M323672 八、新型說明： 【新型所屬之技術領域】· 尤指一種 本創作係有關一種高逮數位傳輸訊號線 月匕夠具有較佳之特性阻抗的傳輸訊號線。 【先前技術】 請參考第一圖所示以lvds訊號傳輸系統為例 。夜晶顯7F ϋ和系統主機之間的訊號通訊量， 且頻率非常高，所以，目前架設在液晶顯示器介面4 :’’先主機板介面3之間的高頻訊號傳輸系統，係採用具高超 L ( ’4Gb/s)、低功耗及低電磁輻射特性的低壓差 =^ ^'(LVDS 5 Low Voltage Differential Signal)4^^^ a 器介面2的訊號傳輸介面，並經由訊號傳輸線 hnsmissl〇n Line)5的連接，與系統主機板介面3上的 =虎_介面，即與系統域板介面3 i的連接器插座 起構成訊號連接，和共同組成一種習用LVDS訊號M323672 VIII. New description: [New technical field] · Especially one type of transmission signal line with high characteristic digital transmission line. [Prior Art] Please refer to the first figure for the lvds signal transmission system as an example. The signal communication between the 7F 夜 and the system host is very high. Therefore, the high-frequency signal transmission system currently installed between the LCD interface 4: ''the motherboard interface 3' is high-end. L ( '4Gb/s), low power consumption and low electromagnetic radiation characteristics of low voltage difference = ^ ^ ' (LVDS 5 Low Voltage Differential Signal) 4 ^ ^ ^ a device 2 interface signal transmission interface, and via the signal transmission line hnsmissl〇 The connection of n Line)5 is connected with the connector socket of the system board interface 3, that is, the connector socket of the system domain board interface 3 i, and together constitutes a conventional LVDS signal.
傳輸系統。'U 仁依據 ANSI_YUA-EIA-644-I995 定義的 LVDS 介面 必準這種LVDS吼號傳輸系統所使用的訊號傳輸線5， =須^特性阻抗(ZG)為丨隱±5%的訊號傳輸、線5，才能 夜晶顯示介面2和系統主機板介面3的電路阻抗(Z)相 白主同日守這種LVDS訊號傳輸系統必須在滿足這種條件 、 之下，才此降低電磁干擾（EMI)和減少雜訊(noise) M323672 干擾’和正確地執行液晶顯示器介面（或簡稱為LVDS介 面）2和系統主機板介面3·之間的訊號傳輸，或避免錯誤 動作產生；否則，液晶顯示器介面2和系統主機板介面3 _之間的訊號傳輸，將會產生信號反射和雜訊(noise)干擾， • 和造成信號損失、變形和失真。 而適合使用在這種習用LVDS訊號傳輸系統中的訊 號傳輸線5,目前有特性阻抗(Zq)設計成1〇〇Ω±5%的傳統 •連接線（Wire Cable)、軟性印刷電路板（FPC，Flexible Printed Circuit)或迷你同軸電纜(Mini c〇axiai等； 但，結構較為簡單且單價成本較低廉的習用軟性排線 (FFC，Flexible Flat Cable)，因為其特性阻抗(z〇)值大約都 在Π0Ω左右，不符合LVDS訊號傳輸系統的標準使用規 -範，故目前並不適合在習用LVDS訊號傳輸系統中使用。 【新型内容】Transmission system. 'U Ren's LVDS interface defined by ANSI_YUA-EIA-644-I995 must be used for the signal transmission line 5 used in this LVDS nickname transmission system, = characteristic impedance (ZG) is ± ± 5% of the signal transmission, line 5, the circuit impedance of the night crystal display interface 2 and the system motherboard interface 3 (Z) phased with the same day, the LVDS signal transmission system must meet this condition, and then reduce electromagnetic interference (EMI) and Reduce noise (Muse) M323672 Interference' and correctly perform signal transmission between LCD display interface (or LVDS interface for short) 2 and system motherboard interface 3, or avoid false actions; otherwise, LCD interface 2 and Signal transmission between the system board interface 3 _ will cause signal reflection and noise interference, and cause signal loss, distortion and distortion. The signal transmission line 5 suitable for use in the conventional LVDS signal transmission system has a conventional characteristic cable (Zq) designed to be 1 〇〇 Ω ± 5% of a wire cable, a flexible printed circuit board (FPC, Flexible Printed Circuit) or Mini Coaxial Cable (Mini c〇axiai, etc.; however, the simple flat cable (FFC) is simpler in structure and lower in cost. Because its characteristic impedance (z〇) value is about Π0Ω or so, does not meet the standard usage specifications of the LVDS signal transmission system, so it is not suitable for use in the conventional LVDS signal transmission system. [New content]
=本創作係之主要目的即在提供―種可形成電子線、》 學線、串行先進技術附件（SeHd Advaneed Tech她g Attachment ’以下簡稱SATA)，亦可應用於lvds訊號$ 輸糸統中以具有較佳特性阻抗之傳輸訊號線結構。 /、中σ亥傳輸汛號線結構係包括有：導電芦、 免 於導電層兩側之第一、-絕緣声以乃< 一 一、、、巴、，象層以及玟於弟二絕緣層相f ^之另側之接地板，該導電層之厚度為0.018〜0. _，覓度為0.2〜0.8 _，而第一、一 έ 0.04〜0.3 mm。 —層之厚度4 M323672 【實施方式】 μ本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地瞭解。 ^ 如第一圖本創作中傳輸訊號線之結構示意圖所示， 該傳輸訊號線1係包括有. 導迅層11 ’ 4導電層u係包括有複數條平行排列之 =、、泉111，其導電層11之整體厚度為0.018〜0.1 mm，寬度 為0.2〜〇·8麵。 第絕緣層12，該第一絕緣層12係設於導電層n 一侧’該第一絕緣们2係為PET材質，其厚度為〇.04〜ο」 mm 〇 、，第一、、、巴緣層13，该第二絕緣層υ係設於導電層η =於第-絕緣層12之另—侧，該第二絕緣層13係為聚 併本-甲酸乙二醇酯（ΡΕΤ)或聚亞酿胺（pc)lyimide)材 貝其厚度為0.04〜0.3 ium。 接地板14，係設於第二絕緣層13相對於導電層“ 之另一側，該接地板14可以為銅或鋁板。 曰 :由第-、二絕緣層12、13將導電層丨丨包覆在中 間亚構成—體，其製程簡便、製造成本較低，且且有矛軟、 耐燃、耐冷熱的特性，且該傳輸訊號線丨的特性阻: 係與傳輸訊號線1的導電層U的寬度及厚度几: 反比關係。 P 壬 當傳輸訊號線1的導電層u寬度增加時、或傳輸訊 M323672 號線1的導電層11增加時，傳輸訊號線丨的特性阻抗(z〇)= The main purpose of this creative department is to provide "electronic line," line, serial advanced technology attachment (SeHd Advaneed Tech her g Attachment 'hereinafter referred to as SATA), can also be applied to lvds signal $ 糸A transmission signal line structure having a better characteristic impedance. /, Zhongxihai transmission 汛 line structure includes: conductive reed, free of the first side of the conductive layer, - insulation sound to be "one, one, two, the image layer and the second layer of insulation The thickness of the conductive layer is 0.018~0. —Thickness of layer 4 M323672 [Embodiment] The characteristics of μ creation can be clearly understood by referring to the detailed description of the drawings and the examples. ^ As shown in the schematic diagram of the transmission signal line in the first picture, the transmission signal line 1 includes. The conduction layer 11' 4 conductive layer u includes a plurality of parallel arrays, and a spring 111. The conductive layer 11 has an overall thickness of 0.018 to 0.1 mm and a width of 0.2 to 〇·8 faces. The first insulating layer 12 is disposed on the side of the conductive layer n. The first insulating layer 2 is made of PET, and has a thickness of 〇.04~ο" mm 〇, first, and The edge layer 13 is provided on the conductive layer n = on the other side of the first insulating layer 12, and the second insulating layer 13 is a poly-ethylene glycolate (ΡΕΤ) or a poly The weight of the saponin (pc) lyimide is 0.04~0.3 ium. The grounding plate 14 is disposed on the other side of the second insulating layer 13 with respect to the conductive layer. The grounding plate 14 may be a copper or aluminum plate. 曰: the conductive layer is wrapped by the first and second insulating layers 12 and 13. Covering the intermediate substructure, the process is simple, the manufacturing cost is low, and the spear is soft, flame resistant, cold and hot resistant, and the characteristic resistance of the transmission signal line is: the conductive layer U of the transmission signal line 1 Width and thickness: inverse ratio relationship P 特性 When the width of the conductive layer u of the transmission signal line 1 increases, or when the conductive layer 11 of the transmission line M323672 increases, the characteristic impedance (z〇) of the transmission signal line 丨 increases.
