TWM551764U - Dual channel flexible circuit bridge wire and dual display card system connected thereto - Google Patents

Description

Dual-channel flexible circuit bridge wiring and its connected dual graphics system

The present invention provides a dual-channel flexible circuit bridge connection and a dual-card system connected thereto, in particular, two display cards can be formed by using a first connection interface at two sides of the two-channel flexible circuit board and two display interfaces at different intervals. Bridging state, which improves the performance of the dual graphics system for faster computing and graphics display.

According to the rapid development of electronic technology, the speed and performance of computers and servers are getting faster and faster. In addition to the central processing unit and memory on the motherboard as the information processing hub in the computer or server, Various peripheral devices such as screens and data devices are also the focus of screen display, data transmission and command control of electronic devices such as computers and servers. You can use the slots on the motherboard to install various types of interface cards to enable peripheral devices. Transfer data between the interface card and the electronic device and use it for expansion purposes.

Furthermore, as people continue to pursue the image of the screen, the resolution and performance requirements of the display interface are getting higher and higher, and some manufacturers have developed an expandable interface that can bridge two display cards and use them as a single output. Scalable Link Interface (SLI) technology is mainly used to install display cards in two slots arranged side by side on the motherboard supporting SLI technology, and a bridge connector at the top of each display card. The multiple connectors of the video card bridge are respectively connected to two display cards The bridge connector forms a bridge state, enabling the motherboard to use Parallel Computing on the image processor on the two display cards and processing the 3D graphics for optimal graphics performance, but with Advances in integrated circuit technology have led to a gradual decline in the hardware architecture of dual-display cards, until emerging virtual reality and hybrid real-world technologies are becoming more prevalent. In order to handle more complex computing and graphics acceleration functions, dual-display bridge technology is again It is mainly used in the current mainstream Peripheral Component Interconnect Express (PCI Express) standard to solve the problem that the bus interface architecture of the early expansion interface is insufficient and the bandwidth is insufficient. Dual graphics cards can fully utilize high-speed graphics display performance through SLI technology.

However, the existing dual graphics bridges on the market can be roughly divided into single-channel soft-slab bridges, single-channel or dual-channel hard-board bridges, wherein the traditional two-channel soft-board bridges have a soft layer on the lower layer of the signal layer. For the insulating layer, due to the soft substrate manufacturing process and the physical arrangement of the wiring layout and structure, the double-layer flexible board can not be designed according to the high transmission rate and high-efficiency design trend, and is easy to generate in high-speed transmission applications. The skin effect of high-frequency signal reflection and transmission process, while the use of multi-layer soft board structure can use the power layer and ground plane of the middle two layers to improve electrical characteristics (such as characteristic impedance), but with the high frequency of multi-layer soft board application The signal transmission channel and the working bandwidth increase, and there are still problems such as thickening of the thickness, insufficient flexibility, and high characteristic impedance. Therefore, the traditional single-channel soft-board bridge is used in a double-layer soft board in applications with a small transmission rate. For the mainstream, it is unable to support the signal transmission of high-order video card bridges.

In addition, traditional single-channel or dual-channel hard-board bridges follow the board process technology The maturity of the technology can produce high-performance, high-density and multi-layer interconnected circuit boards, and in order to meet the needs of high-frequency signal transmission, and to meet electrical characteristics, reduce skin effect and electromagnetic interference between adjacent circuit layers, etc. Add more power and ground planes, the number of layers is representative of the number of layers with independent circuit layers, usually the number of layers is even (such as double, four, eight, etc.), but because the number of layers is more than thickness Thickening and flexible folding can not be bent. If it is applied to the dual-channel dual-channel bridging technology, it will also be unable to bridge the distance of the dual graphics card due to different design schemes of motherboards or display cards manufactured by various manufacturers. Unification, the traditional dual-channel hard-board bridge can not be bridged arbitrarily with the different spacing of the dual graphics cards, which is difficult to meet the user's own upgrade and expansion requirements, which is the key to research and improvement for those engaged in this industry. .

