CN108391379A - A kind of high density PCB metal hemming edge manufacture craft - Google Patents
A kind of high density PCB metal hemming edge manufacture craft Download PDFInfo
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- CN108391379A CN108391379A CN201810318486.1A CN201810318486A CN108391379A CN 108391379 A CN108391379 A CN 108391379A CN 201810318486 A CN201810318486 A CN 201810318486A CN 108391379 A CN108391379 A CN 108391379A
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- high density
- hemming edge
- metal hemming
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to automated machine apparatus fields, and in particular to a kind of high density PCB metal hemming edge manufacture craft.What the present invention was achieved by the following technical programs：A kind of high density PCB metal hemming edge manufacture craft, including sawing sheet step, baking procedure, internal layer circuit processing step, multi-layer board pressing step, molding milling step, electric plating of whole board step, outer graphics transfer processing step, parcel plating thickening step, welding resistance step；Solder mask, identification of steps, secondary baking, anti-oxidation processing step are stamped to multiple-plate outer layer.The object of the present invention is to provide a kind of high density PCB metal hemming edge manufacture crafts, metal hemming edge processing can be carried out to the specified region of printed board, the electromagnetic radiation that digital signal, power supply generate will be told to be wrapped in printed board, avoided to outward leakage to cause EMC exceeded.
Description
Technical field
The present invention relates to automated machine apparatus fields, and in particular to a kind of high density PCB metal hemming edge making work
Skill.
Background technology
Now, with the raising of system velocity, the not only sequential, problems of Signal Integrity of high-speed digital signal is prominent
Go out, while EMC problems are also very prominent caused by the electromagnetic interference and Power Integrity that system high speed digital signal generates.
EMC is Electro Magnetic Compatibility, refers to that equipment or system meet the requirements operation not to appointing in its environment in its electromagnetic environment
What equipment generates the ability of intolerable electromagnetic interference.Therefore, EMC includes the requirement of two aspects：On the one hand refer to equipment
To the electromagnetic interference of place environment generation no more than certain limit value in normal course of operation；On the other hand refer to utensil pair
Electromagnetic interference present in the environment of place has a degree of immunity to interference, i.e. electromagnetic susceptibility.
The electromagnetic interference that high-speed digital signal generates not only results in the serious mutual interference of internal system, reduces the anti-dry of system
Ability is disturbed, while also can generate very strong electromagnetic radiation to the external space, the electromagnetic radiation of system is caused seriously to be marked more than EMC
It is accurate so that product cannot pass through EMC standard authentications.Thus in product design, metal edges are designed in printing electroplate surrounding, and
In side wrap metal, printed board internal electromagnetic radiation is avoided, ensures that product E MC certifications pass through.
Invention content
The object of the present invention is to provide a kind of high density PCB metal hemming edge manufacture crafts, can be to the specified area of printed board
Domain carries out metal hemming edge processing, and the electromagnetic radiation that digital signal, power supply generate will be told to be wrapped in printed board, avoided to leaking
Dew is to cause EMC exceeded.
The present invention above-mentioned technical purpose technical scheme is that：A kind of high density PCB metal
Bound edge manufacture craft, which is characterized in that comprise the following steps:
S01, sawing sheet step：The size that original material material is cut into setting, obtains monolithic；
S02, baking procedure：The monolithic is toasted, moisture is removed；
S03, internal layer circuit processing step：To making figure on the monolithic；
S04, monolithic optical detecting step：Optical scanner is carried out to the monolithic, it is whether consistent with design data to compare；
S05, multi-layer board press step：By multiple single press at multi-layer board；
S06, drill process：It drills on the multi-layer board；
S07, molding milling step：The edge milling subsequently wrapped up into row metal will be needed on the multi-layer board, be cut into metal packet
Border region；
S08, electric plating of whole board step：Copper facing on the hole wall in the hole being drilled on the multi-layer board；
S09, outer graphics transfer processing step：Anti- plating dry film figure is made on the multi-layer board；
S10, parcel plating thicken step：Local point diagram is carried out to the circuit pack figure on the multi-layer board to thicken；
S11, alkali etching step：Complete outer graphics, and move back film to the multi-layer board, etches, takes off tin processing；
S12, secondary optics detecting step：Optical scanner is carried out to the multi-layer board, it is whether consistent with design data to compare；
S13, welding resistance step；Solder mask is stamped to multiple-plate outer layer；
S14, identification of steps：Identifier is made to multiple-plate outer layer；
S15, secondary baking：Baking-curing solder mask；
S16, anti-oxidation processing step：One layer of antioxidation coating is made in the bond pad surface that the multi-layer board is welded；
S17, electrical measurement and forming step：Multiple-plate conductance general character is measured by break-make, subsequent milling is molded into using ruler
It is very little；
S18, final test step：Thermal shock, solderability, high pressure resistant test are carried out to multiple-plate finished product, ensure quality
Reliability.
