CN114980581A - Manufacturing method of blind slot printed board - Google Patents
Manufacturing method of blind slot printed board Download PDFInfo
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- CN114980581A CN114980581A CN202210741183.7A CN202210741183A CN114980581A CN 114980581 A CN114980581 A CN 114980581A CN 202210741183 A CN202210741183 A CN 202210741183A CN 114980581 A CN114980581 A CN 114980581A
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- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 238000007639 printing Methods 0.000 claims abstract description 40
- 239000007921 spray Substances 0.000 claims abstract description 33
- 238000010030 laminating Methods 0.000 claims abstract description 14
- 238000003486 chemical etching Methods 0.000 claims abstract description 8
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- 239000000463 material Substances 0.000 claims description 22
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 230000000903 blocking effect Effects 0.000 claims description 10
- 230000002378 acidificating effect Effects 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a blind slot printed board, which comprises the following steps: providing a first substrate, a second substrate and a prepreg; slotting the first substrate and the prepreg, and laminating the first substrate, the prepreg and the second substrate in sequence to manufacture a laminated board with blind slots; carrying out chemical etching on the laminated board to manufacture a circuit pattern; and (4) manufacturing a solder mask or characters in the blind grooves. The invention has the beneficial effects that: the problems of solder resistance or character brittle fracture, breakage and the like caused by high temperature and high pressure are solved; on the premise of ensuring that the tin resistance effect which is equal to that of solder resistance is formed during welding, the time of the procedures of pre-baking, exposure, development and the like is shortened, and the working efficiency is improved; the characters are directly formed by local spray printing, so that the use amount of ink can be reduced, and the manufacturing cost is effectively reduced. The invention solves the technical problem of solder resist falling caused by inner layer solder resist printing, thereby achieving the purpose of manufacturing the blind slot printed board with good solder resist effect.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a blind slot printed board.
Background
With the development of electronic product technology, the demand of users for multi-functionalization of electronic products is increasing day by day, and the design of PCBs is also changing day by day in order to improve the product performance, the product assembly density, and reduce the product volume and weight. Meanwhile, in order to increase the heat dissipation area and enhance the safety of the surface component device and meet the requirements of high speed and high information content of communication products, a concave stepped area needs to be designed to fix components, so that the design of a stepped groove is brought forward at will.
Meanwhile, with the rapid development of the electronic and communication industries, the high frequency and RF designs are more and more extensive, and the PCB is more and more applied to high frequency materials to meet the requirements of signal transmission. In order to meet the requirements of customers on signal integrity, signal receiving and shielding matching and the like, a high-frequency blind slot is often involved in the design of the PCB to meet the requirements on signal transmission speed and sensitivity.
In the prior art, a technical method for realizing printing resistance welding in a blind slot by a blind slot printed board comprises the following steps: the inner layer is printed with solder resist on the bottom area of the blind groove, the blind groove is milled out, glue blocking materials are put in the inner layer during pressing or are pasted on the position of the blind groove, the blind groove is finally formed on the outer layer by means of depth control milling and the like, and the solder resist is manufactured in the bottom circuit area of the blind groove. According to the method, the solder mask in the blind groove needs to be pressed, and the solder mask is easy to crack and break due to high temperature and high pressure in the pressing process, so that the solder mask in the blind groove falls off.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the manufacturing method of the blind slot printed board, which solves the technical problem of solder resist falling caused by inner layer solder resist printing, thereby achieving the purpose of manufacturing the blind slot printed board with good tin resistance effect.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a manufacturing method of a blind slot printed board comprises the following steps:
providing a first substrate, a second substrate and a prepreg;
slotting a first substrate and a prepreg, and laminating the first substrate, the prepreg and a second substrate in sequence to manufacture a laminated plate with blind slots;
carrying out chemical etching on the laminated board to manufacture a circuit pattern;
and manufacturing a solder mask or characters in the blind grooves.
As a preferred embodiment of the present invention, the grooving of the first substrate and the prepreg includes: respectively milling a first through hole and a second through hole on the first substrate and the prepreg, sequentially overlapping the first substrate, the prepreg and the second substrate, and aligning the first through hole and the second through hole to form a blind groove;
and after the glue blocking material is put into the blind groove, the glue blocking material is taken out after the pressing, so that the laminated plate with the blind groove is formed.