Therefore, in view of the above-mentioned problems and shortcomings, the new creators have collected and reviewed relevant materials through various evaluations and considerations, and have used the trial and modification of many years of R&D experience in this industry to start solving this problem. The dual-channel flexible circuit bridge connection and the dual-display system with dual-channel hard-board bridge transmission can not be arbitrarily bridged with different spacing of dual graphics cards.

The main purpose of the present invention is to provide at least two first bridges with a first connection interface and at least two second bridges with a second connection interface on the same side of the same plane of the dual-channel flexible circuit board, and The first bridge has a first socket and a first terminal group that is internally disposed in the first socket, and the second bridge has a second socket and a second terminal group that is internally disposed in the second socket, so that the first bridge can be connected The second bridge is respectively connected to the bridge connector of the two display cards, so that two display cards connecting all the different pitches can form an arbitrary bridge state, and two display cards can be used for parallel calculation, thereby improving the dual graphics card. Faster arithmetic processing And the performance of the graphic display.

The secondary purpose of the present invention is that the dual-channel flexible circuit board sequentially includes a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second wiring layer, and a fourth insulating layer. And electrically connecting the first terminal group of the first bridge and the second terminal group of the second bridge by the first circuit layer, the ground layer and the second circuit layer, respectively, by using the first circuit layer The ground layer between the second line and the second line serves as a common reference plane for the transmission of the high-frequency signals. For the integrity of the high-frequency signal, the working bandwidth and characteristic impedance can still be met to reduce the corresponding high-frequency signal transmission. Electromagnetic interference, which achieves stable dual-channel high-frequency signal transmission and improves transmission efficiency.

10‧‧‧Double-channel flexible circuit board

101‧‧‧First flexible substrate

102‧‧‧Second flexible substrate

103‧‧‧ Third soft substrate

11‧‧‧First insulation

111‧‧‧First film

112‧‧‧ first layer

12‧‧‧First line layer

121‧‧‧First conductor

13‧‧‧Second insulation

131‧‧‧Second film

132‧‧‧second second layer

133‧‧‧ third layer

14‧‧‧ Grounding layer

141‧‧‧Metal conductor

15‧‧‧ third insulation

151‧‧‧ Third film

152‧‧‧ fourth layer

153‧‧‧ fifth layer

16‧‧‧Second circuit layer

161‧‧‧second conductor

17‧‧‧fourth insulation

171‧‧‧fourth film

172‧‧‧ sixth layer

18‧‧‧through hole

20‧‧‧First connection interface

21‧‧‧First Bridge

211‧‧‧First socket

2111‧‧‧ Socket slot

212‧‧‧First terminal group

2121‧‧‧Docking Department

2122‧‧‧Welding Department

22‧‧‧First reinforcement board

221‧‧‧ jack

222‧‧‧ glue layer

30‧‧‧Second connection interface

31‧‧‧Second Bridge

311‧‧‧second socket

3111‧‧‧ Socket slot

312‧‧‧Second terminal group

3121‧‧‧Docking Department

3122‧‧‧Welding Department

32‧‧‧Second reinforcing plate

321‧‧‧ jack

322‧‧ ‧ glue layer

40‧‧‧System Host

41‧‧‧ motherboard

411‧‧‧PCI-E slot

42‧‧‧ display card

420‧‧‧ chipsets

421‧‧‧Transport interface

422‧‧‧Bridge end connector

4221‧‧‧Metal joints

43‧‧‧heating device

The first picture is a three-dimensional appearance of the creation.

The second picture is a three-dimensional exploded view of the creation.

The third figure is a three-dimensional exploded view of another perspective of the creation.

The fourth figure is a schematic diagram of the structure of the created dual-channel flexible circuit board.

The fifth figure is a schematic structural view of a two-channel flexible circuit board according to a preferred embodiment of the present invention.

Figure 6 is a perspective view of another preferred embodiment of the present invention prior to joining.

Figure 7 is a perspective view of another preferred embodiment of the present invention after being joined.

The eighth figure is a perspective view of a further preferred embodiment of the present invention.

In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present creation, and the structure and function are as follows. To understanding.