As a preference of the present invention, in the S03 steps, specifically comprise the following steps, S031, roughening step：Pass through
The surface of the monolithic is roughened by chemical microetch；
S032, press mold step：Automatic film pressing reduces edges of boards film slag；
S033, step of exposure：Use laser imaging；
S034, development step；
S035, etching step：It is etched using vacuum etch processes.
As a preference of the present invention, in the S02 steps, the temperature of baking is matched with material glass transition temperature itself.
As a preference of the present invention, in the S05 steps, specifically comprise the following steps,
S051, brown step：The monolithic is cleaned, the surface layers of copper of the monolithic is roughened；
S052, lamination step：By multiple monolithic overlapping positioning, fixed by rivet；
S053, pressing step：Hot pressing converts polyethylene by glassy state, bonds multiple monolithics.
As a preference of the present invention, in the S06 steps, selective positioning hole first, and measure production and become harmomegathus, then
Borehole data is adjusted according to harmomegathus, promotes boring positioning precision.
As a preference of the present invention, in the S08 steps, specifically comprise the following steps,
S081, deburring step, burr and dust after clear drilling；
S082, de-smear step remove the resin glue residue in hole；
S083, heavy copper step, the thin copper of heavy last layer on hole wall；
S084, copper thickness thicken step, by plating, by copper thickness thickening >=10um in hole.
As a preference of the present invention, in the S09 steps, specifically comprise the following steps,
S091, pre-treatment：By way of physics polish-brush, the multilayer plate surface is roughened, promotes dry film and production table
The binding force in face；
S092, press mold：Automatic film pressing reduces edges of boards film slag after press mold；
S093, exposure：Use laser imaging；
S094, development：Call developer solution cleans up the dry film for not carrying out polymerisation.
As a preference of the present invention, in the S10 steps, specifically comprise the following steps,
S101, plating：10-15um is thickeied by copper thickness to the plating of the unlapped region of dry film on the multi-layer board；
It is S102, tin plating：In plating thicker region, one layer of tin layers, tin thickness >=8um is electroplated.
As a preference of the present invention, in the S11 steps, specifically comprise the following steps,
S111, film is moved back：It film liquid is moved back into protection dry film use to be etched takes off and remove；
S112, etching：Using vacuum etch processes, pool effect, etch uniformity >=98%, metal hemming edge plate is avoided to make outer
When layer, using alkali etching system liquid medicine, cooperation graphic plating can make fine rule road figure；
S113, tin is taken off：The tin layers that patterned surface plays a protective role are taken off.
In conclusion the present invention has the advantages that：
1, metal hemming edge processing is carried out to the specified region of printed board, the electromagnetic radiation packet that high-speed digital signal, power supply are generated
It is rolled in printed board, avoids EMC exceeded.
2, moisture is removed in process, and Product Precision is high.
Specific implementation mode
This specific embodiment is only explanation of the invention, is not limitation of the present invention, people in the art
Member can as needed make the present embodiment the modification of not creative contribution after reading this specification, but as long as at this
It is all protected by Patent Law in the right of invention.
Embodiment 1, above-mentioned technical purpose of the invention technical scheme is that：A kind of high density print
Making sheet metal hemming edge manufacture craft, which is characterized in that comprise the following steps:
S01, sawing sheet step：The size that original material material is cut into setting, obtains monolithic；
S02, baking procedure：The monolithic is toasted, moisture is removed；The temperature and material glass transition temperature itself of baking
Match.Plank internal stress is removed by toasting, improves the reliability of finished product.
