KR102363957B1 - Cable module and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a cable module and a method for manufacturing the same, and more particularly, a flexible circuit board (FPCB) capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed; Flexible Printed CircuitBoard) type cable module and a method for manufacturing the same.

Description

CABLE MODULE AND MANUFACTURING METHOD OF THE SAME

The present invention relates to a cable module and a method for manufacturing the same, and more particularly, a flexible circuit board (FPCB) capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed; It relates to a cable module of Flexible Printed CircuitBoard) type and a method for manufacturing the same.

Conventionally, in a mobile terminal, a coaxial cable having a transmission line therein is used for transmission of an internal electrical signal. However, the coaxial cable had a limited use area due to its high cost.

In addition, as 5G is commercialized and the number of antennas required for mobile terminals increases, the need for multiple lines increases. In the case of a coaxial cable, it is difficult to implement multiple lines in a limited mobile terminal size.

To improve this, a flexible flat cable using an impedance matching film has been developed, but in the case of a flexible flat cable, the cost is lower than that of a coaxial cable, but the shielding of electromagnetic waves was not perfect, and there was a problem in that cross-talk between signals occurred.

Specifically, when an electric signal is applied to the transmission line of a flat cable, electromagnetic wave interference (EMI) and noise occur. In the case of a conventional flexible flat cable, the shielding performance of these electromagnetic waves and noise is insufficient. there was

Therefore, it is necessary to develop an FPCB type cable module capable of realizing multiple lines within a limited space of a mobile terminal and improving signal transmission efficiency by improving the shielding performance of electromagnetic waves and noise.

Korean Utility Model Publication No. 20-0177475 (Jan. 24, 2000)

Accordingly, the technical problem of the present invention was conceived in this regard, and the present invention is a cable module capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed, and a method for manufacturing the same provides

In addition, a flexible cable module capable of slimming a mobile terminal by implementing multiple lines within a limited space and a method for manufacturing the same are provided.

According to an exemplary embodiment, a base substrate made of an insulating material; a transmission unit disposed on one side of the base substrate; a first grounding unit disposed along the transmission unit at both ends of one side of the base substrate; the other side of the base substrate A second ground portion disposed at both ends to correspond to the first ground portion; A first magnetic layer portion disposed on the other side of the second ground portion; A first cover layer disposed on the transmission unit and one side of the first ground portion part; a second cover layer part disposed on the other side of the first magnetic layer part; a third ground part disposed on one side of the first cover layer part; and a fourth ground part disposed on the other side of the second cover layer part; It provides a cable module, including.

The first cover layer part, the third ground part, the second cover layer part, and the fourth ground part may be connected through a via hole.

A second magnetic layer part is disposed on one side of the third ground part, a third cover layer part is disposed on one side of the second magnetic layer part, and a third magnetic layer part is disposed on the other side of the fourth ground part, The third magnetic A fourth cover layer part may be disposed on the other side of the layerer.

According to another embodiment of the present invention, there is provided a method for manufacturing a cable module according to claim 1, comprising: disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side; disposing a first magnetic layer portion on the other side; forming a transfer portion and a first ground portion by etching the first metal layer; forming an air gap by etching the second metal layer and the second magnetic layer portion; the transfer portion and arranging a first cover layer part on one side of the first ground part; arranging a second cover layer part on the other side of the first magnetic layer part; arranging a third ground part on one side of the first cover layer part; and disposing a fourth grounding part on the other side of the second cover layer part; including, providing a cable module manufacturing method.

The method may further include forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.

arranging a second magnetic layer part on one side of the third ground part; arranging a third magnetic layer part on the other side of the fourth ground part; arranging a third cover layer part on one side of the second magnetic layer part; and The method may further include disposing a fourth cover layer part on the other side of the third magnetic layer part.

According to an embodiment of the present invention, it is possible to improve the electromagnetic wave shielding and noise shielding performance of the cable module by providing a magnetic layer on the opposite side where the transmission line is formed.

In addition, it is possible to provide a flexible cable module capable of slimming a mobile terminal by realizing multiple lines within a limited space.

Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

The summary set forth above as well as the detailed description of preferred embodiments of the present application set forth below may be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the invention, there are shown in the drawings preferred embodiments. It should be understood, however, that the present application is not limited to the precise arrangements and instrumentalities shown.
1 is a schematic diagram of a cable module according to an embodiment of the present invention;
2 is a cross-sectional view of a cable module according to an embodiment of the present invention.
3 and 4 are reference views for explaining a method of manufacturing a cable module according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described to more easily disclose the contents of the present invention, and those of ordinary skill in the art can easily understand that the scope of the present invention is not limited to the scope of the accompanying drawings. you will know

And, in describing the embodiment of the present invention, the same name and the same reference numerals are used for components having the same function, but substantially not completely the same as the components of the prior art.

In addition, the terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, a cable module according to the present invention and a method for manufacturing the same will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numbers, A redundant description thereof will be omitted.

1 is a schematic diagram of a cable module 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 .

1 and 2 , the cable module 100 according to an embodiment of the present invention includes a base substrate 110 , a transmission unit 115 , a first grounding unit 113 , and a second grounding unit 117 . , It may include a first magnetic layer part 121 , a first cover layer part 133 , a second cover layer part 131 , a third ground part 143 , and a fourth ground part 141 .

The cable module 100 according to this embodiment is a process capable of manufacturing a circuit or cable having flexibility, such as a flexible printed circuit board (FPCB) process or a flat flexible cable (FFC) process is available.

Specifically, the base substrate 110 is formed of an insulating material, and may be formed of an insulating material that can be easily bent, such as polyimide, which is a raw material for a flexible printed circuit board. In this case, the base substrate 110 may be formed of, in addition to polyimide, polyethylene phthalate (PET) and thermoplastic polyurethane (TPU).

The transmission unit 115 is a component for transmitting a signal, is disposed on one side of the base substrate 110 and may be made of a material having excellent electrical conductivity, such as copper (Cu).

The transmission unit 115 may be formed by etching a portion of the copper thin film layer, and may be formed in a strip line shape through an etching process.

In the present embodiment, 'one side' may mean 'lower side' in the drawing.

The first grounding unit 113 may be disposed along the transmission unit 115 at both ends of one side of the base substrate 110 . The first grounding unit 113 is made of the same copper (Cu) as the transmission unit 115 . It may be formed of the same conductive material, and may be formed together with the transmission unit 115 by etching the copper thin film. Specifically, a pair of air gaps 116 are formed through the etching process of the copper thin film, and the middle part The transmission unit 115 is formed in the , and a pair of first ground units 113 may be formed on both sides of the base substrate 110 with the transmission unit 115 interposed therebetween.

The second ground unit 117 may be disposed at both ends of the other side of the base substrate 110 to correspond to the first ground unit 113 .

The second ground portion 117 may be formed of a conductive material such as copper (Cu) in the same manner as the first ground portion 113 , and may be formed to correspond to the first ground portion 113 by etching a copper thin film. In this case, the cross section of the second grounding part 117 may be formed to be the same as that of the first grounding part 113 .

In the present embodiment, 'the other side' may mean 'upper side' in the drawing.

The first magnetic layer part 121 may be disposed on the other side of the second ground part 117 .

The first magnetic layer part 121 is for shielding electromagnetic waves, and may be any one of a Ni (nickel) or Mn (manganese)-based structure having magnetism. It may include a blowout core.

The first magnetic layer part 121 may be coated with the second ground part 117 in the form of a thin film.

After the first magnetic layer part 121 is deposited on the second ground part 117 , it may be etched together with the second ground part 117 , and an air gap 125 may be formed by the etching process.

However, the first magnetic layer part 121 is not necessarily etched together with the second ground part 117 , and after etching the second ground part 117 , the first magnetic layer having the same shape as the second ground part 117 . It is also possible for the portion 121 to be deposited.

The first cover layer part 133 may be disposed on one side of the transmission part 115 and the first ground part 113 .

The first cover layer part 133 may be formed of an insulating material, and may be disposed by being adhered to one side of the transmission part 115 and the first contact part.

As described above, the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 . In this configuration, the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.

In addition, according to the present invention, it is possible to effectively shield electromagnetic waves introduced from the outside or generated by the transmission unit 115 by providing the first magnetic layer unit 121 and the air gap 125 on the opposite side of the transmission unit 115 . there is.

In addition, according to the present invention, the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases and the signal of the transmission unit 115 is increased. This is because the transmission efficiency may be reduced by increasing the loss.

