CN104392934A - Solder resist manufacturing method of packaging substrate - Google Patents
Solder resist manufacturing method of packaging substrate Download PDFInfo
- Publication number
- CN104392934A CN104392934A CN201410606048.7A CN201410606048A CN104392934A CN 104392934 A CN104392934 A CN 104392934A CN 201410606048 A CN201410606048 A CN 201410606048A CN 104392934 A CN104392934 A CN 104392934A
- Authority
- CN
- China
- Prior art keywords
- substrate
- windowing
- solder resist
- dry film
- welding resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000007711 solidification Methods 0.000 claims abstract description 8
- 230000008023 solidification Effects 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 39
- 238000003825 pressing Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 238000007788 roughening Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000002203 pretreatment Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a solder resist manufacturing method of a packaging substrate. The method comprises the following steps that step one, coarsening processing is performed on the surface of a substrate and the line pattern of the surface of the substrate; step two, a solder resist dry film is pressure-fit on the surface of the substrate; step three, solidification processing is performed on the substrate after pressure-fitting of the solder resist dry film; step four, solder resist windowing pattern data are manufactured; step five, processing parameters of a laser device are adjusted according to solder resist windowing size, dry film thickness, hardness of the solder resist dry film after solidification of the solder resist windowing pattern data, and windowing processing is performed on a solder resist windowing region by using the laser device; and step six, cleaning processing is performed on residues of the solder resist windowing region processed by laser and the exposed part of the line pattern after windowing. The method is great in technological compatibility and quite suitable for processing of the substrate with small solder resist windowing size and high windowing alignment accuracy requirement.
Description
Technical field
The present invention relates to substrate package field, especially a kind of solder-resisting manufacturing methods of base plate for packaging.
Background technology
Existing substrate welding technique major part is all make welding resistance with fluid oil ink material, because liquid ink affects by base plate line figure, ink characteristics etc. in the course of processing, can produce problems such as biting, ink thickness is uneven.The substrate little for welding resistance window size, windowing contraposition required precision is high, liquid ink carrying out exposing, the technique such as development is all difficult to controlled working precision, welding resistance window size is less than to the substrate of 80um, if process with liquid ink, can produce ill-exposed, development does not wait impact only.Thus affect follow-up making.
Because the packaging density of present substrate, encapsulation precision are more and more higher, what cause the pad size of substrate, line thickness to become is more and more less; When the pad of base plate for packaging, line thickness are more and more less, the aligning accuracy of windowing for welding resistance, the requirement of welding resistance window size are more and more higher, and this to bring by liquid printing ink to manufacture welding resistance technique tradition and greatly limits.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of solder-resisting manufacturing methods of base plate for packaging is provided, by using dry-film type solder resist and UV laser processing, can high-quality completing substrate welding resistance make, the plate that particularly window size is little, windowing contraposition required precision is high; In the course of processing, the inventive method can be completely mutually compatible with existing substrate process technology, do not need to do too much improvement to the substrate process of routine, and process compatibility is good, be applicable to very much little, the windowing contraposition required precision of welding resistance window size high the processing of substrate, and eliminate the work of welding resistance developing procedure, improve the efficiency of processing.The technical solution used in the present invention is:
A solder-resisting manufacturing methods for base plate for packaging, comprises the steps:
Step one, carries out roughening treatment to the surface of substrate and the line pattern of substrate surface;
Step 2, at substrate surface pressing dry film solder mask;
Step 3, is cured process to the substrate after pressing dry film solder mask;
Step 4, makes the graphic documentation that welding resistance is windowed;
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of graphic documentation, build, dry film solder mask solidification of windowing, and to window process to welding resistance windowed regions with laser;
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern carry out clean.
Further, pre-treatment liquid is adopted to carry out roughening treatment in step one.
Further, in step 2, the material of dry film solder mask adopts the AUS410 of Japanese TAIYO company; Pressing dry film solder mask is carried out with vacuum film pressing machine.
Further, in step 5, the laser of employing is UV laser.
The invention has the advantages that:
1) implementing process of the present invention is carried out based on the process of organic substrate and material, reduces the work of welding resistance developing procedure, improves working (machining) efficiency, can meet the requirements such as the welding resistance reliability of technology of substrate.
2) this technical scheme is windowed for the small size welding resistance of base plate for packaging, aligning accuracy brings very large skill upgrading.
3) the welding resistance processing technology of this scheme is mutually compatible with PCB technology, does not need new equipment and process just can realize, and is more adapted to this technology in the popularization of substrate volume production manufacturer and scale of mass production.
Accompanying drawing explanation
Fig. 1 is substrate of the present invention and outer-layer circuit pictorial diagram.
Fig. 2 is vacuum pressing-combining dry film solder mask schematic diagram of the present invention.
Fig. 3 is that laser of the present invention is swept welding resistance and to be windowed schematic diagram.
Fig. 4 is welding resistance windowed regions schematic diagram of the present invention.
Fig. 5 is flow chart of the present invention.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
In Fig. 1, pending substrate 1 front and back has all processed line pattern 2.The solder-resisting manufacturing methods of base plate for packaging comprises the steps:
Step one, carries out roughening treatment to the surface of substrate 1 and the line pattern 2 on substrate 1 surface;
In this step, pre-treatment liquid specifically can be adopted to carry out roughening treatment to substrate 1 surface lines figure, object improves the adhesion of substrate and dry film solder mask.Pre-treatment liquid can adopt " Ebachem Neo Brown " NBD II type liquid of Japanese EBARA company.
Step 2, at the surperficial pressing dry film solder mask 3 of substrate 1;
Because in this example, the front and back of substrate 1 has line pattern, therefore, as shown in Figure 2, at front and back all pressing dry film solder masks 3 of substrate 1; The material of dry film solder mask 3 adopts the AUS410 of Japanese TAIYO company.For ensureing the evenness of dry film solder mask 3, this step needs to carry out pressing with vacuum film pressing machine, carries out according to the thickness of substrate thickness, dry film solder mask the parameter adjusting vacuum film pressing.
Step 3, is cured process to the substrate 1 after pressing dry film solder mask 3;
The solidification of this step can heating cure in an oven, or adopts UV solidification (namely UV: ultraviolet abbreviation, UV solidification utilizes UV radiation curing).
Step 4, make welding resistance window 4 graphic documentation;
Welding resistance window 4 graphic documentation to indicate on substrate 1 which region and need to window, such as pad position;
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of 4 graphic documentations, build, dry film solder mask solidification of windowing, and to window process to welding resistance 4 regions of windowing with laser;
The laser adopted in this step is UV laser, namely ultraviolet laser.Laser is swept welding resistance and is windowed as shown in Figure 3.The effect obtained as shown in Figure 4.
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern 2 carry out clean.
In this step, first carry out plasma cleaning, then carry out the cleaning of low concentration alkalescence.The carbide produced when removing substrate surface laser processing and cull.Pad after windowing on line pattern 2 can clean totally.
As can be seen from above-mentioned steps, the processing mode that this method adopts dry-film type solder resist to combine with UV laser processing, improve minimum working ability, the welding resistance windowing contraposition precision of windowing of substrate, and working (machining) efficiency, for substrate has been carried out in follow-up making surface treatment and packaging and testing, simultaneously, this kind of processing scheme eliminates the operation of welding resistance development, reduce processing cost, meanwhile, this kind of invention also improves the reliability of substrate welding resistance.Substantially increase the aligning accuracy of welding resistance, reach actual welding resistance and window and the equivalent state of pad, meet the high-endization requirement of welding resistance processing further.
Claims (5)
1. a solder-resisting manufacturing methods for base plate for packaging, is characterized in that, comprises the steps:
Step one, carries out roughening treatment to the surface of substrate (1) and the line pattern (2) on substrate (1) surface;
Step 2, the surperficial pressing dry film solder mask (3) of substrate (1);
Step 3, is cured process to the substrate (1) after pressing dry film solder mask (3);
Step 4, makes welding resistance and to window the graphic documentation of (4);
Step 5, carries out adjusting the machined parameters of laser according to the welding resistance hardness after the welding resistance window size of (4) graphic documentation, build, dry film solder mask solidification of windowing, and to window process to welding resistance (4) region of windowing with laser;
Step 6, to the residue of laser processing welding resistance windowed regions, window after the extending part of line pattern (2) carry out clean.
2. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
Pre-treatment liquid is adopted to carry out roughening treatment in step one.
3. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 2, is characterized in that:
Pre-treatment liquid adopts the Ebachem Neo Brown NBD II type liquid of Japanese EBARA company.
4. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
In step 2, the material of dry film solder mask (3) adopts the AUS410 of Japanese TAIYO company; Pressing dry film solder mask (3) is carried out with vacuum film pressing machine.