Please refer to the first, second, third, fourth and fifth figures, which are respectively the three-dimensional appearance drawing, the three-dimensional exploded view, the three-dimensional exploded view of another perspective, the structure diagram of the two-channel flexible circuit board and the better implementation. For a schematic diagram of the structure of the dual-channel flexible circuit board, it can be clearly seen from the figure that the dual-channel flexible circuit bridge connection of the present invention includes a dual-channel flexible circuit board 10 and two opposite sides of the same plane disposed on the dual-channel flexible circuit board 10. The first connection interface 20 and the second connection interface 30 are electrically connected, wherein the dual-channel flexible circuit board 10 sequentially includes the first insulation layer 11, the first circuit layer 12, the second insulation layer 13, and the ground layer. 14. The third insulating layer 15, the second circuit layer 16, and the fourth insulating layer 17 have a first insulating layer 11 having a first film 111, and a first bonding layer 112 is disposed on the upper surface of the first film 111 to form a first film The cover film is provided, and the first conductive layer 121 of the first circuit layer 12 is bonded to the first film 111 through the first adhesive layer 112, and the lower surface of the second film 131 of the second insulating layer 13 is provided with a bond. a second subsequent to the first conductor 121 132, and a third adhesive layer 133 is disposed on the upper surface of the second film 131. The ground layer 14 is a metal conductor 141 disposed between the first circuit layer 12 and the second circuit layer 16 and disposed by the ground layer 14. The third film 151 is bonded to the second film 131 through the third adhesive layer 133. The lower surface of the third film 151 of the third insulating layer 15 is provided with a fourth adhesive layer 152 bonded to the metal conductor 141. The fifth layer 153 is disposed on the upper surface of the film 151, and the second conductor 161 of the second circuit layer 16 is bonded to the third film 151 through the fifth bonding layer 153, and the fourth insulating layer 17 has the The lower surface of the fourth film 171 is provided with a sixth adhesive layer 172 to form another cover film, and is bonded to the second conductor 1 by the fourth film 171 through the sixth adhesive layer 172. 61 is a flexible multilayer board.

Furthermore, the first adhesive layer 112 of the first insulating layer 11, the second adhesive layer 132 of the second insulating layer 13, and the third adhesive layer 133, the fourth adhesive layer 152 and the fifth adhesive layer of the third insulating layer 15 153. The sixth adhesive layer 172 of the fourth insulating layer 17 is made of epoxy resin, polyester resin, acrylic resin or other thermosetting adhesive, and the first circuit layer 12 is formed. The first conductor 121 and the second conductor 161 of the second circuit layer 16 can be made of a material such as a rolled copper foil or an electrolytic copper foil, and the desired wiring is formed by etching or the like, and the ground layer 14 is It is disposed between the first circuit layer 12 and the second circuit layer 16, and the metal conductor 141 of the ground layer 14 can be made of a metal material such as copper, aluminum or silver, preferably copper foil, and the ground layer 14 can be used as A reference plane or a ground plane (0V reference plane) is transmitted adjacent to the upper and lower first circuit layers 12 and the second circuit layer 16.

In the present embodiment, the dual-channel flexible circuit board 10 includes a first insulating layer 11, a first wiring layer 12, a second insulating layer 13, a ground layer 14, a third insulating layer 15, a second wiring layer 16, and a fourth. The insulating layer 17 may further include a first flexible substrate 101, a second flexible substrate 102, and a third flexible substrate 103. The first flexible substrate 101 is formed by the first film 111 of the first insulating layer 11 and the first adhesive layer 112. The first conductor 121 of the first circuit layer 12 is formed into a flexible copper foil substrate (3 Layer FCCL), and the desired wiring is formed by etching or the like. Similarly, the second flexible substrate 102 is composed of The second film 131 of the second insulating layer 13, the third bonding layer 133 and the metal conductor 141 of the ground layer 14 are formed into a rubber-based flexible copper foil substrate, and the third flexible substrate 1 is formed. 03 is composed of a fourth film 171 of the fourth insulating layer 17, a sixth bonding layer 172 and a second conductor 161 of the second wiring layer 16 to form a rubber-based flexible copper foil substrate, and the dual-channel flexible circuit board 10 Or the total thickness of the first flexible substrate 101 and the second flexible substrate 102 plus the third flexible substrate 103 may be between 0.2 and 0.6 mm, and two groups are respectively disposed at two sides of the two-channel flexible circuit board 10. The plurality of via holes 18 are electrically connected to the first circuit layer 12, the ground layer 14 and the second circuit layer 16, respectively, to realize interlayer interconnection of the multilayer structure.

