CN105472901A - Laser engraving manufacturing process for fine circuit - Google Patents
Laser engraving manufacturing process for fine circuit Download PDFInfo
- Publication number
- CN105472901A CN105472901A CN201511030409.9A CN201511030409A CN105472901A CN 105472901 A CN105472901 A CN 105472901A CN 201511030409 A CN201511030409 A CN 201511030409A CN 105472901 A CN105472901 A CN 105472901A
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- CN
- China
- Prior art keywords
- manufacturing process
- radium
- fine
- laser
- line
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a laser engraving manufacturing process for a fine circuit. The manufacturing process comprises the following steps: step 1, preparing a thin circuit with a width of less than or equal to 0.1 mm through a laser engraving manner in an LDS plastic part by utilizing an LDS laser; step 2, mounting the laser engraved plastic part on a jig that combines a roller and a suspension frame; step 3, performing chemical plating treatment on the laser engraved plastic part to obtain a required metal layer on the circuit; and step 4, performing electrical logging on the circuit after the metal layer is obtained. By adoption of the laser engraving manufacturing process for the fine circuit, large-scale production of the fine circuit with the thickness of less than or equal to 0.1 mm can be realized, and the applied range of the LDS process is expanded.
Description
Technical field
The present invention relates to a kind of fine-line radium carving manufacturing process.
Background technology
Manufacture field at LDS, common line width and line-spacing require, mostly at more than 0.2mm, substantially can meet the requirement of ordinary antennas and connector.But for the requirement of fine features and specialities, live width and line-spacing need be contracted to further 0.1mm even below.
But current 0.1mm and following fine-line all can face the problem of broken string and plating of overflowing when producing, cannot normal volume production, or the product needed produced spends and a large amount of manually carries out reprocessing, and cost is very high.
Summary of the invention
A kind of fine-line radium carving manufacturing process that the present invention provides to solve the problem, it is characterized in that, described manufacturing process comprises the following steps:
Step 1, utilizes LDS laser machine radium on LDS plastic parts to undercut the fine rule road of width≤0.1mm;
Step 2, is arranged on the plastic parts that radium is carved on the tool of cylinder and hanger combination;
Step 3, along with tool moves carrying out of the plastic parts plating of carving radium, obtains required metal level on the line;
Step 4, carries out electrical measurement to the circuit after obtaining metal level.
Concrete, in described step 2, the plastic parts that described radium is carved is installed in a serial fashion.
Concrete, the parameter of described LDS laser machine comprises: laser power: 1 ~ 20W; Laser scanning speed: 1000 ~ 4000mm/s; Laser frequency 20 ~ 200KHZ.
Concrete, the parameter of describedization plating solution used comprises: NaOH: 6 ~ 8g/L, formaldehyde: 3 ~ 4g/L, copper: 2 ~ 3g/L.
Beneficial effect of the present invention is: use this fine-line radium to carve manufacturing process, can make≤fine-line the scale of mass production of 0.1mm, expand the range of application of LDS technique.The mode of cylinder can avoid plastic parts, in the process changing plating, plating of overflowing occurs, and operating efficiency is high, can meet a large amount of Production requirement; The mode of hanger can avoid plastic parts to break in the process changing plating.
Accompanying drawing explanation
Fig. 1 is the flow chart of manufacturing process of the present invention;
Fig. 2 is the schematic diagram of tool of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further elaborated:
The invention provides a kind of fine-line radium carving manufacturing process, as shown in Figure 1, manufacturing process comprises the following steps:
Step 1, utilizes LDS laser machine radium on LDS plastic parts to undercut the fine rule road of width≤0.1mm;
Step 2, is arranged on the plastic parts that radium is carved on the tool of cylinder and hanger combination;
Step 3, along with tool moves carrying out of the plastic parts plating of carving radium, obtains required metal level on the line;
Step 4, carries out electrical measurement to the circuit after obtaining metal level.
In said process, the parameter of LDS laser machine comprises: laser power: 1 ~ 20W; Laser scanning speed: 1000 ~ 4000mm/s; Laser frequency 20 ~ 200KHZ.Laser machine causes the Chemical Physics of LDS plastic parts entry material to change by the luminous energy of laser beam and carves vestige, shows figure, the word of required etching.
As shown in Figure 2, tool 1 has cylinder 11 and hanger 12, has gap 120 in hanger 12, and cylinder 11 inside has groove 110, and hanger 12 is embedded in the groove 110 li of cylinder 11.In the present embodiment, the plastic parts (semi-finished product) that radium is carved is arranged in the gap 120 of hanger 12 in a serial fashion, and the cylinder 11 along with outer ring in tank liquor rolls together.
Because the mode of cylinder can move in the plated journey of change, therefore can avoid plastic parts, in the process changing plating, plating of overflowing occurs, and operating efficiency is high, can meet a large amount of Production requirement; Be combined with the mode of hanger, plastic parts can be avoided to collide in the process changing plating, thus avoid the situation causing thin circuit breaking.
In said process, the parameter changing plating solution used comprises: NaOH: 6 ~ 8g/L, formaldehyde: 3 ~ 4g/L, copper: 2 ~ 3g/L.The present invention's employing coating technology, soaks the plastic parts carved radium in the solution by tool, under the catalytic action of metal, produces metal deposition, to complete the manufacture on fine rule road by controllable redox reaction.Compared with plating, change plating and have that coating is even, pin hole is little, do not need DC power supply device, can deposit on non-conductor and there is the features such as some property.In addition, change coating technology discharging of waste liquid few, environmental pollution is little and cost is lower.
Use this fine-line radium to carve manufacturing process ,≤fine-line the scale of mass production of 0.1mm can be made, expanded the range of application of LDS technique.As shown in table 1 with the contrast of traditional handicraft:
Table 1
The above embodiment, just preferred embodiments of the present invention, be not limit practical range of the present invention, therefore all equivalences done according to structure, feature and the principle described in the present patent application the scope of the claims change or modify, and all should be included in patent claim of the present invention.
Claims (4)
1. a fine-line radium carving manufacturing process, it is characterized in that, described manufacturing process comprises the following steps:
Step 1, utilizes LDS laser machine radium on LDS plastic parts to undercut the fine rule road of width≤0.1mm;
Step 2, is arranged on the plastic parts that radium is carved on the tool of cylinder and hanger combination;
Step 3, along with tool moves carrying out of the plastic parts plating of carving radium, obtains required metal level on the line;
Step 4, carries out electrical measurement to the circuit after obtaining metal level.
2. fine-line radium carving manufacturing process as claimed in claim 1, it is characterized in that, in described step 2, the plastic parts that described radium is carved is installed in a serial fashion.
3. fine-line radium carving manufacturing process as claimed in claim 1, it is characterized in that, the parameter of described LDS laser machine comprises: laser power: 1 ~ 20W; Laser scanning speed: 1000 ~ 4000mm/s; Laser frequency 20 ~ 200KHZ.
4. fine-line radium carving manufacturing process as claimed in claim 1, is characterized in that, the parameter of describedization plating solution used comprises: NaOH: 6 ~ 8g/L, formaldehyde: 3 ~ 4g/L, copper: 2 ~ 3g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030409.9A CN105472901A (en) | 2015-12-30 | 2015-12-30 | Laser engraving manufacturing process for fine circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030409.9A CN105472901A (en) | 2015-12-30 | 2015-12-30 | Laser engraving manufacturing process for fine circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105472901A true CN105472901A (en) | 2016-04-06 |
Family
ID=55610022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511030409.9A Pending CN105472901A (en) | 2015-12-30 | 2015-12-30 | Laser engraving manufacturing process for fine circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105472901A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816385A (en) * | 2017-01-24 | 2017-06-09 | 维沃移动通信有限公司 | A kind of wiring method and chip module |
| CN106879165A (en) * | 2017-02-25 | 2017-06-20 | 深圳市聚龙高科电子技术有限公司 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
| CN107155263A (en) * | 2017-07-07 | 2017-09-12 | 广东小天才科技有限公司 | A kind of LDS wiring boards and its processing method and device |
| CN111805091A (en) * | 2020-06-09 | 2020-10-23 | 深圳市信维通信股份有限公司 | LAP laser etching process |
| CN112834953A (en) * | 2020-12-29 | 2021-05-25 | 深圳市信维通信股份有限公司 | PEP vibrator preparation process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4430390A1 (en) * | 1993-09-09 | 1995-03-16 | Krone Ag | Process for the production of structured metallic coatings on surfaces |
| US20120074094A1 (en) * | 2010-09-24 | 2012-03-29 | Kuang Hong Precision Co., Ltd. | Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier |
| CN203801152U (en) * | 2014-03-24 | 2014-08-27 | 北京中科纳通电子技术有限公司 | Laser manufacturing device for printed circuit board |
| CN104981106A (en) * | 2014-04-04 | 2015-10-14 | 罗伯特·博世有限公司 | Method for producing a MID circuit carrier |
-
2015
- 2015-12-30 CN CN201511030409.9A patent/CN105472901A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4430390A1 (en) * | 1993-09-09 | 1995-03-16 | Krone Ag | Process for the production of structured metallic coatings on surfaces |
| US20120074094A1 (en) * | 2010-09-24 | 2012-03-29 | Kuang Hong Precision Co., Ltd. | Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier |
| CN203801152U (en) * | 2014-03-24 | 2014-08-27 | 北京中科纳通电子技术有限公司 | Laser manufacturing device for printed circuit board |
| CN104981106A (en) * | 2014-04-04 | 2015-10-14 | 罗伯特·博世有限公司 | Method for producing a MID circuit carrier |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816385A (en) * | 2017-01-24 | 2017-06-09 | 维沃移动通信有限公司 | A kind of wiring method and chip module |
| CN106879165A (en) * | 2017-02-25 | 2017-06-20 | 深圳市聚龙高科电子技术有限公司 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
| CN107155263A (en) * | 2017-07-07 | 2017-09-12 | 广东小天才科技有限公司 | A kind of LDS wiring boards and its processing method and device |
| CN107155263B (en) * | 2017-07-07 | 2019-09-27 | 广东小天才科技有限公司 | A kind of LDS wiring board and its processing method and device |
| CN111805091A (en) * | 2020-06-09 | 2020-10-23 | 深圳市信维通信股份有限公司 | LAP laser etching process |
| CN112834953A (en) * | 2020-12-29 | 2021-05-25 | 深圳市信维通信股份有限公司 | PEP vibrator preparation process |
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Application publication date: 20160406 |
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