CN104955278A - Method for manufacturing three-dimensional circuit on surface of injection molded part - Google Patents
Method for manufacturing three-dimensional circuit on surface of injection molded part Download PDFInfo
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- CN104955278A CN104955278A CN201410115751.8A CN201410115751A CN104955278A CN 104955278 A CN104955278 A CN 104955278A CN 201410115751 A CN201410115751 A CN 201410115751A CN 104955278 A CN104955278 A CN 104955278A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
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Abstract
The invention discloses a method for manufacturing a three-dimensional circuit on a surface of an injection molded part. The method comprises the steps of A. performing injection molding on a substrate layer through a double-material injection molding machine; B. performing injection molding on the upper surface of the substrate layer through the double-material injection molding machine for forming a metal powder injection-molded layer,, performing pressure-keeping cooling, and opening a mold for taking the injection molded part out; C. performing selective sintering on the metal powder injection molded layer on the surface of the injection molded part through the laser head a CO2 laser in a vacuum environment according to a pre-designed circuit wiring pattern path for forming a primary three-dimensional circuit; and D. performing electroless copper plating on the copper powder which is bared after laser sintering for obtaining an electroless copper-plated layer, thereby forming a copper lead. Relative to a traditional method for manufacturing the three-dimensional circuit, the method of the invention has a simple process and is suitable for high-precision batch production. According to the method of the invention, the three-dimensional circuit can be manufactured on the high-strength injection molded part, and use number of plate type printed circuit boards can be reduced, thereby reducing size and cost of an electronic product and satisfying a requirement for a specific structure.
Description
Technical field
The present invention relates to the manufacture method of three-dimensional circuit, particularly relate to, by laser, selective sintering is carried out to the moulding top layer containing metallic copper powder, and obtain copper conductor by electroless copper, thus manufacture the method for three-dimensional circuit on the surface at moulding.
Background technology
Three-dimensional circuit is also called stereo circuit, refer to by adopting certain processing method on the surface of injection-molded plastic housing, produce required figure wire, then by the assembling of electronic devices and components, the functions such as the protection of the electric interconnection of common printed circuit board, support and plastic casing are combined on a moulding, forms three-dimensional circuit carrier.
The method that tradition generates three-dimensional circuit can be divided into three kinds of methods such as quadric injection mould method, hot stamping and injection moulding composite algorithm.
(1) quadric injection mould method is also called secondary bicomponent injection molding method, and the most frequently used form is activated resin method and surface catalysis method.Activated resin ratio juris is: moulding with can plated resin and can not plated resin injection molded at twice, then plating on moulding, can metallized surfaces generate metallic circuit.Surface catalysis method utilizes to carry out catalytic activation at the resin surface of injection mo(u)lding, then the resin that do not activate of quadric injection mould thereon, and part not capped after plating becomes metallic circuit.The method design freedom is large, is applicable to large-scale production, but cost is high, investment large, flexibility degree is low.
(2) hot stamping is the figure according to design circuit, makes to be laid on the metal forming on moulding base layer surface and plastic base layer bonds by the mode of hot padding, after removing the metal forming do not bondd, and the conducting wire needed for formation.The method technological process is short, base layer material is applied widely, but three-dimensional freedom is less, can be used for manufacture and the production of simple three-dimensional circuit.
(3) main flow of injection moulding composite algorithm is: first make the plastic basis material with line pattern, then by its injection mo(u)lding, completes composite steps simultaneously, and the demoulding afterwards, completes metallization processes.This technique can be used for producing the three-dimensional circuit on some large-scale injection moldings, is not suitable for for manufacturing three-dimensional circuit on baroque moulding.
Above-mentioned three kinds traditional are carried out metallized method on moulding surface, and due to complex manufacturing technology, raw material loss is large, environmental pollution serious, can not meet the requirement that high accuracy and flexibility manufacture.For this reason, domestic and international researcher make great efforts one after another to attempt high for flexibility degree, be applied to moulding surface carry out manufacture and the reparation of three-dimensional circuit without the need to the process technology of directly writing of mask.
The present invention adopts the manufacture of laser selective sintering technology, has without the need to mask, the advantage such as the accuracy of manufacture is high, flexibility degree is high and applied widely.