As a preferred embodiment of the present invention, the grooving of the first substrate and the prepreg further includes: covering a copper layer on the hole wall of the first through hole to enable the first through hole to be a metalized through hole, then pasting a dry film on the hole wall of the first through hole, then pasting a film picture, exposing the hole wall by using ultraviolet light, dissolving and removing the unexposed dry film by using a sodium carbonate developing solution, chemically etching by using an acidic copper chloride etching solution, etching a circuit pattern on the hole wall, and removing the dry film on the hole wall by using a sodium hydroxide solution.
As a preferred embodiment of the present invention, the grooving of the first substrate and the prepreg includes: milling a through hole on the prepreg, sequentially laminating the first substrate, the prepreg with the through hole and the second substrate, placing a glue-resisting material in the through hole, and laminating;
and carrying out depth control milling on the position corresponding to the through hole, and taking out the glue blocking material to form the laminated plate with the blind groove.
As a preferred embodiment of the present invention, the grooving of the first substrate and the prepreg includes: etching the copper layer on the lower surface of the first substrate to manufacture a first blind groove, laminating the first substrate with the blind groove, the prepreg and the second substrate in sequence, etching the copper layer on the upper surface of the first substrate to manufacture a second blind groove, and deeply milling the second blind groove by using laser to communicate the first blind groove with the second blind groove to form a third blind groove, thereby obtaining a laminated plate with the blind groove;
and the upper surface and the lower surface of the first substrate are covered with copper layers.
In a preferred embodiment of the present invention, the method for manufacturing a solder resist includes: uniformly spraying solder resist ink in the blind groove of the laminated board by a solder resist spraying machine, pre-drying for 20-40min at the condition temperature of 75 +/-5 ℃, exposing and developing, and curing for 1-3 hours at the condition temperature of 150 +/-5 ℃ to finish the manufacture of solder resist.
In a preferred embodiment of the present invention, the solder resist ink is sprayed by: adjusting the pressure of a spray gun to 0.1-0.2Mpa and the step speed to 20-30mm/min, spraying the blind groove of the laminated plate by using the spray gun, pre-baking for 30min at the condition of 75 +/-5 ℃, and then using 140-150mj/cm 2 Is exposed to light.
In a preferred embodiment of the present invention, the method for creating characters includes: and (3) using a character jet printer to jet print character ink to directly form a required graph, and using the character jet printer to emit UV light to irradiate the character ink in the blind slot of the laminated board, so as to solidify the character ink and finish the manufacture of the character.
In a preferred embodiment of the present invention, the inkjet printing method includes: and setting the printing precision of the character jet printing machine to be 2400dpi, and after the size of a jet ink drop to be 3pL, carrying out jet printing on the character ink in the blind slot by using the character jet printing machine, and irradiating the character ink back and forth for 1-2 times by using a mercury lamp on the character jet printing machine to solidify the characters.
In a preferred embodiment of the present invention, the chemical etching of the laminated board includes: after a layer of dry film is respectively pasted on the upper surface and the lower surface of the laminated board, a film picture is pasted on the dry films on the upper surface and the lower surface, the laminated board is exposed by using ultraviolet light, the unexposed dry film is dissolved and removed by using a sodium carbonate developing solution, chemical etching is carried out by using an acidic copper chloride etching solution, circuit patterns are etched on the upper surface and the lower surface of the laminated board, and the dry films on the upper surface and the lower surface of the laminated board are removed by using a sodium hydroxide solution.
Compared with the prior art, the invention has the beneficial effects that:
(1) the solder resist or the characters are manufactured on the outer layer, so that the solder resist or the characters are prevented from undergoing a pressing process, and the problems of brittle fracture, breakage and the like of the solder resist or the characters caused by high temperature and high pressure are solved;
(2) when the character is used, on the premise of ensuring that the tin resistance effect which is equal to that of a solder resist is formed during welding, the time of the procedures of pre-baking, exposure, development and the like is shortened, and the working efficiency is improved;
(3) when the invention uses characters, because the solder mask needs to be integrally sprayed and then is exposed and developed for forming, and the characters are directly formed by local spray printing, the use amount of ink can be reduced, thereby effectively reducing the manufacturing cost.
