CN211481587U - Server switching card - Google Patents
Server switching card Download PDFInfo
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- CN211481587U CN211481587U CN201922384395.0U CN201922384395U CN211481587U CN 211481587 U CN211481587 U CN 211481587U CN 201922384395 U CN201922384395 U CN 201922384395U CN 211481587 U CN211481587 U CN 211481587U
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Abstract
The application discloses a server adapter card, which comprises a connector arranged on the upper surface or the lower surface of a PCB (printed Circuit Board); the edge golden fingers are arranged along the length direction of the edge of the PCB, arranged on the upper surface and the lower surface of the PCB and marked as a first golden finger and a second golden finger; in the lamination design of the server adapter card PCB, a surface layer and an adjacent layer adopt a core board design mode, the surface layer is a signal reference plane layer, and the adjacent layer of the surface layer is a signal layer; when the connector is arranged on the upper surface of the PCB, the routing on the upper surface of the PCB is subjected to layer changing to a signal layer adjacent to the upper surface through the first golden finger and the first blind hole and is connected to a connector bonding pad on the surface layer through the second blind hole; the routing on the lower surface of the PCB is changed to a signal layer adjacent to the lower surface through the second golden finger and the third blind hole, and is connected to the connector bonding pad on the surface layer through the first through hole. Through the technical scheme in this application, realized replacing the microstrip line with the stripline and carrying out high-speed serial bus wiring in the switching card, reduced the line loss of walking, improved signal transmission quality.
Description
Technical Field
The application relates to the technical field of server equipment, in particular to a server adapter card.
Background
In the PCIe (Peripheral Component interconnect express) standard, a PCIe bus is generally used as an interconnection channel for transmitting information between respective electrical components, and electromagnetic waves carrying information are transmitted along a predetermined route. In high-speed PCB design, the most common transmission lines are microstrip lines and strip lines, wherein the strip lines are distributed in the inner layer and have two reference planes, and the microstrip lines are distributed in the top or bottom layer of the PCB board and have only one reference plane.
For the PCIe bus, a common topology is the cascade connection between the motherboard, the server riser card, and the PCIe expansion card. One end of the server adapter card is connected with the mainboard through a golden finger, and the other end of the server adapter card is connected with the expansion card through a dual in-line connector or a surface mounting connector.
In the prior art, when the connector on the adapter card is a surface-mount connector, due to various factors such as limited wiring space, fewer layers, low cost and the like, the adapter card can not avoid using a large number of microstrip lines wired on the surface layer to realize interconnection between connectors. In the aspect of the process, because the surface layer of the microstrip line is covered with green oil when being wired, the thickness and material characteristic parameters of the microstrip line have difference and uncertainty, so that the impedance of the surface layer of the microstrip line is difficult to control, and the performance of the server adapter card is influenced.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: the grounding reference surfaces (plane layers) are arranged on the upper surface and the lower surface of the PCB of the adapter card in a copper laying mode, and a blind hole structure and a through hole structure are combined, so that the purpose that a strip line replaces a microstrip line to carry out high-speed serial bus wiring in the adapter card is achieved, the loss of the adapter card is reduced, and the signal transmission quality is improved.
The technical scheme of the application is as follows: there is provided a server riser card comprising: the PCB is provided with a surface mounting connector and a board edge golden finger; the surface-mounted connector is arranged on the surface layer of the PCB, two rows of bonding pads are arranged on the PCB and are marked as a first surface-mounted connector bonding pad and a second surface-mounted connector bonding pad, and the first surface-mounted connector bonding pad and the second surface-mounted connector bonding pad are used for connecting the surface-mounted connector; the golden fingers are arranged along the length direction of the PCB board, are positioned on the surface layer of the PCB board and are sequentially marked as a first golden finger and a second golden finger from top to bottom; the surface layer and the adjacent layer of the PCB are both of a core plate structure, the surface layer is a signal reference plane layer, and the adjacent layer is a signal layer, wherein the surface layer comprises an upper surface and a lower surface.
