M324837 八、新型說明： 【新型所屬之技術領域】 摘作係有關-種高速數位傳輪裝置，尤指—種_ 具有較佳之特性阻抗的數位傳輸裝置。 【先前技術】 - 請參考第一圖所示以lvds訊號傳輸系統為例，由於液 晶顯示^和系統主機之間的訊號通訊量’非常的龐大且頻 • 率非常高，所以，目前架設在液晶顯示器介面2與系統主 機板介面3之間的高頻訊號傳輸系統，係採用具高超速 (1 · 4Gb/s)、低功耗及低電磁輻射特性的低壓差分信號接收 器（LVDS，Low Voltage Differential Signal)4 作為液晶 顯示器介面2的訊號傳輸介面，並經由訊號傳輸線 (Transmission Line)5的連接，與系統主機板介面3上的 訊號傳輸介面，即與系統主機板介面3上的連接器插座 31，一起構成訊號連接，和共同組成一種習用LVDS訊號傳 ^ 輸系統。 - 但依據ANSI-YUA-EIA-644-1995定義的LVDS介面標 準’這種LVDS訊號傳輸系統所使用的訊號傳輸線5，必須 使用特性阻抗（Z〇)為100 Ω ±5%的訊號傳輸線5，才能與液 晶顯示介面2和系統主機板介面3的電路阻抗（Z)相匹配， 同時這種LVDS訊號傳輸系統必須在滿足這種條件的情形 之下，才能降低電磁干擾（EMI)和減少雜訊（noise)干擾， 和正確地執行液晶顯示器介面（或簡稱為LVDS介面）2和系 M324837 .^構成—體’其製程簡便、製造成本較低，且具有柔軟、 耐燃、耐冷熱的特性，且該傳輪訊號線11的特性阻抗（z。) 健傳輸訊號線11的導電層寬度及厚度相關，Π 反比關係。 σ當傳輸訊號線11的導電層111寬度增加時、或傳輸訊 號線11的導電層111增加時，傳輸訊號線11的特性阻抗 -(f°)即隨之降低；當傳輸訊號線11的導電層111寬度減少 -時、或傳輸訊號線11的導電層111減少時，傳輸訊號線J Φ 的特性阻抗（Z。）即隨之增加。 除此之外，該傳輸訊號線1的特性阻抗（Z。）亦與傳輸 訊號線11的第一、二絕緣層112、113的厚度相關/尤其: 傳輸訊號線11的特性阻抗（ζ〇係與傳輸訊號線u的第 一、二絕緣層112、113的厚度呈反比關係。 备傳輸號線11的第一絕緣層112或第二絕緣層113 的厚度增加時，傳輸訊號線11的特性阻抗（Ζ〇)即隨之降 低，反之，當傳輸訊號線11的第一絕緣層112或第二絕緣 Φ 層U3的厚度減少時，傳輸訊號線11的特性阻抗（Ζ。）即隨 . 之增加。 故本創作將導電層111之厚度調整於0018〜0.1111111， 而寬度為0· 2〜0· 8 mm，且使第一、二絕緣層112、113之厚 度調整於0.04〜0.3 mm，就可以形成一具有較佳特性阻抗 (Z〇)為1〇〇Ω±5%的傳輸訊號線卜其傳輸訊號線丨丨可作 為電子線、光學線、串行先進技術附件（Serial AdvancedM324837 VIII. New description: [New technical field] It is a kind of high-speed digital position transmission device, especially a digital transmission device with better characteristic impedance. [Prior Art] - Please refer to the first figure for the lvds signal transmission system. Since the signal communication between the LCD display and the system host is very large and the frequency is very high, it is currently installed in the LCD. The high-frequency signal transmission system between the display interface 2 and the system board interface 3 is a low-voltage differential signal receiver (LVDS, Low Voltage) with high overspeed (1 · 4Gb/s), low power consumption and low electromagnetic radiation characteristics. Differential Signal)4 is used as the signal transmission interface of the LCD interface 2, and is connected via the signal transmission line 5 to the signal transmission interface on the system board interface 3, that is, the connector socket on the system motherboard interface 3. 31, together form a signal connection, and together form a conventional LVDS signal transmission system. - However, according to the LVDS interface standard defined by ANSI-YUA-EIA-644-1995, the signal transmission line 5 used in the LVDS signal transmission system must use a signal transmission line 5 having a characteristic impedance (Z〇) of 100 Ω ± 5%. In order to match the circuit impedance (Z) of the LCD interface 2 and the system board interface 3, the LVDS signal transmission system must meet such conditions to reduce electromagnetic interference (EMI) and reduce noise. (noise) interference, and correctly perform the liquid crystal display interface (or simply LVDS interface) 2 and the system M324837. The composition of the body is simple in process, low in manufacturing cost, and has the characteristics of softness, flame resistance, cold and heat resistance, and The characteristic impedance (z.) of the transmission signal line 11 is related to the width and thickness of the conductive layer of the transmission signal line 11, and is inversely proportional. σ When the width of the conductive layer 111 of the transmission signal line 11 increases, or when the conductive layer 111 of the transmission signal line 11 increases, the characteristic impedance -(f°) of the transmission signal line 11 decreases; when the transmission signal line 11 is electrically conductive When the width of the layer 111 is reduced, or when the conductive layer 111 of the transmission signal line 11 is decreased, the characteristic impedance (Z.) of the transmission signal line J Φ is increased. In addition, the characteristic impedance (Z.) of the transmission signal line 1 is also related to the thickness of the first and second insulating layers 112, 113 of the transmission signal line 11 / in particular: the characteristic impedance of the transmission signal line 11 In inverse relationship with the thicknesses of the first and second insulating layers 112, 113 of the transmission signal line u. When the thickness of the first insulating layer 112 or the second insulating layer 113 of the transmission