CN211480296U - Antenna connection structure and mobile terminal with same - Google Patents
Antenna connection structure and mobile terminal with same Download PDFInfo
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- CN211480296U CN211480296U CN201921906071.2U CN201921906071U CN211480296U CN 211480296 U CN211480296 U CN 211480296U CN 201921906071 U CN201921906071 U CN 201921906071U CN 211480296 U CN211480296 U CN 211480296U
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Abstract
The utility model discloses an antenna connection structure and mobile terminal who has it, antenna connection structure includes: the antenna comprises a connecting area, wherein a metal coating is arranged on the connecting area of the antenna; and the circuit board is welded on the metal coating through soldering paste. According to the utility model discloses the antenna connection structure of implementing has that the electric connection impedance is low, signal loss advantage such as little.
Description
Technical Field
The utility model belongs to the technical field of the communication technology and specifically relates to an antenna connection structure and mobile terminal who has it is related to.
Background
The antenna connection structure 1 'in the related art, as shown in fig. 1, has an antenna 100' and a circuit board 200 ', and the circuit board 200' and the antenna 100 'are electrically connected by hot pressing through an anisotropic conductive film 300' (i.e., ACF).
The anisotropic conductive film 300' realizes an electrical connection method by providing conductive particles for point connection. The number of conductive particles in each connection region is limited (about 10), and therefore the impedance of the connection region is large, resulting in large signal loss.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide an antenna connection structure, which has the advantages of low electrical connection impedance, low signal loss, etc.
The utility model discloses still provide a mobile terminal who has above-mentioned antenna connection structure.
In order to achieve the above object, an embodiment according to a first aspect of the present invention provides an antenna connection structure, including: the antenna comprises a connecting area, wherein a metal coating is arranged on the connecting area of the antenna; and the circuit board is welded on the metal coating through soldering paste.
According to the utility model discloses antenna connection structure through set up metal coating on the connection area of antenna to this adhesive force that improves the soldering paste, recycles surface mounting technology (SMT promptly) and realizes the connection of circuit board and antenna. Compared with the antenna connection structure in the related art, the impedance of the electric connection is reduced, and then the signal loss is reduced.
In addition, according to the utility model discloses the antenna connection structure of implementing can also have following additional technical characteristics:
according to some embodiments of the invention, the metal coating is a copper coating, a gold coating, a nickel coating, a silver coating or a copper-nickel alloy coating.
According to some embodiments of the present invention, the metal plating layer is a plurality of and is in the connection region interval sets up, every the metal plating layer passes through the solder paste with the circuit board is connected. Because the impedance of copper, gold, nickel, silver and copper-nickel alloy is lower, and the adhesion to the solder paste is increased effectively, the resistance between the antenna and the circuit board can be further reduced, and the signal loss is reduced.
According to some embodiments of the present invention, the connection region is located at an edge of the antenna, and the edge of the circuit board is soldered to the metal plating layer through the solder paste. Whereby the impedance can be further reduced.
According to some embodiments of the invention, the antenna comprises: a substrate having an insulating property; an antenna pattern formed in a planar shape on the substrate, the antenna pattern having a conductive portion formed of a conductive film having a mesh structure; wherein at least a part of the conductive portion of the antenna pattern is located in the connection region, and the metal plating layer is provided on the conductive portion of the antenna pattern. This ensures the antenna design and achieves the low resistance required for the antenna.
Further, the substrate is a transparent substrate. Thus, the antenna can be arranged close to the surface of the device with the antenna, and good visual field permeability is obtained.
According to some embodiments of the present invention, the circuit board is a flexible circuit board. Therefore, the occupied space can be reduced, and the arrangement is more flexible.
Further, the circuit board is a polyimide-based flexible circuit board or an industrial liquid crystal polymer-based flexible circuit board. This further reduces signal loss.
According to some embodiments of the invention, the solder paste is solder paste. Therefore, the soldering paste can be melted at a lower temperature, and the circuit board and the antenna are not damaged.
According to the utility model discloses an embodiment of second aspect provides a mobile terminal, according to the utility model discloses a mobile terminal includes according to the embodiment of the first aspect antenna connection structure.
According to the utility model discloses mobile terminal, through utilizing according to the utility model discloses an embodiment of first aspect antenna connection structure, have advantages such as signal loss is little.
Drawings
The above advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an antenna connection structure in the prior art.
Fig. 2 is a top view of an antenna connection structure according to an embodiment of the present invention.
Fig. 3 is a side view of an antenna connection structure according to an embodiment of the present invention.
Fig. 4 is a schematic partial structure diagram of an antenna connection structure according to an embodiment of the present invention.
Reference numerals:
an antenna connection structure 1,
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means two or more, and "a plurality" means one or more.
The antenna connection structure 1 according to an embodiment of the present invention is described below with reference to the drawings.
As shown in fig. 2 to 4, the antenna connection structure 1 includes an antenna 100 and a circuit board 200.
The antenna 100 has a connection area, and the connection area of the antenna 100 is provided with a metal plating 110. The circuit board 200 is soldered to the metal plate 110 by the solder paste 210.
According to the utility model discloses antenna connection structure 1, through set up metal coating 110 on the connection region at antenna 100 to this adhesion force that improves soldering paste 210, recycle surface mounting technology (SMT promptly) and realize being connected of circuit board 200 and antenna 100. Compared to the antenna connection structure 1 ' in the related art, the resistance between the antenna 100 ' and the circuit board 200 ' is 2 Ω. The resistance between the antenna 100 and the circuit board 200 is 0.1 Ω, which reduces the impedance of the electrical connection, thereby reducing signal loss.
So, according to the utility model discloses an antenna connection structure 1 has advantages such as the electric connection impedance is low, signal loss is little.
According to some embodiments of the present invention, as shown in fig. 2-3, the metal coating 110 is a copper coating, a gold coating, a nickel coating, a silver coating, or a copper-nickel alloy coating. Thus, since the impedances of copper, gold, nickel, silver, and copper-nickel alloy are low and the adhesion to the solder paste 210 is increased effectively, the resistance between the antenna 100 and the circuit board 200 can be further reduced, and the signal loss can be reduced.
According to some embodiments of the present invention, as shown in fig. 2 to 3, the metal plating layer 110 is plural and is disposed at intervals in the connection region, and each metal plating layer 110 is connected to the circuit board 200 through the solder paste 210.
For example, the plurality of metal plating layers 110 have the same length and thickness, but may have different widths. Gaps exist between adjacent metal plating layers 110, and the widths of the gaps may be the same. The plurality of metal plating layers 110 are provided at intervals in the width direction of the antenna 100.
Thus, the contact area between the metal plating layer 110 and the circuit board 200 is reduced, so that the resistance between the antenna 100 and the circuit board 200 is reduced, the signal loss is reduced, and the accurate transmission of signals is reliably realized.
According to some embodiments of the present invention, as shown in fig. 2-3, the connection region is located at the edge of the antenna 100, and the edge of the circuit board 200 is soldered to the metal plating layer 110 through the solder paste 210.
For example, the connection region is located at one end of the antenna 100 in the length direction of the antenna 100 and extends along the width direction of the antenna 100, and is located at one side of the antenna 100 in the thickness direction of the antenna 100. The solder paste 210 is located between the metal plating layer 110 and the circuit board 200 in the thickness direction of the antenna 100. The circuit board 200 is soldered to the metal plate 110 at one end in the length direction thereof, and the circuit board 200 extends away from the antenna 100 in the length direction thereof.
Thus, the contact area between the antenna 100 and the circuit board 200 is small, so as to further reduce the impedance, and the signal loss is not easily caused.
According to some embodiments of the present invention, as shown in fig. 4, the antenna 100 includes a substrate 130 and an antenna pattern. The substrate 130 has an insulating property, the antenna pattern is formed in a planar shape on the substrate 130, the conductive portion 140 of the antenna pattern is formed of a conductive thin film having a mesh structure, and is formed of a metal film containing copper, nickel, aluminum, gold, silver, or the like, or a conductive paste film containing fine metal particles or a carbon paste film, and a fine mesh pattern is formed by photolithography of the metal thin film on the substrate 130, etching by a printing resist, printing of a conductive resin paste, or the like.
