CN109714882B - Mobile terminal and flexible circuit board - Google Patents
Mobile terminal and flexible circuit board Download PDFInfo
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- CN109714882B CN109714882B CN201811419360.XA CN201811419360A CN109714882B CN 109714882 B CN109714882 B CN 109714882B CN 201811419360 A CN201811419360 A CN 201811419360A CN 109714882 B CN109714882 B CN 109714882B
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Abstract
The invention discloses a flexible circuit board which comprises a conductive substrate and a protective film covering the surface of the conductive substrate, wherein the conductive substrate comprises a conductive circuit layer and a grounding layer which are arranged in a stacked mode, the conductive circuit layer and the grounding layer are insulated from each other, two ends of the conductive circuit layer are respectively provided with a row of conductive terminals which are arranged at intervals along the width direction of the conductive circuit layer, and two ends of the grounding layer are respectively provided with a grounding terminal. The flexible circuit board is provided with the grounding layer as a grounding channel, a grounding loop can be formed by the grounding terminals at the two ends and the circuit boards at the two ends respectively, and negative charges of the antenna can be effectively transmitted to the radio frequency device on the mainboard through the grounding channel of the flexible circuit board, so that the performance of the antenna is ensured.
Description
Technical Field
The invention relates to the technical field of signal transmission, in particular to a mobile terminal and a flexible circuit board.
Background
At present, the design cost and pressure of mobile phones are getting bigger and bigger, and in the front shell assembly of the mobile phone, a whole metal plate made of materials such as a steel plate or magnesium-aluminum alloy is added in order to ensure the grounding performance of the antenna and the structural performance of the whole mobile phone, so that a PCB (printed circuit board) in an antenna spring plate area and a PCB of an RF (Radio Frequency) device are grounded through the steel plate to reach the shortest path of a current loop, thereby achieving the effects of improving the performance of the antenna and reducing the loss.
In actual product manufacturing, in order to save design cost, a steel plate or a magnesium-aluminum alloy plate in a mobile phone needs to be removed, but a problem is caused by that a GND (Ground) line of a mobile phone antenna is disconnected between an antenna small plate and a main board, and an antenna loop current cannot effectively return to a main board PA (power amplifier), so that the antenna cannot form effective radiation, and the implementation of antenna performance is affected. Therefore, it is necessary to ensure the original antenna performance on the basis of omitting the steel plate, which is a great challenge to the design of the mobile phone.
Disclosure of Invention
In view of the defects in the prior art, the invention provides a mobile terminal and a flexible circuit board, which can ensure the radiation performance of an antenna on the premise of saving a metal plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
the flexible circuit board comprises a conductive substrate and a protective film covering the surface of the conductive substrate, wherein the conductive substrate comprises a conductive circuit layer and a grounding layer which are arranged in a stacked mode, the conductive circuit layer and the grounding layer are mutually insulated, a row of conductive terminals are arranged at two ends of the conductive circuit layer respectively and are arranged at intervals in the width direction of the conductive circuit layer, and grounding terminals are arranged at two ends of the grounding layer respectively.
As one embodiment, the conductive substrate further includes a flexible substrate and an adhesive layer, and each two adjacent structures of the flexible substrate, the conductive circuit layer and the ground layer are bonded through one adhesive layer.
As one embodiment, two ends of the ground layer are respectively provided with two ground terminals arranged at intervals, and the conductive terminal at each end is located between two adjacent ground terminals.
As one embodiment, one side of the conductive circuit layer is adhered to the surface of the flexible substrate, and the ground layer is adhered to the other side of the conductive circuit layer away from the flexible substrate.
In one embodiment, the orthographic projection of the ground layer completely covers the conductive circuit layer.
As one embodiment, the conductive substrate includes at least two ground layers, and at least two of the ground layers are electrically connected to each other through a first conductive via.
In one embodiment, the ground layer is a plurality of layers, and each two adjacent ground layers are electrically connected through at least one first conductive via.
As an implementation manner, at least one layer of the ground layer is disposed on each of two different sides of the flexible substrate, and the first conductive via simultaneously penetrates through the flexible substrate and the conductive circuit layer between the two ground layers electrically connected through the first conductive via, and is disposed in an insulating manner with respect to the conductive circuit layer.
As one embodiment, the conductive substrate includes at least two conductive circuit layers, and the two conductive circuit layers are electrically connected through a second conductive via.