Summary of the invention
The object of the invention is: propose a kind of by double-material injection-molding molding mode, on the moulding top layer containing metal dust, laser selective sintering is carried out to it, and obtains the wire of special metal wiring by chemical plating, thus manufacture the method for three-dimensional circuit on moulding surface.
The present invention is achieved by the following technical solutions.
Manufacture a method for three-dimensional circuit at moulding on the surface, comprise step:
A, form base layer by the common injection molding unit of double-material injection-molding machine and mold injection ground floor basis material, ensure the structural strength of moulding;
B, form metal dust injection molded layers by the metal dust injection molding unit of double-material injection-molding machine and mould to base layer upper surface injection moulding second layer compound, after pressurize cooling, moulding is taken out in die sinking, described second layer compound is by copper powder and can not form by plated resin binding agent, described copper powder size is 200 order-250 orders, and the mass percent in second layer compound is about 85%-90%, percentage by volume is 50%-55%;
C, pass through CO
2the laser head of laser carries out selective sintering according to the wiring figure path designed in advance in the metal dust injection molded layers on moulding surface under vacuum conditions, make can not vaporize after plated resin binding agent sintering in metal dust injection molded layers, thus expose copper powder and form preliminary three-dimensional circuits, described CO
2laser power is 20W-50W, and sweep speed is 100mm/s-300mm/s;
D, carry out electroless copper for laser sintered rear exposed copper powder, exposed copper powder deposits copper top layer, obtains chemical plating copper layer, thus by real for thickening for the preliminary three-dimensional circuits after sintering changes and be communicated with, strengthen conductivity, formation copper conductor.
Further, the material of described base layer is common plastics.
Further, the material of described base layer is the mixture of PC and ABS, and wherein, described PC mass percent is 70%, and described ABS mass percent is 30%, makes base layer have higher mechanical strength.
Compared to prior art, the invention has the beneficial effects as follows, adopt laser selective sintering technology and double-material injection-molding method, then by chemical-copper-plating process, surface metalation process is carried out to moulding, thus obtain three-dimensional circuit.Manufacture the method for three-dimensional circuit relative to tradition, present invention process is simple, is applicable to high accuracy, large batch of production.Directly can manufacture three-dimensional circuit on the moulding needing high strength, decrease the use of conventional print-circuit board, thus reduce volume and the cost of electronic product, meet the demand of special construction.
Accompanying drawing explanation
Fig. 1 is the double-material injection-molding shaping schematic view that the embodiment of the present invention uses.
Fig. 2 is the laser sintered process schematic of the embodiment of the present invention.
Fig. 3 is the moulding cross-sectional schematic represented after double-material injection-molding.
Fig. 4 is the moulding cross-sectional schematic represented after laser sintered.
Fig. 5 is the moulding cross-sectional schematic represented after electroless copper.
Fig. 6 is A place close-up schematic view in Fig. 4.
Fig. 7 is B place close-up schematic view in Fig. 5.
Number in the figure is respectively: 1 be ground floor punch, 2 be ground floor basis material, 3 be ground floor die, 4 be common injection molding unit, 5 be hot-runner nozzle, 6 be metal dust injection molding unit, 7 be second layer die, 8 be second layer compound, 9 be second layer punch, 10 be swivel plate, 11 be motor, 12 be laser head, 13 be copper powder, 14 be metal dust injection molded layers, 15 base layers, 16 are for chemical plating copper layer.
Embodiment
Be described in further detail goal of the invention of the present invention below in conjunction with the drawings and specific embodiments, embodiment can not repeat one by one at this, but therefore embodiments of the present invention are not defined in following examples.
Embodiment one
Manufacture a method for three-dimensional circuit at moulding on the surface, comprise step:
A, form base layer 15 by the common injection molding unit 4 of double-material injection-molding machine and mold injection ground floor basis material 2, described ground floor basis material 2 is common plastics, and the present embodiment selects the mixture of PC and ABS, wherein, described PC mass percent is 70%, and described ABS mass percent is 30%;
B, form metal dust injection molded layers 14 by the metal dust injection molding unit 6 of double-material injection-molding machine and mould to base layer 15 upper surface injection moulding second layer compound 8, after pressurize cooling, moulding is taken out in die sinking, described second layer compound 8 is by copper powder 13 and can not form by plated resin binding agent, described copper powder 13 is 200 orders, and the mass percent of 8 is 85% in second layer compound, percentage by volume is 50%;
C, pass through CO
2the laser head 12 of laser carries out selective sintering according to the wiring figure path designed in advance in the metal dust injection molded layers 14 on moulding surface under vacuum conditions, make can not vaporize after plated resin binding agent sintering in metal dust injection molded layers 14, thus expose copper powder 13 and form preliminary three-dimensional circuits, described CO
2laser power is 20W, and sweep speed is 100mm/s, and the preliminary three-dimensional circuit degree of depth of sintering is no more than 1mm, and width is for being less than 0.95mm;
D, carry out electroless copper for laser sintered rear exposed copper powder 13, exposed copper powder 13 deposits copper top layer, obtains chemical plating copper layer 16, thus by real for thickening for the preliminary three-dimensional circuits after sintering changes and be communicated with, strengthen conductivity, formation copper conductor.
