TWI599125B - High-frequency signal double cable adapter - Google Patents

Description

High-frequency signal double-layer cable riser card

The invention relates to a cable, in particular to a double-layer cable adapter card which solves the problem that the double-layer line generates transmission obstacles due to the side-by-side and overlapping of the high-frequency signal and the DC power supply circuit line.

According to the computer, TV and other electronic products, most of the use of the cable as the connection between the motherboard and the expansion of the component signal, but a series of advancements, the transmission capacity requirements of the motherboard and each expansion component signal round-trip The higher, the result is the line connection products made of the wires covered by the general insulation materials. The transmission capacity of the signal, when the transmission capacity requirement is increased, a new bottleneck will occur in the transmission technology. . Even if the type of the cable is made of a flexible printed circuit type, it has a relatively stable transmission, but the cost is high, and the bending property is not as good as that of the insulating material. The coated wire is limited in its use.

Therefore, the solution of the line connection products generally made of insulating materials covering the wires is to make the transmission capacity of the high-frequency signals exceed the technical bottleneck and multiply; the finished products made of such wires have excellent properties. Flexibility and price are much cheaper than soft printed circuit board types, so the field of application is broader.

As shown in Fig. 1A, a schematic view of a conventional flexible cable 10A is used, in which a plurality of wires 11 are press-formed using an adhesive layer 12 and an insulating film 13. Such a flexible cable 10A can be used as an electrical connection for general transmission. However, as electronic products continue to evolve, there is a demand for high-speed signal transmission. Therefore, the traditional flexible cable 10A has not met the requirements.

Therefore, as shown in FIG. 1B, a flexible cable is used, and the upper and lower double-layer flexible cables 10A and 10B are used, which has the advantages of reducing the length of the connector (not shown) and using the circuit board of the connector. The double-sided electrical connection can be used to increase the transmission circuit, and when it is particularly required, it can be a high-frequency transmission line 10 formed by two upper and two lower two parallel lines.

However, it is checked that the conventional high-frequency transmission cable 10 is necessary for speeding up signal transmission, control of characteristic impedance and magnetic loss. However, most of the conventional technologies are mainly shielded, grounded, and magnetic ring and connector fabrication technologies. There are also electronic components such as capacitors, inductors, or reactances with high-frequency signal processing performance added to the circuit board circuit. As a way to solve the above problems.

The above various solutions may have their functionality for various different electronic products, but as the transmission speed continues to be required, the transmission specifications are being converted from the original PCIe 2.0 to PCIe 3.0.

In a word, the PCIe bus will become a new standard, and it is a signal channel between the processor and the external device. Although it is said that the PCIe mostly thinks of the display card, in fact, such as USB device, audio, network, these materials Data must be transmitted via PCIe or similar signal channels. Therefore, the faster the transmission speed of this channel, the larger the bandwidth, and the faster the data can be transmitted.

According to the above, PCI Express, referred to as PCIe, is a type of computer bus, which uses the existing programming concepts and communication standards, but is built on a faster serial communication system. PCIe has a faster rate to replace the existing internal bus (including AGP and PCI), and the new PCIe does not require an external power supply, can be directly powered by the slot, it has a DC power supply loop, can support +3.3V , 3.3Vaux and +12V three voltages, which also brings convenience to the user.

Figure 1C shows a PCI Express 3.0 bus, where the area indicated by Z (1 to 18 pins) is the most important, and Figure 1D shows the function of pins 1 to 18 in the Z area. As shown in Figures 1C and 1D, PCIe 3.0 can be powered directly from the slot of the Z zone (12V), which has the characteristics of a DC power supply loop and has multiple important grounds. In addition, Figure 1E shows the function description of pins 19 to 32 of PCIe 3.0.

However, the current PCIe 3.0 bus can only be plugged into the expansion device such as a display card on the motherboard, and there is no PCIe 3.0 cable adapter (card) available for support.

