CN108207085A - A kind of grading connecting finger optic module PCB plate surface treatment method - Google Patents
A kind of grading connecting finger optic module PCB plate surface treatment method Download PDFInfo
- Publication number
- CN108207085A CN108207085A CN201711484719.7A CN201711484719A CN108207085A CN 108207085 A CN108207085 A CN 108207085A CN 201711484719 A CN201711484719 A CN 201711484719A CN 108207085 A CN108207085 A CN 108207085A
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- CN
- China
- Prior art keywords
- plank
- surface treatment
- plate surface
- treatment method
- finger
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Abstract
The invention discloses a kind of grading connecting finger optic module PCB plate surface treatment methods, it mainly includes four plank preparation, anti-welding, NiPdAu and plank post-processing steps, the electroplating gold method in prior art is replaced using the method for NiPdAu, pass through the method for chemical lamination, in golden finger surface cladded with nickel gold, nickel gold is made to be evenly coated at copper face surrounding, prevent golden finger from generating notch or protrusion in the fabrication process, or aoxidized during follow-up use because etching the problems such as inaccurate, plating, it is short-circuit the problems such as.
Description
Technical field
The invention belongs to pcb board production field, more particularly to a kind of grading connecting finger optic module PCB plate surface processing side
Method.
Background technology
Existing common processing method is：
(1) concordant golden finger is done in outer layer processing first；
(2) lid selects allelopathic light ink：The position for needing to be classified finger is blocked；
(3) electroplating gold：By the nickel gold of thickness required on finger position electricity；
(4) secondary dry film：Circuit in plate and golden finger are blocked using dry film；
(5) it etches：It will carry out stinging erosion using liquid is etched without gold-plated region at grading connecting finger segmentation；
(6) flow afterwards：Complete shipment.
Existing processing method uses the nickel gold of the method for electroplating gold required thickness in finger position plating, this processing
Method tedious process is complicated, and the production cycle is long, and production cost is high, moreover, in practical operation, PCB expansion and Ink parameters
The problems such as reasons such as mismatching, being easy to cause golden finger deviation, jagged, plating.Nothing at the pcb board golden finger segmentation produced
Surface treatment protection, terminal easy oxidation corrosion in use, this series of problems strong influence property of product
Energy.
Invention content
To solve the above problems, the purpose of the present invention is to provide a kind of points that can be realized gold and be evenly coated at copper face surrounding
Grade golden finger optic module PCB plate surface treatment method.
It is another object of the present invention to provide a kind of golden finger optic module PCB plate surface treatment method, the processing sides
Method process is simple, at low cost and easy to implement.
To achieve the above object, technical scheme is as follows：
The present invention provides a kind of grading connecting finger optic module PCB plate surface treatment method, includes the following steps：
Step 1：Plank preparation：Preparation plank, and processing early period is carried out to plank, obtain the first plank；
Step 2：It is anti-welding：It carries out ink for screen printing exposure imaging on the line to the second plank, exposes the pad for needing to weld
And golden finger, obtain the second plank；
Step 3：NiPdAu：NiPdAu surface treatment is carried out to third plank plate surface, obtains third plank；
Step 4：Plank post-processing：Post-processing is carried out to third plank, obtains sheet forming.
Further, " step 1：Plank preparation " includes following sub-step：
1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is obtained
To initial plank needed for processing；
1.2：Internal layer circuit is made on initial plank and is examined；
1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank coated with copper foil after hot pressing
Carry out increasing layer；
1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；
1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；
1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film figure is turned
It moves on on initial plank, processes the figure of needs, obtain the first plank.
Further, " step 4：Plank preparation " includes following sub-step：
4.1：Molding：By third plate cutting into the shape of customer requirement；
4.2：Test：Open circuit short-circuit test is done to the third plank after excision forming；
Further, plate thickness at golden finger of being subject to during design carries out substrate and folds structure design.