The first connection interface 20 includes at least two first bridges 21 having a first socket 211, and the first terminal group 212 is disposed on both side walls of the two sockets 211. The plurality of abutting portions 2121 are opposite to each other, and each of the abutting portions 2121 is respectively provided with a welded portion 2122 which is formed to be displaced from the bottom of the first socket 211 by a misalignment with respect to the other side of the upper opening of the insertion slot 2111. a first bridge 21 of a dual in-line package (DIP) type, and a first reinforcement with a plurality of sockets 221 respectively under the first socket 211 of the first bridge 21 The board 22 is disposed, and the jacks 221 are respectively disposed corresponding to the soldering portions 2122 at the lower side of the first terminal group 212, and the surface of the first reinforcing board 22 is provided with a bonding layer 222 (as shown in the fourth figure).

The second connection interface 30 includes at least two second bridges 31 having a second socket 311, and the second terminal group 312 is disposed on both side walls of the two sockets 311. The plurality of abutting portions 3121 are opposite to each other, and each of the abutting portions 3121 is respectively provided with a welded portion 3122 which is formed to be displaced from the bottom of the second socket 311 by a misalignment with respect to the other side of the upper opening of the insertion slot 3111. Plate or A second bridge 31 of a dual in-line package (DIP) type, and a second reinforcing plate 32 having a plurality of jacks 321 respectively disposed below the second socket 311 of the second bridge 31 And the jacks 321 are respectively disposed corresponding to the soldering portions 3122 at the lower portion of the second terminal group 312, and the surface of the second reinforcing plate 32 is provided with a glue layer 322 (as shown in the fourth figure).

However, the first reinforcing plate 22 of the first connecting interface 20 and the second reinforcing plate 32 of the second connecting interface 30 may be respectively a fiberglass board, a steel sheet, a polypropylene (PP) or a polyphenylene of a flame resistant material grade FR4. The adhesive layer 222, 322 coated or bonded on the surface of the first reinforcing plate 22 and the second reinforcing plate 32 may be double-sided adhesive tape, hot melt adhesive or epoxy resin, respectively. , polyester resin, acrylic resin and other adhesive tape or pressure sensitive adhesive.

When the creation is assembled, the body of the dual-channel flexible circuit board 10 that completes the processing (such as inner layer fabrication, copper foil etching circuit, pressing, drilling, and plating to form metallized holes, etc.) is first punched out to a specific The first bridge 21 of the first connection interface 20 and the second bridge 31 of the second connection interface 30 are respectively disposed on two sides of the same plane of the dual-channel flexible circuit board 10, The soldering portion 2122 of the one terminal group 212 and the soldering portion 3122 of the second terminal group 312 respectively penetrate vertically downward into the corresponding via holes 18 at the two sides of the dual-channel flexible circuit board 10, and the plurality of first sockets 211 The bottom of the second socket 311 is formed on the same plane as the two-channel flexible circuit board 10, and is disposed at a distance from the bottom of the two-channel flexible circuit board 10 to the left and right, and is formed by using a through hole welding through the two-channel flexible circuit board 10. Sexual connection, and can effectively prevent the solder joints on the first terminal group 212, the second terminal group 312 and the dual-channel flexible circuit board 10 The structure is damaged or stripped to make the overall structure more stable.