In any one of the above technical solutions, further, the surface layer of the PCB is provided with a first GND plane and a second GND plane except for the area of the gold finger, the first surface-mount connector pad, and the area of the second surface-mount connector pad, and the first GND plane and the second GND plane are used as reference planes of the signal layer.
In any one of the above technical solutions, further, a blind hole and a through hole are formed in the PCB, and the blind hole and the through hole are used for achieving signal interconnection between the gold finger and the first surface-mount connector pad and the second surface-mount connector pad.
In any of the above technical solutions, further, the surface mount connector is disposed on an upper surface or a lower surface of the PCB board.
In any of the above technical solutions, further, the surface mount connector is disposed on the upper surface of the PCB, and an upper surface signal line passes through the first gold finger and the first blind hole to be layer-changed to the signal layer adjacent to the upper surface, and is connected to the first surface mount connector pad through the second blind hole; and the signal line on the lower surface of the PCB passes through the second golden finger and the third blind hole layer changing layer to the signal layer adjacent to the lower surface, and is connected to the second surface-mounted connector bonding pad through the through hole.
In any of the above technical solutions, further, the surface mount connector is disposed on the lower surface of the PCB, and a lower surface signal line is layer-changed from the first blind via through the first gold finger to the signal layer adjacent to the lower surface, and is connected to the first surface mount connector pad through the second blind via; and the PCB upper surface signal line passes through the second golden finger and the third blind hole layer changing layer to the signal layer adjacent to the upper surface, and is connected to the second surface-mounted connector bonding pad through the through hole.
The beneficial effect of this application is:
through the technical scheme in this application, adopt the mode of spreading the copper to set up ground reference at adaptor card PCB board upper surface and lower surface, combine blind hole, through-hole structure to utilize the stripline to carry out high-speed serial bus wiring, trade the layer, interconnect in data transmission process, realized using the stripline to replace the microstrip line to carry out the wiring in server adaptor card, reduced the conversion card loss, improved signal transmission quality.
Drawings
The advantages of the above and/or additional aspects of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic diagram of a server riser card with a surface mount connector disposed on a top surface according to one embodiment of the present application;
fig. 2 is a schematic diagram of a server riser card with surface mount connectors disposed on a lower surface according to one embodiment of the present application.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.
One end of the server adapter card in the embodiment is a gold finger, and the other end of the server adapter card is a surface-mounted connector pad, so that interconnection is realized through PCIe strip lines.
The first embodiment is as follows:
when the surface mount connector is disposed on the upper surface of the server adapter card, as shown in fig. 1, the server adapter card in this embodiment includes: the PCB is provided with a surface mounting connector and a board edge golden finger; the surface-mounted connector is arranged on the right side of the surface layer of the PCB, two rows of bonding pads are arranged on the PCB and are marked as a first surface-mounted connector bonding pad 14 and a second surface-mounted connector bonding pad 15, and the first surface-mounted connector bonding pad 14 and the second surface-mounted connector bonding pad 15 are used for connecting the surface-mounted connector, wherein the surface-mounted connector can be arranged on the upper surface or the lower surface of the PCB; the golden fingers are arranged along the length direction of the PCB and positioned on the left side of the surface layer of the PCB, and are marked as a first golden finger 11 and a second golden finger 21; the surface layer and the adjacent layer of the PCB adopt a core board design mode, the surface layer is a signal reference plane layer, the adjacent layer is a signal layer, and the surface layer comprises an upper surface and a lower surface.
The core board in this embodiment is a hard board with a specific thickness and copper-clad on both sides, and is a base material for forming a printed board, and other multilayer core boards and prepregs are arranged between upper and lower core boards of the server adapter card, and the adapter card is formed by laminating and pressing the core boards and the prepregs, and the specific structure of the multilayer board is determined by specific functions to be realized by the server adapter card except for the upper and lower core boards, which is not limited in this embodiment, wherein the prepregs are bonding materials of inner layer conductive patterns of the multilayer printed board and interlayer insulation.