即隨之降低；當傳輸訊號線丨的導電層n寬度減少時Y $傳輸訊號線1的導電層n減少時，，傳輸訊號線丨的特 . 性阻抗(Z〇)即隨之增加。 、 除此之外，該傳輸訊號線1的特性阻抗(z〇)亦與傳輸 訊號線1的第一、二絕緣層12、13的厚度相關。尤其， 傳輸訊號線1的特性阻抗(Zg)係與傳輸訊號線丨的第二、 Φ 二絕緣層12、13的厚度呈反比關係。 當傳輸訊號線1的第一絕緣層12或第二絕緣層 的厚度增加時，傳輸訊號線i的特性阻抗(ZQ)即隨之降 / -低，反之，當傳輸訊號線1的第一絕緣層12或第二絕緣 ，·層13的厚度減少時，傳輸訊號線1的特性阻抗(z〇)即隨 之增加。 - —故本創作將導電層11之厚度調整於0.018〜01 _， 而寬度為0.2〜0.8 mm，且使第一、二絕緣層12、13之厚 鲁-度調整於G.G4〜0·3 _，就可以形成—具有較佳特性阻抗 —(ZQ)為1〇〇Ω±5%的傳輸訊號線丨，其傳輸訊號線丨可作為 電子線、光學線、串行先進技術附件（Serial Advanced Technology Attachment，以下簡稱sata)，亦可應用於 LVDS訊號傳輸系統中。 “、 如第三圖所示為本創作中傳輸訊號線應用於LVDS 訊號傳輸系統之結構示意圖，其係架設於液晶顯示介面2 與=主機板介面3之間的高頻訊號傳輸系統，其係採用 /、门起速（1.4Gb/s)、低功耗及低電磁輻射特性的低壓差分 M323672 信號接收器（LVDS，Low Voltage Differential Signal)4 作 為液晶顯示器介面2的訊號傳輸介面，並經由傳輸訊號線 1的連接，與系統主機板介面3上的訊號傳輸介面，即與 系統主機板介面3上的連接器插座31，一起構成訊號連 接，以改善習有傳輸訊號線無法用為LVDS訊號傳輸系統 之缺失。 本創作之技術内容及技術特點巳揭示如上，然而熟 悉本項技術之人士仍可能基於本創作之揭示而作各種不 背離本案創作精神之替換及修飾。因此，本創作之保護範 圍應不限於實施例所揭示者，而應包括各種不背離本創作 之替換及修飾，並為以下之申請專利範圍所涵蓋。 M323672 【圖式簡單說明j 八第1料㈣液晶时面料統主機 "面之間的LVDS訊號傳輸系統示意圖。 第二圖係為本創作卡傳輸訊‘線之剖面結構示意 圖0 一 第一圖ir'為本創作中傳輪訊號線應用於訊號 傳輪系統之結構示意圖。 【主要元件代表符號說明】 傳輸訊號線1 導電層11 銅線111 第一絕緣層12 弟二絕緣層13 接地板14 液晶顯示器介面2 系統主機板介面3 連接器插座31 低壓差分信號接收器4 訊號傳輸線5That is to say, as the conductive layer n of the Y $ transmission signal line 1 decreases as the width of the conductive layer n of the transmission signal line decreases, the characteristic impedance (Z〇) of the transmission signal line increases. In addition, the characteristic impedance (z〇) of the transmission signal line 1 is also related to the thickness of the first and second insulating layers 12, 13 of the transmission signal line 1. In particular, the characteristic impedance (Zg) of the transmission signal line 1 is inversely proportional to the thickness of the second, Φ two insulating layers 12, 13 of the transmission signal line. When the thickness of the first insulating layer 12 or the second insulating layer of the transmission signal line 1 is increased, the characteristic impedance (ZQ) of the transmission signal line i is lowered/low, and conversely, when the first insulation of the signal line 1 is transmitted When the thickness of the layer 12 or the second insulation layer is reduced, the characteristic impedance (z 〇) of the transmission signal line 1 increases. - Therefore, the thickness of the conductive layer 11 is adjusted to 0.018~01 _, and the width is 0.2~0.8 mm, and the thickness of the first and second insulating layers 12, 13 is adjusted to G.G4~0· 3 _, can form - with better characteristic impedance - (ZQ) is 1 〇〇 Ω ± 5% of the transmission signal line 其, its transmission signal line can be used as electronic wire, optical line, serial advanced technology accessories (Serial Advanced Technology Attachment (hereinafter referred to as sata) can also be applied to LVDS signal transmission systems. "As shown in the third figure, the schematic diagram of the transmission signal line applied to the LVDS signal transmission system is shown in the figure. It is a high-frequency signal transmission system that is installed between the liquid crystal display interface 2 and the motherboard interface 3. Low-voltage differential M323672 signal amplifier (LVDS, Low Voltage Differential Signal) 4 with /, gate speed (1.4Gb/s), low power consumption and low electromagnetic radiation characteristics is used as the signal transmission interface of the liquid crystal display interface 2, and transmitted through The connection of the signal line 1 and the signal transmission interface on the system board interface 3, that is, the connector socket 31 on the system board interface 3, constitute a signal connection to improve the transmission signal line of the system can not be used for LVDS signal transmission. The technical content and technical characteristics of this creation are disclosed above, but those skilled in the art may still make various substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of this creation It should not be limited to those disclosed in the examples, but should include all kinds of substitutions and modifications that do not depart from the creation, and apply for the following patents. Covered by the enclosure. M323672 [The diagram is a simple illustration of the LVDS signal transmission system between the fabrics of the fabric and the host.] The second diagram is a schematic diagram of the cross-sectional structure of the creative card transmission. The first figure ir' is a schematic diagram of the structure of the transmission signal line applied to the signal transmission system. [Main component representative symbol description] Transmission signal line 1 Conductive layer 11 Copper wire 111 First insulation layer 12 Dielectric insulation layer 13 Grounding plate 14 LCD interface 2 System motherboard interface 3 Connector socket 31 Low voltage differential signal receiver 4 Signal transmission line 5