line 11 is increased, the characteristic impedance of the transmission signal line 11 is increased. (Ζ〇) is reduced accordingly. Conversely, when the thickness of the first insulating layer 112 or the second insulating Φ layer U3 of the transmission signal line 11 is decreased, the characteristic impedance (Ζ.) of the transmission signal line 11 is increased. Therefore, the thickness of the conductive layer 111 is adjusted to 0018~0.1111111, and the width is 0·2~0·8 mm, and the thickness of the first and second insulating layers 112 and 113 is adjusted to 0.04~0.3 mm. Forming a transmission signal line with better characteristic impedance (Z〇) of 1〇〇Ω±5%, its transmission signal line can be used as an electronic line, optical line, serial advanced technology accessory (Serial Advanced
Technology Attachment，以下簡稱SATA)，亦可應用於 8 • M324837 -LVDS、USB、SATA、_、R川、RJ45、1394 之訊號傳輸系 統中。 斤-再者，各印刷電路板12 一側係設有複數線路121，如 第:圖所不，各線路121可與複數銅線a相連接，而該印 刷電路板12相對於各線路121之一側係設有與各線路121 連接之連接裝置122,該連接裝置可以為0DD(0pticalDisc • Drive) ^ SATA(Serial ΑΤΑ) > HDMI(High-Definition Multimedia Interface) 、USB 或是 D—sub 傳輸介面的連 φ 接埠本體，請同時參閱第四圖所示，係為本創作中高速數 位傳輸裝置應用於LVDS訊號傳輸系統之結構示意圖，其係 架設於液晶顯示介面2與系統主機板介面3之間，該液晶 顯示介面2與系統主機板介面3則分別藉由各印刷電路板 12上之連接裝置122構成連接，並由傳輸訊號線11構成 液晶顯示介面2與系統主機板介面3間之訊號連接，以改 善習有傳輸訊號線無法用為LVDS訊號傳輸系統之缺失。 本創作之技術内容及技術特點巳揭示如上，然而熟悉 φ 本項技術之人士仍可能基於本創作之揭示而作各種不背離 . 本案創作精神之替換及修飾。因此，本創作之保護範圍應 不限於實施例所揭示者，而應包括各種不背離本創作之替 換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 第一圖係為習用液晶顯示器L C D介面與系統主機板介面之 間的LVDS訊號傳輸系統示意圖。 9 M324837 第二圖（A)、（B)係為本創作中傳輸訊號線之剖面結構示意 圖。 第三圖係為本創作中高速數位傳輸裝置之結構分解圖。 第四圖係為本創作中高速數位傳輸裝置應用於LVDS訊號 傳輸系統之結構示意圖。 【主要元件代表符號說明】 高速數位傳輸裝置1 傳輸訊號線11 導電層111 銅線a 第一絕緣層112 第二絕緣層113 接地板114 印刷電路板12 線路121 連接裝置122 液晶顯示器介面2 系統主機板介面3 連接器插座31 低壓差分信號接收器4 訊號傳輸線5Technology Attachment (hereinafter referred to as SATA) can also be used in 8 • M324837 - LVDS, USB, SATA, _, Rchuan, RJ45, 1394 signal transmission systems. Further, a plurality of lines 121 are provided on one side of each printed circuit board 12, and as shown in the figure: each line 121 may be connected to a plurality of copper lines a, and the printed circuit board 12 is opposed to each line 121. One side is provided with a connecting device 122 connected to each line 121, and the connecting device can be 0DD (0pticalDisc • Drive) ^ SATA (Serial ΑΤΑ) > HDMI (High-Definition Multimedia Interface), USB or D-sub transmission The interface of the interface is connected to the main body of the LVDS signal transmission system. The liquid crystal display interface 2 and the system motherboard interface 3 are respectively connected by the connecting device 122 on each printed circuit board 12, and the transmission signal line 11 is formed between the liquid crystal display interface 2 and the system motherboard interface 3. Signal connection to improve the transmission of the signal line can not be used as a missing LVDS signal transmission system. The technical content and technical characteristics of this creation are disclosed above, but those who are familiar with this technology may still make various changes based on the disclosure of this creation. The replacement and modification of the creative spirit of this case. Therefore, the scope of protection of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims. [Simple diagram of the diagram] The first diagram is a schematic diagram of the LVDS signal transmission system between the conventional LCD display L C D interface and the system motherboard interface. 9 M324837 The second picture (A) and (B) are schematic diagrams of the cross-sectional structure of the transmission signal line in this creation. The third figure is an exploded view of the structure of the high-speed digital transmission device in the creation. The fourth picture is a schematic diagram of the structure of the high-speed digital bit transmission device applied to the LVDS signal transmission system. [Description of main component representative symbols] High-speed digital transmission device 1 Transmission signal line 11 Conductive layer 111 Copper wire a First insulating layer 112 Second insulating layer 113 Ground plate 114 Printed circuit board 12 Line 121 Connection device 122 Liquid crystal display interface 2 System host Board interface 3 connector socket 31 low voltage differential signal receiver 4 signal transmission line 5