S03, internal layer circuit processing step：To making figure on the monolithic；
Specifically, S031, roughening step：By chemical microetch, the surface of the monolithic is roughened, rises dry film and production table
The binding force in face promotes product yield,
S032, press mold step：Automatic film pressing reduces edges of boards film slag；
S033, step of exposure：Using laser imaging, Product Precision is promoted, be promoted to by ± 25um compared with traditional handicraft precision ±
5um。
S034, development step；The dry film of polymerisation will be had neither part nor lot in, is cleaned up by developer solution.
S035, etching step：It is etched using vacuum etch processes.Using vacuum etch processes, pool effect is avoided,
Etch uniformity >=98%.When internal layer circuit makes, using acid etching system liquid medicine, circuit precision is high, and etch capabilities are strong.
Then, S04, monolithic optical detecting step：To the monolithic carry out optical scanner, come compare whether with design data
Unanimously；
S05, multi-layer board press step：By multiple single press at multi-layer board；
This process, specially：
S051, brown step：The monolithic is cleaned, the surface layers of copper of the monolithic is roughened；
S052, lamination step：It by 8 hole positioning methods, is fixed by rivet, controls the coincidence between lamination different layers
Degree.
S053, pressing step：Hot pressing converts polyethylene by glassy state, bonds multiple monolithics.By specific cold
Pressure discharges the stress in finished product, places warpage when using.
S06, drill process：It drills on the multi-layer board；Specifically, selective positioning hole first, and measures production and become and rise
Contracting then adjusts borehole data according to harmomegathus, promotes boring positioning precision.
S07, molding milling step：The edge milling subsequently wrapped up into row metal will be needed on the multi-layer board, be cut into gold
Belong to bound edge region；
S08, electric plating of whole board step：Copper facing on the hole wall in the hole being drilled on the multi-layer board；Specifically, S081, unhairing
Pierce step, burr and dust after clear drilling；
S082, de-smear step remove the resin glue residue in hole, copper facing are avoided copper particle occur；
S083, heavy copper step, by the method for Chemical Exchange on the hole wall being drilled, the thin copper of heavy last layer, variation plating is same to be led
It is logical.
S084, copper thickness thicken step, and copper thickness thickening >=10um in hole is ensured the reliability of conducting by plating.
Then, S09, outer graphics transfer processing step：Anti- plating dry film figure is made on the multi-layer board；Specifically
, S091, pre-treatment：By way of physics polish-brush, the multilayer plate surface is roughened, promotes dry film and production surface
Binding force；
S092, press mold：Automatic film pressing reduces edges of boards film slag after press mold；Dry film use is directed to hachure and makes special dry film, does
Film thickness 2mil avoids folder film bad.
S093, exposure：Use laser imaging；Product Precision is promoted, be promoted to by ± 25um compared with traditional handicraft precision ±
5um。
S094, development：Call developer solution cleans up the dry film for not carrying out polymerisation.
Then, step is thickeied into S10, parcel plating：Partial points are carried out to the circuit pack figure on the multi-layer board
Figure thickeies；Specifically, S101, plating：10-15um is thickeied by copper thickness to the plating of the unlapped region of dry film on the multi-layer board；
It is S102, tin plating：In plating thicker region, one layer of tin layers, tin thickness >=8um is electroplated.
Enter S11, alkali etching step later：Complete outer graphics, and carries out moving back film, erosion to the multi-layer board
It carves, take off tin processing；Specifically, S111, moving back film：It film liquid is moved back into protection dry film use to be etched takes off and remove；S112, etching：Using
Vacuum etch processes avoid pool effect, etch uniformity >=98% from using alkali etching body when metal hemming edge plate makes outer layer
It is liquid medicine, cooperation graphic plating can make fine rule road figure；S113, tin is taken off：The tin layers that patterned surface is played a protective role
It takes off.
S12, secondary optics detecting step：To the multi-layer board carry out optical scanner, come compare whether with design data one
It causes；Defective products is avoided to circulate to lower process.