Advantage of the invention is that：It needs use that carburetion ink is selected to carry out covering plating resist in existing processing technology, before electroplating gold, makes
With carburetion ink is selected, there are following points：First, can not ensure that it is concordant with golden finger edge during carburetion ink using selecting, and ink with
Golden finger edge is not concordant then to cause lead to generate notch or protrusion after etching；When secondly, using carburetion ink is selected, because of finger tip
Spacing is smaller or the design parameter of carburetion ink is selected to select the reasons such as error, and when leading to electroplating gold, nickel gold, which is plating to, to be selected under carburetion ink
Fang Zaocheng platings.And a kind of grading connecting finger optic module PCB plate surface treatment method provided by the invention, use the side of NiPdAu
Method replaces the electroplating gold method in prior art, by the method for chemical lamination, in golden finger surface cladded with nickel gold, makes nickel gold
It is even to be coated on copper face surrounding, prevent golden finger from generating notch or protrusion in the fabrication process or because of the problems such as etching is inaccurate, plating
Aoxidized during follow-up use, it is short-circuit the problems such as.
Description of the drawings
Fig. 1 is a kind of flow chart of grading connecting finger optic module PCB plate surface treatment method of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
To achieve the above object, technical scheme is as follows：
Shown in Figure 1, the present invention provides the present invention and provides a kind of grading connecting finger optic module PCB plate surface processing side
Method, in this embodiment, this method include the following steps：
S1：Plank preparation：Preparation plank, and processing early period is carried out to plank, obtain the first plank；
S2：It is anti-welding：It carries out ink for screen printing exposure imaging on the line to the second plank, exposes the pad and gold for needing to weld
Finger obtains the second plank；
S3：NiPdAu：NiPdAu surface treatment is carried out to third plank plate surface, obtains third plank；
S4：Plank post-processing：Post-processing is carried out to third plank, obtains sheet forming.
“S1：Plank preparation " includes following sub-step：
1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is obtained
To initial plank needed for processing；
1.2：Internal layer circuit is made on initial plank and is examined；
1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank coated with copper foil after hot pressing
Carry out increasing layer；
1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；
1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；
1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film figure is turned
It moves on on initial plank, processes the figure of needs, obtain the first plank.
“S4：Plank preparation " includes following sub-step：
4.1：Molding：By third plate cutting into the shape of customer requirement；
4.2：Test：Open circuit short-circuit test is done to the third plank after excision forming；
It carries out substrate it should be noted that being subject to plate thickness at golden finger during design and folds structure design.
Advantage of the invention is that：It needs use that carburetion ink is selected to carry out covering plating resist in existing processing technology, before electroplating gold, makes
With carburetion ink is selected, there are following points：First, can not ensure that it is concordant with golden finger edge during carburetion ink using selecting, and ink with
Golden finger edge is not concordant then to cause lead to generate notch or protrusion after etching；When secondly, using carburetion ink is selected, because of finger tip
Spacing is smaller or the design parameter of carburetion ink is selected to select the reasons such as error, and when leading to electroplating gold, nickel gold, which is plating to, to be selected under carburetion ink
Fang Zaocheng platings.And a kind of grading connecting finger optic module PCB plate surface treatment method provided by the invention, use the side of NiPdAu
Method replaces the electroplating gold method in prior art, by the method for chemical lamination, in golden finger surface cladded with nickel gold, makes nickel gold
It is even to be coated on copper face surrounding, prevent golden finger from generating notch or protrusion in the fabrication process or because of the problems such as etching is inaccurate, plating
Aoxidized during follow-up use, it is short-circuit the problems such as.
The foregoing is merely a prefered embodiment of the invention, is not intended to limit the invention, it is all the present invention spirit and
All any modification, equivalent and improvement made within principle etc., should all be included in the protection scope of the present invention.
Claims (4)
- A kind of 1. grading connecting finger optic module PCB plate surface treatment method, which is characterized in that the grading connecting finger optical module Pcb board surface treatment method includes the following steps：Step 1：Plank preparation：Preparation plank, and processing early period is carried out to plank, obtain the first plank；Step 2：It is anti-welding：It carries out ink for screen printing exposure imaging on the line to the second plank, exposes the pad and gold for needing to weld Finger obtains the second plank；Step 3：NiPdAu：NiPdAu surface treatment is carried out to third plank plate surface, obtains third plank；Step 4：Plank post-processing：Post-processing is carried out to third plank, obtains sheet forming.
