CN106816385A - A kind of wiring method and chip module - Google Patents
A kind of wiring method and chip module Download PDFInfo
- Publication number
- CN106816385A CN106816385A CN201710053221.9A CN201710053221A CN106816385A CN 106816385 A CN106816385 A CN 106816385A CN 201710053221 A CN201710053221 A CN 201710053221A CN 106816385 A CN106816385 A CN 106816385A
- Authority
- CN
- China
- Prior art keywords
- plastic cement
- cement pedestal
- chip
- line
- chip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 62
- 239000004568 cement Substances 0.000 claims abstract description 59
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 239000003814 drug Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 230000004913 activation Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 abstract description 29
- 239000004744 fabric Substances 0.000 description 3
- PQHZWWBJPCNNGI-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC(Cl)=CC=2Cl)Cl)=C1 PQHZWWBJPCNNGI-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 101150013987 FCPB gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106816385A true CN106816385A (en) | 2017-06-09 |
CN106816385B CN106816385B (en) | 2018-11-30 |
Family
ID=59111347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710053221.9A Active CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106816385B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103633430A (en) * | 2013-11-29 | 2014-03-12 | 重庆国虹科技发展有限公司 | LDS technology-based novel antenna wiring method |
CN104955278A (en) * | 2014-03-26 | 2015-09-30 | 华南理工大学 | Method for manufacturing three-dimensional circuit on surface of injection molded part |
CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
-
2017
- 2017-01-24 CN CN201710053221.9A patent/CN106816385B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103633430A (en) * | 2013-11-29 | 2014-03-12 | 重庆国虹科技发展有限公司 | LDS technology-based novel antenna wiring method |
CN104955278A (en) * | 2014-03-26 | 2015-09-30 | 华南理工大学 | Method for manufacturing three-dimensional circuit on surface of injection molded part |
CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
Also Published As
Publication number | Publication date |
---|---|
CN106816385B (en) | 2018-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171107 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant after: VIVO MOBILE COMMUNICATION CO., LTD. Applicant after: Wewo Mobile Communication Co. Ltd. Beijing branch Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant before: VIVO MOBILE COMMUNICATION CO., LTD. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200526 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Patentee after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Co-patentee before: Wewo Mobile Communication Co. Ltd. Beijing branch Patentee before: VIVO MOBILE COMMUNICATION Co.,Ltd. |
|
TR01 | Transfer of patent right |