CN203801152U - Laser manufacturing device for printed circuit board - Google Patents
Laser manufacturing device for printed circuit board Download PDFInfo
- Publication number
- CN203801152U CN203801152U CN201420132082.0U CN201420132082U CN203801152U CN 203801152 U CN203801152 U CN 203801152U CN 201420132082 U CN201420132082 U CN 201420132082U CN 203801152 U CN203801152 U CN 203801152U
- Authority
- CN
- China
- Prior art keywords
- laser
- circuit board
- printed circuit
- shell
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 238000010410 dusting Methods 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims description 21
- 239000007789 gas Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 230000003028 elevating effect Effects 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052754 neon Inorganic materials 0.000 claims description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 241001076960 Argon Species 0.000 claims 1
- 235000013876 argon Nutrition 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a laser manufacturing device for a printed circuit board. The device comprises a shell, a protective gas supply unit, a printing platform, a metal powder spreading unit and a laser curing unit. The shell is in the form of an air-tight shell. The printed printing platform comprises a precisely lifting unit. The metal powder spreading unit comprises a powder spreading roller, a powder dusting roller and a horizontal guide rail. The laser curing unit comprises a precisely lifting guide rail and a laser emitting unit. According to the technical scheme of the utility model, metal powders within the pattern region of a specified circuit can be cured by utilizing laser, so that the specified circuit can be formed by the metal powders. Finally, uncured powders are removed and a circuit board is formed. The circuit board is simple in manufacturing process. Since the plate making step is no longer required, the cost is low. Therefore, personalized circuit boards can be manufactured in a small batch by means of the above device.
Description
Technical field
The utility model relates to a kind of printed circuit panel assembly of manufacturing, and relates in particular to a kind of laser and manufactures printed circuit panel assembly.
Background technology
Along with the fast development of electronic technology, printed circuit board is widely used in every field, all comprises corresponding printed circuit board in nearly all electronic equipment.
In PCB design process, often need to draw a design, Electronics Engineer carries out small lot test manufacture to factory after designing circuit and completing PCB Layout.Due to common Manufacturing Technology for PCB on present market, the manufacture of general employing subtraction, use exposure etching, manufacture circuit by etch away unwanted part in copper-clad plate, manufacture process is loaded down with trivial details, manufacturing cycle is longer, and production process produces a large amount of waste liquids, and the required cost of small lot batch manufacture or the perparation of specimen is higher.
And other circuit manufacture, as silk-screen printed circuit or inkjet printing circuit, owing to needing to use resin etc. in electrocondution slurry used or conductive ink, the circuit conductivity forming is poor, solderability, soldering resistance also cannot be compared with traditional circuit-board, manufacture the circuit board that is difficult to substitute the manufacture of traditional circuit-board manufacture craft of circuit board by these two kinds of technology.
Summary of the invention
The purpose of this utility model is the defect existing for above-mentioned technology, provide one can low cost, small lot laser printed circuit panel assembly.The utility model, by the metal dust of laser curing specified circuit area of the pattern, makes metal dust form the circuit of specifying, and finally removes the powder not being cured, and obtains circuit board.
Adopted technical scheme of the present utility model is that a kind of laser of design is manufactured printed circuit panel assembly, and this device comprises shell, protective gas feedway, print platform, metal dust spreading device and laser curing device.
Described shell is hermetically sealed, can be whole device airtight environment is provided.
The available protective gas of described protective gas feedway can be the inert gases such as helium (He), neon (Ne), argon (Ar), can be also nitrogen.
Described print platform also comprises precise elevating gear.
Described metal dust spreading device forms by spreading powder cylinder, dusting device and horizontal guide rail.
Described laser curing device comprises accurate riser guide and the laser beam emitting device with F-Theta field lens.
The utlity model has following advantage:
1, by laser curing metal dust, can be formed directly in circuit, pollution-free, environmental protection.
2, circuit board fabrication process simple, without plate-making, cost is low, can realize personalization, small lot is manufactured circuit.
Brief description of the drawings
Fig. 1 is that laser described in the utility model is manufactured circuit board arrangement structural representation.
Fig. 2 is that laser described in the utility model is manufactured circuit board formation schematic diagram.