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a step diagram of a method for manufacturing a blind slot printed board according to an embodiment of the present invention;
fig. 2 is a process flow chart of the manufacturing process of the laminated board with blind grooves in the manufacturing method of the blind groove printed board according to the embodiment of the invention;
fig. 3-is a process flow chart of solder resist in the method for manufacturing the blind slot printed board according to the embodiment of the invention;
fig. 4-is a flow chart of a manufacturing process of characters in the manufacturing method of the blind slot printed board according to the embodiment of the invention;
fig. 5 is a schematic structural diagram of a laminated board with blind grooves in the manufacturing method of the blind groove printed board according to the embodiment of the invention.
Description of reference numerals: 1. a first substrate; 2. a second substrate; 3. a prepreg; 4. a copper layer.
Detailed Description
The manufacturing method of the blind slot printed board provided by the invention comprises the following steps as shown in figure 1:
s1: providing a first substrate 1, a second substrate 2 and a prepreg 3;
s2: slotting the first substrate 1 and the prepreg 3, and laminating the first substrate 1, the prepreg 3 and the second substrate 2 in sequence to manufacture a laminated plate with blind slots;
s3: carrying out chemical etching on the laminated board to manufacture a circuit pattern;
s4: and (4) manufacturing a solder mask or characters in the blind grooves.
In step S2, as shown in fig. 2, the grooving of the first substrate 1 and the prepreg 3 includes: respectively milling a first through hole and a second through hole on the first substrate 1 and the prepreg 3, sequentially overlapping the first substrate 1, the prepreg 3 and the second substrate 2, and aligning the first through hole and the second through hole to form a blind groove;
after the glue resisting material is put into the blind groove, the glue resisting material is taken out after the pressing, thereby forming the laminated plate with the blind groove.
The layers of the multilayer circuit board are usually bonded by prepregs, and when the circuit board is in a thick copper, multilayer, dense circuit and other structure, the glue filling amount required in the pressing process is large, so that the problem of glue overflow control of a flexible region at a corresponding windowing part is brought, and therefore, glue overflow control at a joint part is realized by filling glue blocking materials in the blind grooves.
In the pressing process, the pressure of the press is transmitted to the glue resisting material through the substrate, the glue resisting material begins to deform under the action of the pressure, and meanwhile, the deformation performance of the glue resisting material can be improved due to the high temperature during pressing. Due to extrusion in the thickness direction, the glue-resisting material can only expand and deform in the horizontal length and width directions. The deformation direction is opposite to the flowing direction of the resin of the prepreg 3, so that the resin of the prepreg 3 is prevented from flowing to the flexible area, and the glue overflow defect is avoided.
Preferably, the glue blocking material is any one of silicon rubber, Polytetrafluoroethylene (PTFE) and Polyimide (PI), and these high polymer materials can bear high temperature and high pressure during pressing, and also have certain deformability, and can play a role in glue blocking.
Further, slotting the first substrate 1 and the prepreg 3 further includes: coating a copper layer on the wall of the first through hole to enable the first through hole to be a metalized through hole, then pasting a dry film on the wall of the first through hole, then pasting a film picture, exposing the wall of the through hole by using ultraviolet light, dissolving and removing the unexposed dry film by using a sodium carbonate developing solution, chemically etching by using an acidic copper chloride etching solution, etching a circuit pattern on the wall of the through hole, and removing the dry film on the wall of the through hole by using a sodium hydroxide solution.
In step S2, as shown in fig. 2, the grooving of the first substrate 1 and the prepreg 3 includes: and milling a through hole on the prepreg 3, sequentially laminating the first substrate 1, the prepreg 3 with the through hole and the second substrate 2, putting a glue blocking material in the through hole, laminating, and taking out the glue blocking material after depth control milling at the position corresponding to the through hole to form the laminated plate with the blind groove.
In the manufacture of printed boards with different functional areas, a depth-controlled groove milling technology (also called a cover-uncovering technology) is one of the key technologies influencing the product quality. The depth-control groove milling technology mainly comprises the traditional numerical control machine tool technologies such as mechanical V-Cut and mechanical depth-control groove milling, a laser processing technology, a chemical etching windowing technology and the like.