S13, welding resistance step；Solder mask is stamped to multiple-plate outer layer；Specifically, pre-treatment：By sandblasting side
Production plate surface is roughened, promotes the binding force of solder mask and copper surface by formula；Then, welding resistance is printed：In production plate table
Face prints last layer 50um thickness by silk-screen mode, and carried out by baking oven it is pre-baked, by liquid ink primary solidification.Later, it exposes
Light：Pass through pattern transfer, it would be desirable to which the ink of holding part carries out polymerisation, improves the chemical resistance of ink.Finally, it shows
Shadow：Call weak base will clean up for the ink for not carrying out polymerisation.
S14, identification of steps：Identifier is made to multiple-plate outer layer；
S15, secondary baking：Baking-curing solder mask；
Identifier is made on production surface, convenient for being used when welding and debugging.After identifier completes, toasted by baking oven
Cure solder mask.
S16, anti-oxidation processing step：It is anti-oxidation in one layer of the bond pad surface making that the multi-layer board is welded
Layer.Blowout prevention tin dry film：By way of pattern transfer, in production plate surface by way of pattern transfer, to gold surface is electroplated
It is protected, the mode of more traditional blue adhesive tape of patch greatly improves aligning accuracy, while can obtain preferable quality stabilization
Property.
S17, electrical measurement and forming step：Multiple-plate conductance general character is measured by break-make, subsequent milling, which is molded into, to be made
Use size；
S18, final test step：Thermal shock, solderability, high pressure resistant test are carried out to multiple-plate finished product, ensure quality
Reliability.
After processing is completed, the key technical indexes of metal hemming edge：Copper thickness >=25um, binding force meet 650 test-strips of IPC
Under part, 288 DEG C of drift tin impact 3 times, no layering foaming phenomena.
Claims (9)
1. a kind of high density PCB metal hemming edge manufacture craft, which is characterized in that comprise the following steps:S01, sawing sheet step：
The size that original material material is cut into setting, obtains monolithic；
S02, baking procedure：The monolithic is toasted, moisture is removed；
S03, internal layer circuit processing step：To making figure on the monolithic；
S04, monolithic optical detecting step：Optical scanner is carried out to the monolithic, it is whether consistent with design data to compare；
S05, multi-layer board press step：By multiple single press at multi-layer board；
S06, drill process：It drills on the multi-layer board；
S07, molding milling step：The edge milling subsequently wrapped up into row metal will be needed on the multi-layer board, be cut into metal packet
Border region；
S08, electric plating of whole board step：Copper facing on the hole wall in the hole being drilled on the multi-layer board；
S09, outer graphics transfer processing step：Anti- plating dry film figure is made on the multi-layer board；
S10, parcel plating thicken step：Local point diagram is carried out to the circuit pack figure on the multi-layer board to thicken；
S11, alkali etching step：Complete outer graphics, and move back film to the multi-layer board, etches, takes off tin processing；
S12, secondary optics detecting step：Optical scanner is carried out to the multi-layer board, it is whether consistent with design data to compare；
S13, welding resistance step；Solder mask is stamped to multiple-plate outer layer；
S14, identification of steps：Identifier is made to multiple-plate outer layer；
S15, secondary baking：Baking-curing solder mask；
S16, anti-oxidation processing step：One layer of antioxidation coating is made in the bond pad surface that the multi-layer board is welded；
S17, electrical measurement and forming step：Multiple-plate conductance general character is measured by break-make, subsequent milling is molded into using ruler
It is very little；
S18, final test step：Thermal shock, solderability, high pressure resistant test are carried out to multiple-plate finished product, ensure quality
Reliability.
2. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
It in S03 steps, specifically comprises the following steps, S031, roughening step：By chemical microetch, the surface of the monolithic is carried out thick
Change；
S032, press mold step：Automatic film pressing reduces edges of boards film slag；
S033, step of exposure：Use laser imaging；
S034, development step；
S035, etching step：It is etched using vacuum etch processes.
3. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
In S02 steps, the temperature of baking is matched with material glass transition temperature itself.
4. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
In S05 steps, specifically comprise the following steps,
S051, brown step：The monolithic is cleaned, the surface layers of copper of the monolithic is roughened；
S052, lamination step：By multiple monolithic overlapping positioning, fixed by rivet；
S053, pressing step：Hot pressing converts polyethylene by glassy state, bonds multiple monolithics.
5. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
In S06 steps, selective positioning hole first, and measure production and become harmomegathus, borehole data is then adjusted according to harmomegathus, it is fixed to promote drilling
Position precision.
6. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
It in S08 steps, specifically comprises the following steps, S081, deburring step, burr and dust after clear drilling；
S082, de-smear step remove the resin glue residue in hole；
S083, heavy copper step, the thin copper of heavy last layer on hole wall；
S084, copper thickness thicken step, by plating, by copper thickness thickening >=10um in hole.
7. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
In S09 steps, specifically comprise the following steps,
S091, pre-treatment：By way of physics polish-brush, the multilayer plate surface is roughened, promotes dry film and production table
The binding force in face；
S092, press mold：Automatic film pressing reduces edges of boards film slag after press mold；
S093, exposure：Use laser imaging；
S094, development：Call developer solution cleans up the dry film for not carrying out polymerisation.
8. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
In S10 steps, specifically comprise the following steps,
S101, plating：10-15um is thickeied by copper thickness to the plating of the unlapped region of dry film on the multi-layer board；It is S102, tin plating：
In plating thicker region, one layer of tin layers, tin thickness >=8um is electroplated.
9. a kind of high density PCB metal hemming edge manufacture craft according to claim 1, it is characterised in that：Described
It in S11 steps, specifically comprises the following steps, S111, moves back film：It film liquid is moved back into protection dry film use to be etched takes off and remove； S112、
Etching：Using vacuum etch processes, pool effect, etch uniformity >=98% is avoided when metal hemming edge plate makes outer layer, to use
Alkali etching system liquid medicine, cooperation graphic plating can make fine rule road figure；S113, tin is taken off：Patterned surface is played into protection
The tin layers of effect are taken off.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810318486.1A CN108391379A (en) | 2018-04-11 | 2018-04-11 | A kind of high density PCB metal hemming edge manufacture craft |
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| CN201810318486.1A CN108391379A (en) | 2018-04-11 | 2018-04-11 | A kind of high density PCB metal hemming edge manufacture craft |
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Family
ID=63073745
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Cited By (8)
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| CN109379854A (en) * | 2018-09-20 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A kind of low TG spray tin plays the control method of white point |
| CN109451665A (en) * | 2018-11-09 | 2019-03-08 | 博罗康佳精密科技有限公司 | A kind of manufacture craft of electro-optical package |
| CN111331859A (en) * | 2018-11-02 | 2020-06-26 | 北部湾大学 | Software taping process of plate-shaped workpiece taping system |
| CN111331858A (en) * | 2018-11-02 | 2020-06-26 | 北部湾大学 | Software loading, taking and placing process of plate-shaped workpiece edge covering system |
| CN111347684A (en) * | 2018-11-02 | 2020-06-30 | 北部湾大学 | Feeding rod touch pressure sensor of plate-shaped workpiece edge covering device |
| CN112752431A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
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| CN115052429A (en) * | 2022-08-13 | 2022-09-13 | 四川英创力电子科技股份有限公司 | Circuit board production method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109379854A (en) * | 2018-09-20 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A kind of low TG spray tin plays the control method of white point |
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| CN111331858A (en) * | 2018-11-02 | 2020-06-26 | 北部湾大学 | Software loading, taking and placing process of plate-shaped workpiece edge covering system |
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| CN112752431A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
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| CN112752431B (en) * | 2020-11-12 | 2023-10-13 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
| CN114228164A (en) * | 2021-12-17 | 2022-03-25 | 全兴汽车配件（福州）有限公司 | Automobile sun shield pressing device and working method thereof |
| CN114228164B (en) * | 2021-12-17 | 2024-06-04 | 全兴汽车配件（福州）有限公司 | Pressing device for automobile sun shield and working method thereof |
| CN115052429A (en) * | 2022-08-13 | 2022-09-13 | 四川英创力电子科技股份有限公司 | Circuit board production method |
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Application publication date: 20180810 |