CN106816385A - A kind of wiring method and chip module - Google Patents
A kind of wiring method and chip module Download PDFInfo
- Publication number
- CN106816385A CN106816385A CN201710053221.9A CN201710053221A CN106816385A CN 106816385 A CN106816385 A CN 106816385A CN 201710053221 A CN201710053221 A CN 201710053221A CN 106816385 A CN106816385 A CN 106816385A
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- China
- Prior art keywords
- plastic cement
- cement pedestal
- chip
- line
- chip module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a kind of wiring method and chip module.Wherein, the wiring method includes：Plastic cement pedestal is formed by injection moulding；Using laser activation on the plastic cement pedestal default position, formed activated face；The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is paved with activated face, form wiring route.Technical scheme provided in an embodiment of the present invention, connected up on the plastic cement pedestal of chip module by using LDS techniques, then the circuit for being formed on plastic cement pedestal is electrically connected with the circuit on FPCB again, the area of the line holding FPCB of relatively long distance can so be reduced, so as to reduce the area of FPCB, space hold of the chip module to mobile terminal is saved.
Description
Technical field
The present invention relates to manufacturing process area, more particularly to a kind of wiring method and chip module.
Background technology
As the function of mobile terminal is more and more, in order to support the realization of function, the hardware configuration in mobile terminal
It is more and more.In the prior art, as shown in Figure 1 to Figure 3, segment chip module includes：Plastic cement pedestal 101, it is arranged on plastic cement base
(the Flexible Printed Circuit of flexible PCB 103 that chip 102 on seat 101 is electrically connected with chip 102
Board, abbreviation FPCB) and the connector 104 that is electrically connected with flexible PCB 103.Wherein, letter is gone out from chip diverse location
Number line, the cabling on FPCB plates is also different, such as the holding wire from chip away from connector position out, general cloth line-spacing
From more long, and may need to avoid other device architectures or circuit, the circuit of arrangement can be in irregular shape, the wiring of occupancy
Area can be larger, and causing needs the FPCB of larger area and carry substantial amounts of wiring, and the FPCB of large area make it is originally nervous
Mobile terminal space is more nervous.
The content of the invention
A kind of wiring method and chip module are the embodiment of the invention provides, with solution in the prior art chip module
The big problem of FCPB areas occupied.
A kind of first aspect, there is provided wiring method, including：
Plastic cement pedestal is formed by injection moulding；
Using laser activation on the plastic cement pedestal default position, formed activated face；
The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is paved with activated face, form wiring line
Road.
A kind of second aspect, there is provided chip module, including：
Flexible PCB that plastic cement pedestal, the chip being arranged on plastic cement pedestal are electrically connected with the chip and with it is described
The connector of flexible PCB electrical connection；
Wherein, the first line that many strip adoption laser direct structuring techniques are formed is provided with the plastic cement pedestal, it is described
The second circuit corresponding with the first line is provided with flexible PCB, the first line is right with the chip respectively
The signal pin answered and corresponding second circuit are electrically connected.
The beneficial effects of the invention are as follows：
Above-mentioned technical proposal, by using laser direct structuring technique (Laser Direct Structuring, abbreviation
LDS) connected up on the plastic cement pedestal of chip module, the wiring route for then being formed on the plastic cement pedestal again with FPCB on
Circuit is electrically connected, and can so reduce the area of the line holding FPCB of relatively long distance, so as to reduce the area of FPCB, saves core
Space hold of the piece module to mobile terminal.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be in embodiment or description of the prior art
The required accompanying drawing for using is briefly described, it should be apparent that, drawings in the following description are only some realities of the invention
Example is applied, for those of ordinary skill in the art, without having to pay creative labor, can also be attached according to these
Figure obtains other accompanying drawings.
Fig. 1 represents the front view of chip module of the prior art；
Fig. 2 represents another front view of chip module of the prior art；
Fig. 3 represents the side view of chip module of the prior art；
Fig. 4 represents that the present invention first implements the flow chart of the wiring method of offer；
Fig. 5 represents the front view of chip module provided in an embodiment of the present invention；
Fig. 6 represents the side view of chip module provided in an embodiment of the present invention；
Fig. 7 represents another side view of chip module provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
First embodiment
A kind of wiring method is the embodiment of the invention provides, as shown in figure 4, including：
Step 401, by injection moulding formed plastic cement pedestal.
In the embodiment of the present invention, the plastic cement pedestal is by a kind of modified plastic rubber for including organometallic compounds using injection work
Skill is made.