Another objective of the present invention is to provide a mobile terminal, which includes a first circuit board, a second circuit board, and the flexible circuit board, wherein an antenna is disposed on the second circuit board, the first circuit board and the second circuit board are both provided with copper exposing regions, the flexible circuit board is electrically connected to the first circuit board and the second circuit board through the conductive terminals at two ends, and is respectively contacted with the copper exposing regions of the first circuit board and the second circuit board through the ground terminals at two ends.
The flexible circuit board is provided with the grounding layer as a grounding channel, a grounding loop can be formed by the grounding terminals at the two ends and the circuit boards at the two ends respectively, and negative charges of the antenna can be effectively transmitted to the radio frequency device on the mainboard through the grounding channel of the flexible circuit board, so that the performance of the antenna is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board applied to a mobile terminal according to the present invention;
FIG. 2 is a schematic structural diagram of a flexible printed circuit according to the present invention;
Fig. 3 is a schematic view of a laminated structure of a flexible wiring board of embodiment 1 of the present invention;
fig. 4 is a sectional view of a flexible wiring board of embodiment 1 of the present invention;
fig. 5 is a schematic view of a laminated structure of a flexible wiring board of embodiment 2 of the present invention;
fig. 6 is a sectional view of a flexible wiring board of embodiment 2 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and 2, the mobile terminal of the present invention mainly includes a flexible circuit board 10, a first circuit board 20, and a second circuit board 30, wherein the flexible circuit board 10 is connected between the first circuit board 20 and the second circuit board 30, the second circuit board 30 may be provided with an antenna, an antenna spring, etc., the first circuit board 20 may be provided with a main control chip and a radio frequency module, and the flexible circuit board 10 is electrically connected with the first circuit board 20 and the second circuit board 30 through conductive terminals 101 at both ends; the first circuit board 20 and the second circuit board 30 are both provided with copper exposed regions, and the flexible printed circuit board 10 is grounded by the grounding terminals 102 at both ends contacting the copper exposed regions of the first circuit board 20 and the second circuit board 30, respectively.
By using the grounding layer of the flexible circuit board as a grounding channel, grounding loops can be formed by the grounding terminals at the two ends of the flexible circuit board and the circuit boards at the two ends respectively, and negative charges of the antenna can be effectively transmitted to the radio frequency device on the mainboard through the grounding channel of the flexible circuit board, so that the performance of the antenna is ensured.
Example 1
As shown in fig. 3, specifically, the flexible wiring board 10 of the present embodiment is of a single-panel configuration, which includes a conductive base material 11 and a protective film 12 covering one surface of the conductive base material 11.
As shown in fig. 4, the conductive substrate 11 has a conductive circuit layer 112 and a ground layer 113 stacked on each other, the conductive circuit layer 112 and the ground layer 113 are insulated from each other, a row of conductive terminals 101 arranged at intervals along the width direction of the conductive circuit layer 112 is respectively disposed at two ends of the conductive circuit layer 112, and a ground terminal 102 is respectively disposed at two ends of the ground layer 113.
As a preferred implementation manner of this embodiment, the conductive substrate 11 specifically includes a flexible substrate 111, a conductive circuit layer 112, a ground layer 113, and an adhesive layer 114, where the conductive circuit layer 112 and the ground layer 113 are sequentially disposed on the flexible substrate 111 from bottom to top, and each two adjacent structures of the flexible substrate 111, the conductive circuit layer 112, and the ground layer 113 are bonded by the adhesive layer 114. That is, one surface of the conductive trace layer 112 is adhered to the surface of the flexible substrate 111, and the ground layer 113 is adhered to the other surface of the conductive trace layer 112 away from the flexible substrate 111. The protective film 12 generally includes another flexible substrate and a glue layer formed on the surface of the flexible substrate for adhesion, and the protective film 12 is attached to the surface of the outermost ground layer 113 through the glue layer.
In the ground layer 113, two ends of the length direction of the ground layer are respectively provided with two ground terminals 102 arranged at intervals at the end part, the conductive terminals 101 at each end are linearly arranged to form a gold finger for plugging and conducting, and the two ground terminals 102 at each end respectively clamp the corresponding conductive terminals 101 in the interval between the two ground terminals 102, and the three keep a certain interval. When the flexible printed circuit board 10 is used, the conductive terminals 101 at the two ends can be respectively connected to the first circuit board 20 and the second circuit board 30 through the board-to-board connector, the grounding terminals 102 at the two ends are directly contacted with the exposed copper regions of the corresponding circuit boards to realize a grounding loop, and the grounding terminals 102 do not affect the use of the board-to-board connector.