Furthermore, the surface layer of the PCB is provided with a first GND plane 17 and a second GND plane 23 except the areas of the gold fingers and the first surface-mount connector pads 14 and the second surface-mount connector pads 15, and the first GND plane 17 and the second GND plane 23 are used as reference planes of the signal layer.
In order to realize the layer changing of signals in the server adapter card, blind holes and through holes 16 are formed in the PCB, the blind holes and the through holes 16 are used for realizing the signal interconnection of cash fingers and the first surface-mounted connector bonding pads 14 and the second surface-mounted connector bonding pads 15, and the blind holes comprise first blind holes 12, second blind holes 13 and third blind holes 22.
Specifically, on the basis of the existing PCB wiring, copper is laid on the surface layer of the PCB in a large area to serve as a signal reference plane. The method is characterized in that blind holes are formed in the PCB by laser drilling or other modes, copper is plated on the blind holes, layer changing in the signal transmission process is achieved by the blind holes, microstrip lines are replaced by strip lines, wiring is conducted on the inner layer, and crosstalk and loss of the server adapter card are reduced.
Further, when the surface mount connector is arranged on the upper surface of the PCB, the upper surface signal line is changed to a signal layer adjacent to the upper surface through the first golden finger 11 and the first blind hole 12, and is connected to the first surface mount connector pad 14 through the second blind hole 13; the signal line on the lower surface of the PCB is replaced to a signal layer adjacent to the lower surface through the second golden finger 21 and the third blind hole 22, the signal is transmitted in a strip line mode, and the strip line is connected to the second surface-mounted connector bonding pad 15 through the through hole 16.
Specifically, the upper surface of the PCB is used as a plane layer, except for the lead-out line of the first gold finger 11, the rest is used as one of reference planes of the PCIe bus of the high-speed signal line, after the signal trace is led out from the first gold finger 11, the layer is changed to a signal layer adjacent to the upper surface through the first blind hole 12, the signal layer is transmitted in a strip line manner, and the signal layer is connected to the first surface-mount connector pad 14 through the second blind hole 13, so that signal routing is realized.
Similarly, in order to realize the signal transmission between the second surface-mount connector pad 15 and the second gold finger 21, the signal trace is led out from the second gold finger 21, is replaced to the signal layer adjacent to the lower surface through the third blind hole 22, is transmitted in a strip line manner on the signal layer, and is connected to the second surface-mount connector pad 15 through the through hole 16.
Example two:
when the surface mount connector is disposed on the lower surface of the server adapter card, as shown in fig. 2, on the basis of the above mentioned force, the surface mount connector of the server adapter card in this embodiment is disposed on the lower surface of the PCB, and the lower surface signal line is layered through the first gold finger 11 and the first blind hole 12 to the signal layer adjacent to the lower surface, and is connected to the first surface mount connector pad 14 through the second blind hole 13; the signal line on the upper surface of the PCB is replaced to a signal layer adjacent to the upper surface through the second gold finger 21 and the third blind hole 22, the signal is transmitted in a strip line manner, and the strip line is connected to the second surface mount connector pad 15 through the through hole 16.
Specifically, when the surface mount connector is disposed on the lower surface of the server adapter card, the lower surface of the PCB is used as a planar layer, and the position relationship and the connection relationship of the first blind hole 12, the second blind hole 13, the first surface mount connector pad 14, the third blind hole 22, and the second surface mount connector pad 15 are all symmetrical to the surface mount connector disposed on the upper surface of the server adapter card, which is not described herein again.
Example three:
as shown in fig. 1, this embodiment shows a concrete implementation manner of a server adapter card, and this server adapter card is applicable to surface mount type connector, and the upper and lower two sides of server adapter card all are provided with the core, are connected with through-hole 16 between upper core and the lower floor, and through-hole 16 is located the right side of server adapter card, and the upper and lower surface of upper core is plane layer and signal layer in proper order, and upper core includes: the circuit board comprises a first golden finger 11, a first blind hole 12, a second blind hole 13 and two surface-mounted connector pads, wherein a lower-layer core board signal layer is connected to a surface-mounted connector pad 15 of an upper-layer core board plane layer through a through hole 16, and the first golden finger 11 is arranged on the left side of the upper surface of an upper-layer core board; the first blind hole 12 is positioned on the right side of the first golden finger 11, and the upper end of the first blind hole 12 is connected to the first golden finger 11 through a short surface layer routing strip line; the surface-mounted connector pads are arranged on the right side of the upper surface of the upper-layer core plate, are symmetrically arranged on the left side and the right side of the through hole 16 in the left-right side mode, and are sequentially marked as a left surface-mounted connector pad 14 and a right surface-mounted connector pad 15; the second blind hole 13 is located the left side of left side table pastes connector pad 14, and the upper end of second blind hole 13 is walked to connect in left side table and is pasted connector pad 14 through shorter top layer, and the upper surface of upper core board has spread first copper layer 17 except that first golden finger 11, left side table paste connector pad 14 and right side table paste connector pad 15 region.
Further, a first signal line 18 is connected between the lower end of the first blind via 12 and the lower end of the second blind via 13, and is referred to as a signal layer, wherein the first signal line 18 is a strip line.
Further, the through hole 16 is plated with a copper layer, and the upper end of the through hole 16 is connected to the right surface-mount connector pad 15 through a short surface layer trace strip line.
Further, the lower core plate includes: a second gold finger 21 and a third blind hole 22; the second golden finger 21 is arranged on the lower surface of the lower-layer core plate and is positioned below the first golden finger 11; the third blind hole 22 is disposed on the right side of the second golden finger 21 and located below the first blind hole 12, the lower end of the third blind hole 22 is connected to the second golden finger 21 through a short surface layer routing strip line, and the upper end of the third blind hole 22 is connected to the through hole 16 through a second signal 24 line, wherein the second signal 24 line is a strip line.
Further, a second copper layer 23 is laid between the lower end of the third blind via 22 and the lower end of the through hole 16 except for the area of the second gold finger 21.
In the server adapter card in this embodiment, all the high-speed signal lines are ensured to be striplines by modifying the laminated structure of a conventional adapter card and adding a blind hole design, so that microstrip lines are avoided.
The technical scheme of the application is explained in detail in the above with reference to the attached drawings, and the application provides a server adapter card which comprises a connector arranged on the upper surface or the lower surface of a PCB (printed circuit board); the edge golden fingers are arranged along the length direction of the edge of the PCB, arranged on the upper surface and the lower surface of the PCB and marked as a first golden finger and a second golden finger; in the lamination design of the server adapter card PCB, a surface layer and an adjacent layer adopt a core board design mode, the surface layer is a signal reference plane layer, and the adjacent layer of the surface layer is a signal layer; when the connector is arranged on the upper surface of the PCB, the routing on the upper surface of the PCB is subjected to layer changing to a signal layer adjacent to the upper surface through the first golden finger and the first blind hole and is connected to a connector bonding pad on the surface layer through the second blind hole; the routing on the lower surface of the PCB is changed to a signal layer adjacent to the lower surface through the second golden finger and the third blind hole, and is connected to the connector bonding pad on the surface layer through the first through hole. Through the technical scheme in this application, realized replacing the microstrip line with the stripline and carrying out high-speed serial bus wiring in the switching card, reduced the line loss of walking, improved signal transmission quality.
In the present application, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The shapes of the various elements in the drawings are illustrative and do not preclude the existence of certain differences from the actual shapes, and the drawings are used for the purpose of illustrating the principles of the present application and are not intended to limit the present application.
Although the present application has been disclosed in detail with reference to the accompanying drawings, it is to be understood that such description is merely illustrative and not restrictive of the application of the present application. The scope of the present application is defined by the appended claims and may include various modifications, adaptations, and equivalents of the subject application without departing from the scope and spirit of the present application.
Claims (6)
1. A server riser card, comprising: the PCB is provided with a surface mounting connector and a board edge golden finger;
the surface-mounted connector is arranged on the surface layer of the PCB, two rows of bonding pads are arranged on the PCB and are marked as a first surface-mounted connector bonding pad (14) and a second surface-mounted connector bonding pad (15), and the first surface-mounted connector bonding pad (14) and the second surface-mounted connector bonding pad (15) are used for connecting the surface-mounted connector;
the golden fingers are arranged along the length direction of the PCB board, are positioned on the surface layer of the PCB board, and are sequentially marked as a first golden finger (11) and a second golden finger (21) from top to bottom;
the surface layer and the adjacent layer of the PCB are both of a core plate structure, the surface layer is a signal reference plane layer, and the adjacent layer is a signal layer, wherein the surface layer comprises an upper surface and a lower surface.
2. The server riser card according to claim 1, wherein the surface layer of the PCB board is provided with a first GND plane (17) and a second GND plane (23) except for the gold finger and the area of the first surface-mount connector pad (14) and the second surface-mount connector pad (15), and the first GND plane (17) and the second GND plane (23) are used as reference planes of the signal layer.
3. The server riser card according to claim 2, wherein the PCB board is provided with blind holes and through holes (16), and the blind holes and the through holes (16) are used for realizing signal interconnection of the gold fingers with the first surface-mount connector pads (14) and the second surface-mount connector pads (15).
4. The server riser card of claim 1, wherein the surface mount connector is disposed on an upper surface or a lower surface of the PCB board.
5. The server riser card of claim 3, wherein the surface mount connector is disposed on the upper surface of the PCB, and upper surface signal lines are exchanged between layers through the first gold finger (11) and the first blind hole (12) to the signal layer adjacent to the upper surface, and are connected to the first surface mount connector pad (14) through the second blind hole (13);
the signal line on the lower surface of the PCB is connected to a second surface-mounted connector pad (15) through the through hole (16) after being replaced by the second golden finger (21) and the third blind hole (22) to the signal layer adjacent to the lower surface.
6. The server riser card of claim 3, wherein the surface mount connector is disposed on the lower surface of the PCB, and a lower surface signal line passes through the first gold finger (11) and the first blind hole (12) to be exchanged to the signal layer adjacent to the lower surface, and is connected to the first surface mount connector pad (14) through the second blind hole (13);
the PCB upper surface signal line passes through the second golden finger (21) and the third blind hole (22) and is changed the layer to the signal layer adjacent to the upper surface, and passes through the through hole (16) and is connected to the second surface-mounted connector pad (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922384395.0U CN211481587U (en) | 2019-12-26 | 2019-12-26 | Server switching card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922384395.0U CN211481587U (en) | 2019-12-26 | 2019-12-26 | Server switching card |
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| Publication Number | Publication Date |
|---|---|
| CN211481587U true CN211481587U (en) | 2020-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922384395.0U Active CN211481587U (en) | 2019-12-26 | 2019-12-26 | Server switching card |
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| CN (1) | CN211481587U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923860A (en) * | 2021-10-11 | 2022-01-11 | 恒为科技（上海）股份有限公司 | SFI interface-based electrical signal testing device |
-
2019
- 2019-12-26 CN CN201922384395.0U patent/CN211481587U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923860A (en) * | 2021-10-11 | 2022-01-11 | 恒为科技（上海）股份有限公司 | SFI interface-based electrical signal testing device |
| CN113923860B (en) * | 2021-10-11 | 2023-08-29 | 恒为科技（上海）股份有限公司 | Electric signal testing device based on SFI interface |
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