CN104981106A - Method for producing a MID circuit carrier - Google Patents
Method for producing a MID circuit carrier Download PDFInfo
- Publication number
- CN104981106A CN104981106A CN201510151889.8A CN201510151889A CN104981106A CN 104981106 A CN104981106 A CN 104981106A CN 201510151889 A CN201510151889 A CN 201510151889A CN 104981106 A CN104981106 A CN 104981106A
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- China
- Prior art keywords
- printed conductor
- toe
- contact
- contact area
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
Abstract
The invention relates to a method for producing a MID circuit carrier (1), injection molding technology with at least the steps of forming a one-piece injection-molded body (3) having a substrate (7) and a contact region (2), structuring a circuit surface area ( 4a) on the substrate (7) and a contact tabs surface portion (2a) on the contact area (2) with activation of metal nuclei, wherein on the circuit surface area (4a) of conductor tracks areas are structured, which has become the Kontaktfahnen- surface area (2a) of the contact area (2), electroless deposition of a first metal layer (21) on the patterned circuit surface area (4a) and the contact lugs surface area (2a) such that at least two conductors (6) of the circuit surface area (4a); formed to at least one of the contact lugs surface area (2a) line junction (12), wherein the conductor tracks (6) on the at least one line junction (12) are contacted with each other, electrochemically forming a second metal layer on or to the first metal layer (21) while applying an electrical potential to the line junction (12), and removing at least the line junction (12) and electrically disconnecting the conductor tracks (6).
Description
Technical field
The present invention relates to a kind of method for the manufacture of MID circuit carrier and such MID circuit carrier.
Background technology
MID (Molded Interconnect Devices: molding interconnect device) circuit carrier is the circuit carrier of injection moulding, and these circuit carriers have with three-dimensionally shaped substrate and the metal printed conductor be configured at least one surf zone of substrate.What can realize in the surface of the body that the three-dimensionally shaped as far as possible freely of substrate or printed circuit board as far as possible freely design to three-dimensional thus is integrated.
Known different MID manufacture method, such as two component injection mouldings and laser MID method such as laser direct organization (LDS).The metal crystal nuclei when LDS---such as little metal particle is received in plastic material, and described plastic material is compatibly shaping by injection moulding process subsequently.Subsequently by laser implementing structured, wherein, treating exposing metal nucleus in structurized surf zone.Make surf zone or whole injection moulding body in an electroplating bath, in the solution with copper ion, such as stand initiatively plating subsequently.Therefore, electroless plating occurs based on the potential difference of copper ion in metal crystal nuclei and solution, generally forms the first metal layer by non-alloyed copper by described electroless plating.
Passive plating can be continued further to construct larger printed conductor thickness; But, printed conductor also transversely width expansion, thus can short circuit be caused in trickle pitch (Pitch) or pitch (Rasterma β) in the little laterally spaced situation namely between printed conductor center after certain process duration.In addition can be stored together in the structure shown here by solution when passive dirty particle, thus limiting material characteristic, especially ductility.Therefore, the advantage of passive plating is, first can construct trickle pitch or the little interval between printed conductor and can construct little printed conductor width, but limiting printed conductor thickness and quality of materials.
Can realize initiatively plating after the first metal layer of the passive plating of structure subsequently, its mode is, is namely applied on each printed conductor constructed relative to the voltage of the electroplating bath be applicable to by a current potential.Initiatively plating can construct more quickly and can realize the use of material targetedly in technology, such as, for constructing the alloy with higher ductility and better material behavior be made up of gold and nickel.
But, when there is little horizontal printed conductor width and be such as less than 150 μm be such as also less than the printed conductor structure of the trickle pitch of 100 μm, the contact of each printed conductor is difficult for initiatively plating to a certain extent.
Summary of the invention
According to the invention provides a kind of MID method, wherein, injection moulding body configuration is for having contact area, such as contact chip (Kontaktfahne), described contact area is provided with at least one toe-in (Leitungszusammenf ü hrung), described at least one toe-in contact at least two printed conductors.
An only unique toe-in especially can be set, namely for contacting the central toe-in of whole printed conductor; But, also can realize the structure of multiple toe-in in principle, such as, there are multiple contact areas of each toe-in.
For the active electrolytic deposition of the second metal level, that is carry out the structure of toe-in in MID manufacture method executing the plating of the active in alive situation; But remove toe-in again subsequently, thus printed conductor is separated from each other.
Some advantages are realized according to the present invention:
By executing the mode realizing metallide initiatively or structure in alive situation, the material be applicable to can be selected and the material behavior that can realize, especially high ductility and therefore high mechanical load-bearing capability.Initiatively electrolytic deposition can realize under the condition limited, and wherein, thickness is passed through the supplied quantity of electric charge and therefore determined by electric current.In addition can avoid or at least reduce printed conductor transversely direction expansion and therefore avoid or at least reduce short circuit risk.
