CN106993378A - A kind of pcb board selective surface handling process - Google Patents
A kind of pcb board selective surface handling process Download PDFInfo
- Publication number
- CN106993378A CN106993378A CN201710309113.3A CN201710309113A CN106993378A CN 106993378 A CN106993378 A CN 106993378A CN 201710309113 A CN201710309113 A CN 201710309113A CN 106993378 A CN106993378 A CN 106993378A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- handling process
- baking
- carried out
- selective surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The present invention provides a kind of pcb board selective surface handling process, comprises the following steps：A kind of pcb board selective surface handling process, comprises the following steps：(1) pcb board pre-treatment, and carry out surface treatment first and green oil coating；(2) sequent surface is needed to handle the antiacid protection ink of printing baking-type and baking-curing at the position of figure on the PCB after being surface-treated first；(3) sequent surface handling process is carried out；(4) black processing is carried out to pcb board for 3% 5% sodium hydroxide with mass concentration；(5) pcb board is post-processed.The beneficial effects of the invention are as follows：Realize that protection first time or more makes the technique of surface treatment by ink, than saving technological process and Material Cost using dry film processing technology, also improve production efficiency.
Description
Technical field
The present invention relates to printed-board technology field, more particularly to a kind of pcb board selective surface handling process.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is almost the basis of any electronic product, appears in
Almost in each electronic equipment, if it is, in general, that having electronic component in some equipment, then they are also all to be collected
Into on the PCB of different sizes.In addition to fixed various components, PCB main function is to provide between every component
Connect circuit.With electronic equipment become increasingly complex, it is necessary to component it is more and more, the circuit of PCB surface and component
It is more and more intensive.Partial circuit plate be able to can be selected at different surfaces due to welding requirements and performance cost requirement, same sheet
Reason, most normal See's is combined as adding of golden finger gold.
Golden finger is made up of numerous golden yellow conductive contact blades, because of its surface gold-plating and conductive contact blade arrangement such as finger
Shape, so referred to as golden finger.Golden finger, which is often referred to be formed at, is used for the connection member of connected slot, all signals on circuit board
All it is to be transmitted by golden finger, therefore golden finger is critically important for the performance of circuit board.For example, for
Internal storage location in PC, all data flows of internal memory processing unit, electron stream are exactly based on golden finger and memory bank
Contact swapped with PC systems, be the I/O mouthful of internal memory, therefore its manufacture craft is quite weighed for Memory linkage
Will.Golden finger plates last layer gold again actually in copper-clad plate by plating or chemical plating process, and chemical plating is on copper face
Gold is deposited on sulfuric acid nickel surface formation golden finger by chemically reacting after deposition nickel sulfate.Plating is that ammonia is electroplated on copper face
Golden finger is ultimately formed after base sulphur nickel in nickel table plated with gold with the mode of plating again.
Change gold, be heavy nickel gold, industry is frequently referred to electroless nickel golden (ElectrolessNickel Immersion Gold) again
Nickel leaching gold .PCB chemical nickel and golds of referred to as sinking refer to the chemical nickel plating on naked copper face, and then a kind of solderable surface of chemistry leaching gold is applied
Its existing good contact conduction of coating process, and with good erection welding performance, while it can also be with other tables
Face coating processes are with the use of with people's exhibition of electronics industry with rapid changepl. never-ending changes and improvements, and the effect that chemical nickel and gold technique is showed is increasingly
It is important.
Defect present in existing processing technology is：Common process on protection circuit plate in order to make surface treatment figure
The position of shape, can carry out covering dry film action, the price of dry film is higher on the market, and wants justifying press mold every time, causes
Waste of raw materials than larger；In addition, carrying out lid dry film process every time needs to undergo pre-treatment-press mold-exposure-development-inspection
Etc. step, after completionization gold+gold-plated action, then dry film is carried out, thus, the technological process of lid dry film is more complicated, influence life
Produce efficiency.
The content of the invention
Based on this, surface treatment pattern bit can be made on protection circuit plate it is an object of the invention to provide one kind
The technique put, instead of old lid dry film process, saves technological process, also save Material Cost, improving production efficiency.