1: shell, 2: protective gas feedway, 3: print platform, 4: precise elevating gear, 5: printing substrate, 6: metal dust spreading device, 7: paving powder cylinder, 8: dusting device, 9: horizontal guide rail, 10: accurate riser guide, 11: laser curing device, 12: laser beam emitting device, 13: metal dust, 14: circuit, 15: laser
Embodiment
Below in conjunction with accompanying drawing, the utility model will be further described.
Fig. 1 is the structural representation that laser is manufactured circuit board arrangement, and this device is made up of shell 1, protective gas feedway 2, print platform 3, metal dust spreading device 6 and laser curing device 11.Shell 1 has air-tightness, and sealed environment can be provided; Protective gas feedway 2 can provide protective gas, and protective gas can be the inert gases such as helium (He), neon (Ne), argon (Ar), can be also nitrogen, avoids metal dust to be oxidized in print procedure; Metal dust spreading device 6 is made up of paving powder cylinder 7, dusting device 8 and horizontal guide rail 9, paving powder cylinder 7 and dusting device 8 can be sprawled the uniform metal dust of one deck on substrate 5 to be printed, and horizontal guide rail 9 determines the movement in the horizontal direction of powder spreading device.
Referring to Fig. 1, when use, adjusted the accurate lifting of print platform by precise elevating gear 4, match with metal dust spreading device 6, can control thickness and the uniformity of metal dust; Laser curing device 11 comprises accurate riser guide 10 and the laser beam emitting device 12 with F-Theta field lens, can accurate lifting under the effect of accurate riser guide 10, coordinate F-Theta field lens, can make laser focus on accurately the plane at metal dust place, can melt metal dust according to given pattern, form the circuit of specifying.
Referring to Fig. 2, after the surperficial spreading metal dust of printing substrate 5, under the control of relevant control software, laser 15 focuses on metal dust 13 surfaces becomes the point-like laser of high energy, and point-like laser can be advanced according to the path setting in advance, and metal dust 13 melts rapidly under the effect of point-like laser, and form continuous metal pat at circuit board surface, after laser 15 has irradiated, the rapid cooling formation thin metal layer of the metal liquid of thawing, and then form circuit 14; After laser curing process completes, do not remove and can not obtained circuit board by the metal dust of laser curing.
Claims (3)
1. laser is manufactured a printed circuit panel assembly, it is characterized in that: this device is by shell, protective gas feedway, print platform, metal dust spreading device and laser curing installation composition; Described shell is hermetically sealed; Described print platform also comprises precise elevating gear; Described metal dust spreading device forms by spreading powder cylinder, dusting device and horizontal guide rail; Described laser curing device comprises accurate riser guide and laser beam emitting device.
2. laser according to claim 1 is manufactured printed circuit panel assembly; it is characterized in that: the available protective gas of described protective gas feedway can, for inert gases such as helium (He), neon (Ne), argons (Ar), can be also nitrogen.
3. laser according to claim 1 is manufactured printed circuit panel assembly, it is characterized in that: described laser beam emitting device is with F-Theta field lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420132082.0U CN203801152U (en) | 2014-03-24 | 2014-03-24 | Laser manufacturing device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420132082.0U CN203801152U (en) | 2014-03-24 | 2014-03-24 | Laser manufacturing device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203801152U true CN203801152U (en) | 2014-08-27 |
Family
ID=51383334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420132082.0U Expired - Fee Related CN203801152U (en) | 2014-03-24 | 2014-03-24 | Laser manufacturing device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203801152U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
-
2014
- 2014-03-24 CN CN201420132082.0U patent/CN203801152U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NANO TOP (SHENZHEN) PHOTOELECTRIC NEW MATERIAL CO. Free format text: FORMER OWNER: NANO TOP ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20150701 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150701 Address after: Silver Star Technology Building No. 1301 Longhua District Guanlan Street sightseeing road 518110 Guangdong city in Shenzhen Province, 8 floor Patentee after: Zhongke Nathon (Shenzhen) photoelectric New Material Co.,Ltd. Address before: 101400 Beijing city Huairou District Yanqi Yanqi Economic Development Zone South four Street No. 25 Patentee before: NANO TOP ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| DD01 | Delivery of document by public notice |
Addressee: Zhongke Nathon (Shenzhen) photoelectric New Material Co.,Ltd. Document name: Notification of Passing Examination on Formalities |
|
| DD01 | Delivery of document by public notice |
Addressee: He Wei Document name: payment instructions |
|
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: He Wei Document name: Notice of Termination of Patent Rights |
|
| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140827 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |