CN109451665A - A kind of manufacture craft of electro-optical package - Google Patents
A kind of manufacture craft of electro-optical package Download PDFInfo
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- CN109451665A CN109451665A CN201811330496.3A CN201811330496A CN109451665A CN 109451665 A CN109451665 A CN 109451665A CN 201811330496 A CN201811330496 A CN 201811330496A CN 109451665 A CN109451665 A CN 109451665A
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- plate
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- optical package
- film
- manufacture craft
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A kind of manufacture craft of electro-optical package, including sawing sheet, original copper clad plate is cut into required size, then pass through baking removal steam and organic volatile, the processing of edging fillet is carried out by mechanical grinding again, then inner figure is carried out, copper face is roughened by pre-treatment microetch to the plate that mechanical grinding obtains and carries out nog plate processing, nog plate mode is traditional sandblasting, nog plate is dry, stick the dry film film, it is aligned and is exposed with ultraviolet light, weak base develops again, etching, move back the operation such as film, complete circuit image transfer, the effect of the harmomegathus coefficient of strict control of material itself may be implemented, the deviation of image transfer is controlled in extremely low range, circuit image transfer aligning accuracy is greatly improved, to provide solid foundation for going on smoothly for subsequent processing operations, unnecessary cost in production process is reduced to pay, it mentions High efficiency.
Description
Technical field
The present invention relates to pcb board manufacture craft fields, more specifically to a kind of manufacture craft of electro-optical package.
Background technique
Electro-optical package refers to the PCB for purposes such as LCD, and the requirement for size is very strict.Design has one on electro-optical package
Golden finger is arranged, entire PCB length is run through in region, due to that need to be bonded with conducting resinl and soft board in assembling, is being bonded
The aligning accuracy of each golden finger is required more in journey it is very high, once slightly dislocation will result in it is functional bad, therefore for
The requirement of the position of each golden finger, i.e., the lengthwise dimension stability of entire PCB is very high.
Electro-optical package image line, anti-welding, machining, surface treatmentization gold are primarily present in the manufacture craft of electro-optical package
Etc. techniques process problem, perplex very much in PCB factory industry thus.
Especially this problem of electro-optical package image line, it is especially prominent, in this procedure, the harmomegathus coefficient of material itself
Control it is particularly important, traditional circuit image shift aligning accuracy general control within 0.075mm-0.05mm, material rises
Contracting coefficient is not controlled, and the image of electro-optical package can be made to shift and deviation occur, so that the quality of electro-optical package is detached from production standard, can lead
Causing subsequent processing operations is largely to flog a dead horse, and increases production cost, reduces production efficiency.
Summary of the invention
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a kind of manufacture craft of electro-optical package, it
The effect that the harmomegathus coefficient of strict control of material itself may be implemented controls the deviation of image transfer in extremely low range,
Circuit image transfer aligning accuracy is greatly improved, to provide solid base for going on smoothly for subsequent processing operations
Plinth reduces unnecessary cost in production process and pays, improves production efficiency.
2. technical solution
To solve the above problems, the present invention adopts the following technical scheme that.
A kind of manufacture craft of electro-optical package, comprising the following steps:
Step 1: sawing sheet, is cut into required size for original copper clad plate, then by baking removal steam and
Organic volatile, then the processing of edging fillet is carried out by mechanical grinding；
Step 2: inner figure, is roughened copper face by pre-treatment microetch to plate obtained in step 1 and carries out at nog plate
Reason, nog plate mode are traditional sandblasting, and nog plate is dry, sticks the dry film film, are aligned and are exposed with ultraviolet light, then weak base development, erosion
It the operation such as carves, move back film, complete circuit image transfer；
Step 3: carrying out brownification and Darkening process to the plate that step 2 obtains, brownification plate is formed；
Step 4: open PP piece (prepreg), then by lamination, typesetting, pressing, the brownification plate that step 3 is obtained with
PP piece and inner plating carry out lamination riveted, obtain jigsaw；
Step 5: drilling, forms the channel of the electric conductivity between connection line layer, before carrying out this process, plate makes
With high temperature ovens by between plate copper foil and PP piece moisture and humidity sufficiently discharge；
Step 6: heavy copper deposits the uniform metallic copper of a thickness on the hole wall and plate copper face of insulation, it is rear process
Certain metal plating conductting layer is provided；
Step 7: graphic plating, in the layers of copper of the whole plate face plating thin copper area required thickness of PCB, then etches, obtains line
Road figure；
Step 8: welding resistance, while print character, the silk-screen grenadine of silk-screen printing use on the space of a whole page with silk-screen printing technology
The halftone of 36 vertical pullings；
Step 9: surface treatmentization is golden, using the quality status of AOI scanning plate face before supplied materials, carried out again after confirmation is qualified
Production；
Step 10: jigsaw, the shape finished product wiring board of required size is cut into using gong trigger, in this step by gong plate
In, setting gong plate gong plate program is gong plate program of taking advantage of a situation, and the folded number of gong plate is that 3pnl is often folded, and gong board parameter turns in original parameter gong plate
Speed is cut, cutter lifting speed, declines 30% on the basis of row cutting speed degree；
Step 11: first carrying out final inspection, outbound is finally packed.
Further, before the electro-optical package production, it is ensured that film coefficient is consistent with plate, and two sides film coefficient is identical.
Further, the metal copper thickness deposited in the step 6 is about 0.3-0.7 microns, can make subsequent handling
Hole wall keeps complete.
Further, the nog plate mode of pre-treatment can also be metal spraying emery in the step 2.
Further, the dry film film harmomegathus coefficient in the step 2 declines 50% in the original basis margin of tolerance, dry film
The currently advanced online scanning of subsequent use is produced to confirm, when the margin of tolerance of dry film film harmomegathus coefficient does not drop to 50%,
Then illustrate that the dry film film is not inconsistent standardization, replaces the suitable dry film film.
Further, the halftone of 36 vertical pullings in the step 8 is also possible to the oblique pull net of special halftone 41T, makes ink
Lower oil mass is more uniform.
Further, the plate data coefficient in kind after being etched before being aligned in the step 2 using Quadratic Finite Element measurement, according to
The real data of plate in kind is adjusted that alignment film is identical as the coefficient of plate in kind, and contraposition is produced using CCD automatic exposure machine,
The setting of automatic exposure aligning accuracy is adjusted within 2mil (0.05mm).
Further, the dry film, that is, dry steamed bun photoresist abbreviation is water-soluble resist film layer, with a thickness of
1.5mil, the dry film after exposure, meeting weak base cannot dissolve, and meeting highly basic can dissolve, and unexposed dry film, which meets weak base, to be dissolved, benefit
Facilitated in pattern transfer to copper face with the characteristic of dry film.
Further, the ink thickness that silk-screen prints in the step 8 controls between 10-20 microns, than general industry
Interior ink thickness is thin, keeps anti-welding drift rate smaller.
Further, the gong plate is changed to the single-blade edge of a knife by the twolip edge of a knife with the blade of gong knife, can reduce gong plate at
Type tolerance improves the quality of molding gong plate.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
(1) effect of the harmomegathus coefficient of strict control of material itself may be implemented in this programme, the deviation control that image is shifted
System in extremely low range, be greatly improved circuit image transfer aligning accuracy, thus for subsequent processing operations it is smooth into
Row provides solid foundation, reduces unnecessary cost in production process and pays, improves production efficiency.
(2) before electro-optical package production, it is ensured that film coefficient is consistent with plate, and two sides film coefficient is identical.
(3) the metal copper thickness deposited in step 6 is about 0.3-0.7 microns, and the hole wall of subsequent handling can be made to have kept
It is whole.
(4) the nog plate mode of pre-treatment can also be metal spraying emery in step 2.
(5) the dry film film harmomegathus coefficient in step 2 declines 50% in the original basis margin of tolerance, and dry film production is subsequent to be made
Confirmed with currently advanced online scanning, when the margin of tolerance of dry film film harmomegathus coefficient does not drop to 50%, then illustrates that this is dry
The film film is not inconsistent standardization, replaces the suitable dry film film.
(6) halftone of 36 vertical pullings in step 8 is also possible to the oblique pull net of special halftone 41T, makes under ink oil mass more
Uniformly.
(7) using the plate data coefficient in kind after Quadratic Finite Element measurement etching before being aligned in step 2, according to the reality of plate in kind
Border data are adjusted that alignment film is identical as the coefficient of plate in kind, and contraposition is produced using CCD automatic exposure machine, by automatic exposure
Aligning accuracy setting is adjusted within 2mil (0.05mm).
(8) dry film, that is, dry steamed bun photoresist abbreviation is water-soluble resist film layer, with a thickness of 1.5mil, after exposure
Dry film, meeting weak base cannot dissolve, and meeting highly basic can dissolve, and unexposed dry film, which meets weak base, to be dissolved, and utilize the spy of dry film
Property facilitates in pattern transfer to copper face.
(9) ink thickness that silk-screen prints in step 8 controls between 10-20 microns, than ink thickness in general industry
It is thin, keep anti-welding drift rate smaller.
(10) gong plate is changed to the single-blade edge of a knife by the twolip edge of a knife with the blade of gong knife, can reduce the molding tolerance of gong plate, mention
The quality of height molding gong plate.
Detailed description of the invention
Fig. 1 is process flow chart of the invention；
Fig. 2 is the data acquisition tables of high temperature ovens of the invention PCB expansion coefficient at different temperatures.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention；Technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description；Obviously；Described embodiments are only a part of the embodiments of the present invention；Instead of all the embodiments, it is based on
Embodiment in the present invention；It is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment；It shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "inner", "outside", " top/bottom end "
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Be equipped with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to removable
Connection is unloaded, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements.It for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
Embodiment 1:
Referring to Fig. 1, a kind of manufacture craft of electro-optical package, a kind of manufacture craft of electro-optical package, comprising the following steps:
Step 1: sawing sheet, is cut into required size for original copper clad plate, then by baking removal steam and
Organic volatile, then the processing of edging fillet is carried out by mechanical grinding；
Step 2: inner figure, is roughened copper face by pre-treatment microetch to plate obtained in step 1 and carries out at nog plate
Reason, nog plate mode are traditional sandblasting, and nog plate is dry, sticks the dry film film, are aligned and are exposed with ultraviolet light, then weak base development, erosion
It the operation such as carves, move back film, complete circuit image transfer；
Step 3: carrying out brownification and Darkening process to the plate that step 2 obtains, brownification plate is formed；
Step 4: open PP piece (prepreg), then by lamination, typesetting, pressing, the brownification plate that step 3 is obtained with
PP piece and inner plating carry out lamination riveted, obtain jigsaw；
Step 5: drilling, forms the channel of the electric conductivity between connection line layer, before carrying out this process, plate makes
With high temperature ovens by between plate copper foil and PP piece moisture and humidity sufficiently discharge, so that material is obtained harmomegathus offset smaller, in
State Patent No. CN105307397A discloses a kind of circuit board exposure method and device, it is noted that a kind of to calculate what harmomegathus deviated
Method, below using pcb board as rectangle pcb board, and for the target on pcb board is respectively distributed on four angles, first in step
In S1, four target placements on pcb board are positioned using the optical identification element technique of counterpoint in exposure machine, are obtained
The actual size of the pcb board can be calculated after four target placements.Specifically, by lower left corner target and lower right corner target it
Between distance definition be X1, the distance between upper left corner target and upper right corner target are defined as X2, lower left corner target and the upper left corner
The distance between target is defined as Y1, and the distance between lower right corner target and upper right corner target are defined as Y2, then the reality of pcb board
Having a size of ((X1+X2)/2, (Y1+Y2)/2), the harmomegathus of the pcb board is calculated using the actual size and actual size of pcb board
Coefficient, is defined as (X0, Y0) for the standard size of pcb board, and harmomegathus coefficient is denoted as (X, Y), with specific reference to following arithmetic expression meter
Calculate: X=((X1+X2)/2)-X0)/X0, Y=((Y1+Y2)/2-Y0)/Y0, it should be noted that different types of pcb board
There may be differences for size calculation, but its actual size is identical with standard-sized Computing Principle, i.e., actual size is
According to the size that the actual physics parameter of pcb board is calculated, and standard size is calculated according to the theoretical standard parameter of pcb board
Obtained size, harmomegathus coefficient are by the difference between actual size and standard size divided by the obtained ratio of standard size；