Preferably, the laser control deep groove milling technology is adopted, and the laser control deep groove milling machine has the characteristics of accurate positioning, high depth control precision, high machining efficiency and the like.
Further preferably, a UV laser depth-controlled groove milling technology is adopted, the UV laser wavelength is 400nm (located in an ultraviolet region and belongs to a high-energy laser beam), the drilling mechanism is photochemical crack etching, namely, a processed substance absorbs high-energy photons, a macromolecular chain of an organic substance is cracked into particles with smaller molecular weight, pores are formed by evaporation and injection, residual carbides can be reduced, the penetrating power is strong, and glass fibers and copper foils can be directly removed.
In step S2, as shown in fig. 2 and 5, the grooving of the first substrate 1 and the prepreg 3 includes: etching the copper layer 4 on the lower surface of the first substrate 1 to manufacture a first blind groove, laminating the first substrate 1 with the blind groove, the prepreg 3 and the second substrate 2 in sequence, laminating, etching the copper layer 4 on the upper surface of the first substrate to manufacture a second blind groove, and deeply milling the second blind groove by using laser to communicate the first blind groove with the second blind groove to form a third blind groove, so as to obtain a laminated plate with the blind groove;
wherein, the upper and lower surfaces of the first substrate 1 are covered with copper layers 4.
In step S4, as shown in fig. 3, the method for manufacturing solder resist includes: uniformly spraying solder resist ink in a blind groove of the laminated board by a solder resist spraying machine, pre-drying for 20-40min at the temperature of 75 +/-5 ℃, exposing and developing, and curing for 1-3 hours at the temperature of 150 +/-5 ℃ to finish the manufacture of the solder resist.
With the diversification and differentiation of PCB products, the traditional screen printing process conditions are difficult to standardize, the screen printing quality depends on the screen printing skill of printing personnel to a great extent, and the problems of low efficiency, poor quality and the like exist. The invention utilizes the solder resist low-pressure spraying technology to accurately position and spray ink on the PCB, has uniform ink and high reliability, replaces the traditional screen printing, breaks through the constraint that the solder resist processing depends on the printing skill for a long time, greatly improves the production efficiency and reduces the production cost.
The principle of the low-pressure spraying technology is as follows: the low-pressure spraying system achieves a sufficient atomization effect by changing liquid ink into mist gas under a low-pressure condition, low-pressure air cannot expand rapidly when coming out of a spray gun, and the atomization effect formed by air mass and enough energy possessed by the low-pressure air spray system can spray the ink to the surface of the substrate. In addition, the air jet thrust of the low-pressure spraying spray gun can not cause excessive spraying and flying, the low air pressure simultaneously avoids Faraday shielding effect, the positions of pits and corners are completely covered, and the rebound is little. The thickness uniformity of the low-pressure spraying ink can reach more than 85%, the production efficiency is improved by 3-4 times compared with that of the traditional silk screen printing, meanwhile, an automatic integrated production mode is formed by combining an IR furnace pre-baking line, the actual production capacity is greatly improved, and the labor degree is reduced.
Further, when the solder resist ink is sprayed, the method comprises the following steps: adjusting the pressure of spray gun to 0.1-0.2Mpa and the step speed to 20-30mm/min, spraying blind groove of laminated board with spray gun, pre-baking at 75 + -5 deg.C for 30min, and using 140-150mj/cm 2 Is exposed to light.
Wherein, the length multiplied by the width of the blind groove is 10mm multiplied by 10mm, and the depth is 1.5 mm.
In step S4, as shown in fig. 4, the method includes: and (3) spraying and printing character ink by using a character spraying and printing machine to directly form a required graph, irradiating the character ink in the blind groove of the pressing plate by using UV light emitted from the interior of the character spraying and printing machine, and solidifying the character ink to finish the manufacturing of the character.
The digital character jet printer is based on CAD or CAM file data to jet print special character ink onto circuit board and ultraviolet lamp to cure character in real time. The character spray printing technology eliminates the process and equipment for manufacturing the screen printing plate, thereby saving the field and the space, obviously reducing the material consumption (particularly negative films and the like), shortening the production period of products, reducing the environmental pollution and reducing the cost. In addition, the digital character jet printing machine has the CCD automatic positioning function and can effectively solve the problem of expansion and shrinkage of the circuit board. And the continuous lines of the characters can be ensured by the spray printing mode, so that the problem that the common characters at the falling positions are incomplete in the silk-screen printing process can be solved. Based on the above advantages, the digital character jet printer is very advantageous for improving character quality of the PCB and shortening the production flow.