Wherein, plastic cement pedestal provided in an embodiment of the present invention can be the pedestal for setting camera chip, it is also possible to
It is the pedestal for setting fingerprint chip, it is of course possible to understanding, can also be that other can implement the pedestal of LDS techniques.
Step 402, using laser activation on plastic cement pedestal default position, formed activated face.
In the embodiment of the present invention, the plastic cement pedestal of injection moulding, in the presence of laser exciting, the chemical combination key of modified plastic rubber
Can be opened, the metallic in modified plastic rubber is exposed, therefore in wiring process, plastic cement pedestal be irradiated using laser
Upper default position (needing the position of wiring), it becomes possible to which the activated face needed for being formed, is that further wiring lays the first stone.
Step 403, plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is paved with activated face, form cloth
Line circuit.
The metallic being exposed in step 402, the introducing a fine variety as metal deposit in activity copper facing liquid medicine very high,
Promote the copper in liquid medicine to be paved with whole activated face, i.e., the circuit for being capable of conduction, such as Fig. 5 and Tu are formed on the plastic cement pedestal of insulation
In 6 505 shown in, and do not connected up on plastic cement pedestal in the prior art, as shown in Figures 2 and 3.
The embodiment of the present invention is connected up using LDS techniques on plastic cement pedestal, the wiring for then being formed on plastic cement pedestal
Circuit is electrically connected with the circuit on FPCB again, wiring is not limited on FPCB, can so reduce the circuit of relatively long distance
The area of FPCB is taken, so as to reduce the area of FPCB, space hold of the chip module to mobile terminal is saved.Wherein, LDS works
Skill maturation is steady, flexible design, can realize three-dimensional Butut, is conducive to saving the inner space of mobile terminal.
Further, the embodiment of the present invention is in order that the wiring route formed on plastic cement pedestal can be with chip and FPCB
It is electrically connected, solder joint 506 in the two ends welding of the every wiring route formed on plastic cement pedestal, as shown in figure 5 and figure 7.
Further, in the embodiment of the present invention, activated face is located at the top surface of plastic cement pedestal (i.e. away from flexible PCB
Surface) on and/or the side in plastic cement base thickness direction on, you can with plastic cement pedestal away from flexible PCB surface
Connected up on the upper and/or side in plastic cement base thickness direction, concrete condition can be designed according to the actual requirements, can so be increased
Plus wiring space, make wiring more flexible.
In sum, the embodiment of the present invention is connected up by using LDS techniques on the plastic cement pedestal of chip module, so
The circuit for being formed on plastic cement pedestal afterwards is electrically connected with the circuit on FPCB again, wiring is not limited on FPCB, such energy
Enough reduce the area of the line holding FPCB of relatively long distance, so as to reduce the area of FPCB, save chip module to mobile terminal
Space hold.
Second embodiment
A kind of chip module is the embodiment of the invention provides, as shown in Figure 5 and Figure 6, including：Plastic cement pedestal 501, it is arranged on
Flexible PCB (i.e. FPCB) 503 and and flexible PCB that chip 502 on plastic cement pedestal 501 is electrically connected with chip 502
The connector 504 of 503 electrical connections.
Wherein, the first line that many strip adoption laser direct structuring techniques i.e. (LDS) is formed is provided with plastic cement pedestal 501
505, be provided with second circuit corresponding with first line 505 on flexible PCB 503, first line 505 respectively with chip 502
Upper corresponding signal pin and the electrical connection of corresponding second circuit.
The embodiment of the present invention is connected up using LDS techniques on plastic cement pedestal 501, then the shape on plastic cement pedestal 501
Into circuit electrically connected with the circuit on FPCB again, wiring is not limited on FPCB, can so reduce relatively long distance
The area of line holding FPCB, so as to reduce the area of FPCB, saves space hold of the module of chip 502 to mobile terminal.Its
In, LDS technical maturities are steady, flexible design, can realize three-dimensional Butut, are conducive to saving the inner space of mobile terminal.
Wherein, embodiment of the present invention chips 502 are the mould of chip 502 that camera or fingerprint recognition etc. meet said structure
Chip 502 in group.
Further, first line 505 is arranged on plastic cement pedestal 501 on the surface of flexible PCB 503 and/or moulds
On the side of matrix 501 thickness directions of seat, you can with the plastic cement pedestal 501 on the surface of flexible PCB 503 and/or
Connected up on the side of the thickness direction of plastic cement pedestal 501, concrete condition can be designed according to the actual requirements, can so be increased cloth
Space of lines, makes wiring more flexible.
For example, first line 505 includes：Along the first sub-line road away from flexible PCB 503 of plastic cement pedestal 501, with
And along plastic cement pedestal 501 thickness direction lay the second sub-line road and the 3rd sub-line road, the second sub-line road, the first sub-line road and
3rd sub-line road is sequentially connected, and the end on the first sub-line road is formed with the weldering connected with the corresponding signal pin on chip 502
Point, the end on the 3rd sub-line road is formed with the solder joint with corresponding second connection.
Further, as shown in figure 5 and figure 7, the embodiment of the present invention is in order that the circuit energy formed on plastic cement pedestal 501
Enough to be electrically connected with chip 502 and FPCB, the two ends of every first line 505 are respectively arranged with a solder joint 506, first line
505 are electrically connected by solder joint 506 with the second circuit.
In sum, the embodiment of the present invention is carried out by using LDS techniques on the plastic cement pedestal 501 of the module of chip 502
Wiring, the circuit for then being formed on plastic cement pedestal 501 is electrically connected with the circuit on FPCB again, wiring is not limited in FPCB
On, can so reduce the area of the line holding FPCB of relatively long distance, so as to reduce the area of FPCB, save the mould of chip 502
Space hold of the group to mobile terminal.
Above-described is the preferred embodiment of the present invention, it should be pointed out that the ordinary person for the art comes
Say, some improvements and modifications can also be made under the premise of principle of the present invention is not departed from, and these improvements and modifications also exist
In protection scope of the present invention.
Claims (7)
1. a kind of wiring method, it is characterised in that including：
Plastic cement pedestal is formed by injection moulding；
Using laser activation on the plastic cement pedestal default position, formed activated face；
The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is paved with activated face, form wiring route.
2. wiring method according to claim 1, it is characterised in that described that the plastic cement pedestal is placed on copper facing liquid medicine
In, the copper in copper facing liquid medicine is paved with activated face, the step of form wiring route after, the wiring method also includes：
Solder joint in the two ends welding of the every wiring route formed on the plastic cement pedestal.
3. wiring method according to claim 1, it is characterised in that the activated face is located at plastic cement pedestal top table
On face and/or on the side in the plastic cement base thickness direction.
4. a kind of chip module, it is characterised in that including：
Flexible PCB that plastic cement pedestal, the chip being arranged on plastic cement pedestal are electrically connected with the chip and with the flexibility
The connector of circuit board electrical connection；
Wherein, the first line that many strip adoption laser direct structuring techniques are formed, the flexibility are provided with the plastic cement pedestal
The second circuit corresponding with the first line is provided with circuit board, the first line is corresponding with the chip respectively
Signal pin and corresponding second circuit are electrically connected.
5. chip module according to claim 4, it is characterised in that the first line is arranged on the plastic cement pedestal back of the body
On the surface of the flexible PCB and/or on the side in the plastic cement base thickness direction.
6. chip module according to claim 4, it is characterised in that the two ends of every first line are respectively arranged with
One solder joint, the first line is electrically connected by the solder joint with second circuit.
7. chip module according to claim 4, it is characterised in that the chip is camera chip or fingerprint recognition core
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106816385A true CN106816385A (en) | 2017-06-09 |
| CN106816385B CN106816385B (en) | 2018-11-30 |
Family
ID=59111347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710053221.9A Active CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106816385B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633430A (en) * | 2013-11-29 | 2014-03-12 | 重庆国虹科技发展有限公司 | LDS technology-based novel antenna wiring method |
| CN104955278A (en) * | 2014-03-26 | 2015-09-30 | 华南理工大学 | Method for manufacturing three-dimensional circuit on surface of injection molded part |
| CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
-
2017
- 2017-01-24 CN CN201710053221.9A patent/CN106816385B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633430A (en) * | 2013-11-29 | 2014-03-12 | 重庆国虹科技发展有限公司 | LDS technology-based novel antenna wiring method |
| CN104955278A (en) * | 2014-03-26 | 2015-09-30 | 华南理工大学 | Method for manufacturing three-dimensional circuit on surface of injection molded part |
| CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106816385B (en) | 2018-11-30 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171107 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant after: VIVO MOBILE COMMUNICATION CO., LTD. Applicant after: Wewo Mobile Communication Co. Ltd. Beijing branch Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant before: VIVO MOBILE COMMUNICATION CO., LTD. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200526 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Patentee after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Co-patentee before: Wewo Mobile Communication Co. Ltd. Beijing branch Patentee before: VIVO MOBILE COMMUNICATION Co.,Ltd. |
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| TR01 | Transfer of patent right |