For example, the inventor's invention of the "upright computer mainframe" No. 099123744 originally used a PCIe x16 switching device to enable the circuit board and the expansion component to be connected side by side, but must be faced when commercialized. The most common display card for expansion components, the transmission specification is being converted from the original PCIe2.0 specification to PCIe3.0, making it difficult to complete the PCIe2.0 specification switching device, and it is impossible to start the serious new generation PCIe3.0 specification display card. problem. The reason is that the transmission structure of the current PCI_Express switching device is only focused on the area where the I/O signal is exchanged at a high-frequency speed, and how to set up the grounding with sufficient isolation interference, which is almost separated from each other. Line pin (shown in Figure 1E), ignoring the same I/O high-frequency signal is responsible for detection and give the start of the transmission loop, the ground line pin not only does not have two pairs of configurations, there are side by side The continuous magnetic field effect brought by the DC link line, when the user has a transfer request similar to the inventor's invention of the "upright computer host" invention No. 099123744, in order to smoothly connect the circuit boards at both ends The upper and lower contact surfaces, in turn, use two layers of wires arranged side by side, so that the faster and faster I/O signal exchange frequency is interfered by the magnetic field of the fixed strength of the DC line, resulting in the same high frequency I/O signal. Transmission, responsible for detecting and giving the signal loop of the start, and then converting to the transmission of the wire, but because the original pin is not configured to the ground wire sufficient to play the isolation interference , And too close to the DC line was blocked magnetic area, but can not start frequency signal transmission to and from nearly doubled PCI_Express3.0 to a new generation of graphics cards.

Therefore, there has not been a double-layer cable transfer device designed for PCIe 3.0 display cards, and even if a riser card made of a flexible printed circuit type (Flexible Print Circuit) type is available, this transfer is possible. The card still has a high cost and is not resistant to bending, so the scope of use will be limited, and it is convenient and practical to use the double-layer cable; therefore, the present invention will not be considered.

Therefore, the inventors of the present invention have in view of the above-mentioned conventional soft double-layer cable, and the obstacles arising from the high-speed transmission requirements are considered to be the main subject of the present invention.

The main purpose of the present invention is to provide a high-frequency signal transmission double-layer cable riser card with a data transmission bandwidth exceeding 8 Gb/s bottleneck, which has a transmission characteristic of high-frequency signal without distortion, and can be realized. Excellent flexibility and bending resistance, and low cost improvement.
In order to achieve the above object, the technical means adopted by the present invention is a two-layer cable trunking card which solves the problem that the double-layer line generates transmission obstacles due to the side-by-side and overlapping of the high-frequency signal and the DC power supply circuit, and includes:

a first connecting end, and a first substrate and a connector, wherein a front side and a back side of the first substrate are respectively provided with a first connecting pin and a second connecting pin;

a second connecting end is provided with a second substrate, and a front side and a back side of the second substrate are respectively provided with a third connecting pin position and a fourth connecting pin position;

The cable group formed by the at least two cables is connected between the first and second connecting ends in an upper and lower double layer, wherein the front and rear ends of the first row of the upper layer are electrically connected to each other respectively. a first terminal of the first substrate and a third terminal of the second substrate, and the front and rear ends of the second layer of the lower layer are electrically connected to the second terminal of the first substrate And a fourth terminal pin of the second substrate; wherein:

A metal foil with good conductivity is disposed between the upper and lower layers of the cable group, and the width of the metal foil must cover at least the cable group as a power supply loop region, so that the upper and lower sides are The layered wires have a magnetic field effect in the region of the power supply circuit to be separated; and

The entire double-layer cable is coated with a conductive tape with high-frequency shielding to minimize the loss of high-frequency signals.

According to the foregoing feature, the metal foil may be formed of a copper foil, and one surface of the copper foil may be provided with an adhesive.

According to the pre-existing feature, the cable group can be composed of two cables, and further includes four cables, which are arranged side by side on the first and second rows of lines and the lower two-layer cable. There is a third line of the upper layer and a fourth line of the lower layer. According to the four-frequency line, two high-frequency signal switching devices are arranged side by side.

According to the above, a metal foil can be provided between the third row and the fourth row according to requirements.

According to the foregoing feature, the inner edge surface of the conductive adhesive tape may be respectively provided with an insulating layer relative to the position of the connecting pin of the first and second connecting ends; and the insulating layer may be composed of an insulating tape.

The invention utilizes the above-mentioned technical feature to disperse the magnetic field generated by the DC circuit into the ground return line by the metal foil, and eliminate the maximum factor affecting the I/O signal, and the conductive tape with high frequency shielding effect will be The double-layer cable is coated to minimize the loss of high-frequency signal attenuation due to outward emission; so that it can effectively and efficiently solve the high-frequency signal with increasing transmission capacity under the effect of the two. Layer-line riser card, a transmission barrier caused by high-frequency signals passing through the magnetic field of the power supply circuit that is too closely aligned with it.

First, please refer to FIG. 2 to FIG. 7 , the high-frequency signal double-layer cable adapter card 20 of the present invention uses a flexible cable manufactured by separately covering the insulating materials as a transmission line, and can be used as a transmission line. Flexibility and bending resistance, and low cost characteristics, and a preferred embodiment of the present invention comprises:
A first connecting end 30 is provided with a first substrate 31 and a connector 34. The front and back sides of the first substrate 31 are respectively provided with a first pin 32 and a second pin 33.
A second connecting end 40 is provided with a second substrate 41. The front and back sides of the second substrate 41 are respectively provided with a third pin position 42 and a fourth pin position 43.
The at least two wires 51, 52 are formed by the upper and lower double layers connected between the first connecting end 30 and the second connecting end 40, wherein the upper layer of the first row 51 is in front of the first row The second terminal is electrically connected to the first pin 32 of the first substrate 31 and the third pin 42 of the second substrate 41, and the front and rear of the second row 52 of the lower layer are respectively connected. The two ends are electrically connected to the second pin 33 of the first substrate 31 and the fourth pin 43 of the second substrate 41, but are not limited thereto, and the double row of the present invention The line riser card 20 includes two upper and lower double-layer cables, and may also include four cable wires. In this embodiment, the cable is connected to the first cable 51 and the second cable 52. The side of the lower double-layer cable is arranged side by side with a third row line 53 of the upper layer and a fourth row line 54 of the lower layer. According to the four rows of lines, the cable group 50 is arranged side by side. However, the above-mentioned constitution is a prior art, and is not a patent of the present invention, and is not described herein.
The main features of the invention are:
A conductive metal foil 60 is disposed between the upper cable set 50 and the lower double-layer cable 51/52, and the width W of the metal foil 60 must cover at least the power supply 50. Returning the route area Z (1st to 18th pins), according to the upper and lower two-layer cable 51/52 of the power supply circuit line area Z; in this embodiment, the first connection end 30 and the second connection end 40, the cable group 50 includes four wires, which are arranged on the first row 51 and the second row 52, and on the side of the lower double-layer cable, and are arranged in a third row of the upper layer. The line 53 and the fourth line 54 of the lower layer are formed into a two-layer cable riser card 20 for overlapping high frequency signals of four lines and two adjacent lines. As for the setting of the metal foil 60, the width W can be determined according to requirements.
4A and 2, 3, a preferred embodiment discloses two metal foils 60 disposed between the upper and lower layers of the wires 51/52, 53/54; and the two metal foils 60. The width W is almost equivalent to the width of the upper and lower layers of the cable, but is not limited thereto; that is, as shown in FIG. 4B, only one of the metal foils is disposed between the two layers of the wires 51/52. 60, this can also be implemented. In addition, as shown in FIG. 4C, the metal foil piece 60 has only one piece, and its width W can cover more than the wire group 50 as the power supply circuit line area Z, so that the area Z of the power supply circuit will be The upper and lower two-layer wires 51/52 are separated; thus, the metal foil 60 can be used to introduce the magnetic field generated by the DC circuit of the power supply circuit region Z into the grounding wire, thereby eliminating the maximum factor affecting the I/O signal. . In the present embodiment, the metal foil 60 is preferably formed of a copper foil. The copper foil 60 can be provided with a glue 61 on one surface thereof, so that the metal foil 60 can be positioned between the upper and lower layers of the wires 51/52, 53/54; the adhesive 61 can be sprayed or pasted. It is formed on the entire surface or a part of the surface of the metal foil sheet 60.
Referring to FIG. 5 to FIG. 8 , the present invention further coats the entire double-layer cable group 50 with a conductive tape 70 having a high-frequency shielding function, so that high-frequency signals are not leaked. In a preferred embodiment, the inner peripheral surface of the conductive adhesive tape 70 is provided with an insulating layer 71, which may be formed of an insulating tape, with respect to the positions of the terminals 32/33 and 42/43. Therefore, when the conductive tape 70 covers the cable group 50, the electrical relationship is not affected; of course, the insulating layer 71 is not limited to be disposed on the inner edge of the conductive tape 70, and may be directly insulated tape. The surface of the wiring pin is covered to be insulated from the conductive tape 70.
The present invention utilizes the above-mentioned technical feature to introduce the magnetic field generated by the DC circuit into the grounding wire by the metal foil 60, thereby eliminating the maximum factor affecting the I/O signal, and using the conductive adhesive tape 70 having the high-frequency shielding effect. The double-layer cable is coated to minimize the loss of high-frequency signals; it can effectively and efficiently solve the transmission of high-frequency signals and power supply loops due to side-by-side and overlap under the effect of the mutual multiplication. obstacle.
More importantly, the thickness of the metal foil 60 and the conductive adhesive tape 70 used in the above invention are both thin and hardly exceed 0.1 mm to 0.3 mm, so that the flexibility and flexibility of the flexible cable are not affected. Characteristics, which are not achievable by conventional flexible printed circuit type (wireless Print Circuit) type; furthermore, the present invention has the advantage of low cost, and is mainly used in the internal space of a personal computer or a server. Therefore, the length of 25cm is sufficient, so the invention is based on a 25cm cable, and the conventional soft cable is used for the specifications of various versions of PCI Express. The test results are as follows: ˇ stands for use, × stands for use