The flux used on the soldering portion of the via hole 18 of the dual-channel flexible circuit board 10 is continuously removed, and the double-channel flexible circuit board 10 is sized on the other side surface of the first bridge 21 and the second bridge 31. Or, the release film attached to the first reinforcing plate 22 and the second reinforcing plate 32 on the bonding layers 222 and 322 is peeled off, and each of the insertion holes 221 and 321 respectively corresponds to the first terminal group 212 and the second terminal. The terminal group 312 passes through the soldering portions 2122 and 3122 on the back surface of the dual-channel flexible circuit board 10, and then presses the first reinforcing plate 22 and the second reinforcing plate 32 respectively, so as to be coupled to the dual channel through the bonding layers 222 and 322. On the back surface of the flexible circuit board 10, the plurality of insertion holes 221 and 321 of the first reinforcement plate 22 and the second reinforcement plate 32 have larger apertures than the plurality of soldering portions 2122 and 3122 of the first terminal group 212 and the second terminal group 312. A reinforcing plate 22 and a second reinforcing plate 32 can be reinforced and press-fitted on the back surface of the dual-channel flexible circuit board 10 to prevent air bubbles from being formed, so as to ensure the subsequent characteristics of each other, and the assembly of the whole assembly can be completed.

As shown in the fifth figure, the two-channel flexible circuit board 10 in this embodiment is different from the above embodiment in that the first film 111 of the first flexible substrate 101 and the first conductor 121 may not be used first. The layer 112 and the first conductor 121 of the first circuit layer 12 can be directly formed on the first film 111 according to the process to form a non-glue flexible copper foil substrate (2 Layer FCCL), and then formed by etching or the like. The required circuit, but not limited thereto, the third adhesive layer 133 disposed between the second film 131 of the second flexible substrate 102 and the metal conductor 141, and the third flexible substrate 103 The sixth bonding layer 172 disposed between the fourth film 171 and the second conductor 161 may also be omitted and the metal conductor 141 and the second conductor 161 may also be processed. The difference is directly formed on the second film 131 and the fourth film 171 to form a gel-free soft copper foil substrate, and the difference between the glue-free soft copper foil substrate and the glue-based soft copper foil substrate is that the first softness is different. There is no adhesive layer between the film of the substrate 101, the second flexible substrate 102 and the third flexible substrate 103 and the copper foil, which avoids problems such as internal stress and thinning of the metal in the adhesive layer, and has good flexibility and dimensional stability. Good properties, etc., and in the case of a reduced number of layers, the total thickness of the overall structure can be reduced, but the process of the non-adhesive soft copper foil substrate (such as coating method, pressing method, sputtering/electroplating method, etc.) costs Higher, in contrast, the adhesive-based soft copper foil substrate is obtained by laminating the film and the copper foil, and has the advantage of lower cost than the non-adhesive soft copper foil substrate, but is suitable for thick copper. The layer fabrication can be carried out according to the thickness and the flexural resistance required for the dual-channel flexible circuit board 10, so that the descriptions in the following descriptions of the case are combined and combined with Chen Ming.

The three-dimensional external view of the preferred embodiment of the present invention, the three-dimensional external view after the connection, and the three-dimensional external view of a further preferred embodiment are shown in the accompanying drawings. As can be clearly seen from the figure, the dual-channel flexible circuit bridge-connected dual graphics system of the present invention can be applied to a system host 40 including, but not limited to, a desktop or personal computer, an industrial computer, a server, a barebone system, etc. The system host 40 includes a motherboard 41, and a plurality of PCI-E (fast peripheral component interconnection standard, PCI Express, or simply PCIe) slot 411 disposed side by side on the motherboard 41, and at least two PCIs - The E-slot 411 is respectively connected with a PCI-E transmission interface 421 corresponding to a graphics card 42, and the display card 42 is provided with a chipset 420 which can be an image processor (GPU). The display card 42 in this embodiment can support the SLI technology, and two fronts are respectively disposed at the top edge of each display card 42 near the side edge. After the bridge ends 422 are separated by a distance, and the plurality of metal contacts 4221 are respectively disposed on the left and right sides of the bridge terminals 422, the display card 42 can cooperate with the motherboard 41 to perform 3D picture calculation and graphics acceleration. .