- 2. a kind of grading connecting finger optic module PCB plate surface treatment method as described in claim 1, which is characterized in that described " step 1：Plank preparation " includes following sub-step：1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is added Initial plank needed for work；1.2：Internal layer circuit is made on initial plank and is examined；1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank after hot pressing and carries out coated with copper foil Increasing layer；1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film pattern transfer is arrived On initial plank, the figure of needs is processed, obtains the first plank.
- 3. a kind of grading connecting finger optic module PCB plate surface treatment method as described in claim 1, which is characterized in that described " step 4：Plank preparation " includes following sub-step：4.1：Molding：By third plate cutting into the shape of customer requirement；4.2：Test：Open circuit short-circuit test is done to the third plank after excision forming；
- A kind of 4. grading connecting finger optic module PCB plate surface treatment method as described in claim 1, which is characterized in that design When be subject to plate thickness at golden finger and carry out substrate and fold structure design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484719.7A CN108207085A (en) | 2017-12-29 | 2017-12-29 | A kind of grading connecting finger optic module PCB plate surface treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484719.7A CN108207085A (en) | 2017-12-29 | 2017-12-29 | A kind of grading connecting finger optic module PCB plate surface treatment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108207085A true CN108207085A (en) | 2018-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711484719.7A Pending CN108207085A (en) | 2017-12-29 | 2017-12-29 | A kind of grading connecting finger optic module PCB plate surface treatment method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062523A (en) * | 2019-04-04 | 2019-07-26 | 广州兴森快捷电路科技有限公司 | Golden finger and preparation method thereof, circuit board and preparation method thereof |
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN113838761A (en) * | 2021-11-24 | 2021-12-24 | 新恒汇电子股份有限公司 | Preparation method of industrial card of Internet of things |
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| US20130168132A1 (en) * | 2011-12-29 | 2013-07-04 | Sumsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| CN105451454A (en) * | 2015-12-14 | 2016-03-30 | 谢兴龙 | Fabrication method of gold-plated finger board |
| CN206164982U (en) * | 2016-09-30 | 2017-05-10 | 武汉光谷创元电子有限公司 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
| JP2017120395A (en) * | 2015-12-25 | 2017-07-06 | 株式会社タムラ製作所 | Photosensitive resin composition |
| CN106993378A (en) * | 2017-05-04 | 2017-07-28 | 东莞联桥电子有限公司 | A kind of pcb board selective surface handling process |
-
2017
- 2017-12-29 CN CN201711484719.7A patent/CN108207085A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130168132A1 (en) * | 2011-12-29 | 2013-07-04 | Sumsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| CN105451454A (en) * | 2015-12-14 | 2016-03-30 | 谢兴龙 | Fabrication method of gold-plated finger board |
| JP2017120395A (en) * | 2015-12-25 | 2017-07-06 | 株式会社タムラ製作所 | Photosensitive resin composition |
| CN206164982U (en) * | 2016-09-30 | 2017-05-10 | 武汉光谷创元电子有限公司 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
| CN106993378A (en) * | 2017-05-04 | 2017-07-28 | 东莞联桥电子有限公司 | A kind of pcb board selective surface handling process |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062523A (en) * | 2019-04-04 | 2019-07-26 | 广州兴森快捷电路科技有限公司 | Golden finger and preparation method thereof, circuit board and preparation method thereof |
| WO2020199499A1 (en) * | 2019-04-04 | 2020-10-08 | 广州兴森快捷电路科技有限公司 | Gold finger and manufacturing method therefor and circuit board and manufacturing method therefor |
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN110687642B (en) * | 2019-09-26 | 2021-10-01 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN113838761A (en) * | 2021-11-24 | 2021-12-24 | 新恒汇电子股份有限公司 | Preparation method of industrial card of Internet of things |
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Application publication date: 20180626 |
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