CN109451665B - Manufacturing process of photoelectric plate - Google Patents
Manufacturing process of photoelectric plate Download PDFInfo
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- CN109451665B CN109451665B CN201811330496.3A CN201811330496A CN109451665B CN 109451665 B CN109451665 B CN 109451665B CN 201811330496 A CN201811330496 A CN 201811330496A CN 109451665 B CN109451665 B CN 109451665B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
A process for preparing photoelectric plate includes cutting raw copper plate into needed size, then removing water vapor and organic volatile matters through baking, performing edge grinding and fillet treatment through mechanical polishing, then performing inner layer graph, carrying out plate grinding treatment on the plate obtained by mechanical grinding through pretreatment and microetching coarsened copper surface, wherein the plate grinding mode is the traditional sand blasting, plate grinding drying, dry film pasting, contraposition exposure by ultraviolet rays, weak base development, etching, film stripping and other operations to finish circuit image transfer, can realize the effect of strictly controlling the expansion and contraction coefficient of the material, control the deviation of image transfer in an extremely low range, greatly improve the line image transfer contraposition precision, therefore, a solid foundation is provided for smooth proceeding of subsequent processing procedures, unnecessary cost payment in the production process is reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the field of PCB (printed circuit board) manufacturing processes, in particular to a manufacturing process of a photoelectric board.
Background
The electro-optical panel refers to a PCB used for LCD and the like, and the requirement for size is very strict. The design has a row of golden fingers on the photoelectricity board, and its region runs through whole PCB length, owing to need with conducting resin and soft board laminating when the equipment, it is very high to the counterpoint precision of every golden finger many requirements in the laminating process, in case slightly misplace will cause functional bad, consequently to the position of every golden finger, the requirement of whole PCB's length direction dimensional stability is very high promptly.
The manufacturing process of the photoelectric plate mainly has the processing difficulties of image circuits, solder prevention, mechanical processing, surface treatment, chemical gold processing and the like of the photoelectric plate, and is very puzzled in the PCB factory industry.
The difficult problem of the photoelectric plate image circuit is particularly outstanding, in the process, the control of the expansion and contraction coefficient of the material is particularly important, the image transfer of the photoelectric plate is deviated due to the fact that the image transfer alignment precision of the traditional circuit is generally controlled within 0.075mm-0.05mm, and the expansion and contraction coefficient of the material is not well controlled, so that the quality of the photoelectric plate is separated from the manufacturing standard, the subsequent processing process is useless to a great extent, the production cost is increased, and the production efficiency is reduced.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to provide a manufacturing process of a photoelectric plate, which can realize the effect of strictly controlling the expansion and contraction coefficient of a material, control the deviation of image transfer within an extremely low range and greatly improve the line image transfer alignment precision, thereby providing a solid foundation for the smooth operation of subsequent processing procedures, reducing unnecessary cost in the production process and improving the production efficiency.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A manufacturing process of a photoelectric plate comprises the following steps:
cutting an original copper clad laminate into required sizes, then removing water vapor and organic volatile matters through baking, and then performing edge grinding and fillet treatment through mechanical polishing;
step two, inner layer graph, the board grinding treatment is carried out on the board obtained in the step one through pretreatment micro-etching coarsening copper surface, the board grinding mode is traditional sand blasting, the board grinding is dried, a dry film is pasted, the ultraviolet ray is used for contraposition exposure, and then weak base developing, etching, film removing and other operations are carried out to complete the circuit image transfer;
step three, performing browning and blackening treatment on the plate obtained in the step two to form a browning plate;
opening a PP sheet (prepreg), laminating, typesetting and pressing, and laminating and riveting the brown oxidation plate obtained in the step three, the PP sheet and the inner layer plate to obtain a spliced plate;
drilling to form a channel with conductive performance between the connection circuit layers, and fully releasing moisture and humidity between the copper foil and the PP sheet of the sheet by using a high-temperature oven before the process;
depositing copper, namely depositing a layer of metal copper with uniform thickness on the insulated hole wall and the copper surface of the plate to provide a certain metal electroplating conducting layer for the subsequent process;
step seven, pattern electroplating, namely electroplating a copper layer with the thickness required by a thin copper area on the whole board surface of the PCB, and etching to obtain a circuit pattern;
step eight, resistance welding, namely printing characters on the layout by using a silk-screen printing technology, wherein a 36 straight-pull screen plate is used for silk-screen gauze printed by silk screen printing;
step nine, surface treatment is carried out on gold, before the gold is fed, AOI is used for scanning the quality condition of the board surface, and production is carried out after the qualified product is confirmed;
step ten, routing boards, namely cutting the jointed boards into finished circuit boards with the required size by using a board routing machine, wherein in the step, a board routing program is set to be a homeopathic board routing program, the number of stacked boards is 3pnl, each stacked board is routed, and the board routing parameters are reduced by 30% on the basis of the original parameters of board routing rotating speed, cutter setting, cutter lifting speed and row cutting speed;
and eleventh, carrying out final inspection, and finally packaging and delivering out of the warehouse.
Furthermore, before the photoelectric plate is produced, the film coefficients are ensured to be consistent with those of the plate, and the film coefficients of the two surfaces are the same.
Furthermore, the thickness of the copper metal deposited in the sixth step is about 0.3-0.7 microns, so that the pore wall of the subsequent process can be kept intact.
Furthermore, the plate grinding mode of the pretreatment in the second step can be emery blasting.
Further, the expansion and contraction coefficient of the dry film in the second step is reduced by 50% in the original basic tolerance range, the dry film production is subsequently confirmed by the current advanced online scanning, and when the tolerance range of the expansion and contraction coefficient of the dry film is not reduced to 50%, the dry film is not in accordance with the standard, and the appropriate dry film is replaced.
Further, the 36 straight-pulled screen in the eighth step can also be an inclined-pulling screen of a specially-made screen 41T, so that the oil dropping amount of the printing ink is more uniform.
Further, the data coefficient of the etched real object plate is measured by using a quadratic element before alignment in the second step, the coefficient of the alignment film is adjusted to be the same as that of the real object plate according to the actual data of the real object plate, the alignment is produced by using a CCD automatic exposure machine, and the automatic exposure alignment precision is adjusted to be within 2mil (0.05 mm).
Further, the dry film, namely the dry bun photoresist, is a water-soluble resistance agent film layer, the thickness of the dry film is 1.5mil, the exposed dry film can not be dissolved when meeting weak base and can be dissolved when meeting strong base, the unexposed dry film can be dissolved when meeting weak base, and the characteristic of the dry film is utilized to facilitate the pattern transfer to the copper surface.
Furthermore, the thickness of the ink for silk-screen printing in the step eight is controlled to be 10-20 microns, and is thinner than the thickness of the ink in the general industry, so that the welding deviation prevention degree is smaller.
Furthermore, the cutting edge of the gong knife for gong board is changed from a double-edge cutting edge into a single-edge cutting edge, so that the forming tolerance of gong board can be reduced, and the quality of formed gong board can be improved.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme can realize the effect of strictly controlling the expansion and contraction coefficient of the material, controls the deviation of image transfer in an extremely low range, and greatly improves the line image transfer alignment precision, thereby providing a solid foundation for the smooth proceeding of subsequent processing procedures, reducing the unnecessary cost payment in the production process and improving the production efficiency.
(2) Before the photoelectric plate is produced, the film coefficients are ensured to be consistent with the plate, and the film coefficients of the two surfaces are the same.
(3) The thickness of the metal copper deposited in the sixth step is about 0.3-0.7 microns, so that the pore wall of the subsequent process can be kept complete.
(4) The plate grinding mode of the pretreatment in the second step can also be diamond sand spraying.
(5) And in the second step, the expansion and contraction coefficient of the dry film is reduced by 50% in the original basic tolerance range, the current advanced online scanning is used for confirming the subsequent production of the dry film, and when the tolerance range of the expansion and contraction coefficient of the dry film is not reduced to 50%, the dry film is not in accordance with the standard, and the proper dry film is replaced.
(6) The 36 straight-pulled screen printing plate in the step eight can also be an inclined screen printing plate of a special screen printing plate 41T, so that the oil feeding amount of the printing ink is more uniform.
(7) And secondly, measuring the data coefficient of the etched real object plate by using a quadratic element before alignment, adjusting the coefficient of the alignment film to be the same as that of the real object plate according to the actual data of the real object plate, performing alignment by using a CCD (charge coupled device) automatic exposure machine, and adjusting the setting of automatic exposure alignment precision to be within 2mil (0.05 mm).
(8) The dry film, namely the dry steamed bun photoresist, is called a water-soluble resistance agent film layer for short, the thickness of the dry film is 1.5mil, the exposed dry film can not be dissolved when meeting weak base and can be dissolved when meeting strong base, the unexposed dry film can be dissolved when meeting weak base, and the characteristic of the dry film is utilized to facilitate the transfer of the pattern to a copper surface.
(9) And the thickness of the ink printed by silk screen printing in the step eight is controlled to be 10-20 microns, and is thinner than the thickness of the ink in the general industry, so that the welding deviation prevention degree is smaller.
(10) The cutting edge of the gong knife for gong board is changed from a double-edge cutting edge into a single-edge cutting edge, so that the forming tolerance of gong board can be reduced, and the quality of formed gong board is improved.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a table showing the data collection of the expansion and contraction coefficients of the PCB at different temperatures in the high temperature oven of the present invention.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, a process for fabricating a photovoltaic panel includes the following steps:
cutting an original copper clad laminate into required sizes, then removing water vapor and organic volatile matters through baking, and then performing edge grinding and fillet treatment through mechanical polishing;
step two, inner layer graph, the board grinding treatment is carried out on the board obtained in the step one through pretreatment micro-etching coarsening copper surface, the board grinding mode is traditional sand blasting, the board grinding is dried, a dry film is pasted, the ultraviolet ray is used for contraposition exposure, and then weak base developing, etching, film removing and other operations are carried out to complete the circuit image transfer;
step three, performing browning and blackening treatment on the plate obtained in the step two to form a browning plate;
opening a PP sheet (prepreg), laminating, typesetting and pressing, and laminating and riveting the brown oxidation plate obtained in the step three, the PP sheet and the inner layer plate to obtain a spliced plate;
step five, drilling to form a channel for connecting the electrical conductivity between circuit layers, wherein before the working procedure, a plate material uses a high-temperature oven to fully release moisture and humidity between a copper foil and a PP sheet of the plate material, so that the expansion and shrinkage offset of the material is smaller, Chinese patent No. CN105307397A discloses a circuit board exposure method and a device, and provides a method for calculating the expansion and shrinkage offset. Specifically, the distance between the lower left corner target and the lower right corner target is defined as X1, the distance between the upper left corner target and the upper right corner target is defined as X2, the distance between the lower left corner target and the upper left corner target is defined as Y1, the distance between the lower right corner target and the upper right corner target is defined as Y2, the actual size of the PCB is ((X1+ X2)/2, (Y1+ Y2)/2), the expansion and contraction coefficient of the PCB is calculated by using the actual size and the actual size of the PCB, the standard size of the PCB is defined as (X0, Y0), the expansion and contraction coefficient is defined as (X, Y), and the calculation is specifically performed according to the following operational formula: x ═ ((X1+ X2)/2) -X0)/X0, Y ═ ((Y1+ Y2)/2-Y0)/Y0, it should be noted that, the size of the PCB boards of different types may be calculated differently, but the actual size is calculated in the same principle as the standard size, that is, the actual size is calculated according to the actual physical parameters of the PCB boards, the standard size is calculated according to the theoretical standard parameters of the PCB boards, and the coefficient of expansion and contraction is the ratio obtained by dividing the difference between the actual size and the standard size by the standard size;
referring to fig. 2, at different temperatures of the high temperature oven, the difference between each temperature gradient is 0.5 ℃, the expansion and contraction coefficients corresponding to the different temperatures are calculated according to the above method, the obtained data is filled into the table of fig. 2 every time a group of data is obtained, the translation table corresponding to each object in the expansion and contraction coefficient set and the expansion and contraction coefficient set is preset, a worker compares the obtained multiple groups of expansion and contraction coefficients at different temperatures with the data in the preset translation table according to a large amount of data obtained by experiments on the PCB of the type to obtain a group of data with the minimum translation amount, and then the temperature of the high temperature oven is adjusted to the temperature value corresponding to the data, so that the expansion and contraction offset between the materials can be controlled in an extremely low range;
depositing copper, namely depositing a layer of metal copper with uniform thickness on the insulated hole wall and the copper surface of the plate to provide a certain metal electroplating conducting layer for the subsequent process;
step seven, pattern electroplating, namely electroplating a copper layer with the thickness required by a thin copper area on the whole board surface of the PCB, and etching to obtain a circuit pattern;
step eight, resistance welding, namely printing characters on the layout by using a silk-screen printing technology, wherein a 36 straight-pull screen plate is used for silk-screen gauze printed by silk screen printing;
step nine, surface treatment of gold, before coming, AOI is used for scanning the quality condition of the board surface, production is carried out after the qualified condition is confirmed, the process comprises nickel deposition, before nickel deposition, nickel deposition pretreatment is enhanced, the PH value is adjusted, whether an automatic control device fails or not is checked, the automatic control device is checked, the concentrations of palladium ions and sulfuric acid in an activation cylinder are adjusted, activation treatment parameters (such as the concentration of an activation solution and treatment parameters) are changed, the washing time is shortened, the washing flow is enhanced, the tin stripping process is improved, residual films on the copper surface are reduced, the cylinder is changed, impurity sources are eliminated, an automatic replenishment device is checked, the load is increased, and the reaction activity is increased
Step ten, routing boards, namely cutting the jointed boards into finished circuit boards with the required size by using a board routing machine, wherein in the step, a board routing program is set to be a homeopathic board routing program, the number of stacked boards is 3pnl, each stacked board is routed, and the board routing parameters are reduced by 30% on the basis of the original parameters of board routing rotating speed, cutter setting, cutter lifting speed and row cutting speed;
and eleventh, carrying out final inspection, and finally packaging and delivering out of the warehouse.
Before the production of the photoelectric plate, film coefficients are ensured to be consistent with the plate, the film coefficients of two surfaces are the same, the thickness of the metal copper deposited in the step six is about 0.3-0.7 micrometer, the hole wall of a subsequent process can be kept complete, the grinding mode of pretreatment in the step two can be sprayed with emery, the expansion and contraction coefficient of the dry film in the step two is reduced by 50% in the original basic tolerance range, the current advanced online scanning is used for confirming the subsequent production of the dry film, when the tolerance range of the expansion and contraction coefficient of the dry film is not reduced to 50%, the dry film is proved to be not in accordance with the standard, a proper dry film is replaced, the 36 straight-pulled screen in the step eight can also be an inclined-pulled screen of a specially-made screen 41T, so that the oil quantity under the printing ink is more uniform, the data coefficient of the etched real object plate is measured by using a second time element before the alignment in the step two, the coefficient of the alignment film is adjusted to be the same as the coefficient of, the counterpoint is produced by using a CCD automatic exposure machine in the prior art, the automatic exposure counterpoint accuracy is set and adjusted to be within 2mil (0.05mm), a dry film, namely a dry bun photoresist, is a water-soluble resistance agent film layer, the thickness of the dry film is 1.5mil, the exposed dry film cannot be dissolved when meeting weak base and can be dissolved when meeting strong base, the unexposed dry film can be dissolved when meeting weak base, the pattern is convenient to transfer to a copper surface by utilizing the characteristic of the dry film, the thickness of the ink printed by silk printing in the step eight is controlled to be between 10 and 20 micrometers, the thickness of the ink is thinner than that of the ink in the general industry, the solder-proof deviation degree is smaller, the forming tolerance of the gong board can be reduced by changing a double-edge knife edge into a single-edge knife edge, the quality of the gong board can be improved, the effect of strictly controlling the expansion and contraction coefficient of the material can be realized, the deviation of image transfer is controlled in an extremely low range, and the line image transfer, therefore, a solid foundation is provided for smooth proceeding of subsequent processing procedures, unnecessary cost payment in the production process is reduced, and the production efficiency is improved.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (6)