As described above, according to the present invention, the transmission unit 115 is spaced apart from the base substrate 110 , the first cover layer unit 133 , the first ground unit 113 , and the first ground unit 113 and the transmission unit 115 . The shielding performance of electromagnetic waves and noise can be improved by sealing the air gap 116 that is disposed and formed, and disposing the first magnetic layer part 121 and another air gap 125 on the other side of the transmission part 115 . it can be

In this case, the second cover layer part 131 may be formed on the other side of the first magnetic layer part 121 , and the third ground part 143 may be formed on one side of the first cover layer part 133 , , A fourth ground portion 141 may be formed on the other side of the second cover layer portion 131 .

The second cover layer part 131 may be formed of the same insulating material as the first cover layer part 133 , and may be deposited by being adhered to the first magnetic layer part 121 .

The third ground part 143 and the fourth ground part 141 may be formed of a conductive material such as copper (Cu) or silver (Ag), and the first cover layer part 133 and the second cover layer part, respectively. It may be deposited by adhering to (131).

Meanwhile, the cable module 100 according to the present embodiment may further include a via hole 147 .

The via hole 147 electrically connects the third ground portion 143 disposed in one direction of the base substrate 110 and the fourth ground portion 141 disposed in the other direction of the base substrate 110 .

The via hole 147 includes the base substrate 110 , the first ground part 113 , the first cover layer part 133 , the second ground part 117 , the first magnetic layer part 121 , and the second cover layer. It may be formed by drilling the part 131 to form a cylindrical through hole.

Meanwhile, the cable module 100 according to the present embodiment further includes a second magnetic layer part 153 , a third cover layer part 163 , a third magnetic layer part 151 , and a fourth cover layer part 161 . may include

The second magnetic layer part 153 may be disposed on one side of the third ground part 143 , and the third cover layer part 163 may be disposed on one side of the second magnetic layer part 153 . The three magnetic layer part 151 may be disposed on the other side of the fourth ground part 141 , and the fourth cover layer part 161 may be disposed on the other side of the third magnetic layer part 151 .

The material and method of forming the second magnetic layer part 153 and the third magnetic layer part 151 are the same as those of the first magnetic layer part 121, and a description thereof will be replaced with the previous description.

In addition, since the material of the third cover layer part 163 and the fourth cover layer part 161 is the same as that of the first cover layer part 133 and the second cover layer part 131 , a description thereof is also replaced with the previous description. decide to do

According to the present embodiment, the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.

Meanwhile, FIGS. 3 and 4 are reference views for explaining a method of manufacturing the cable module 100 according to another embodiment of the present invention. Referring to FIGS. 3 and 4 , the present invention includes the cable module 100 A method of manufacturing is provided.

The method for manufacturing the cable module 100 according to the present embodiment includes disposing FCCL (S100), depositing a magnetic layer (S200), etching step (S300), disposing a cover layer (S400), disposing a metal layer It may include a step S500, a drilling step S600, a magnetic layer arrangement step S700, a cover layer arrangement step S800, and a punching step S900.

Hereinafter, a method of manufacturing the cable module 100 will be described in detail with reference to FIG. 4 .

A flexible copper clad laminated film (FCCL) provided with metal layers (a first metal layer and a second metal layer) stacked on both sides of the base substrate 110 made of an insulating material that can be easily bent, such as polyimide, is positioned. (a of FIG. 4). In this case, the metal layer may be made of a high-conductivity copper (Cu) material.

A first magnetic layer part 121 is laminated on the other side of the second metal layer laminated on the other side (upper surface in the drawing) of the disposed FCCL ( FIG. 4 b ).

The transfer part 115 and the first ground part 113 are formed by etching the first metal layer stacked on one side of the FCCL. In addition, the second metal layer and the second magnetic layer part 153 are etched to form the air gap 125 . ) is formed (FIG. 4 c).

The first cover layer part 133 is laminated on one side of the transmission unit 115 and the first ground unit 113 , and the second cover layer part 131 is laminated on the other side of the first magnetic layer part 121 . (Fig. 4d). In addition, a third ground part 143 is laminated on one side of the first cover layer part 133 , and a fourth ground part 141 is laminated on the other side of the second cover layer part 131 ( FIG. 4E ).

The stacked magnetic layer part and the cover layer part are the same as the magnetic layer part and the cover layer part described in the embodiment of the cable module 100, so the description of materials and properties will be replaced with the description of the previous embodiment.