It can be seen from the above table that the transfer mode of the conventional soft cable is enabled in the PCIe 1.0 version, but when the transmission specification is upgraded to the PCIe 3.0 version, the transferred display card cannot be started at all. use. The high-frequency signal double-layer cable connection card 20 of the present invention can be used for all versions of PCIe 1.0 to PCIe 3.0, even if the PCIe3 is made of a flexible printed circuit type (Flexible Print Circuit) type. .0 connector (card), but in addition to the electrical characteristics of high-frequency signal transmission without hysteresis or magnetic loss, the present invention is more cost-effective and can achieve excellent flexibility and bending resistance. This is a function that cannot be achieved by a flexible printed circuit type connector.
The invention utilizes the technical features of the above, and the metal foil is placed into the magnetic field generated by the DC circuit by the experimental method, and is dispersed into the ground return line, and the maximum factor affecting the I/O signal is excluded, and then the high frequency shielding is performed. The utility of the conductive tape wraps the double-layer cable to minimize the loss of the high-frequency signal due to the outward emission; so that it can smoothly start the new generation PCI_Express3 under the effect of the two. The display card of 0, and also passed the various test tests that the inventor can carry out a variety of computer performance test software, thus confirming that this method can effectively and effectively solve the transmission obstacles generated on the high frequency signal wire and Many problems such as signal attenuation, the data transmission bandwidth from the original PCI_Express2.0 4Gb / s, doubled to PCI_Express3.0 8Gb / s, because PCI_Express3.0 is the current data transmission bandwidth requirements of computer equipment The highest specification, and the actual test of the present invention is indeed sufficient, and can solve the latest specification point of the current latest specification display card transfer problem.
To sum up, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to be invented by the bureau. German sense.
The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