1. A manufacturing process of a photoelectric plate is characterized by comprising the following steps: the method comprises the following steps:
cutting an original copper clad laminate into required sizes, then removing water vapor and organic volatile matters through baking, and then performing edge grinding and fillet treatment through mechanical polishing;
step two, inner layer graph, the board grinding treatment is carried out on the board obtained in the step one through pretreatment micro-etching coarsening copper surface, the board grinding mode is traditional sand blasting, the board grinding is dried, a dry film is pasted, the ultraviolet ray is used for contraposition exposure, and then weak base developing, etching, film removing and other operations are carried out to complete the circuit image transfer; the expansion and contraction coefficient of the dry film is reduced by 50% in the original basic tolerance range, the dry film production is subsequently confirmed by advanced online scanning at present, the data coefficient of the etched real object plate is measured by using a quadratic element before alignment, the coefficients of the alignment film and the real object plate are adjusted to be the same according to the actual data of the real object plate, the alignment is produced by using a CCD automatic exposure machine, and the automatic exposure alignment precision is set and adjusted to be within 2 mil;
step three, performing browning and blackening treatment on the plate obtained in the step two to form a browning plate;
opening a PP sheet (prepreg), laminating, typesetting and pressing, and laminating and riveting the brown oxidation plate obtained in the step three, the PP sheet and the inner layer plate to obtain a spliced plate;
drilling to form a channel for connecting the circuit layers and the conductive performance, wherein before the process, the plate uses a high-temperature oven to fully release the moisture and humidity between the copper foil and the PP sheet of the plate, the difference between each temperature gradient is 0.5 ℃ at different temperatures of the high-temperature oven, the corresponding expansion and contraction coefficients at different temperatures are calculated, the translation tables corresponding to each object in the expansion and contraction coefficient set and the expansion and contraction coefficient set are preset, a worker compares the obtained expansion and contraction coefficients at different temperatures with the data in the preset translation tables according to a large amount of data obtained by experiments on the PCB to obtain a group of data with the minimum translation quantity, and then the temperature of the high-temperature oven is adjusted to the temperature value corresponding to the data, so that the expansion and contraction offset between the materials can be controlled in an extremely low range;
depositing copper, namely depositing a layer of metal copper with uniform thickness on the insulated hole wall and the copper surface of the plate to provide a certain metal electroplating conducting layer for the subsequent process; the thickness of the metal copper deposited in the sixth step is 0.3-0.7 micron;
step seven, pattern electroplating, namely electroplating a copper layer with the thickness required by a thin copper area on the whole board surface of the PCB, and etching to obtain a circuit pattern;
step eight, resistance welding, namely printing characters on the layout by using a silk-screen printing technology, wherein a 36 straight-pull screen plate is used for silk-screen gauze printed by silk screen printing; the thickness of the ink printed by silk-screen printing in the step eight is controlled to be 10-20 microns;
step nine, surface treatment is carried out on gold, before the gold is fed, AOI is used for scanning the quality condition of the board surface, and production is carried out after the qualified product is confirmed;
step ten, routing boards, namely cutting the jointed boards into finished circuit boards with the required size by using a routing board machine, wherein in the step, a routing program is set to be a gesture routing program, the number of routing board stacks is 3pnl, each routing board stack is formed, routing board parameters are reduced by 30% on the basis of routing board rotating speed, cutter feeding speed, cutter lifting speed and row cutting speed of original parameters;
and eleventh, carrying out final inspection, and finally packaging and delivering out of the warehouse.
2. A process for manufacturing a photovoltaic panel according to claim 1, characterized in that: before the photoelectric plate is produced, film coefficients are ensured to be consistent with those of the plate, and the film coefficients of the two surfaces are the same.
3. A process for manufacturing a photovoltaic panel according to claim 1, characterized in that: the plate grinding mode of the pretreatment in the second step can also be emery blasting.
4. A process for manufacturing a photovoltaic panel according to claim 1, characterized in that: the 36 straight-pulled screen in the step eight can also be a slant-pull screen of the special screen 41T.
5. A process for manufacturing a photovoltaic panel according to claim 1, characterized in that: the dry film, a short name for dry-baked-bun photoresist, is a water-soluble resist film layer with a thickness of 1.5 mil.
6. A process for manufacturing a photovoltaic panel according to claim 1, characterized in that: the cutting edge of the milling cutter for milling boards is changed from a double-edge cutting edge into a single-edge cutting edge.
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| CN110113878B (en) * | 2019-06-11 | 2020-04-17 | 杭州鹏润电子有限公司 | Multilayer circuit board processing technology and equipment |
| CN110572959B (en) * | 2019-07-31 | 2021-11-02 | 珠海精毅电路有限公司 | Production process of high-voltage-resistant power panel |
| CN111315134B (en) * | 2019-12-19 | 2021-10-19 | 黄石星河电路有限公司 | Production process of high-precision photoelectric printed circuit board |
| CN111148352A (en) * | 2019-12-25 | 2020-05-12 | 安徽中瑞通信科技股份有限公司 | Manufacturing process of PCB for 5G antenna |
| CN116916559A (en) * | 2020-04-16 | 2023-10-20 | 惠州市科迪盛科技有限公司 | Manufacturing method of multilayer printed circuit board |
| CN111465198B (en) * | 2020-05-26 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN112533361A (en) * | 2020-12-15 | 2021-03-19 | 深圳市瀚鼎电路电子有限公司 | Manufacturing method of circuit board with electromagnetic shielding structure |
| CN113408238A (en) * | 2021-05-25 | 2021-09-17 | 奥士康科技股份有限公司 | Method for determining optimal alignment value of anti-welding 8-point CCD |
| CN113873776A (en) * | 2021-09-08 | 2021-12-31 | 江苏博敏电子有限公司 | Printed circuit board manufacturing method based on selective gold processing technology |
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| JPH047890A (en) * | 1990-04-25 | 1992-01-13 | Fujitsu Ltd | Pretreatment method for ceramic substrate |
| JP2005183690A (en) * | 2003-12-19 | 2005-07-07 | Murata Mfg Co Ltd | Method for manufacturing ceramic substrate |
| CN101389189B (en) * | 2007-09-10 | 2010-10-20 | 南亚电路板股份有限公司 | Circuit board producing method |
| CN104968151B (en) * | 2015-07-03 | 2017-12-15 | 景旺电子科技(龙川)有限公司 | A kind of preparation method for carving cup copper base |
| CN105307397B (en) * | 2015-09-16 | 2018-12-07 | 广州美维电子有限公司 | A kind of circuit board exposure method and device |
| CN108391379A (en) * | 2018-04-11 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of high density PCB metal hemming edge manufacture craft |
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Denomination of invention: A Manufacturing Process for Photovoltaic Panels Effective date of registration: 20230714 Granted publication date: 20210706 Pledgee: China Co. truction Bank Corp Boluo branch Pledgor: BOLUO KONKA EXACTITUDE SCIENCE TECHNOLOGY Co.,Ltd. Registration number: Y2023980048521 |