CN212305770U - Printed circuit board and display panel - Google Patents
Printed circuit board and display panel Download PDFInfo
- Publication number
- CN212305770U CN212305770U CN202020643118.7U CN202020643118U CN212305770U CN 212305770 U CN212305770 U CN 212305770U CN 202020643118 U CN202020643118 U CN 202020643118U CN 212305770 U CN212305770 U CN 212305770U
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- Prior art keywords
- circuit board
- printed circuit
- plating
- lead
- region
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Abstract
The embodiment of the utility model provides a printed circuit board and display panel. The problem that extra cost is increased due to the fact that excessive plating is formed in unnecessary areas is solved. The printed circuit board includes a cell region; a plurality of plating leads configured to plate the cell region, wherein the plating leads include a bent region, the plating leads of the bent region having a bent shape.
Description
Technical Field
The utility model relates to a show technical field, concretely relates to printed circuit board and display panel.
Background
In the semiconductor package substrate process, an electronic device may be mounted on a surface of a semiconductor package substrate, or in the case of a ball grid array substrate, electrical connection may be made with another package substrate. Wire bond pads or solder ball pads are used to provide electrical connections to an electronic device or another package substrate. If gold plating is performed on the gold-plated pad, the surface of the partial region connected to the plating lead is also gold-plated, and therefore, the surface of the partial region connected to the plating lead is relatively larger in area than the area of the gold-plated pad, and therefore, excessive gold plating is caused, increasing unnecessary costs.
Disclosure of Invention
In view of this, the embodiment of the present invention provides a printed circuit board and a display panel. The problem that extra cost is increased due to the fact that excessive plating is formed in unnecessary areas is solved.
An embodiment of the utility model provides a pair of printed circuit board and display device. The printed circuit board includes a cell region; a plurality of plating leads configured to plate the cell region, wherein the plating leads include a bent region, the plating leads of the bent region having a bent shape; a first region disposed at a periphery of the cell region, an electronic device within the first region being electrically connected to the plated lead.
In one embodiment, the bent shape is one or more of the following shapes: wavy, triangular or rectangular.
In one embodiment, the method further comprises: a bonding pad connected with the plating lead; and a fuse resistor connected in series between the pad 4 and the plating lead, configured to disconnect the plating lead.
In one embodiment, the fuse resistor has a fuse current less than a minimum breakdown current of devices on the printed circuit board; preferably, the fuse resistor has a fuse current of 0.5A to 1A.
In one embodiment, the fuse resistor has a resistance value of 10 Ω to 100 Ω; preferably, the fuse resistor 5 has a resistance value of 50 Ω.
In one embodiment, the fuse resistor is located at an edge position of the printed circuit board.
In one embodiment, the method comprises the following steps: a plurality of mold gates disposed in the first region, electrically connected to the plating leads of the bending region, and configured to achieve electrical connection with an electronic component; wherein an inner wall of the mold gate is covered with an electroplated layer having conductivity, and the mold gate is used for inserting a lead of the electronic component.
In one embodiment, a plurality of the mold gates have a plurality of sizes of apertures.
In one embodiment, the plating layer of the mold gate inner wall and the lead of the electronic component are soldered by dipping in molten solder.
A display panel comprising a printed circuit board as described in any of the above.
The embodiment of the utility model provides a printed circuit board and display panel, wherein printed circuit board includes the unit area; a plurality of plating leads configured to plate the cell region, wherein the plating leads include a bent region, the plating leads of the bent region having a bent shape. The electrical connection is made by the plating lead having the bent shape and the other region, that is, by making the other region and the lead of which the plating lead is connected to each other thinner and longer, the resistance of the plating lead becomes larger, thereby reducing the amplitude of the current applied to the other region. By reducing the magnitude of the current applied to other regions, a relatively thinner plated layer can be formed in other regions when plating, thereby saving plated metal and reducing cost waste.
Drawings
Fig. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a curved shape according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a curved shape according to another embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a curved shape according to another embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating an enlarged structure of a portion B of a printed circuit board according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a first region 3 of a printed circuit board according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention. Fig. 2 is a schematic structural diagram of a curved shape according to an embodiment of the present invention. Fig. 3 is a schematic structural diagram of a curved shape according to another embodiment of the present invention. Fig. 4 is a schematic structural diagram of a curved shape according to another embodiment of the present invention.
As shown in fig. 1 to 3, the printed circuit board includes a cell area 1 and a plurality of plating leads 2. A unit area 1 in which a plurality of unit plates 11 may be disposed; the electroplating lead 2 is used for electroplating the unit area 1; wherein, the electroplating lead 2 is configured to electroplate the unit area 1, the electroplating lead 2 can be electrically connected with the first area 3 outside the unit area 1, wherein the electroplating lead 2 comprises a bending area 21 and a non-bending area 2221, and the electroplating lead 2 in the bending area 21 has a bending shape. The electrical connection is made by the plating lead 2 and the first region 3 having the bent shape, that is, by making the lead, which connects the first region 3 and the plating lead 2 to each other, thinner and longer, the resistance of the plating lead 2 becomes larger, thereby reducing the magnitude of the current applied to the first region 3. By reducing the magnitude of the current applied to the first region 3, a relatively thinner plated layer can be formed in the first region 3 when plated, thereby saving plated metal and reducing cost waste.
It is understood that the first region 3 may be provided with the mold gate 31, or the first region 3 may be provided with other electronic devices, etc., and the present invention is not limited to the specific electronic devices provided in the first region 3.
It will also be appreciated that the bent shape may be one or more of the following: wavy lines (as shown in fig. 3), triangular (as shown in fig. 4), or rectangular (as shown in fig. 1). The shape of buckling can be selected according to the actual product demand, the utility model discloses do not do the injecion to the concrete shape of the shape of buckling.
It will also be appreciated that the printed circuit board may be a flexible printed circuit board, or the printed circuit board may also be a non-flexible printed circuit board. The specific nature of printed circuit board can be set for according to actual product needs, the utility model discloses do not do the injecing to printed circuit board's specific nature.
Fig. 5 is a schematic diagram illustrating an enlarged structure of a portion B of a printed circuit board according to an embodiment of the present invention.
As shown in fig. 5, the printed circuit board may further include a pad 4 and a fuse resistor 5. Wherein, pad 4 is connected with electroplating lead 2, and fusing resistance 5 sets up between pad 4 and electroplating lead 2, and the effect is for disconnecting electroplating lead 2, and fusing resistance 5 can be located printed circuit board's marginal position. Increase fusing resistor 5 between pad 4 and electroplating lead 2, like this when electroplating the completion back, only need increase the electric current make fusing resistor 5 fuse can break off electroplating lead 2, consequently, can avoid using the recess that produces when back-etch technology disconnection electroplating lead 2 to prevent to store the foreign matter in groove and the printed circuit board cutting bursts the limit, reinforcing printed circuit board peripheral roughness and pleasing to the eye degree.
It can be understood that fusing resistor 5 can be located printed circuit board's border position, perhaps fusing resistor 5 can also be located printed circuit board's other positions, under the prerequisite of guaranteeing fusing resistor 5 can break off electroplating lead 2, the utility model discloses do not do the injecture to what position that fusing resistor 5 is located printed circuit board.
The utility model discloses an embodiment, fusing resistance 5's fusing current is less than the minimum breakdown current of each device on the printed circuit board, and preferably, fusing circuit's fusing current can be at 0.5A ~ 1A. The fuse resistor 5 has a resistance of 10-100 ohms, and preferably, the fuse resistor 5 has a resistance of 50 ohms.
Fig. 6 is a schematic structural diagram of a first region 3 of a printed circuit board according to an embodiment of the present invention.
As shown in fig. 6, the printed circuit board may further include a plurality of mold gates 31, and the plurality of mold gates 31 may be disposed at the first region 3. The plurality of mold gates 31 are electrically connected to the plated leads 2 in the bending region 21, and function to electrically connect the electronic component to the printed circuit board. In which the inside of the mold gate 31 is covered with a plating layer having conductivity, and the electrical connection of the printed circuit board and the electronic component can be achieved by inserting the lead of the electronic component into the mold gate.
In an embodiment of the present invention, the mold gate 31 may have a plurality of sizes, and the mold gates 31 having different sizes may connect different kinds of electronic components, so that the printed circuit board may connect various kinds of electronic components.
It can be understood that the bore of the mold gate 31 can be 1mm, or the bore of the mold gate can be 0.9mm, and the specific numerical value of the bore of the plurality of mold gates 31 can be set according to the requirement of the product, the utility model discloses do not limit the specific numerical value of the bore of the plurality of mold gates 31.
In an embodiment of the present invention, the inner surface of the mold gate is covered with the conductive plating layer, and the solder filled in the mold gate is used to heat the printed circuit board, so that it is easy to ensure the solder to be wetted even if the mold gate 31 has a smaller cross-sectional area and is thin. With this configuration, the diameter of the mold gate 31 provided in the printed circuit board is changed in accordance with the pin arrangement around the pin to be provided in the electronic component, and solder wetting and high-density wiring can be simultaneously secured.
In an embodiment of the present invention, the display panel includes the printed circuit board of any one of the above embodiments, and the printed circuit board includes a unit area 1 and a plurality of plating leads 2. A unit area 1 in which a plurality of unit plates 11 may be disposed; the electroplating lead 2 is used for electroplating the unit area 1; wherein, the electroplating lead 2 is configured to electroplate the unit area 1, the electroplating lead 2 can be electrically connected with the first area 3 outside the unit area 1, wherein the electroplating lead 2 comprises a bending area 21 and a non-bending area 2221, and the electroplating lead 2 in the bending area 21 has a bending shape. The electrical connection is made by the plating lead 2 and the first region 3 having the bent shape, that is, by making the lead, which connects the first region 3 and the plating lead 2 to each other, thinner and longer, the resistance of the plating lead 2 becomes larger, thereby reducing the magnitude of the current applied to the first region 3. By reducing the magnitude of the current applied to the first region 3, a relatively thinner plated layer can be formed in the first region 3 when plated, thereby saving plated metal and reducing cost waste.
It can be understood that display panel can be the display panel on cell-phone, computer or the mobile unit, and display panel uses and what kind of display device can select according to the circumstances of reality, the utility model discloses do not do the restriction to display panel's specific application type.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalents and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A printed circuit board, comprising;
a cell region;
a plurality of plating leads for plating the cell area, wherein the plating leads include a bent area, and the plating leads of the bent area have a bent shape;
a first region disposed at a periphery of the cell region, an electronic device within the first region being electrically connected to the plated lead.
2. The printed circuit board of claim 1, wherein the bent shape is one or more of the following shapes: wavy, triangular or rectangular.
3. The printed circuit board of claim 1, further comprising:
a bonding pad connected with the plating lead; and
and a fusing resistor connected in series between the bonding pad and the plating lead to disconnect the plating lead.
4. The printed circuit board of claim 3, wherein the fuse resistor has a fuse current less than a minimum breakdown current of devices on the printed circuit board.
5. The printed circuit board of claim 3, wherein the fuse resistor has a resistance value of 10 Ω to 100 Ω.
6. The printed circuit board of claim 3, wherein the fuse resistor is located at an edge of the printed circuit board.
7. The printed circuit board of claim 1, comprising: the plurality of die gates are arranged in the first area, are electrically connected with the electroplating lead of the bending area and realize the electrical connection with an electronic component;
wherein an inner wall of the mold gate is covered with an electroplated layer having conductivity, and the mold gate is used for inserting a lead of the electronic component.
8. The printed circuit board of claim 7, wherein a plurality of the mold gates have a plurality of sizes of apertures.
9. The printed circuit board according to claim 7, wherein the plating layer of the mold gate inner wall and the lead of the electronic component are soldered by dipping in molten solder.
10. A display panel comprising the printed circuit board of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020643118.7U CN212305770U (en) | 2020-04-24 | 2020-04-24 | Printed circuit board and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020643118.7U CN212305770U (en) | 2020-04-24 | 2020-04-24 | Printed circuit board and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212305770U true CN212305770U (en) | 2021-01-05 |
Family
ID=73964735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020643118.7U Expired - Fee Related CN212305770U (en) | 2020-04-24 | 2020-04-24 | Printed circuit board and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212305770U (en) |
-
2020
- 2020-04-24 CN CN202020643118.7U patent/CN212305770U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210105 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |