CN104392934A - Solder resist manufacturing method of packaging substrate - Google Patents
Solder resist manufacturing method of packaging substrate Download PDFInfo
- Publication number
- CN104392934A CN104392934A CN201410606048.7A CN201410606048A CN104392934A CN 104392934 A CN104392934 A CN 104392934A CN 201410606048 A CN201410606048 A CN 201410606048A CN 104392934 A CN104392934 A CN 104392934A
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- CN
- China
- Prior art keywords
- substrate
- windowing
- solder resist
- dry film
- welding resistance
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
Abstract
The invention provides a solder resist manufacturing method of a packaging substrate. The method comprises the following steps that step one, coarsening processing is performed on the surface of a substrate and the line pattern of the surface of the substrate; step two, a solder resist dry film is pressure-fit on the surface of the substrate; step three, solidification processing is performed on the substrate after pressure-fitting of the solder resist dry film; step four, solder resist windowing pattern data are manufactured; step five, processing parameters of a laser device are adjusted according to solder resist windowing size, dry film thickness, hardness of the solder resist dry film after solidification of the solder resist windowing pattern data, and windowing processing is performed on a solder resist windowing region by using the laser device; and step six, cleaning processing is performed on residues of the solder resist windowing region processed by laser and the exposed part of the line pattern after windowing. The method is great in technological compatibility and quite suitable for processing of the substrate with small solder resist windowing size and high windowing alignment accuracy requirement.
Description
Technical field
The present invention relates to substrate package field, especially a kind of solder-resisting manufacturing methods of base plate for packaging.
Background technology
Existing substrate welding technique major part is all make welding resistance with fluid oil ink material, because liquid ink affects by base plate line figure, ink characteristics etc. in the course of processing, can produce problems such as biting, ink thickness is uneven.The substrate little for welding resistance window size, windowing contraposition required precision is high, liquid ink carrying out exposing, the technique such as development is all difficult to controlled working precision, welding resistance window size is less than to the substrate of 80um, if process with liquid ink, can produce ill-exposed, development does not wait impact only.Thus affect follow-up making.
Because the packaging density of present substrate, encapsulation precision are more and more higher, what cause the pad size of substrate, line thickness to become is more and more less; When the pad of base plate for packaging, line thickness are more and more less, the aligning accuracy of windowing for welding resistance, the requirement of welding resistance window size are more and more higher, and this to bring by liquid printing ink to manufacture welding resistance technique tradition and greatly limits.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of solder-resisting manufacturing methods of base plate for packaging is provided, by using dry-film type solder resist and UV laser processing, can high-quality completing substrate welding resistance make, the plate that particularly window size is little, windowing contraposition required precision is high; In the course of processing, the inventive method can be completely mutually compatible with existing substrate process technology, do not need to do too much improvement to the substrate process of routine, and process compatibility is good, be applicable to very much little, the windowing contraposition required precision of welding resistance window size high the processing of substrate, and eliminate the work of welding resistance developing procedure, improve the efficiency of processing.The technical solution used in the present invention is:
A solder-resisting manufacturing methods for base plate for packaging, comprises the steps:
Step one, carries out roughening treatment to the surface of substrate and the line pattern of substrate surface;
Step 2, at substrate surface pressing dry film solder mask;
Step 3, is cured process to the substrate after pressing dry film solder mask;
Step 4, makes the graphic documentation that welding resistance is windowed;
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of graphic documentation, build, dry film solder mask solidification of windowing, and to window process to welding resistance windowed regions with laser;
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern carry out clean.
Further, pre-treatment liquid is adopted to carry out roughening treatment in step one.
Further, in step 2, the material of dry film solder mask adopts the AUS410 of Japanese TAIYO company; Pressing dry film solder mask is carried out with vacuum film pressing machine.
Further, in step 5, the laser of employing is UV laser.
The invention has the advantages that:
1) implementing process of the present invention is carried out based on the process of organic substrate and material, reduces the work of welding resistance developing procedure, improves working (machining) efficiency, can meet the requirements such as the welding resistance reliability of technology of substrate.
2) this technical scheme is windowed for the small size welding resistance of base plate for packaging, aligning accuracy brings very large skill upgrading.
3) the welding resistance processing technology of this scheme is mutually compatible with PCB technology, does not need new equipment and process just can realize, and is more adapted to this technology in the popularization of substrate volume production manufacturer and scale of mass production.
Accompanying drawing explanation
Fig. 1 is substrate of the present invention and outer-layer circuit pictorial diagram.
Fig. 2 is vacuum pressing-combining dry film solder mask schematic diagram of the present invention.
Fig. 3 is that laser of the present invention is swept welding resistance and to be windowed schematic diagram.
Fig. 4 is welding resistance windowed regions schematic diagram of the present invention.
Fig. 5 is flow chart of the present invention.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
In Fig. 1, pending substrate 1 front and back has all processed line pattern 2.The solder-resisting manufacturing methods of base plate for packaging comprises the steps:
Step one, carries out roughening treatment to the surface of substrate 1 and the line pattern 2 on substrate 1 surface;
In this step, pre-treatment liquid specifically can be adopted to carry out roughening treatment to substrate 1 surface lines figure, object improves the adhesion of substrate and dry film solder mask.Pre-treatment liquid can adopt " Ebachem Neo Brown " NBD II type liquid of Japanese EBARA company.