The principle of ink jet printing will be described below by taking as an example the piezoelectric ejection principle in which a piezoelectric device applies an electric signal to a piezoelectric element to deform the piezoelectric element and eject liquid by pressing the liquid in the head. The piezoelectric type spray head consists of a piezoelectric ceramic piece, a spray nozzle and a small cavity, when a driving signal is not applied to the piezoelectric ceramic piece, the pressure of liquid in the small cavity is low enough, and the liquid is kept in the small cavity due to surface tension; when the liquid needs to be sprayed, a pulse voltage is applied to the piezoelectric ceramic sheet, the piezoelectric ceramic immediately generates micron-scale deformation, under the action, the volume of the small cavity is rapidly reduced, pressure waves towards the nozzle are generated, and the pressure waves overcome the pressure loss in the nozzle and the surface tension of the liquid, so that a liquid drop is formed at the nozzle and is sprayed out of the nozzle. Then the piezoelectric ceramic piece and the containing cavity are restored to the original state, and new liquid enters the small containing cavity of the spray head due to the action of surface tension.
The invention adopts an ultraviolet light curing technology, which is called U V technology for short, and is a process that liquid resin with chemical reaction activity can be crosslinked and cured in a short time under the irradiation of ultraviolet light with a certain wavelength to form a good coating. Compared with the traditional curing technology, the curing agent has the advantages of economy, environmental friendliness, high production efficiency, good film coating performance and the like.
Further, when the character ink is jet printed, the method comprises the following steps: the printing precision of the character spray printing machine is set to be 2400dpi, after the size of the sprayed ink drop is 3pL, the character spray printing machine is used for spraying character ink on the blind slot, and the character ink is irradiated back and forth for 1-2 times by using a mercury lamp on the character spray printing machine to solidify the character.
The PCB character jet printing machine is divided into an electrical part and a mechanical part. Wherein, the electrical apparatus part mainly contains: the ink jet printing device comprises a control nozzle moving part, a positioning identification part, an ink curing part and other auxiliary system parts. The mechanical part mainly comprises: the device comprises a spray head, a CCD camera, a transmission control system, the shape of a machine tool and the like. The main structure of the PCB character jet printer comprises the following points:
(1) the bearing system comprises: the machine tool comprises a whole machine body of the machine tool, a workbench for placing a PCB (printed circuit board) and a space for providing assembly and connection of other components, and the like;
(2) a transmission system: the servo motor drives the spray head X, Y to move in the direction, and the visual positioning camera moves back and forth and rotates the platform and the like;
(3) a vision system: the PCB positioning device comprises an image acquisition card and a CCD camera, and is used for completing the detection and positioning functions of a PCB;
(4) a printing system: the control system controls the spray head to move back and forth, required characters are sprayed and printed at the designated position on the substrate, and the whole pattern and character spray-painting is completed. Because the control of the spray head depends on the control of a high-precision control system, no manual operation is carried out in the process, the product precision is greatly improved;
(5) an ink curing system: compared with the traditional printer, the printing ink used by the PCB character jet printing machine is the specific printing ink, so that the printing ink is cured immediately after the jet printing is finished, the printing ink can be solidified in time, a better jet printing effect is achieved, and the printing ink curing system needs to be added at the head of the jet head. Heating and curing the printing ink by mainly adopting an ultraviolet lamp;
(6) the control system comprises: the FPGA is used as a control core, and the movement of the servo motor is controlled by communicating and transmitting data with an upper computer, so that the movement control of the spray head is completed. The ink-jet work of the nozzle of the spray head is completed by carrying out time sequence control on the spray head;
(7) and others: the system comprises a power supply system, signal systems of all parts, a water cooling system and other protection systems.
