CN111497116A - Preparation method of injection molding structural part with integrated intelligent surface - Google Patents
Preparation method of injection molding structural part with integrated intelligent surface Download PDFInfo
- Publication number
- CN111497116A CN111497116A CN201910097789.XA CN201910097789A CN111497116A CN 111497116 A CN111497116 A CN 111497116A CN 201910097789 A CN201910097789 A CN 201910097789A CN 111497116 A CN111497116 A CN 111497116A
- Authority
- CN
- China
- Prior art keywords
- injection molding
- electronic component
- printed
- ink
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
- B29C2045/14245—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
- B29C2045/14704—Coating articles provided with a decoration ink decorations
Abstract
The invention relates to a preparation method of an injection molding structural part with an integrated intelligent surface, which comprises the following steps: A. printing a conductive circuit on the reverse side of the substrate by using conductive ink; B. covering and printing insulating ink on the conductive circuit, and completely drying; C. pressing the printed base material into a 3D-shaped printed product; D. electrically connecting an electronic component to a corresponding position of the conductive circuit on the printed product pressed into the 3D shape by using a conductive adhesive; E. and (3) placing the printed product in the 3D shape and electrically connected with the electronic component into an injection mold, adding a molten injection molding material, and performing injection molding to obtain the integrated intelligent surface injection molding structural component. According to the preparation method of the injection molding structural member with the integrated intelligent surface, disclosed by the invention, the electronic component and the circuit are directly embedded into the injection molding structural member without being connected with the FPCB, so that the surface intelligence of the injection molding structural member is directly realized, the weight is obviously reduced, the space is obviously reduced, and the injection molding structural member has great advantages in the aspects of moisture resistance and dust resistance.
Description
Technical Field
The invention relates to the technical field of printing, in particular to a preparation method of an injection molding structural part with an integrated intelligent surface.
Background
At present, the industrial fields of new energy automobiles, airplanes, household appliances, consumer electronics and the like all use a process of combining a touch panel and a flexible circuit board, are particularly heavy in structure, high in cost and complex in manufacturing, and are not beneficial to continuous development in the aspect of future light weight requirements.
In patent CN201410749946, an off-mold electronic film and a manufacturing method thereof are proposed, which have great defects in the fixing and position of electronic components, and the electronic components have plastic part grooves which are easy to loosen, and are particularly troublesome to operate. Patent CN201721683724 proposes an integrated intelligent surface structure functional piece, and this process needs to be connected with an actual FPCB line, but has the problems of high cost, complex manufacturing and the like, and does not meet the requirement of future light weight.
Disclosure of Invention
The invention aims to provide a preparation method of an injection molding structural part with an integrated intelligent surface, and solves the problems of heavy structure, complex manufacturing, high cost and the like in the process of combining a touch panel with an electronic element and a flexible circuit board in the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows: a preparation method of an injection molding structural part with an integrated intelligent surface comprises the following steps:
A. printing a conductive circuit on the reverse side of the substrate by using conductive ink;
B. covering and printing insulating ink on the conductive circuit, and completely drying;
C. pressing the printed base material into a 3D-shaped printed product;
D. electrically connecting an electronic component to a corresponding position of the conductive circuit on the printed product pressed into the 3D shape by using a conductive adhesive;
E. and (3) placing the printed product with the 3D shape of the connected electronic component into an injection mold, adding a molten injection molding material, and performing injection molding to obtain the integrated intelligent surface injection molding structural component.
In the preparation method of the present invention, step a is preceded by step F: and printing an image-text decoration on the back surface of the substrate to form an image-text decoration layer, wherein the conductive circuit is printed on the image-text decoration layer.
In the preparation method of the present invention, in step B, an impact resistant ink is further printed on the insulating ink and completely dried.
In the preparation method of the invention, a high-temperature resistant adhesive is printed on the impact-resistant ink and is completely dried.
In the manufacturing method of the present invention, in step C, the printed base material is pressed into a 3D-shaped print using a high-pressure molding apparatus or a hot press molding apparatus.
In the preparation method of the invention, a step G is further included between the steps D and E: and (4) dripping the high-temperature-resistant insulating glue on the electronic component to fix the electronic component.
In the preparation method, the high-temperature-resistant insulating glue is coated on the periphery of the electronic component.
The preparation method of the injection molding structural part with the integrated intelligent surface has the following beneficial effects: according to the preparation method of the injection molding structural member with the integrated intelligent surface, disclosed by the invention, the electronic component and the circuit are directly embedded into the injection molding structural member without being connected with the FPCB, so that the surface intelligence of the injection molding structural member is directly realized, the weight is obviously reduced, the space is obviously reduced, and the injection molding structural member has great advantages in the aspects of moisture resistance and dust resistance.
Detailed Description
The preparation method of the injection-molded structural part with the integrated intelligent surface of the invention is further explained by combining the following embodiments:
the invention relates to a preparation method of an injection molding structural part with an integrated intelligent surface, which comprises the following steps:
s1, printing a conductive circuit on the reverse side of the substrate by using conductive ink; the substrate may be, for example, a plastic film such as pc (polycarbonate) or PET (polyethylene terephthalate); the conductive ink can be conductive silver paste or conductive copper paste and the like;
s2, printing insulating ink on the conducting circuit in a covering mode, and completely drying; the insulating ink is stretchable insulating ink for subsequent 3D press forming, and may be stretchable insulating ink, such as a full set of ink for polo, malaibao ink, etc., PDT-110 stretchable insulating oil from meihua corporation, etc.;
impact-resistant ink is printed on the insulating ink and is thoroughly dried, so that the effects of impact resistance and buffering are achieved, and ink flushing during subsequent injection molding can be prevented, such as the IPA-1100A model of the Meilihua company; the impact-resistant ink is also printed with a high-temperature-resistant adhesive and is completely dried, such as the IMD-306 model of the Meilihua company, so that the impact-resistant ink and the injection molding material are bonded, and the combination of the impact-resistant ink and the injection molding material is more stable;
s3, pressing the printed base material into a 3D-shaped printed product by using high-pressure forming equipment or hot-press forming equipment; the 3D shape refers to a shape having a concave-convex structure, and may be various shapes, as required;
s4, electrically connecting the electronic component to the corresponding position of the conductive circuit on the printed product pressed into the 3D shape by using the conductive adhesive; the electronic components include, but are not limited to, resistors, capacitors, potentiometers, valves, heat sinks, and the like; the conductive adhesive can be conductive adhesive, the conductive adhesive is adhesive with certain conductivity after being solidified or dried, and the conductive adhesive can also be conductive silver paste, conductive copper paste and the like;
s5, dripping high-temperature-resistant insulating glue on the electronic component, and completely coating the high-temperature-resistant insulating glue on the periphery of the electronic component to fix the electronic component; wherein, the high-temperature resistant insulating glue can be silica gel glue and the like;
s6, placing the 3D-shaped printed product electrically connected with the electronic component into an injection mold, adding molten injection molding material, and performing injection molding to obtain the integrated intelligent surface injection molding structural part, wherein the injection molding material can be PC (polycarbonate), PET (polyethylene terephthalate), ABS (acrylonitrile butadiene styrene) and other plastic materials.
If the text is needed, the method may further include, before step S1, step S0: the back surface of the substrate is printed with the graphic decoration layer, and the conductive circuit is printed on the graphic decoration layer.
According to the preparation method of the injection molding structural part with the integrated intelligent surface, the traditional circuit is replaced by the printed circuit, the electronic component is attached to the printed circuit by the conductive adhesive to generate the conductive circuit, and after the conductive circuit is pressed into a 3D shape under the hot pressing or high pressure condition, the electronic function of the conductive circuit cannot be deteriorated or disappear; through a special surface mounting process, electronic components are protected from loosening during the injection molding process of the conductive circuit; the conductive circuit is embedded into the injection molding structural part and forms a whole with the injection molding structural part, so that the surface of the injection molding structural part has an electronic function.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (7)
1. A preparation method of an injection molding structural part with an integrated intelligent surface is characterized by comprising the following steps:
A. printing a conductive circuit on the reverse side of the substrate by using conductive ink;
B. covering and printing insulating ink on the conductive circuit, and completely drying;
C. pressing the printed base material into a 3D-shaped printed product;
D. electrically connecting an electronic component to a corresponding position of the conductive circuit on the printed product pressed into the 3D shape by using a conductive adhesive;
E. and (3) placing the printed product with the 3D shape of the connected electronic component into an injection mold, adding a molten injection molding material, and performing injection molding to obtain the integrated intelligent surface injection molding structural component.
2. The method of claim 1, further comprising, before step a, step F: and printing an image-text decoration on the back surface of the substrate to form an image-text decoration layer, wherein the conductive circuit is printed on the image-text decoration layer.
3. The method according to claim 1, wherein in step B, an impact resistant ink is further printed on the insulating ink and completely dried.
4. The method of claim 3, wherein a high temperature resistant adhesive is further printed on the impact resistant ink and dried thoroughly.
5. The production method according to claim 1, wherein in step C, the printed substrate is pressed into a 3D-shaped print using a high-pressure molding apparatus or a hot press molding apparatus.
6. The method of claim 1, further comprising, between steps D and E, step G: and (4) dripping the high-temperature-resistant insulating glue on the electronic component to fix the electronic component.
7. The manufacturing method according to claim 6, wherein the high-temperature-resistant insulating glue is coated on the periphery of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097789.XA CN111497116A (en) | 2019-01-31 | 2019-01-31 | Preparation method of injection molding structural part with integrated intelligent surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097789.XA CN111497116A (en) | 2019-01-31 | 2019-01-31 | Preparation method of injection molding structural part with integrated intelligent surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111497116A true CN111497116A (en) | 2020-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910097789.XA Pending CN111497116A (en) | 2019-01-31 | 2019-01-31 | Preparation method of injection molding structural part with integrated intelligent surface |
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| Country | Link |
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| CN (1) | CN111497116A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382531A (en) * | 2021-06-02 | 2021-09-10 | 深圳市合盛创杰科技有限公司 | In-mold electronic panel with double-layer plastic structure and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1557622A (en) * | 2004-02-07 | 2004-12-29 | 福建省石狮市通达电器有限公司 | Plastic member coated with film to decorate surface in mould and its making method |
| CN103092445A (en) * | 2013-01-08 | 2013-05-08 | 苏州市智诚光学科技有限公司 | Manufacturing method of capacitive touchpad |
| DE102014206558A1 (en) * | 2014-04-04 | 2015-10-08 | Robert Bosch Gmbh | Method for producing a MID circuit carrier and MID circuit carrier |
| CN106797702A (en) * | 2014-03-06 | 2017-05-31 | 塔科图特科有限责任公司 | Method, relevant apparatus and product for manufacturing electronic product |
| CN208428873U (en) * | 2018-06-29 | 2019-01-25 | 深圳市华仁三和科技有限公司 | A kind of IMD panel |
-
2019
- 2019-01-31 CN CN201910097789.XA patent/CN111497116A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1557622A (en) * | 2004-02-07 | 2004-12-29 | 福建省石狮市通达电器有限公司 | Plastic member coated with film to decorate surface in mould and its making method |
| CN103092445A (en) * | 2013-01-08 | 2013-05-08 | 苏州市智诚光学科技有限公司 | Manufacturing method of capacitive touchpad |
| CN106797702A (en) * | 2014-03-06 | 2017-05-31 | 塔科图特科有限责任公司 | Method, relevant apparatus and product for manufacturing electronic product |
| DE102014206558A1 (en) * | 2014-04-04 | 2015-10-08 | Robert Bosch Gmbh | Method for producing a MID circuit carrier and MID circuit carrier |
| CN208428873U (en) * | 2018-06-29 | 2019-01-25 | 深圳市华仁三和科技有限公司 | A kind of IMD panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382531A (en) * | 2021-06-02 | 2021-09-10 | 深圳市合盛创杰科技有限公司 | In-mold electronic panel with double-layer plastic structure and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200807 |
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| RJ01 | Rejection of invention patent application after publication |