Step 2, at the surperficial pressing dry film solder mask 3 of substrate 1;
Because in this example, the front and back of substrate 1 has line pattern, therefore, as shown in Figure 2, at front and back all pressing dry film solder masks 3 of substrate 1; The material of dry film solder mask 3 adopts the AUS410 of Japanese TAIYO company.For ensureing the evenness of dry film solder mask 3, this step needs to carry out pressing with vacuum film pressing machine, carries out according to the thickness of substrate thickness, dry film solder mask the parameter adjusting vacuum film pressing.
Step 3, is cured process to the substrate 1 after pressing dry film solder mask 3;
The solidification of this step can heating cure in an oven, or adopts UV solidification (namely UV: ultraviolet abbreviation, UV solidification utilizes UV radiation curing).
Step 4, make welding resistance window 4 graphic documentation;
Welding resistance window 4 graphic documentation to indicate on substrate 1 which region and need to window, such as pad position;
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of 4 graphic documentations, build, dry film solder mask solidification of windowing, and to window process to welding resistance 4 regions of windowing with laser;
The laser adopted in this step is UV laser, namely ultraviolet laser.Laser is swept welding resistance and is windowed as shown in Figure 3.The effect obtained as shown in Figure 4.
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern 2 carry out clean.
In this step, first carry out plasma cleaning, then carry out the cleaning of low concentration alkalescence.The carbide produced when removing substrate surface laser processing and cull.Pad after windowing on line pattern 2 can clean totally.
As can be seen from above-mentioned steps, the processing mode that this method adopts dry-film type solder resist to combine with UV laser processing, improve minimum working ability, the welding resistance windowing contraposition precision of windowing of substrate, and working (machining) efficiency, for substrate has been carried out in follow-up making surface treatment and packaging and testing, simultaneously, this kind of processing scheme eliminates the operation of welding resistance development, reduce processing cost, meanwhile, this kind of invention also improves the reliability of substrate welding resistance.Substantially increase the aligning accuracy of welding resistance, reach actual welding resistance and window and the equivalent state of pad, meet the high-endization requirement of welding resistance processing further.
Claims (5)
1. a solder-resisting manufacturing methods for base plate for packaging, is characterized in that, comprises the steps:
Step one, carries out roughening treatment to the surface of substrate (1) and the line pattern (2) on substrate (1) surface;
Step 2, the surperficial pressing dry film solder mask (3) of substrate (1);
Step 3, is cured process to the substrate (1) after pressing dry film solder mask (3);
Step 4, makes welding resistance and to window the graphic documentation of (4);
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of (4) graphic documentation, build, dry film solder mask solidification of windowing, and to window process to welding resistance (4) region of windowing with laser;
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern (2) carry out clean.
2. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
Pre-treatment liquid is adopted to carry out roughening treatment in step one.
3. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 2, is characterized in that:
Pre-treatment liquid adopts the Ebachem Neo Brown NBD II type liquid of Japanese EBARA company.
4. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
In step 2, the material of dry film solder mask (3) adopts the AUS410 of Japanese TAIYO company; Pressing dry film solder mask (3) is carried out with vacuum film pressing machine.
5. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
In step 5, the laser of employing is UV laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410606048.7A CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410606048.7A CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104392934A true CN104392934A (en) | 2015-03-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410606048.7A Pending CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104392934A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684234A (en) * | 2017-01-20 | 2017-05-17 | 深圳市润芯科技有限公司 | LED wafer packaging substrate, preparation method thereof and LED light source |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN113597132A (en) * | 2021-09-06 | 2021-11-02 | 深圳市先地图像科技有限公司 | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) |
| CN113811077A (en) * | 2020-06-11 | 2021-12-17 | 深南电路股份有限公司 | Flexible circuit board and windowing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276091A (en) * | 1997-10-17 | 2000-12-06 | 伊比登株式会社 | Package substrate |
| CN1675760A (en) * | 2002-08-09 | 2005-09-28 | 揖斐电株式会社 | Multilayer printed wiring board |
| CN101112142A (en) * | 2005-02-02 | 2008-01-23 | 揖斐电株式会社 | Multilayer printed wiring board |
| JP2008235801A (en) * | 2007-03-23 | 2008-10-02 | Nippon Mektron Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
-
2014
- 2014-10-31 CN CN201410606048.7A patent/CN104392934A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276091A (en) * | 1997-10-17 | 2000-12-06 | 伊比登株式会社 | Package substrate |
| CN1675760A (en) * | 2002-08-09 | 2005-09-28 | 揖斐电株式会社 | Multilayer printed wiring board |
| CN101112142A (en) * | 2005-02-02 | 2008-01-23 | 揖斐电株式会社 | Multilayer printed wiring board |
| JP2008235801A (en) * | 2007-03-23 | 2008-10-02 | Nippon Mektron Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684234A (en) * | 2017-01-20 | 2017-05-17 | 深圳市润芯科技有限公司 | LED wafer packaging substrate, preparation method thereof and LED light source |
| CN113811077A (en) * | 2020-06-11 | 2021-12-17 | 深南电路股份有限公司 | Flexible circuit board and windowing method thereof |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112165765B (en) * | 2020-10-27 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board and electronic communication device |
| CN113597132A (en) * | 2021-09-06 | 2021-11-02 | 深圳市先地图像科技有限公司 | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) |
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Application publication date: 20150304 |