Referring to Fig. 2,0.5 DEG C is differed between each temperature gradient, according to above-mentioned side at a temperature of high temperature ovens are different
Method calculates harmomegathus coefficient corresponding under different temperatures, often show that one group of data just inserts the data obtained in the table of Fig. 2,
Translation table corresponding to each object is preset in harmomegathus coefficient sets and harmomegathus coefficient sets, and being directed to by staff should
The pcb board of model by largely testing the data obtained, according to harmomegathus coefficient under the multiple groups different temperatures obtained with it is preset
Data are compared in translation table, obtain the smallest one group of data of translational movement, the temperature of high temperature ovens is then tuned into the data
Corresponding temperature value, so that the harmomegathus offset between material can control in extremely low range；
Step 6: heavy copper deposits the uniform metallic copper of a thickness on the hole wall and plate copper face of insulation, it is rear process
Certain metal plating conductting layer is provided；
Step 7: graphic plating, in the layers of copper of the whole plate face plating thin copper area required thickness of PCB, then etches, obtains line
Road figure；
Step 8: welding resistance, while print character, the silk-screen grenadine of silk-screen printing use on the space of a whole page with silk-screen printing technology
The halftone of 36 vertical pullings；
Step 9: surface treatmentization is golden, using the quality status of AOI scanning plate face before supplied materials, carried out again after confirmation is qualified
Production before heavy nickel, reinforces heavy nickel pre-treatment, adjusts pH value, and checks automatic control dress in this procedure including heavy nickel
It sets and whether fails, check automatic control device, adjust active cylinder palladium ion and sulfuric acid concentration, it is (such as living that change is activated parameter
Change liquid concentration and processing parameter), shorten washing time, reinforce washing flow, improves stripping tin processing procedure, reduce copper face residual film, change cylinder,
And prevent impurity source, it checks automatically supplying apparatus, increases load, to increase reactivity
Step 10: jigsaw, the shape finished product wiring board of required size is cut into using gong trigger, in this step by gong plate
In, setting gong plate gong plate program is gong plate program of taking advantage of a situation, and the folded number of gong plate is that 3pnl is often folded, and gong board parameter turns in original parameter gong plate
Speed is cut, cutter lifting speed, declines 30% on the basis of row cutting speed degree；
Step 11: first carrying out final inspection, outbound is finally packed.
Before electro-optical package production, it is ensured that film coefficient is consistent with plate, and two sides film coefficient is identical, deposits in step 6
Metal copper thickness is about 0.3-0.7 microns, the hole wall of subsequent handling can be made to keep complete, the nog plate side of pre-treatment in step 2
Formula can also be metal spraying emery, and the dry film film harmomegathus coefficient in step 2 declines 50% in the original basis margin of tolerance, and dry film is raw
Postpartum is continuous using currently advanced online scanning confirmation, when the margin of tolerance of dry film film harmomegathus coefficient does not drop to 50%, then
Illustrate that the dry film film is not inconsistent standardization, replace the suitable dry film film, the halftone of 36 vertical pullings in step 8 is also possible to spy
The oblique pull net of halftone 41T processed, keeps oil mass under ink more uniform, and the reality after Quadratic Finite Element measurement etching is used before aligning in step 2
Object plate data coefficient, is adjusted that alignment film is identical as the coefficient of plate in kind, and contraposition is used according to the real data of plate in kind
CCD automatic exposure machine production in the prior art, the setting of automatic exposure aligning accuracy is adjusted within 2mil (0.05mm), is done
Film, that is, dry steamed bun photoresist abbreviation, for water-soluble resist film layer, with a thickness of 1.5mil, dry film after exposure meets weak base
It cannot dissolve, meeting highly basic can dissolve, and unexposed dry film, which meets weak base, to be dissolved, and facilitate pattern transfer using the characteristic of dry film
Onto copper face, the ink thickness that silk-screen prints in step 8 is controlled between 10-20 microns, than ink thickness in general industry
It is thin, keep anti-welding drift rate smaller, gong plate is changed to the single-blade edge of a knife by the twolip edge of a knife with the blade of gong knife, can reduce the molding of gong plate
Tolerance improves the quality of molding gong plate, the effect of the harmomegathus coefficient of strict control of material itself may be implemented, by image transfer
Deviation controls in extremely low range, circuit image transfer aligning accuracy is greatly improved, thus for subsequent processing operations
It goes on smoothly and provides solid foundation, reduce unnecessary cost in production process and pay, improve production efficiency.
It is described above；It is merely preferred embodiments of the present invention；But scope of protection of the present invention is not limited thereto；
Anyone skilled in the art is in the technical scope disclosed by the present invention；According to the technique and scheme of the present invention and its
It improves design and is subject to equivalent substitution or change；It should be covered by the scope of protection of the present invention.
Claims (10)
1. a kind of manufacture craft of electro-optical package, it is characterised in that: the following steps are included:
Step 1: sawing sheet, is cut into required size for original copper clad plate, then by baking removal steam and organic
Volatile matter, then the processing of edging fillet is carried out by mechanical grinding；
Step 2: inner figure, is roughened copper face by pre-treatment microetch to plate obtained in step 1 and carries out nog plate processing, mill
Plate mode is traditional sandblasting, and nog plate is dry, sticks the dry film film, is aligned and is exposed with ultraviolet light, then weak base develops, etches, moves back
Circuit image transfer is completed in the operation such as film；
Step 3: carrying out brownification and Darkening process to the plate that step 2 obtains, brownification plate is formed；
Step 4: PP piece (prepreg) is opened, and then by lamination, typesetting, pressing, the brownification plate that step 3 is obtained and PP piece
And inner plating carries out lamination riveted, obtains jigsaw；
Step 5: drilling, forms the channel of the electric conductivity between connection line layer, before carrying out this process, plate uses high
Warm oven by between plate copper foil and PP piece moisture and humidity sufficiently discharge；
Step 6: heavy copper deposits the uniform metallic copper of a thickness, provides for rear process on the hole wall and plate copper face of insulation
Certain metal plating conductting layer；
Step 7: graphic plating, in the layers of copper of the whole plate face plating thin copper area required thickness of PCB, then etches, obtains line map
Shape；
Step 8: welding resistance, while print character, the silk-screen grenadine of silk-screen printing are straight using 36 on the space of a whole page with silk-screen printing technology
The halftone of drawing；
Step 9: surface treatmentization is golden, using the quality status of AOI scanning plate face before supplied materials, produced again after confirmation is qualified；
Step 10: jigsaw, the shape finished product wiring board of required size is cut into using gong trigger by gong plate, in this step, if
Setting gong plate gong plate program is to take advantage of a situation gong plate program, and the folded number of gong plate is that 3pnl is often folded, gong board parameter in original parameter gong plate revolving speed, under
Knife, cutter lifting speed decline 30% on the basis of row cutting speed degree；
Step 11: first carrying out final inspection, outbound is finally packed.
2. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: before the electro-optical package production, really
It protects film coefficient to be consistent with plate, and two sides film coefficient is identical.
3. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: the gold deposited in the step 6
Belonging to copper thickness is about 0.3-0.7 microns.
4. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: pre-treatment in the step 2
Nog plate mode can also be metal spraying emery.
5. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: the dry film in the step 2 is luxuriant and rich with fragrance
Woods harmomegathus coefficient declines 50% in the original basis margin of tolerance, and dry film production is subsequent to be confirmed using currently advanced online scanning.
6. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: 36 vertical pullings in the step 8
Halftone be also possible to the oblique pull net of special halftone 41T.
7. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: make before being aligned in the step 2
With the plate data coefficient in kind after Quadratic Finite Element measurement etching, alignment film and material object are adjusted according to the real data of plate in kind
The coefficient of plate is identical, and contraposition is produced using CCD automatic exposure machine, and the setting of automatic exposure aligning accuracy is adjusted to 2mil
Within (0.05mm).
8. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: the dry film, that is, dry steamed bun is photic anti-
The abbreviation of agent is lost, is water-soluble resist film layer, with a thickness of 1.5mil.
9. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: silk-screen prints in the step 8
Ink thickness control between 10-20 microns.
10. a kind of manufacture craft of electro-optical package according to claim 1, it is characterised in that: the knife of the gong plate gong knife
Sword is changed to the single-blade edge of a knife by the twolip edge of a knife.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811330496.3A CN109451665B (en) | 2018-11-09 | 2018-11-09 | Manufacturing process of photoelectric plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811330496.3A CN109451665B (en) | 2018-11-09 | 2018-11-09 | Manufacturing process of photoelectric plate |
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| CN109451665A true CN109451665A (en) | 2019-03-08 |
| CN109451665B CN109451665B (en) | 2021-07-06 |
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| CN110113878A (en) * | 2019-06-11 | 2019-08-09 | 杭州鹏润电子有限公司 | A kind of odt circuit board machining process and equipment |
| CN110572959A (en) * | 2019-07-31 | 2019-12-13 | 珠海精毅电路有限公司 | Production process of high-voltage-resistant power panel |
| CN111148352A (en) * | 2019-12-25 | 2020-05-12 | 安徽中瑞通信科技股份有限公司 | Manufacturing process of PCB for 5G antenna |
| CN111315134A (en) * | 2019-12-19 | 2020-06-19 | 黄石星河电路有限公司 | Production process of high-precision photoelectric printed circuit board |
| CN111405768A (en) * | 2020-04-16 | 2020-07-10 | 惠州市科迪盛科技有限公司 | Method for manufacturing multilayer printed circuit board |
| CN111465198A (en) * | 2020-05-26 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN112533361A (en) * | 2020-12-15 | 2021-03-19 | 深圳市瀚鼎电路电子有限公司 | Manufacturing method of circuit board with electromagnetic shielding structure |
| CN113408238A (en) * | 2021-05-25 | 2021-09-17 | 奥士康科技股份有限公司 | Method for determining optimal alignment value of anti-welding 8-point CCD |
| CN113873776A (en) * | 2021-09-08 | 2021-12-31 | 江苏博敏电子有限公司 | Printed circuit board manufacturing method based on selective gold processing technology |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047890A (en) * | 1990-04-25 | 1992-01-13 | Fujitsu Ltd | Pretreatment method for ceramic substrate |
| JP2005183690A (en) * | 2003-12-19 | 2005-07-07 | Murata Mfg Co Ltd | Method for manufacturing ceramic substrate |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Circuit board producing method |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| CN108391379A (en) * | 2018-04-11 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of high density PCB metal hemming edge manufacture craft |
-
2018
- 2018-11-09 CN CN201811330496.3A patent/CN109451665B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047890A (en) * | 1990-04-25 | 1992-01-13 | Fujitsu Ltd | Pretreatment method for ceramic substrate |
| JP2005183690A (en) * | 2003-12-19 | 2005-07-07 | Murata Mfg Co Ltd | Method for manufacturing ceramic substrate |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Circuit board producing method |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| CN108391379A (en) * | 2018-04-11 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of high density PCB metal hemming edge manufacture craft |
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| CN110113878A (en) * | 2019-06-11 | 2019-08-09 | 杭州鹏润电子有限公司 | A kind of odt circuit board machining process and equipment |
| CN110572959A (en) * | 2019-07-31 | 2019-12-13 | 珠海精毅电路有限公司 | Production process of high-voltage-resistant power panel |
| CN110572959B (en) * | 2019-07-31 | 2021-11-02 | 珠海精毅电路有限公司 | Production process of high-voltage-resistant power panel |
| CN111315134A (en) * | 2019-12-19 | 2020-06-19 | 黄石星河电路有限公司 | Production process of high-precision photoelectric printed circuit board |
| CN111148352A (en) * | 2019-12-25 | 2020-05-12 | 安徽中瑞通信科技股份有限公司 | Manufacturing process of PCB for 5G antenna |
| CN111405768A (en) * | 2020-04-16 | 2020-07-10 | 惠州市科迪盛科技有限公司 | Method for manufacturing multilayer printed circuit board |
| CN111465198A (en) * | 2020-05-26 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN111465198B (en) * | 2020-05-26 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN112533361A (en) * | 2020-12-15 | 2021-03-19 | 深圳市瀚鼎电路电子有限公司 | Manufacturing method of circuit board with electromagnetic shielding structure |
| CN113408238A (en) * | 2021-05-25 | 2021-09-17 | 奥士康科技股份有限公司 | Method for determining optimal alignment value of anti-welding 8-point CCD |
| CN113873776A (en) * | 2021-09-08 | 2021-12-31 | 江苏博敏电子有限公司 | Printed circuit board manufacturing method based on selective gold processing technology |
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