5. the solder-resisting manufacturing methods of base plate for packaging as claimed in claim 1, is characterized in that:
In step 5, the laser of employing is UV laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410606048.7A CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410606048.7A CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104392934A true CN104392934A (en) | 2015-03-04 |
Family
ID=52610814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410606048.7A Pending CN104392934A (en) | 2014-10-31 | 2014-10-31 | Solder resist manufacturing method of packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104392934A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684234A (en) * | 2017-01-20 | 2017-05-17 | 深圳市润芯科技有限公司 | LED wafer packaging substrate, preparation method thereof and LED light source |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN113597132A (en) * | 2021-09-06 | 2021-11-02 | 深圳市先地图像科技有限公司 | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) |
| CN113811077A (en) * | 2020-06-11 | 2021-12-17 | 深南电路股份有限公司 | Flexible circuit board and windowing method thereof |
| CN113823571A (en) * | 2021-08-12 | 2021-12-21 | 紫光宏茂微电子(上海)有限公司 | Manufacturing method of chip packaging substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276091A (en) * | 1997-10-17 | 2000-12-06 | 伊比登株式会社 | Package substrate |
| CN1675760A (en) * | 2002-08-09 | 2005-09-28 | 揖斐电株式会社 | Multilayer printed wiring board |
| CN101112142A (en) * | 2005-02-02 | 2008-01-23 | 揖斐电株式会社 | Multilayer printed wiring board |
| JP2008235801A (en) * | 2007-03-23 | 2008-10-02 | Nippon Mektron Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
-
2014
- 2014-10-31 CN CN201410606048.7A patent/CN104392934A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276091A (en) * | 1997-10-17 | 2000-12-06 | 伊比登株式会社 | Package substrate |
| CN1675760A (en) * | 2002-08-09 | 2005-09-28 | 揖斐电株式会社 | Multilayer printed wiring board |
| CN101112142A (en) * | 2005-02-02 | 2008-01-23 | 揖斐电株式会社 | Multilayer printed wiring board |
| JP2008235801A (en) * | 2007-03-23 | 2008-10-02 | Nippon Mektron Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684234A (en) * | 2017-01-20 | 2017-05-17 | 深圳市润芯科技有限公司 | LED wafer packaging substrate, preparation method thereof and LED light source |
| CN113811077A (en) * | 2020-06-11 | 2021-12-17 | 深南电路股份有限公司 | Flexible circuit board and windowing method thereof |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112165765B (en) * | 2020-10-27 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board and electronic communication device |
| CN113823571A (en) * | 2021-08-12 | 2021-12-21 | 紫光宏茂微电子(上海)有限公司 | Manufacturing method of chip packaging substrate |
| CN113597132A (en) * | 2021-09-06 | 2021-11-02 | 深圳市先地图像科技有限公司 | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104392934A (en) | Solder resist manufacturing method of packaging substrate | |
| CN104870682B (en) | Method for producing mask film | |
| CN108668428B (en) | Laser LDS 3D three-dimensional circuit fine circuit board manufacturing process | |
| CN103796449B (en) | The manufacture method of high thickness to diameter ratio wiring board plated hole consent | |
| CN107960017A (en) | The processing method of wiring board solder mask | |
| CN104582287B (en) | A kind of leadless gold plating plate moves back film method | |
| US10197911B2 (en) | Imprint apparatus and method of manufacturing article | |
| TW200735178A (en) | Rinse processing method, developing processing apparatus, and computer readable medium encoded with a control program to be executed by a computer | |
| CN103200784A (en) | Solder mask windowing method for printed circuit board | |
| KR101869671B1 (en) | Imprint method, imprint apparatus, and method for manufacturing device | |
| CN103077904B (en) | A kind of method that bonding machine platform device is aimed at bonding | |
| US10828805B2 (en) | Imprint apparatus, control method, and method for manufacturing article | |
| CN106793587A (en) | A kind of rigid-flex combined board with blind slot and preparation method thereof | |
| JP2013229448A (en) | Imprint device, imprint method, and article manufacturing method | |
| CN102056412A (en) | Method and system for processing graphs | |
| CN103108490A (en) | Circuit manufacturing method of super-thick copper circuit board | |
| CN104290523A (en) | Method for processing fine lines or pattern on surface of thin glass | |
| CN103207515B (en) | A kind of Three-dimensional mask plate and its preparation process | |
| KR101196677B1 (en) | Method for drawing fine pattern | |
| CN105887086A (en) | Anchor type three-dimensional etching method | |
| CN105722329A (en) | Method for plugging hole with resin | |
| CN105282982A (en) | Photosensitive preparation method of holes | |
| CN102728909B (en) | Discharging correction edge-finding tool | |
| CN103369849A (en) | Window-opening processing technology for covering layer of flexible circuit board | |
| CN110769611B (en) | Method for manufacturing COF product with combination mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150304 |