The working process of the PCB character spray printing machine can be roughly divided into the following parts:
(1) the upper computer analyzes the graphic information contained in the Gerber file by reading the Gerber file generated by the CAM and developing software such as VS/VC and the like;
(2) transmitting the analyzed data information to an FPGA internal cache through data transmission;
(3) the CCD camera scans the PCB information, searches the Mark point coordinates on the PCB, and the platform drives the PCB to rotate through corresponding coordinate calculation to complete PCB positioning;
(4) according to the pattern and character information analyzed by the upper computer, the servo motor drives the spray head to move to reach the position needing spray painting, and the spray head is driven to work according to the spray printing information to complete the spray painting process;
(5) after the characters are sprayed and printed, the control system turns on the ultraviolet lamp to immediately heat and solidify the characters which are just sprayed and printed, so that the characters are quickly solidified;
(6) and finishing the whole PCB character jet printing process.
In the step S3, the step of chemically etching the laminated plate includes: respectively sticking a layer of dry film on the upper surface and the lower surface of the laminated board, sticking a film picture on the dry film on the upper surface and the lower surface, exposing the laminated board by using ultraviolet light, dissolving and removing the unexposed dry film by using a sodium carbonate developing solution, chemically etching by using an acidic copper chloride etching solution, etching a circuit pattern on the upper surface and the lower surface of the laminated board, and removing the dry films on the upper surface and the lower surface of the laminated board by using a sodium hydroxide solution.
The PCB film is mainly applied to a Printed Circuit Board (PCB) photoplotting process flow, so that the quality of a film master is very important. The film used by the invention is coated with a layer of protective film on the surface to improve the hardness, enhance the scratch resistance and improve the utilization rate of the film base plate, thereby reducing the production cost of the printed board.
The PCB manufactured by the dry film has the advantages of high resolution, capability of manufacturing patterns with the line width smaller than 0.1mm, capability of obtaining lines with vertical edges within the thickness range of the dry film and capability of ensuring line precision. Because the thickness and the constitution of the dry film are basically stable, discontinuity in imaging can be avoided, and the imaging reliability is high and the control is convenient. The dry film can greatly simplify the manufacturing process of the printed board, and is beneficial to realizing mechanization and automation.
Dry film exposure principle: through the targeted irradiation of ultraviolet rays, cross-linking curing reaction is carried out on part of resin irradiated by the ultraviolet rays to form a macromolecular structure, and according to different performances of monomer components of the macromolecular structure and an initial state, chemical liquid medicine (a stripping method of a mainstream water-soluble dry film and a solvent-type dry film and a stripping-type dry film are different in material and method) is used for selectively developing and stripping, so that a circuit required by a PCB (printed circuit board) is obtained.
Preferably, the invention adopts the water-soluble dry film, is convenient for subsequent demoulding and improves the working efficiency on the premise of ensuring the line precision.
Preferably, the invention uses ultraviolet light with the wavelength of 310 nm-440 nm to carry out exposure, and the wavelength range can be matched with the functional electronic transition energy level in the resin.
Compared with the prior art, the invention has the beneficial effects that:
(1) the solder resist or the characters are manufactured on the outer layer, so that the solder resist or the characters are prevented from undergoing a pressing process, and the problems of brittle fracture, breakage and the like of the solder resist or the characters caused by high temperature and high pressure are solved;
(2) when the character is used, on the premise of ensuring that the tin resistance effect which is equal to that of a solder resist is formed during welding, the time of the procedures of pre-baking, exposure, development and the like is shortened, and the working efficiency is improved;
(3) when the invention uses characters, because the solder mask needs to be integrally sprayed and then is exposed and developed for forming, and the characters are directly formed by local spray printing, the use amount of ink can be reduced, thereby effectively reducing the manufacturing cost.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. The manufacturing method of the blind slot printed board is characterized by comprising the following steps:
providing a first substrate, a second substrate and a prepreg;
slotting a first substrate and a prepreg, and laminating the first substrate, the prepreg and a second substrate in sequence to manufacture a laminated plate with blind slots;
carrying out chemical etching on the laminated board to manufacture a circuit pattern;
and manufacturing a solder mask or characters in the blind grooves.
2. The method for manufacturing the blind slot printed board according to claim 1, wherein the grooving of the first substrate and the prepreg comprises: respectively milling a first through hole and a second through hole on the first substrate and the prepreg, sequentially overlapping the first substrate, the prepreg and the second substrate, and aligning the first through hole and the second through hole to form a blind groove;
and after the glue resisting material is put into the blind groove, the glue resisting material is taken out after the pressing, so that the laminated plate with the blind groove is formed.