At least a part of the conductive part 140 of the antenna pattern is located in the connection region, and the metal plating layer 110 is provided on the conductive part 140 of the antenna pattern. Thereby, the design of the antenna 100 can be ensured and the low resistance required for the antenna 100 can be realized.
Further, the substrate 130 is a transparent substrate, for example, PET (i.e., polyethylene terephthalate) or CPI (transparent polyimide) or COP (cyclic olefin polymer). In this way, the antenna 100 can be provided close to the surface of the device having the antenna 100, and excellent field of view transparency can be obtained.
According to some embodiments of the present invention, as shown in fig. 2-3, the circuit board 200 is a flexible circuit board (i.e., FPC), for example, a polyimide-based flexible circuit board or an industrial liquid crystal polymer-based flexible circuit board, i.e., LCP (i.e., industrial liquid crystal polymer) or PI (polyimide) is used as a base material of the circuit board 200. Thus, the signal loss through the flexible circuit board is low, and further, the signal loss is reduced.
According to some embodiments of the present invention, as shown in fig. 2-3, the solder paste 210 is a solder paste, which is a low temperature solder paste having a melting point of 140-160 ℃. Thus, the solder paste 210 can be melted at a lower temperature, so that the circuit board 200 can be soldered on the antenna 100 without causing damage to the circuit board 200 and the antenna 100.
The following describes according to the embodiment of the present invention, the mobile terminal includes the antenna connection structure 1 according to the present invention, and the mobile terminal may be a mobile phone, a tablet computer, etc.
According to the utility model discloses mobile terminal, through utilizing according to the utility model discloses the antenna connection structure 1 of above-mentioned embodiment has advantages such as signal loss is little.
Other configurations of mobile terminals according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, references to the description of the terms "particular embodiment," "particular example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An antenna connection structure, comprising:
the antenna comprises a connecting area, wherein a metal coating is arranged on the connecting area of the antenna;
and the circuit board is welded on the metal coating through soldering paste.
2. The antenna connection structure according to claim 1, wherein the metal plating layer is a copper plating layer, a gold plating layer, a nickel plating layer, a silver plating layer, or a copper-nickel alloy plating layer.
3. The antenna connection structure according to claim 1, wherein the metal plating is plural and is provided at intervals in the connection region, and each of the metal plating is connected to the circuit board through the solder paste.
4. The antenna connection structure according to claim 1, wherein the connection area is located at an edge of the antenna, and the edge of the circuit board is soldered to the metal plating layer by the solder paste.
5. The antenna connection structure according to any one of claims 1 to 4, wherein the antenna includes:
a substrate having an insulating property;
an antenna pattern formed in a planar shape on the substrate, the conductive portion of the antenna pattern being formed of a conductive film having a mesh structure;
wherein at least a part of the conductive portion of the antenna pattern is located in the connection region, and the metal plating layer is provided on the conductive portion of the antenna pattern.
6. The antenna connection structure according to claim 5, wherein the substrate is a transparent substrate.
7. The antenna connection structure according to any one of claims 1 to 4, wherein the circuit board is a flexible circuit board.
8. The antenna connection structure according to claim 7, wherein the circuit board is a polyimide-based flexible circuit board or an industrial liquid crystal polymer-based flexible circuit board.
9. The antenna connection structure according to any one of claims 1 to 4, wherein the solder paste is a solder paste.
10. A mobile terminal, characterized in that it comprises an antenna connection structure according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921906071.2U CN211480296U (en) | 2019-11-06 | 2019-11-06 | Antenna connection structure and mobile terminal with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921906071.2U CN211480296U (en) | 2019-11-06 | 2019-11-06 | Antenna connection structure and mobile terminal with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211480296U true CN211480296U (en) | 2020-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921906071.2U Active CN211480296U (en) | 2019-11-06 | 2019-11-06 | Antenna connection structure and mobile terminal with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211480296U (en) |
-
2019
- 2019-11-06 CN CN201921906071.2U patent/CN211480296U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20211013 Address after: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Patentee after: Jiangxi zhanyao Microelectronics Co.,Ltd. Address before: 330000 Huangjiahu Road, Nanchang Economic and Technological Development Zone, Jiangxi Province Patentee before: Nanchang OFilm Tech. Co.,Ltd. |