Little horizontal printed conductor width and trickle pitch can be realized, such as to be less than the printed conductor width of 60 μm and to be less than 150 μm---with larger transverse width structure and therefore the pitch of 100 μm is such as less than, because can electrical contact toe-in or the connection contact site that is connected with toe-in without any problems.Therefore, the transverse width of printed conductor and pitch do not limit by electrolytic method in principle.
Printed conductor is contacted with each other by a common toe-in or multiple toe-in, wherein, toe-in only arranges the step for active electrolytic deposition or initiatively plating, but is removed again subsequently, so that printed conductor is in due form for separating of function, such as, can realize the difference contact of electric components.
The removal of toe-in can realize advantageous by the removal of whole contact area, and therefore described contact area such as can be configured to thin contact chip, and described thin contact chip is only temporarily configured to a part for injection moulding body together, but is removed subsequently.
For this reason, contact area or contact chip can be configured to have expectation separation unit, contact chip subsequently expectation separate section from.Therefore, each printed conductor by expect separation unit extend at least one toe-in arranged in the contact areas, thus along expect separate section from time realized each printed conductor separation or plating isolation.Expect that separation unit also can be constructed by mechanical reduction at this, namely, be especially configured to expect fracture portion, thus by such as bending or realizing mechanical breaking process by machine cuts.In addition, also can by laser cutting or laser ablation make expectation separate section from.
Can additional advantage be realized thus:
Only larger surf zone can structuring and electrodepositable, and described larger surf zone also has for toe-in and if desired for connecting the contact chip surf zone of contact site except the circuit surface region of substrate; But this does not cause processing delay.
By the separation of contact area, the plating achieving each printed conductor with high fail safe is separated or isolation.
Therefore, method according to the present invention when very little additional expend allow high process fail safe, it has large advantage, such as especially electroplating technology and Material selec-tion improvement and fast technique guide.
Replace the separation of contact area also can only toe-in and connection contact site additional if desired be removed from contact area, such as, pass through laser ablation.Therefore, also contact area can be utilized subsequently, such as, for location and the process of MID circuit carrier.
Toe-in especially can be straight line, if such as expect that separation unit is set to expect that fracture portion is for directly fractureing or cutting contact area.But also can realize nonlinear or non-directional toe-in structure, wherein, be such as separated at this and realized by cutting or punching press or described laser ablation.
Accompanying drawing explanation
Fig. 1: the details amplification of MID circuit carrier before contact chip is separated according to an embodiment of the invention is shown;
Fig. 2 to 6: the sequential step that the method for the manufacture of MID circuit carrier according to an embodiment of the invention is shown.
Embodiment
According to Fig. 1, three-dimensional injection moulding body 3 is constructed by plastic material or moulding material.At least one surf zone 4 of injection moulding body 3 constructs printed conductor structure 5, and it has multiple single printed conductor 6.According to execution mode illustrated in the accompanying drawings, be structured as the surf zone 4 with printed conductor 6 and substantially flatly or entirely construct; But also printed conductor 6 can be configured on bending or three-dimensionally shaped face, such as, in the cylindrical region also illustrated below further in FIG in principle.
The injection moulding body 3 of single type has substrate 7 as subregion and contact chip 2, described substrate and contact chip are by expecting that fracture portion 8 is connected, wherein, expect fracture portion 8 can be configured to such as in FIG by the thinning part shown in otch 9, be configured to recess or indenture.Contact chip 2 is extended to from substrate by expectation fracture portion 8 through structurized surf zone 4; Therefore, substrate 7 is formed circuit surface region 4a, and on contact chip 2, forms contact chip surf zone 2a, they are by one or more continuous print metal layer formation by expecting fracture portion 8 extension jointly.
Each printed conductor 6 extends through the connecting plate 10 in this bending at a right angle, and extend through from connecting plate 10 and expect that fracture portion 8 is to the common toe-in 12 constructed at contact chip surf zone 2a, described toe-in therefore with the electrical contact of whole printed conductor 6, wherein, toe-in 12 is transitioned into the connection contact site 14 that constructs on contact chip surf zone 2a or is attached thereto.Central web 10 such as also can extend completely through contact chip 2, but wherein, such structure is more expensive and high cost.
Substrate 7 is together with circuit surface region 4a until expect that fracture portion 8 forms a MID circuit carrier 1, and wherein, first multiple printed conductors 6 of circuit surface region 4a are electrically connected or short circuit by toe-in 12.
For Fig. 1 execution mode alternatively, also can there is the MID circuit carrier 1 of multiple contact chip 2, thus the central web 10 of each contact chip 2 contacts with a part for line 6.