3. The method for manufacturing the blind slot printed board according to claim 2, wherein the grooving of the first substrate and the prepreg further comprises: covering a copper layer on the hole wall of the first through hole to enable the first through hole to be a metalized through hole, then pasting a dry film on the hole wall of the first through hole, then pasting a film picture, exposing the hole wall by using ultraviolet light, dissolving and removing the unexposed dry film by using a sodium carbonate developing solution, chemically etching by using an acidic copper chloride etching solution, etching a circuit pattern on the hole wall, and removing the dry film on the hole wall by using a sodium hydroxide solution.
4. The method for manufacturing the blind slot printed board according to claim 1, wherein the grooving of the first substrate and the prepreg comprises: milling a through hole on the prepreg, sequentially laminating the first substrate, the prepreg with the through hole and the second substrate, placing a glue-resisting material in the through hole, and laminating;
and carrying out depth control milling on the position corresponding to the through hole, and taking out the glue blocking material to form the laminated plate with the blind groove.
5. The method for manufacturing the blind slot printed board according to claim 1, wherein the grooving of the first substrate and the prepreg comprises: etching the copper layer on the lower surface of the first substrate to manufacture a first blind groove, laminating the first substrate with the blind groove, the prepreg and the second substrate in sequence, etching the copper layer on the upper surface of the first substrate to manufacture a second blind groove, and deeply milling the second blind groove by using laser to communicate the first blind groove with the second blind groove to form a third blind groove, thereby obtaining a laminated plate with the blind groove;
the upper surface and the lower surface of the first substrate are covered with copper layers.
6. The method for manufacturing the blind slot printed board according to claim 1, wherein when the solder mask is manufactured, the method comprises the following steps: uniformly spraying solder resist ink in the blind groove of the laminated board by a solder resist spraying machine, pre-drying for 20-40min at the condition temperature of 75 +/-5 ℃, exposing and developing, and curing for 1-3 hours at the condition temperature of 150 +/-5 ℃ to finish the manufacture of solder resist.
7. The method for manufacturing the blind slot printed board according to claim 6, wherein when the solder resist ink is sprayed, the method comprises the following steps: adjusting the pressure of a spray gun to 0.1-0.2Mpa and the step speed to 20-30mm/min, spraying the blind groove of the laminated plate by using the spray gun, pre-baking for 30min at the condition of 75 +/-5 ℃, and then using 140-150mj/cm 2 Is exposed to light.
8. The method for manufacturing the blind slot printed board according to claim 1, wherein the method for manufacturing the characters comprises the following steps: and (3) using a character jet printer to jet print character ink to directly form a required graph, and using the character jet printer to emit UV light to irradiate the character ink in the blind slot of the laminated board, so as to solidify the character ink and finish the manufacture of the character.
9. The method for manufacturing the blind slot printed board according to claim 8, wherein when the character ink is jet printed, the method comprises the following steps: and setting the printing precision of the character jet printing machine to be 2400dpi, and after the size of a jet ink drop to be 3pL, carrying out jet printing on the character ink in the blind slot by using the character jet printing machine, and irradiating the character ink back and forth for 1-2 times by using a mercury lamp on the character jet printing machine to solidify the characters.
10. The method for manufacturing the blind groove printed board according to claim 1, wherein the step of chemically etching the laminated board comprises: after a layer of dry film is respectively pasted on the upper surface and the lower surface of the laminated board, a film picture is pasted on the dry films on the upper surface and the lower surface, the laminated board is exposed by using ultraviolet light, the unexposed dry film is dissolved and removed by using a sodium carbonate developing solution, chemical etching is carried out by using an acidic copper chloride etching solution, circuit patterns are etched on the upper surface and the lower surface of the laminated board, and the dry films on the upper surface and the lower surface of the laminated board are removed by using a sodium hydroxide solution.
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Cited By (1)
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| CN115406891A (en) * | 2022-09-19 | 2022-11-29 | 上海航天电子通讯设备研究所 | Method and system for detecting solder paste sprayed and printed by solder paste detector |
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