When the dual graphics system connected by the dual-channel flexible circuit bridge of the present invention is to connect the two display cards 42 on the motherboard 41, the two-channel flexible circuit board 10 in the first figure is first turned over to one hundred and eight. The tenth opposite direction is indicated, and the first connection interface 20 and the second connection interface 30 are respectively corresponding to the two display cards 42, respectively, and the first bridge 21 can be respectively connected downward to the first display card 42. The bridge terminal 422 is inserted into the insertion slot 2111 of the first socket 211, and the first terminal group 212 is pushed outwards relative to the abutting portion 2121. The bridge terminal 422 can be smoothly inserted into the insertion slot 2111, and the abutting portion 2121 of the first terminal group 212 is brought into contact with the corresponding plurality of metal contacts 4221 on the bridge terminal 422 to form a positive electrical connection. The second socket 311 of the second bridge 31 can be respectively connected to the bridge terminal 422 of the second display card 42 in the manner described above, and the abutting portion 2121 of the second terminal group 312 can be brought into contact with the bridge terminal 422. The corresponding plurality of metal contacts 4221 form electricity The first connection interface 20 with the two first bridges 21 and the second bridge 31 on the two sides of the dual-channel flexible circuit board 10 and the second connection interface 30 are connected to the two display cards 42. The four bridge terminals 422 are configured to connect the two display cards 42 to form a two-channel bridge state, so that the system host 40 can use the chip set 420 on the two display cards 42 for parallel calculation, thereby improving the dual graphics system faster. The performance of arithmetic processing and graphics display.

In this embodiment, when the dual-channel flexible circuit board 10 utilizes the first connection medium When the first 20 bridges 21 and the second bridges 31 of the second connection interface 30 are connected to the two display cards 42 to form an arbitrary bridge state, the first circuit layer 12 and the second circuit layer 16 may be provided. The high-frequency signal transmission of the two channels is performed, and the ground layer 14 between the first circuit layer 12 and the second circuit layer 16 is used as a high-frequency signal to transmit a common reference plane, so that the first circuit layer 12 and the second circuit layer 16 are connected. The formation 14 impedance is matched to meet the requirement of a characteristic impedance of 50 ohms (Ω), and the power loss of the skin effect during high-frequency signal reflection and transmission can be reduced, while the first circuit layer 12 is grounded by the ground layer 14. Forming a shielding and isolation effect with the second circuit layer 16 so that the distance between the circuit layer and the reference plane is close to reduce interference such as electromagnetic waves and crosstalk generated during high-frequency signal transmission. The dual-channel flexible circuit board 10 is multi-layered. The structure design is only 400MHz compared to the traditional single-channel soft-board bridge connection. The working bandwidth of the traditional dual-channel hard-board bridge is only 680MHz, which cannot meet the increase of the working bandwidth, and with the signal transmission channel and The increase of the working bandwidth still has problems such as thickening of the thickness and insufficient flexibility. The dual-channel flexible circuit board 10 of the present invention not only satisfies the requirement of increasing the working bandwidth to 1360 MHz, but also has a total thickness of 0.2 to 0.6. Thinness between mm and higher flexural resistance, for high-frequency signal transmission integrity, can still meet the test requirements of 50 ohm (Ω) characteristic impedance, and thus achieve stable two-channel high frequency Signal transmission and the effect of improving transmission efficiency.

In addition, the dual-channel flexible circuit board 10 used in the present invention has light weight, higher flex resistance and thinning characteristics, and can bend the double-channel flexible circuit board 10 to form upward arching, sagging or The folding forms an acute angle setting, and the plurality of flexing does not cause the destruction or breakage of the structure of the two-channel hard board bridge, so that the first connection interface 20 and the second connection interface 30 can be the first of the two pairs. Bridge 21 and second bridge 31 are connected The two display cards 42 having different pitches are suitable for different manufacturers to manufacture different specifications of the motherboard 41 or the display card 42 of different specifications, and are not limited by different bridging distances or insertion spaces to meet the requirements. The user needs to upgrade and expand the usage requirements.

As shown in the eighth embodiment, the system host 40 in the present embodiment is different from the above embodiment in that the display card 42 further includes a heat sink 43 and has a heat sink 43 against the surface of the wafer set 420. A heat dissipation module (such as a heat sink or a plurality of heat sinks of the heat sink), and a fan is mounted on the heat dissipation module, and a plurality of heat pipes can be further disposed on the heat dissipation module to connect the power line of the fan The display card 42 provides its power to operate the fan to match the heat dissipation module to assist in rapid heat dissipation of the wafer set 420.