20. . . Double layer cable riser card

30. . . First connection

31. . . First substrate

32. . . First wiring pin

33. . . Second wiring pin

34. . . Connector

40. . . Second connection

41. . . Second substrate

42. . . Third wiring pin

43. . . Fourth wiring pin

50. . . Cable group

51. . . First line

52. . . Second line

53. . . Third line

54. . . Fourth line

60. . . Metal foil

61. . . Viscose

70. . . Conductive tape

71. . . Insulation

Fig. 1A is a schematic structural view of a conventional flexible cable.
Fig. 1B is a schematic structural view of a conventional double-layer flexible cable.
Figure 1C is a schematic diagram of a PCIe bus.
Figure 1D is a 1 to 18 pin description of the Z region in Figure 1C.
Figure 1E is a 19-32 pin description of Figure 1C.
Figure 2 is an exploded perspective view of a metal foil in accordance with a preferred embodiment of the present invention.
Figure 3 is a perspective view of the metal foil of Figure 2 placed between the sets of wires.
Figure 4A is a schematic view of the direction 4A-4A of Figure 3.
Fig. 4B is another embodiment of the metal foil sheet setting region of the present invention.
Fig. 4C is still another embodiment of the metal foil sheet setting region of the present invention.
Fig. 5 is a schematic view (1) of a wire assembly coated with a conductive tape of the present invention.
Figure 6 is a schematic view (2) of the wire assembly of the present invention coated with a conductive tape.
Fig. 7 is a perspective view showing the completion of the wiring group of the present invention coated with a conductive tape.
Figure 8 is an enlarged cross-sectional view showing a portion of the structure of Figure 7.

20. . . Double layer cable riser card

30. . . First connection

31. . . First substrate

32. . . First wiring pin

33. . . Second wiring pin

34. . . Connector

40. . . Second connection

41. . . Second substrate

42. . . Third wiring pin

43. . . Fourth wiring pin

50. . . Cable group

51. . . First line

52. . . Second line

53. . . Third line

54. . . Fourth line

60. . . Metal foil

70. . . Conductive tape

71. . . Insulation

Claims (7)

A high-frequency signal double-layer cable riser card includes: a first connection end, a first substrate and a connector, and a first terminal pin and a front side of the first substrate a second connecting end; a second connecting end, comprising a second substrate, wherein the front side and the back side of the second substrate are respectively provided with a third connecting pin position and a fourth connecting pin position; and at least two connecting lines are formed The upper and lower double layers are connected between the first and second connecting ends, wherein the front and rear ends of the first row of the upper layer are respectively electrically connected to the first substrate a second pin of the second substrate, and the second and second ends of the second layer of the lower layer are electrically connected to the second pin of the first substrate and the second substrate a fourth wiring pin; wherein: a first metal foil with good conductivity is disposed between the upper and lower double-layer wires of the cable group, and the width of the first metal foil must cover at least As the area of the power supply circuit line, the cable group is used to supply power to the upper and lower double-layer cables. The magnetic effect of the linear region to be spaced resolved; as well as a conductive tape having a high-frequency blocking action, will be covered the entire double row line group, the high-frequency signal loss is minimized. The high-frequency signal double-layer cable riser card according to claim 1, wherein the first metal foil is made of copper foil. The high-frequency signal double-layer cable riser card according to claim 2, wherein the cable group is provided with four wires, which are tied to the first row and the second row, and the lower layer The third side of the upper line and the fourth line of the lower layer are arranged side by side on the side of the cable, and four high-frequency signal switching devices are arranged to be stacked side by side. The high-frequency signal double-layer cable riser card according to claim 3, wherein a second metal foil is disposed between the third and fourth cable double-layer wires, the second The metal foil is composed of copper foil. The high-frequency signal double-layer cable riser card according to claim 4, wherein one of the first metal foil and the second metal foil is provided with a glue. The high-frequency signal double-layer cable riser card according to any one of claims 1 to 5, wherein the inner edge of the conductive tape is opposite to the first pin position, the second pin position, and The positions of the three wiring pins and the fourth wiring pins are respectively provided with an insulating layer. The high-frequency signal double-layer cable riser card according to claim 6, wherein the insulating layer is composed of an insulating tape.