It is shaping that the present embodiment employing double-material injection-molding machine carries out double-material injection-molding, and described double-material injection-molding machine as shown in Figure 1.Described double-material injection-molding machine comprises ground floor punch 1, ground floor compound 2, ground floor die 3, common injection molding unit 4, hot-runner nozzle 5, metal dust injection molding unit 6, second layer die 7, second layer compound 8, second layer punch 9, swivel plate 10 and motor 11.
Before injection moulding, produce double-material injection-molding mould according to three-dimensional circuit and corresponding moulding structure.Double-material injection-molding machine adopts parallel injection moulding, swivel plate 10 rotates the double-material injection-molding machine of 180 °, and wherein the common injection molding unit 4 of ground floor adopts common screw, and second layer metal powder injection molding unit 6 adopts metal dust injection moulding bolt special.Ground floor punch 1 is fixed on swivel plate 10, when after ground floor punch 1 and ground floor die 3 matched moulds, by common injection molding unit 4 injection moulding ground floor compound 2, control mould temperature, make ground floor compound 2 die sinking at a certain temperature, to ensure, with second layer compound 8, there is certain adhesive property.Motor 11 driven rotary plate 10 rotates 180 °, ground floor compound 2 is fixed on ground floor punch 1, after the position exchange of ground floor punch 1 and second layer punch 9, by ground floor punch 1 and second layer die 7 matched moulds, the mold cavity space injection moulding second layer compound 8 reserved after matched moulds by metal dust injection molding unit 6.After pressurize cooling, moulding is taken out in die sinking.Motor 11 rotates 180 ° again and enters next molding cycle.
Wherein, ground floor punch 1 is the same with second layer punch 9 size.Ground floor compound 2 can adopt general plastic rubber material, and the embodiment of the present invention adopts PC and ABS compound, PC mass fraction 70%, ABS mass fraction 30%.Second layer compound 8 adopts copper powder and can not the compound of plated resin binding agent composition, and copper powder adopts red copper copper powder, and size is 200 orders, and the mass percent in compound is 85%, and percentage by volume is 50%.The moulding that described method obtains as shown in Figure 3, comprising the metal dust injection molded layers 14(also i.e. second layer), moulding base layer 15(also i.e. ground floor).
Described moulding adopt on the surface laser selective sinter as shown in Figure 2.Fig. 2 is the laser selective sintering process schematic diagram of the embodiment of the present invention.Namely the embodiment of the present invention comprises laser head 12, copper powder 13, metal dust injection molded layers (also the second layer) 14, moulding base layer 15(also i.e. ground floor).
Adopt CAD Software for Design three-dimensional circuit wiring diagram, and pass through CO
2laser carries out selective sintering on moulding top layer to second layer compound by wiring figure path under vacuum conditions.CO
2laser power adopts 20W, and sweep speed is 100mm/s, can not sinter rear vaporization by plated resin binding agent, thus expose copper powder 13, as shown in Fig. 4 and Fig. 6 under this process conditions.A copper powder 13 particle part is embedded in metal dust injection molded layers (being also the second layer) 14, and another part is outside exposed.The degree of depth after oversintering is 0.2mm ~ 0.3mm.The conductor width obtaining preliminary three-dimensional circuit after oversintering is less than 0.95mm.Described method obtains moulding as shown in Figure 4, comprising copper powder 13, metal dust injection molded layers the 14(also i.e. second layer) and moulding base layer 15(be also ground floor).