The present invention provides a kind of pcb board selective surface handling process, comprises the following steps：
(1) pcb board pre-treatment, and carry out surface treatment first and green oil coating；
(2) need sequent surface to handle on the PCB after being surface-treated first and the antiacid protection of baking-type is printed at the position of figure
Ink and baking-curing；
(3) sequent surface handling process is carried out；
(4) sodium hydroxide for being 3%-5% with mass concentration carries out black processing to pcb board；
(5) pcb board is post-processed.
Preferably, before the step (5) is carried out, repeating said steps (2) to the step (4) are at least one times.
Preferably, the antiacid protection ink of the baking-type selects the GMS- of Dongguan Jing Nian Electronics Co., Ltd.s
The antiacid protection ink of 9100HBK thermohardening types.
Preferably, the black treatment conditions of going in the step (4) are：45 DEG C -55 DEG C go down ink -70 seconds 50 seconds.
Preferably, the sequent surface handling process is golden finger technique, tin spray process, changes silver process, changes gold
Technique, the one kind changed in process of tin.
Preferably, the baking-curing condition in the step (2) is, baking temperature：Under 120 degrees Celsius, baking
Time：25 minutes.
Preferably, the step (1) comprises the steps of：
A provides multi-layer PCB board raw material；
B carries out sawing sheet respectively to pcb board raw material described in multilayer；
C carries out inner figure transfer to form internal layer circuit circuit in the pcb board raw material as the surface of internal layer raw material, and
Automatic optics inspection is carried out to the internal layer circuit circuit；
Pcb board raw material described in multilayer fold and set by D, and is further pressed to form the multi-layer PCB board, then to described many
Layer pcb board is practiced shooting and bore process；
The multi-layer PCB board is carried out heavy process for copper processing by E, obtains covering the pcb board of the copper plate；
The pcb board of the copper plate is carried out a dry film and an etch process by F；
Plate after once etching is carried out press mold, exposure, development, inspection technique by G, and rear make is surface-treated for the first time；
First time is surface-treated the plate completed and carries out striping and solder mask green process operation by H.
Preferably, the step (5) comprises the steps of：
A carries out character silk printing to pcb board；
B gongs go out the profile and V-CUT of finished product, cleaning；
C is opened a way to each layer of pcb board, short-circuit test；
D carries out finished appearance inspection and packaging/storage to pcb board.
Beneficial effects of the present invention are：Realize that protection first time or more makes the technique of surface treatment by ink,
Than saving technological process and Material Cost using dry film processing technology, production efficiency is also improved.
Embodiment
For the feature, technological means and the specific purposes reached, function of the present invention can be further appreciated that, with reference to
Embodiment is described in further detail to the present invention.
The present invention provides the present invention and provides a kind of pcb board selective surface handling process, comprises the following steps：
(1) pcb board pre-treatment, and carry out surface treatment first and green oil coating；
(2) need sequent surface to handle on the PCB after being surface-treated first and the antiacid protection of baking-type is printed at the position of figure
Ink and baking-curing；
(3) sequent surface handling process is carried out；
(4) sodium hydroxide for being 3%-5% with mass concentration carries out black processing to pcb board；
(5) pcb board is post-processed.
As preferred embodiment, before the step (5) is carried out, repeating said steps (2) to the step (4) are at least
Once, it is possible to realize the technique for protecting first time or more to make surface treatment.
As preferred embodiment, the antiacid protection ink of baking-type is from Dongguan Jing Nian Electronics Co., Ltd.s
The antiacid protection ink of GMS-9100HBK thermohardening types.
As preferred embodiment, the black treatment conditions of going in the step (4) are：45 DEG C -55 DEG C go down ink 50 seconds -
70 seconds.
As preferred embodiment, the sequent surface handling process is golden finger technique, tin spray process, changes silver-colored work
Skill, immersion process, the one kind changed in process of tin.
As preferred embodiment, the baking-curing condition in the step (2) is, baking temperature：120 degrees Celsius
Under, baking time：25 minutes.
As preferred embodiment, the step (1) comprises the steps of：
A provides multi-layer PCB board raw material；
B carries out sawing sheet respectively to pcb board raw material described in multilayer；
C carries out inner figure transfer to form internal layer circuit circuit in the pcb board raw material as the surface of internal layer raw material, and
Automatic optics inspection is carried out to the internal layer circuit circuit；
Pcb board raw material described in multilayer fold and set by D, and is further pressed to form the multi-layer PCB board, then to described many
Layer pcb board is practiced shooting and bore process；
The multi-layer PCB board is carried out heavy process for copper processing by E, obtains covering the pcb board of the copper plate；
The pcb board of the copper plate is carried out a dry film and an etch process by F；
Plate after once etching is carried out press mold, exposure, development, inspection technique by G, and rear make is surface-treated for the first time；
First time is surface-treated the plate completed and carries out striping and solder mask green process operation by H.
As preferred embodiment, the step (5) comprises the steps of：
A carries out character silk printing to pcb board；
B gongs go out the profile and V-CUT of finished product, cleaning；
C is opened a way to each layer of pcb board, short-circuit test；
D carries out finished appearance inspection and packaging/storage to pcb board.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of pcb board selective surface handling process, it is characterised in that comprise the following steps：
(1) pcb board pre-treatment, and carry out surface treatment first and green oil coating；
(2) need sequent surface to handle on the PCB after being surface-treated first and the antiacid protection of baking-type is printed at the position of figure
Ink and baking-curing；
(3) sequent surface handling process is carried out；
(4) sodium hydroxide for being 3%-5% with mass concentration carries out black processing to pcb board；
(5) pcb board is post-processed.
2. a kind of pcb board selective surface handling process according to claim 1, it is characterised in that also including following step
Suddenly：Before the step (5) is carried out, repeating said steps (2) to the step (4) are at least one times.
3. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the baking-type
Antiacid protection ink selects the antiacid protection ink of GMS-9100HBK thermohardening types of Dongguan Jing Nian Electronics Co., Ltd.s.
4. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the step
(4) the black treatment conditions of going in are：45 DEG C -55 DEG C go down ink -70 seconds 50 seconds.
5. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the rear continued
Face handling process is golden finger technique, tin spray process, change silver process, immersion process, the one kind changed in process of tin.
6. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the step
(2) the baking-curing condition in is, baking temperature：Under 120 degrees Celsius, baking time：25 minutes.
7. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the step
(1) comprise the steps of：
A provides multi-layer PCB board raw material；
B carries out sawing sheet respectively to pcb board raw material described in multilayer；
C carries out inner figure transfer to form internal layer circuit circuit in the pcb board raw material as the surface of internal layer raw material, and
Automatic optics inspection is carried out to the internal layer circuit circuit；
Pcb board raw material described in multilayer fold and set by D, and is further pressed to form the multi-layer PCB board, then to described many
Layer pcb board is practiced shooting and bore process；
The multi-layer PCB board is carried out heavy process for copper processing by E, obtains covering the pcb board of the copper plate；
The pcb board of the copper plate is carried out a dry film and an etch process by F；
Plate after once etching is carried out press mold, exposure, development, inspection technique by G, and rear make is surface-treated for the first time；
First time is surface-treated the plate completed and carries out striping and solder mask green process operation by H.