Preferably, the distance between the two ground terminals 102 at the same end is 10-20mm, and the distance between the flexible circuit board 10 and the antenna feed point is 20-30 mm. The conductive trace layer 112 and the ground layer 113 may be made of the same material, for example, copper foil, the adhesive layer 114 may be epoxy resin, and the flexible substrate 111 may be polyimide or PET.
As one embodiment, the orthographic projection of the ground layer 113 completely covers the conductive trace layer 112, and the ground layer 113 is attached to the conductive trace layer 112 below through an adhesive layer 114 and protects the conductive trace layer 112 therein.
In addition, the conductive substrate 11 may have at least two ground layers 113, the ground layers 113 may be electrically connected to each other through the first conductive vias, the number of the first conductive vias between two ground layers 113 may be more than one, a more reliable charge transfer channel may be realized, and when one of the ground layers 113 is broken, the ground may still be realized through the adjacent ground layer 113.
The first conductive via is formed by first forming a through hole penetrating through the two ground layers 113, and then forming a conductive channel in the through hole by electrodeposition or plating metal (such as copper plating). To save manufacturing process, at least one first conductive via penetrates all the ground layers 113 to electrically connect all the ground layers 113. Specifically, through holes penetrating all the ground layers 113 are formed at one time, and then conductive materials are formed in the through holes.
It should be noted that the number of the ground layers 113 is not limited to one or two, and may also be multiple layers, and each two adjacent ground layers 113 may be electrically connected through at least one first conductive via. The conductive substrate 11 may further include at least two conductive trace layers 112, and the two conductive trace layers 112 may be electrically connected through a second conductive via in a similar manner. Here, it should be emphasized that the second conductive via is disposed in insulation with respect to the ground layer 113, and the first conductive via is disposed in insulation with respect to the conductive circuit layer 112, so that the ground layer 113 and the conductive circuit layer 112 are in an isolated state without mutual influence therebetween.
Example 2
As shown in fig. 5, unlike embodiment 1, the flexible wiring board 10 of the present embodiment is of a double-sided board configuration including a conductive base material 11 and protective films 12 respectively covering two different side surfaces of the conductive base material 11.
As shown in fig. 6, the conductive substrate 11 specifically includes a flexible substrate 111 located in the middle, a conductive trace layer 112, a ground layer 113 and an adhesive layer 114 respectively located on two different sides of the flexible substrate 111, the conductive trace layer 112 and the ground layer 113 are sequentially disposed on the flexible substrate 111, and each two adjacent structures of the flexible substrate 111, the conductive trace layer 112 and the ground layer 113 are bonded by the adhesive layer 114. The two protective films 12 are respectively attached to the surface of the grounding layer 113 on the top surface and the bottom surface through adhesive layers.
At least one ground layer 113 is respectively arranged on two different sides of the flexible substrate 111, and the first conductive via 113h simultaneously penetrates through the conductive circuit layer 112 between the flexible substrate 111 and the two ground layers 113 electrically connected through the first conductive via 113h and is arranged in an insulating manner with the conductive circuit layer 112. Similarly, each side of the flexible substrate 111 of the conductive substrate 11 may also have at least two ground layers 113, at least two ground layers 113 may be electrically connected through a first conductive via 113h, and two conductive trace layers 112 may be electrically connected through a second conductive via 112h in a similar manner. The second conductive via 112h is insulated from the ground layer 113, and the first conductive via 113h is insulated from the conductive trace layer 112, so that the ground layer 113 and the conductive trace layer 112 are isolated from each other. Here, it is preferable that at least one first conductive via 113h is electrically connected to all the ground layers 113 at the same time, at least one second conductive via 112h is electrically connected to all the conductive line layers 112 at the same time, and both the first conductive via 113h and the second conductive via 112h penetrate the flexible substrate 111 in the middle at the same time.