The copper coating of described employing general chemistry obtains having the moulding of three-dimensional circuit as shown in Figure 5.Fig. 7 is the partial enlarged view of moulding after electroless copper.The moulding of effects on surface after laser selective sintering adopts traditional chemical depositing process to carry out electroless copper, copper powder 13 deposits copper top layer, obtains chemical plating copper layer 16, makes the copper powder after sintering 13 form wire and is communicated with, and increase its thickness.The thickness of described chemical plating copper layer 16 is subject to the control of chemical plating process.The moulding with three-dimensional circuit finally obtained as shown in Figure 5, comprising copper powder 13, metal dust injection molded layers the 14(also i.e. second layer), moulding base layer 15(also i.e. ground floor) and chemical plating copper layer 16.
Embodiment two
Manufacture a method for three-dimensional circuit at moulding on the surface, comprise step:
A, form base layer 15 by the common injection molding unit 4 of double-material injection-molding machine and mold injection ground floor basis material 2, described ground floor basis material 2 is common plastics, and the present embodiment selects PC;
B, form metal dust injection molded layers 14 by the metal dust injection molding unit 6 of double-material injection-molding machine and mould to base layer 15 upper surface injection moulding second layer compound 8, after pressurize cooling, moulding is taken out in die sinking, described second layer compound 8 is by copper powder 13 and can not form by plated resin binding agent, described copper powder 13 size is 220 orders, and the mass percent of 8 is 88% in second layer compound, percentage by volume is 52%;
C, pass through CO
2the laser head 12 of laser carries out selective sintering according to the wiring figure path designed in advance in the metal dust injection molded layers 14 on moulding surface under vacuum conditions, make can not vaporize after plated resin binding agent sintering in metal dust injection molded layers 14, thus expose copper powder 13 and form preliminary three-dimensional circuits, described CO
2laser power is 40W, and sweep speed is 200mm/s, and the preliminary three-dimensional circuit degree of depth of sintering is no more than 1mm, and width is for being less than 0.95mm;
D, carry out electroless copper for laser sintered rear exposed copper powder 13, exposed copper powder 13 deposits copper top layer, obtains chemical plating copper layer 16, thus by real for thickening for the preliminary three-dimensional circuits after sintering changes and be communicated with, strengthen conductivity, formation copper conductor.
Double-material injection-molding machine selected by the present embodiment is identical with embodiment 1.
Embodiment three
Manufacture a method for three-dimensional circuit at moulding on the surface, comprise step:
A, form base layer 15 by the common injection molding unit 4 of double-material injection-molding machine and mold injection ground floor basis material 2, described ground floor basis material 2 is common plastics, and the present embodiment selects ABS;
B, form metal dust injection molded layers 14 by the metal dust injection molding unit 6 of double-material injection-molding machine and mould to base layer 15 upper surface injection moulding second layer compound 8, after pressurize cooling, moulding is taken out in die sinking, described second layer compound 8 is by copper powder 13 and can not form by plated resin binding agent, described copper powder 13 size is 250 orders, and the mass percent of 8 is 90% in second layer compound, percentage by volume is 55%;
C, pass through CO
2the laser head 12 of laser carries out selective sintering according to the wiring figure path designed in advance in the metal dust injection molded layers 14 on moulding surface under vacuum conditions, make can not vaporize after plated resin binding agent sintering in metal dust injection molded layers 14, thus expose copper powder 13 and form preliminary three-dimensional circuits, described CO
2laser power is 50W, and sweep speed is 300mm/s, and the preliminary three-dimensional circuit degree of depth of sintering is no more than 1mm, and width is for being less than 0.95mm;
D, carry out electroless copper for laser sintered rear exposed copper powder 13, exposed copper powder 13 deposits copper top layer, obtains chemical plating copper layer 16, thus by real for thickening for the preliminary three-dimensional circuits after sintering changes and be communicated with, strengthen conductivity, formation copper conductor.
Double-material injection-molding machine selected by the present embodiment is identical with embodiment 1.
Three-dimensional circuit manufactured by the method manufacturing three-dimensional circuit at moulding on the surface of the present invention is attached on common moulding base layer top layer, decrease the space because ordinary circuit board occupies in electronic product, be conducive to the miniaturization of electronic product, meet special structural design needs simultaneously, solve some circuit common and the problem such as cannot to assemble in special injection molding part.The three-dimensional circuit that the method manufactures can in the front of moulding, and also at the back side of moulding, or also can adopt other double-material injection-molding machines, its thinking, technique and technical method are the same, do not repeat them here.
Above by reference to the accompanying drawings to invention has been exemplary description; obvious specific implementation of the present invention is not subject to the restrictions described above; as long as have employed the various transformations that method of the present invention is conceived and technical scheme is carried out; or directly apply to other occasion, all within protection scope of the present invention without improving.
Claims (2)
1. manufacture a method for three-dimensional circuit at moulding on the surface, it is characterized in that, comprise step:
A, form base layer (15) by the common injection molding unit (4) of double-material injection-molding machine and mold injection ground floor basis material (2);
B, form metal dust injection molded layers (14) by the metal dust injection molding unit (6) of double-material injection-molding machine and mould to base layer (15) upper surface injection moulding second layer compound (8), after pressurize cooling, moulding is taken out in die sinking, described second layer compound (8) is by copper powder (13) and can not form by plated resin binding agent, described copper powder (13) size is 200 order-250 orders, and the mass percent of (8) is 85%-90% in second layer compound, percentage by volume is 50%-55%;
C, pass through CO
2the laser head (12) of laser carries out selective sintering according to the wiring figure path designed in advance in the metal dust injection molded layers (14) on moulding surface under vacuum conditions, make can not vaporize after plated resin binding agent sintering in metal dust injection molded layers (14), thus expose copper powder (13) and form preliminary three-dimensional circuits, described CO
2laser power is 20W-50W, and sweep speed is 100mm/s-300mm/s;
D, carry out electroless copper for laser sintered rear exposed copper powder (13), on the copper top layer of the upper deposition of exposed copper powder (13), obtain chemical plating copper layer (16), thus preliminary three-dimensional circuits thickening the changes reality after sintering is communicated with, strengthen conductivity, form copper conductor.
2. the method manufacturing three-dimensional circuit at moulding on the surface according to claim 1, is characterized in that: the material of described base layer (15) is common plastics.
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| CN201410115751.8A CN104955278B (en) | 2014-03-26 | 2014-03-26 | A kind of method that three-dimensional circuit is manufactured on moulding surface |
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| CN201410115751.8A CN104955278B (en) | 2014-03-26 | 2014-03-26 | A kind of method that three-dimensional circuit is manufactured on moulding surface |
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| CN106816385A (en) * | 2017-01-24 | 2017-06-09 | 维沃移动通信有限公司 | A kind of wiring method and chip module |
| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN108411286A (en) * | 2018-01-31 | 2018-08-17 | 华东师范大学 | The manufacturing method of arbitrary configuration three-dimensional conductive metal micro-nanostructure |
| CN109664520A (en) * | 2018-05-29 | 2019-04-23 | 广东立义科技股份有限公司 | A kind of 3D printing injection molding process |
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| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN106816385A (en) * | 2017-01-24 | 2017-06-09 | 维沃移动通信有限公司 | A kind of wiring method and chip module |
| US11098691B2 (en) | 2017-02-03 | 2021-08-24 | General Electric Company | Methods for manufacturing wind turbine rotor blades and components thereof |
| US10830206B2 (en) | 2017-02-03 | 2020-11-10 | General Electric Company | Methods for manufacturing wind turbine rotor blades and components thereof |
| US10773464B2 (en) | 2017-11-21 | 2020-09-15 | General Electric Company | Method for manufacturing composite airfoils |
| US10821652B2 (en) | 2017-11-21 | 2020-11-03 | General Electric Company | Vacuum forming mold assembly and method for creating a vacuum forming mold assembly |
| WO2019103835A3 (en) * | 2017-11-21 | 2019-07-25 | General Electric Company | Apparatus and method for manufacturing composite airfoils |
| WO2019103827A3 (en) * | 2017-11-21 | 2019-08-08 | General Electric Company | Vacuum forming mold assembly and associated methods |
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| WO2019103825A3 (en) * | 2017-11-21 | 2019-07-18 | General Electric Company | Vacuum forming mold assembly and related methods of use |
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| CN108411286A (en) * | 2018-01-31 | 2018-08-17 | 华东师范大学 | The manufacturing method of arbitrary configuration three-dimensional conductive metal micro-nanostructure |
| CN108411286B (en) * | 2018-01-31 | 2023-11-24 | 华东师范大学 | Manufacturing method of three-dimensional conductive metal micro-nano structure with arbitrary configuration |
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