Being manufactured in Fig. 2 to 6 of MID circuit carrier 1 describes in one embodiment.In principle can with different MID manufacture methods structure MID circuit carrier 1.Particularly depict a kind of laser direct organization (LDS) below, and without loss of generality.
First, according to Fig. 2, construct injection moulding body 3 by the plastic material of blast blending or moulding material with injection moulding process.
At this, injection moulding body 3 can be constructed in a unique step, or first construct substrate 7 and injection moulding contact chip 2.
Patterned surface region 4 in Fig. 3 to 5 subsequently; This especially can be realized by means of the laser beam 13 indicated at this by laser direct organization (LDS), but other MID techniques are also possible.Therefore, first exposed by laser direct organizationization in figure 3 and therefore activate the metal crystal nuclei 16 indicated in figure 3.Therefore, first exposing the printed conductor region 106 of more late printed conductor 6, is the toe-in region 112 on the position of the toe-in 12 treating more late structure and the connection contact site region 114 on the position of connection contact site 14 for the treatment of more late structure in addition.
Subsequently according to Fig. 4 deposit short without the metal level 21 of foreign current, especially copper (Cu) layer 21 as electric conducting material.Therefore, in the step of Fig. 4, electroless plating is realized by potential difference when not applying external voltage.Therefore, the step of Fig. 4 by being immersed in applicable bath 13, especially have in the solution of copper ion and realize, described solution has the voltage potential higher than metal crystal nuclei 16.
Injection moulding body 3 is applied by the mode of initiatively electrolysis subsequently according to Fig. 5.For this reason, general being placed into by injection moulding body 3 has in the electrolysis bath of liquid be applicable to of applicable metal ion such as copper ion, nickel ion and gold ion (Cu, Ni, Au), and therefore the connection contact site 14 applicable current potential V being applied to contact chip 2 is applied on central web 10, generally to connect the negative potential V relative to another electrode 20 be immersed in electrolysis bath of liquid on contact site 14.Therefore, by applying voltage U, connect contact site 14 together with central web 10 and all printed conductor 6 be arranged on the negative potential common relative to of this bath or another electrode 20 in electrolysis bath of liquid 17.Construct metal level 18 thus, described metal level forms the printed conductor structure 5 with printed conductor 6, the formation toe-in 12 according to Fig. 1 according to structuring and connects contact site 14.
The separation of contact chip 2 is realized subsequently according to Fig. 6.This especially can be embodied as machinery separation by fractureing of contact chip 2, namely such as by bending, ruptures targetedly because be configured with at expectation place of fracture portion 8.Because each printed conductor 6 extends through expect fracture portion 8, so printed conductor 6 no longer contacts with each other after removal contact chip 2 and central toe-in 12, but can contact separately on connecting plate 10.
Replace mechanical breaking, also can be realized the separation of contact plate 2 by separation by laser (laser) or machine cuts; In addition, other interfering separation are also possible.
Contact chip 2 is retained subsequently in the execution mode revised compared to Fig. 6; Correspondingly, also do not need in principle and advantageously in said embodiment not presence watch in the distance until it vanishes the portion of splitting 8.In the step of immediately Fig. 5, printed conductor 6 is mutually electrically separated, its mode is, at least optionally removes central toe-in 12 and such as also has and connect contact site 14, such as, pass through laser ablation.Contact chip 2 may be used for the location of MID circuit carrier 1 subsequently.
But in the execution mode of Fig. 2 to 6, the separating step of Fig. 6 can be realized after assembly, thus contact chip 2 may be used for the location of MID circuit carrier 1 subsequently.
Conductor contact sheet structure 5 can have a large amount of, such as more than ten printed conductor 6, wherein, each printed conductor 6 such as has the printed conductor width L being less than 60 μm, and has the pitch interval d (interval between each printed conductor 6 or printed conductor center) being less than 100 μm.
Claims (11)
1., for the manufacture of a method for MID circuit carrier (1), it has at least following steps:
By the injection moulding body (3) of injection molding technology structure single type, described injection moulding body has substrate (7) and contact area (2); When activator metal nucleus (16) at the upper structured circuit surf zone (4a) of described substrate (7) and at the upper structured contact sheet surf zone (2a) of described contact area (2), wherein, in the upper structuring printed conductor region (105) of described circuit surface region (4a), described printed conductor region extends to the contact chip surf zone (2a) of described contact area (2); Like this without foreign current ground on structurized circuit surface region (4a) and described contact chip surf zone (2a), depositing the first metal layer (21), make at least two printed conductors (6) extend at least one from described circuit surface region (4a) and be configured in toe-in (12) described contact chip surf zone (2a), wherein, described printed conductor (6) is contacted with each other by described at least one toe-in (12); Go up at described the first metal layer (21) when applying current potential (V) to described toe-in (12) or electrochemically construct the second metal level (18) together with described the first metal layer; And at least remove described toe-in (12) and make described printed conductor (6) electrically separated.
2. method according to claim 1, it is characterized in that, construct between described substrate (7) and described contact area (2) and expect separation unit (8), wherein, described multiple printed conductor (6) extends to described toe-in (12) from described circuit surface region (4a) by described expectation separation unit (8); And make described contact area (2) be separated along expectation separation unit (8) from described substrate (7) and described printed conductor (6) is separated when removing described toe-in (12).
3. method according to claim 2, it is characterized in that, described expectation separation unit (8) is configured to the expectation fracture portion (8) with material thinning part, such as cutting (9), and described contact area (2) is separated by means of described toe-in (12) machinery, such as, makes it rupture by bending.
4. method according to claim 2, is characterized in that, by laser cutting, described contact area (2) is separated at described expectation separation unit (8) place.
5. method according to claim 1 and 2, is characterized in that, under described contact area (2) does not have separative situation, such as remove described at least one toe-in (12) by laser ablation.
6. the method according to any one of the preceding claims, it is characterized in that, especially described the first metal layer (21) is formed with copper ion in first bath (13), and especially described second metal level (18) is formed with gold ion in the second bath (17), wherein, between the electrode (20) be applied in described second bath (17) and described the first metal layer (21), voltage (U) is applied.
7. the method according to any one of the preceding claims, it is characterized in that, described contact area (2) make connection contact site (14) contact with described at least one toe-in (12), wherein, described connection contact site (14) has the transverse width (a) larger than each printed conductor (6) and arranges the electrical contacts for the formation of the electrolytic deposition for the second metal level (21).
8. the method according to any one of the preceding claims, it is characterized in that, plastic material has metal crystal nuclei (16), and described metal crystal nuclei is exposed in by laser structured, structuring particularly by laser direct organization and arranges for constructing described printed conductor (6), at least one toe-in described (12) and preferred described connection contact site (14).
9. a MID circuit carrier (1), it can by the method manufacture according to any one of the preceding claims.
10. MID circuit carrier (1) according to claim 9, it is characterized in that, described printed conductor (6) has the first metal layer (21) and the second metal level (18) by active metallide structure, wherein, described printed conductor (6) has and is less than 150 μm, is such as less than the size of space (d) of 100 μm.
11. MID circuit carriers (1) according to claim 10, is characterized in that, described printed conductor (6) has the printed conductor width (L) being less than 60 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014206558.5A DE102014206558A1 (en) | 2014-04-04 | 2014-04-04 | Method for producing a MID circuit carrier and MID circuit carrier |
| DE102014206558.5 | 2014-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104981106A true CN104981106A (en) | 2015-10-14 |
Family
ID=54146390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510151889.8A Pending CN104981106A (en) | 2014-04-04 | 2015-04-01 | Method for producing a MID circuit carrier |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6646943B2 (en) |
| CN (1) | CN104981106A (en) |
| DE (1) | DE102014206558A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
| CN108702838A (en) * | 2016-01-20 | 2018-10-23 | 松下知识产权经营株式会社 | Circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6338547B2 (en) * | 2015-03-31 | 2018-06-06 | オリンパス株式会社 | Molded circuit component, method for manufacturing molded circuit component, and circuit module |
| DE102017201634B3 (en) | 2017-02-01 | 2018-06-14 | Leoni Kabel Gmbh | Strand-shaped element and method for producing a strand-like element |
| CN111497116A (en) * | 2019-01-31 | 2020-08-07 | 深圳正峰印刷有限公司 | Preparation method of injection molding structural part with integrated intelligent surface |
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2014
- 2014-04-04 DE DE102014206558.5A patent/DE102014206558A1/en active Pending
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- 2015-03-31 JP JP2015071002A patent/JP6646943B2/en active Active
- 2015-04-01 CN CN201510151889.8A patent/CN104981106A/en active Pending
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| US20080212972A1 (en) * | 2006-12-15 | 2008-09-04 | Nelson Stephen T | Molded communications module having integrated plastic circuit structures |
| TW200906249A (en) * | 2007-07-16 | 2009-02-01 | Nanya Technology Corp | Gold finger of circuit board and fabricating method thereof |
| CN102014579A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Gold-plating method of long and short golden fingers |
| CN102740589A (en) * | 2011-04-01 | 2012-10-17 | 易鼎股份有限公司 | Composite circuit board with easy-to-break structure |
| CN103037615A (en) * | 2011-09-30 | 2013-04-10 | 无锡江南计算技术研究所 | Printed circuit board and formation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
| CN108702838A (en) * | 2016-01-20 | 2018-10-23 | 松下知识产权经营株式会社 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015201634A (en) | 2015-11-12 |
| JP6646943B2 (en) | 2020-02-14 |
| DE102014206558A1 (en) | 2015-10-08 |
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