8. a kind of pcb board selective surface handling process according to claim 1 or 2, it is characterised in that the step
(5) comprise the steps of：
A carries out character silk printing to pcb board；
B gongs go out the profile and V-CUT of finished product, cleaning；
C is opened a way to each layer of pcb board, short-circuit test；
D carries out finished appearance inspection and packaging/storage to pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710309113.3A CN106993378A (en) | 2017-05-04 | 2017-05-04 | A kind of pcb board selective surface handling process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710309113.3A CN106993378A (en) | 2017-05-04 | 2017-05-04 | A kind of pcb board selective surface handling process |
Publications (1)
| Publication Number | Publication Date |
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| CN106993378A true CN106993378A (en) | 2017-07-28 |
Family
ID=59418449
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| CN201710309113.3A Pending CN106993378A (en) | 2017-05-04 | 2017-05-04 | A kind of pcb board selective surface handling process |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454762A (en) * | 2017-09-14 | 2017-12-08 | 桐城市闲产网络服务有限公司 | A kind of preparation method of computer circuit board |
| CN108207085A (en) * | 2017-12-29 | 2018-06-26 | 深圳欣强智创电路板有限公司 | A kind of grading connecting finger optic module PCB plate surface treatment method |
| CN110257742A (en) * | 2019-08-05 | 2019-09-20 | 浙江菲尔特工贸有限公司 | A kind of copper door process of surface treatment |
| CN110795874A (en) * | 2019-09-30 | 2020-02-14 | 武汉大学 | Digital twin model for flexible circuit board manufacturing process |
| CN112469202A (en) * | 2020-11-24 | 2021-03-09 | 绍兴德汇半导体材料有限公司 | Selective silver plating method applied to copper-clad ceramic substrate |
| CN112930044A (en) * | 2021-02-06 | 2021-06-08 | 深圳市迅捷兴科技股份有限公司 | Three different surface treatment manufacturing methods of circuit board |
| CN113543520A (en) * | 2020-04-21 | 2021-10-22 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN114390783A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| WO2022151013A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
| CN116761346A (en) * | 2023-06-07 | 2023-09-15 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
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| CN101197462A (en) * | 2006-12-07 | 2008-06-11 | 上海英内电子标签有限公司 | Production method for RFID etching aluminum antenna |
| CN105338752A (en) * | 2015-11-13 | 2016-02-17 | 喜健环球科技有限公司 | Circuit forming method of outer layer of circuit board |
| CN106604561A (en) * | 2017-01-18 | 2017-04-26 | 维沃移动通信有限公司 | Circuit board manufacturing method and mobile terminal |
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Patent Citations (3)
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| CN101197462A (en) * | 2006-12-07 | 2008-06-11 | 上海英内电子标签有限公司 | Production method for RFID etching aluminum antenna |
| CN105338752A (en) * | 2015-11-13 | 2016-02-17 | 喜健环球科技有限公司 | Circuit forming method of outer layer of circuit board |
| CN106604561A (en) * | 2017-01-18 | 2017-04-26 | 维沃移动通信有限公司 | Circuit board manufacturing method and mobile terminal |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454762A (en) * | 2017-09-14 | 2017-12-08 | 桐城市闲产网络服务有限公司 | A kind of preparation method of computer circuit board |
| CN108207085A (en) * | 2017-12-29 | 2018-06-26 | 深圳欣强智创电路板有限公司 | A kind of grading connecting finger optic module PCB plate surface treatment method |
| CN110257742A (en) * | 2019-08-05 | 2019-09-20 | 浙江菲尔特工贸有限公司 | A kind of copper door process of surface treatment |
| CN110257742B (en) * | 2019-08-05 | 2020-07-17 | 浙江菲尔特工贸有限公司 | Copper door surface treatment process |
| CN110795874A (en) * | 2019-09-30 | 2020-02-14 | 武汉大学 | Digital twin model for flexible circuit board manufacturing process |
| CN113543520A (en) * | 2020-04-21 | 2021-10-22 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN113543520B (en) * | 2020-04-21 | 2022-10-21 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN114390783A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112469202A (en) * | 2020-11-24 | 2021-03-09 | 绍兴德汇半导体材料有限公司 | Selective silver plating method applied to copper-clad ceramic substrate |
| WO2022151013A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
| CN112930044B (en) * | 2021-02-06 | 2022-03-22 | 深圳市迅捷兴科技股份有限公司 | Three different surface treatment manufacturing methods of circuit board |
| CN112930044A (en) * | 2021-02-06 | 2021-06-08 | 深圳市迅捷兴科技股份有限公司 | Three different surface treatment manufacturing methods of circuit board |
| CN116761346A (en) * | 2023-06-07 | 2023-09-15 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
| CN116761346B (en) * | 2023-06-07 | 2023-11-21 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
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Application publication date: 20170728 |