As described above, the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 . In this configuration, the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.

In addition, according to the present invention, it is possible to effectively shield electromagnetic waves introduced from the outside or generated by the transmission unit 115 by providing the first magnetic layer unit 121 and the air gap 125 on the opposite side of the transmission unit 115 . there is.

In addition, according to the present invention, the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases and the signal of the transmission unit 115 is increased. This is because the transmission efficiency may be reduced by increasing the loss.

A via hole 147 is formed so that the first cover layer part 133, the third ground part 143, the second cover layer part 131, and the fourth ground part 141 are connected (FIG. 4f). . The via hole 147 includes the base substrate 110 , the first ground portion 113 , the first cover layer portion 133 , the second ground portion 117 , the first magnetic layer portion 121 , and the second cover layer. It may be formed by drilling the part 131 to form a cylindrical through hole.

The via hole 147 includes a first cover layer part 133 disposed in a direction on one side of the base substrate 110 , a third ground part 143 , and a second cover layer part disposed on the other side of the base substrate 110 . 131 and the fourth ground unit 141 are electrically connected.

The second magnetic layer part 153 is stacked on one side of the third ground part 143 , and the third magnetic layer part 151 is stacked on the other side of the fourth ground part 141 ( FIG. 4 g ). Next, a third cover layer part 163 is laminated on one side of the second magnetic layer part 153 , and a fourth cover layer part 161 is laminated on the other side of the third magnetic layer part 151 ( FIG. 4 h).

In the present embodiment, the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.

As described above, preferred embodiments according to the present invention have been reviewed, and the fact that the present invention can be embodied in other specific forms without departing from the spirit or scope of the present invention in addition to the above-described embodiments is one of ordinary skill in the art. It is obvious to them. Therefore, the above-described embodiments are to be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

100: cable module
110: base substrate
115: transmission unit
113: first grounding part
116, 125: air gap
117: second grounding part
121: first magnetic layer part
133: first cover layer part
131: second cover layer part
143: third ground portion
141: fourth ground portion
147: via hole
153: second magnetic layer unit
151: third magnetic layer part
163: third cover layer part
161: fourth cover layer part

Claims (6)

an insulating base substrate;
a transmission unit disposed on one side of the base substrate;
a first ground portion disposed along the transmission portion at both ends of one side of the base substrate;
a second ground portion disposed at both ends of the base substrate to correspond to the first ground portion;
a first magnetic layer portion disposed on the other side of the second ground portion;
a first cover layer part disposed on one side of the transmission part and the first ground part;
an air gap formed on the other side of the base substrate to overlap the transmission unit with the second ground unit and the first magnetic layer unit;
a second cover layer portion disposed on the other side of the first magnetic layer portion to cover the air gap;
A third ground portion disposed on one side of the first cover layer portion; And
A cable module including; a fourth ground portion disposed on the other side of the second cover layer portion.
According to claim 1,
The first cover layer part, the third ground part, the second cover layer part, and the fourth ground part are connected through a via hole, characterized in that the cable module.
3. The method of claim 2,
A second magnetic layer part is disposed on one side of the third ground part,
A third cover layer portion is disposed on one side of the second magnetic layer portion,
A third magnetic layer part is disposed on the other side of the fourth ground part,
A cable module, characterized in that a fourth cover layer portion is disposed on the other side of the third magnetic layer portion.
It relates to a method for manufacturing the cable module according to claim 1,
disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side;
disposing a first magnetic layer part on the other side of the second metal layer;
etching the first metal layer to form a transmission part and a first ground part;
etching the second metal layer and the first magnetic layer to form an air gap formed to overlap the transmission part;
disposing a first cover layer part on one side of the transmission part and the first ground part;
disposing a second cover layer to cover the air gap on the other side of the first magnetic layer;
disposing a third grounding part on one side of the first cover layer part; and
Placing a fourth ground part on the other side of the second cover layer part; Containing, Cable module manufacturing method.
5. The method of claim 4,
The method of manufacturing a cable module, characterized in that it further comprises forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.
6. The method of claim 5,
disposing a second magnetic layer part on one side of the third ground part;
disposing a third magnetic layer part on the other side of the fourth ground part;
disposing a third cover layer part on one side of the second magnetic layer part; and
The method further comprising the step of disposing a fourth cover layer portion on the other side of the third magnetic layer portion, Cable module manufacturing method.

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