In summary, the flexible printed circuit board of the present invention has the ground layer as the ground channel, and the ground terminals at the two ends can respectively form the ground loop with the circuit boards at the two ends, so that the negative charges of the antenna can be effectively transmitted to the rf device on the motherboard through the ground channel of the flexible printed circuit board, thereby ensuring the performance of the antenna. Meanwhile, a grounding layer/conductive circuit layer with a composite structure can be arranged in the conductive base material of the flexible circuit board, so that the circuit loop is more reliable, and the service life is longer.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (2)
1. The flexible circuit board is used for connecting an antenna and a circuit board and is characterized by comprising a conductive base material (11) and a protective film (12) covering the surfaces of two different sides of the conductive base material (11), wherein the conductive base material (11) comprises a flexible substrate (111) and a conductive line layer (112) and a ground layer (113) which are sequentially stacked on two different sides of the flexible substrate (111), the flexible substrate (111) and the conductive line layer (112) are bonded through a glue layer (114), the conductive line layer (112) and the ground layer (113) are bonded through a glue layer (114), the ground layer (113) is electrically connected through a first conductive via hole (113h) penetrating through the flexible substrate (111) and the glue layer (114) and penetrating through a gap in the conductive line layer (112), and the conductive line layer (112) is electrically connected through a second conductive via hole (113h) penetrating through the flexible substrate (111) and the glue layer (114) The conductive vias (112h) are electrically connected;
A row of conductive terminals (101) which are arranged at intervals along the width direction of the conductive circuit layer (112) are respectively arranged at two ends of the conductive circuit layer (112), a grounding terminal (102) is respectively arranged at two ends of the grounding layer (113), and the conductive terminals (101) and the grounding terminal (102) are positioned at different layers; the orthographic projection of the grounding layer (113) completely covers the conducting circuit layer (112), two ends of the grounding layer (113) are respectively provided with two grounding terminals (102) which are arranged at intervals, and the conducting terminals (101) at each end are arranged linearly to form a golden finger which can be inserted and conducted, and the golden finger is positioned between two adjacent grounding terminals (102); the two grounding terminals (102) at each end respectively clamp the corresponding golden finger in the interval between the two grounding terminals (102), and the three keep a certain interval.
2. The mobile terminal is characterized by comprising a first circuit board (20), a second circuit board (30) and the flexible circuit board of claim 1, wherein an antenna is arranged on the second circuit board (30), the first circuit board (20) and the second circuit board (30) are both provided with copper exposure areas, the flexible circuit board is electrically connected with the first circuit board (20) and the second circuit board (30) through the conductive terminals (101) at two ends, and the grounding terminals (102) at two ends are respectively in contact with the copper exposure areas of the first circuit board (20) and the second circuit board (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811419360.XA CN109714882B (en) | 2018-11-26 | 2018-11-26 | Mobile terminal and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811419360.XA CN109714882B (en) | 2018-11-26 | 2018-11-26 | Mobile terminal and flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN109714882A CN109714882A (en) | 2019-05-03 |
| CN109714882B true CN109714882B (en) | 2022-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811419360.XA Active CN109714882B (en) | 2018-11-26 | 2018-11-26 | Mobile terminal and flexible circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418497A (en) * | 2019-08-22 | 2019-11-05 | 京信通信技术(广州)有限公司 | Pcb board splicing construction and antenna assembly |
| CN117255148A (en) * | 2021-05-21 | 2023-12-19 | 荣耀终端有限公司 | Transmission assembly and foldable electronic equipment |
| CN114585150A (en) * | 2022-03-16 | 2022-06-03 | 安捷利（番禺）电子实业有限公司 | Reinforcing sheet, antenna assembly and radio frequency connecting assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204968221U (en) * | 2015-08-25 | 2016-01-13 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7030815B2 (en) * | 2004-09-08 | 2006-04-18 | Motorola, Inc. | Integrated patch antenna and electronics assembly and method for fabricating |
| CN101861050A (en) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Flexible printed circuit board |
| CN106470523B (en) * | 2015-08-19 | 2019-04-26 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN105792544A (en) * | 2015-12-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Manufacturing method of multi-layer flexible circuit board, multi-layer flexible circuit board and mobile terminal |
| CN206134908U (en) * | 2016-10-18 | 2017-04-26 | 上海光线新材料科技有限公司 | Cover membrane with EMI function |
| JP6982962B2 (en) * | 2017-02-16 | 2021-12-17 | 日本ルメンタム株式会社 | Optical module |
| CN108617075B (en) * | 2018-04-04 | 2020-07-03 | Oppo广东移动通信有限公司 | Electronic device and flexible circuit board assembly thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204968221U (en) * | 2015-08-25 | 2016-01-13 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
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| CN109714882A (en) | 2019-05-03 |
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