, and window at golden finger position and welding position respectively, make golden finger position and welding position out exposed.
8., according to claim 7 described a kind of PCB surface treatment method, it is characterized in that, comprise after described step S3: tear the blue glue on PCB.
9. a kind of PCB surface treatment method according to any one of claim 1-6, is characterized in that, in the heavy nickel gold process of described step S1, the THICKNESS CONTROL of heavy nickel dam is at 4-6 μm, and the THICKNESS CONTROL of turmeric layer is being more than or equal to 0.05 μm.
10. a kind of PCB surface treatment method according to any one of claim 1-6, is characterized in that, in the electric thick gold process of described step S3, the THICKNESS CONTROL of electric layer gold is being more than or equal to 0.76 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522453.0A CN104284520B (en) | 2014-09-29 | 2014-09-29 | A kind of PCB surface processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522453.0A CN104284520B (en) | 2014-09-29 | 2014-09-29 | A kind of PCB surface processing method |
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| Publication Number | Publication Date |
|---|---|
| CN104284520A true CN104284520A (en) | 2015-01-14 |
| CN104284520B CN104284520B (en) | 2017-11-28 |
Family
ID=52258854
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|---|---|---|---|
| CN201410522453.0A Expired - Fee Related CN104284520B (en) | 2014-09-29 | 2014-09-29 | A kind of PCB surface processing method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
| CN107241874A (en) * | 2017-08-09 | 2017-10-10 | 博敏电子股份有限公司 | The preparation method that a kind of lead turmeric adds the printed circuit board of gold-plated combination process |
| CN107241873A (en) * | 2017-07-17 | 2017-10-10 | 胜宏科技（惠州）股份有限公司 | A kind of improved golden finger gold plating method |
| CN107734876A (en) * | 2017-09-29 | 2018-02-23 | 广东兴达鸿业电子有限公司 | The method that pcb board plates golden finger |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
| CN111093334A (en) * | 2019-12-30 | 2020-05-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
| CN114900970A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
| CN105848423B (en) * | 2016-05-20 | 2018-11-06 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with electroplating gold and chemical two kinds of surface treatments of turmeric |
| CN107241873A (en) * | 2017-07-17 | 2017-10-10 | 胜宏科技（惠州）股份有限公司 | A kind of improved golden finger gold plating method |
| CN107241874A (en) * | 2017-08-09 | 2017-10-10 | 博敏电子股份有限公司 | The preparation method that a kind of lead turmeric adds the printed circuit board of gold-plated combination process |
| CN107734876A (en) * | 2017-09-29 | 2018-02-23 | 广东兴达鸿业电子有限公司 | The method that pcb board plates golden finger |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
| CN111093334A (en) * | 2019-12-30 | 2020-05-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
| CN111093334B (en) * | 2019-12-30 | 2023-09-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
| CN114900970A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
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| CN104284520B (en) | 2017-11-28 |
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