Since the display card 42 of the dual graphics system generally adds the heat sink 43 to the display card 42 for the purpose of rapid heat dissipation, the size of the display card 42 in the width direction is increased, and any two adjacent PCIs are added. In the E slot 411, the display card 42 cannot be separately inserted, and two PCI-E slots 411 need to be vacated between the two display cards 42 to form an architecture spanning four PCI-E slots 411, and then The two-channel flexible circuit board 10 can be connected between the two display cards 42 by using the first connection interface 20 and the second connection interface 30. The first bridge 21 and the second bridge 31 are connected to each other. Different specifications of the motherboard 41 and the display card 42 can eliminate the need to install different specifications of the dual-channel hard-board bridge due to the difference between the two display cards 42, and the use cost is increased, and the inconvenience of storage when not in use, Practical and adaptable effects.

Therefore, the present invention is mainly directed to the first connection interface 20 and the second connection interface 30 electrically connected to the two sides of the same plane of the dual-channel flexible circuit board 10, and sequentially includes the first insulation layer on the dual-channel flexible circuit board 10 in sequence. 11. First circuit layer 12 and second insulation layer 1 The grounding layer 14, the third insulating layer 15, the second circuit layer 16, and the fourth insulating layer 17, and the first connecting interface 20 includes a first bridge 21 having a first socket 211 and a first terminal group 212, The second connection interface 30 includes a second bridge 31 having a second socket 311 and a second terminal group 312, so that the first connection interface 20 and the second connection interface 30 can form a total of four pairs of first bridges 21, The two bridges 31 are respectively connected to the bridge terminals 422 of the two display cards 42 to realize the bridging state of the two display cards 42 connected to different distances, and the two display cards 42 can be used for parallel calculation, thereby improving the dual graphics system. Faster computational processing and graphics display performance.

The above detailed description is intended to be illustrative of a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation.

In summary, the above-mentioned dual-channel flexible circuit bridge wiring and its connected dual graphics system can achieve its efficacy and purpose when used. Therefore, this creation is a practical and excellent creation, which is in line with the new patent. Apply for the requirements, apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the hard work of the new creators. If there is any doubt in the bureau, please do not hesitate to give instructions, the new creators will try their best to cooperate, and feel really good.

10‧‧‧Double-channel flexible circuit board

18‧‧‧through hole

20‧‧‧First connection interface

21‧‧‧First Bridge

211‧‧‧First socket

2111‧‧‧ Socket slot

212‧‧‧First terminal group

2121‧‧‧Docking Department

2122‧‧‧Welding Department

22‧‧‧First reinforcement board

30‧‧‧Second connection interface

31‧‧‧Second Bridge

311‧‧‧second socket

3111‧‧‧ Socket slot

312‧‧‧Second terminal group

3121‧‧‧Docking Department

3122‧‧‧Welding Department

32‧‧‧Second reinforcing plate

Claims (8)

A two-channel flexible circuit bridge connection includes a two-channel flexible circuit board and a first connection interface and a second connection interface that are electrically connected to opposite sides of the same plane of the two-channel flexible circuit board, wherein: the dual channel The flexible circuit board sequentially includes a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer, and a fourth insulating layer; the first connection interface includes at least two a first bridge of a socket, and a plurality of mating portions at one side of the first terminal group are disposed in the inner socket of the first socket, and the other side of each of the mating portions is provided with a bottom portion of the first socket a soldering portion electrically connected to the first circuit layer, the ground layer, and the second circuit layer; the second connecting interface includes at least two second bridges having a second socket, and the sockets are respectively inserted in the second socket The plurality of abutting portions at one side of the second terminal group are disposed, and the other side of each of the abutting portions is electrically connected to the first circuit layer, the ground layer and the second circuit layer respectively. Welding department. The dual-channel flexible circuit bridge of claim 1, wherein the first insulating layer of the dual-channel flexible circuit board has a first film and has a first conductor and a second insulation in the first circuit layer. The layer has a second film, and a second adhesive layer bonded to the first conductor is disposed on the lower surface of the second film, and the ground layer has a metal conductor and a third film on the third insulating layer, and the third a lower surface of the film is provided with a fourth bonding layer bonded to the metal conductor, and a fifth bonding layer is disposed on the upper surface of the third film, and the second circuit layer has a fifth bonding layer bonded to the third film. The second conductor has a fourth film on the fourth insulating layer. The dual-channel flexible circuit bridge of claim 2, wherein the first film upper surface of the first insulating layer is further provided with a first adhesive layer and is bonded to the first conductive layer through the first adhesive layer The first film is further provided with a third adhesive layer on the upper surface of the second film, and the metal conductive system is bonded to the second film through the third adhesive layer, and a sixth adhesive layer is further disposed on the lower surface of the fourth film. And the fourth film is bonded to the second conductor through the sixth adhesive layer. The two-channel flexible circuit bridge connection according to claim 1, wherein the two sides of the dual-channel flexible circuit board are respectively provided with a plurality of conductive vias, and each of the conductive vias is electrically connected to the first circuit layer and connected respectively. The ground layer and the second circuit layer form an interlayer interconnection, and the first terminal group of the first bridge and the second terminal group of the second bridge are soldered to the plurality of via holes by the soldering portion in a double in-line package. A dual-channel flexible circuit bridge-connected dual graphics system includes a dual-channel flexible circuit board, a first connection interface, a second connection interface, and a display card installed in two slots arranged side by side on a predetermined motherboard. And each of the display cards is provided with two spaced-apart bridge ends, wherein: the dual-channel flexible circuit board sequentially comprises a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, and a third An insulating layer, a second circuit layer and a fourth insulating layer; the first connection interface comprises at least two first bridges having a first socket, and the first socket has a plug-in connector for inserting the display card The plurality of abutting portions are formed on one side of the first terminal group for contacting the bridge end connector to form an electrical connection in the socket, and the other side of each abutting portion is provided with a through-out portion a soldering portion electrically connected to the first circuit layer, the ground layer, and the second circuit layer at the bottom of the socket; The second connection interface includes at least two second bridges having a second socket, and the second socket has a socket for inserting the bridge end of the display card, and is inserted in the insertion slot. One side of the second terminal group is configured to contact the plurality of abutting portions of the bridge end connector to form an electrical connection, and the other side of each of the abutting portions is provided with a bottom portion of the second socket and a first circuit layer and a ground layer respectively. The second circuit layer forms an electrically connected soldering portion, whereby the first connecting interface and the second connecting interface are electrically connected to each other at opposite sides of the same plane of the dual-channel flexible circuit board, and are connected by the first connecting interface and the second The connection interface connects two display cards of different pitch to form a bridge state. The dual-channel flexible circuit bridge-connected dual graphics system as described in claim 5, wherein the first insulating layer of the dual-channel flexible circuit board has a first film and has a first conductor on the first circuit layer. The second insulating layer has a second film, and a second adhesive layer bonded to the first conductor is disposed on the lower surface of the second film, and the ground layer has a metal conductor and has a third layer on the third insulating layer. a film, and a lower surface of the third film is provided with a fourth adhesive layer bonded to the metal conductor, and a fifth adhesive layer is disposed on the upper surface of the third film, and the second circuit layer is coupled to the fifth adhesive layer through the fifth adhesive layer a second conductor on the third film and a fourth film on the fourth insulating layer. The dual-graphics system of the two-channel flexible circuit bridge connection according to claim 6, wherein the first film upper surface of the first insulating layer is further provided with a first adhesive layer and is transmitted by the first conductor An adhesive layer is bonded to the first film, and a second adhesive layer is further disposed on the upper surface of the second film, and the metal conductive system is bonded to the second film through the third adhesive layer, and further disposed on the lower surface of the fourth film A sixth subsequent layer, and the fourth film is bonded to the second conductor through the sixth adhesive layer. The dual-graphics system of the dual-channel flexible circuit bridge connection according to claim 5, wherein the two sides of the dual-channel flexible circuit board are respectively provided with a plurality of conductive vias, and the conductive vias are respectively electrically connected to the first a circuit layer, a ground layer and a second circuit layer form an interlayer interconnection, and the first terminal group of the first bridge and the second terminal group of the second bridge are encapsulated by a soldering portion in a double-in-line package manner Through hole welding.