M326654 八、新型說明： ， 【新型所屬之技術領域】 ‘ 本創作係有關一種高速數位傳輪系統，尤指一種能夠 具有較佳之特性阻抗的數位傳輸系統。 【先前技術】 - 请參考第一圖所示以LVDS訊號傳輸系統為例，由於液 ， 晶顯不器和系統主機之間的訊號通訊量，非常的龐大且頻 φ 率非常高，所以，目前架設在液晶顯示器介面A與系統主 機板介面B之間的高頻訊號傳輸系統，係採用具高超速 〇· 4Gb/s)、低功耗及低電磁輻射特性的低壓差分信號接收 器（LVDS，Low Voltage Differential Signal)C 作為液晶 顯示器介面A的訊號傳輸介面，並經由訊號傳輸線 (TransmissionLine)D的連接，與系統主機板介面b上的 訊號傳輸介面，即與系統主機板介面B上的連接器插座 B1，一起構成訊號連接，和共同組成一種習用LVDS訊號傳 φ 輸系統。 - 但依據ANSI-YUA-EIA-644-1995定義的LVDS介面標 準，這種LVDS訊號傳輸系統所使用的訊號傳輸線D，必須 使用特性阻抗（Z。）為1〇〇 Ω ±5%的訊號傳輸線D，才能與液 晶顯示介面A和系統主機板介面B的電路阻抗（z)相匹配， 同時這種LVDS訊號傳輸系統必須在滿足這種條件的情形 之下，才能降低電磁干擾（EMI)和減少雜訊（n〇ise)干擾， 和正確地執行液晶顯示器介面（或簡稱為LVDS介面）A和系 M326654 統主機板介面B之間的訊號傳輸，或避免錯誤動作產生； 否則，液晶顯示器介面A和系統主機板介面B之間的訊號 傳輸，將會產生信號反射和雜訊（noise)干擾，和造成信號 損失、變形和失真。 而適合使用在這種習用LVDS訊號傳輸系統中的訊號 傳輸線D，目前有特性阻抗（Z。）設計成100 Ω ±5%的傳統連 接線（Wire Cable)、軟性印刷電路板（FPC，Flexible Printed Circuit)或迷你同軸電纜（Mini Coaxial Cable) 等；但，結構較為簡單且單價成本較低廉的習用軟性排線 (FFC，Flexible Flat Cable)，因為其特性阻抗（Z。）值大 約都在130Ω左右，不符合LVDS訊號傳輸系統的標準使用 規範，故目前並不適合在習用LVDS訊號傳輸系統中使用。 【新型内容】 本創作係之主要目的即在提供一種可形成電子線、光 學線、串行先進技術附件（Serial Advanced Technology Attachment，以下簡稱SATA)，並可藉由第一、二連接裝 置應用於二介面中以具有較佳特性阻抗之高速數位傳輸系 統0 其中’该兩速數位傳輸系統至少包含有：第一、二連 接裝置以及傳輸訊號線，該第一、二連接裝置分別設於第 一、二介面及傳輸訊號線間，該傳輸訊號線則包括有：導 電層、刀別δ又於導電層兩侧之第一、二絕緣層以及接地板， 該導電層之厚度為O.OUU麵，寬度為〇 2~〇.8_，而 M326654 第一、二絕緣層之厚度為（Κ 04〜0· 3 mm。 【實施方式】 本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地暸解。 如第二圖本創作中該高速數位傳輸系統1係使用於第 一、二介面2、3之間的傳輸系統，其至少包含有：第一、 二連接裝置10、20以及傳輸訊號線30。 該傳輸訊號線30係包括有：導電層31、第一、二絕 緣層32、33以及接地板34，如第三圖（A)所示；其中 該導電層31，該導電層31係包括有複數條平行排列 之銅線a，其導電層31之整體厚度為0. 018〜0. 1丽，寬度 為 0· 2〜0· 8 mm。 第一絕緣層32,該第一絕緣層32係設於導電層31 — 侧，該第一絕緣層32係為PET材質，其厚度為0.04〜0.3 mm 〇 第二絕緣層33，該第二絕緣層33係設於導電層31相 對於第一絕緣層32之另一侧，該第二絕緣層33係為聚對 苯二曱酸乙二醇酯（PET)或聚亞醢胺（polyimide)材質， 其厚度為0· 04〜0· 3 mm。 接地板34,係設於第一絕緣層32或第二絕緣層33 — 側或兩側同時有接地板，如圖所示，其係設於第二絕緣層 33相對於導電層31之另一侧，該接地板34可以為銅或鋁 板；該接地板34亦可設於第一絕緣層32相對於導電層31 M326654 之另一側，如第三圖（B)所示 並f ::==== =耐冷熱的特性’且該傳輸訊號線3〇的特性阻抗人 1:=號線3°的導電層31的寬度及厚度相關， 对卜-姻_嫌3G特陳⑽）亦與傳輸 心虎線30的弟一、二絕緣層32、33的厚度相關， 傳輸訊號線30的特性阻抗㈤係與傳輸訊號線^ 一、二絕緣層32、33的厚度呈反比關係。 的弟 故本創作將導電層3〇之厚度調整於〇 〇18~〇 寬度為0.2〜0.8 mm，且使第一、二絕緣層32、33之严 1 整於〇.〇4〜0.3 nun ’就可以形成-具有較佳特性‘二 為1〇〇Ω±5%的傳輸訊號線30,其傳輸訊號線3〇可作為電 子線、光學線、串行先進技術附件（SeHal Advanced Technology Attachment，以下簡稱SATA)，亦可應用於 LVDS、USB、SATA、ODD、RJ11、RJ45、1394 之訊號傳輸系 統中。 當應用於第一、二介面2、3分別為液晶顯示介面和系 統主機板介面間時，該第一連接裝置10係設於第一介面2 及傳輸訊號線30間，而該第一連接裝置1〇可以為掀蓋連 接器、插板連接器、焊接連接或壓接連接，如第四圖所示 之實施例中，該第一連接裝置10係為插板連接器，該插板 連接器可包含有設於第一介面2之第一連接器本體11、設 M326654 於傳輸訊號線30 —侧之第一導電部12(其導電部12係為 導電層31 —侧外露於傳輸訊號線30的部份），以及設於第 一導電部12上之第二連接器本體13，該第一連接器本體 11可以為低壓差分信號接收器（LVDS)，該第二連接器本體 13並設有包覆在本體13外部並相對應於第一導電部12之 上、下金屬殼體131、132，以及金屬卡扣件133，請同時 參閱第五圖所示，該金屬卡扣件133係穿設在本體13的邊 側部位與上金屬殼體131相接觸，該金屬卡扣件133係設 有一朝向本體13前方延伸的鉤部1331，以及相對於夠部 1331另侧之按壓部1332，以當第二連接器本體13插入^ 一連接器本體11至定位時，可利用金屬卡扣件133的鉤1 1331與第一連接器本體π 一侧形成扣持作用【如第六曰 (A)所示】，並可藉由按壓按壓部1332，使該鉤部133ι ' 離第一連接器本體11【如第六圖（B)所示】，而使第一、脫 連接器本體11、13相互脫離。 而該第二連接裝置2〇係設於第二介面3及傳輪訊號線 30間，而該第二連接裝置可以為掀蓋連接器、插板連接 器、焊接連接或壓接連接，如第四圖所示之實施例中，診 第二連接裝置20係為掀蓋連接器，該掀蓋連接器可包含g 設於第二介面3之第三連接器本體21以及設於傳輪訊號線 30—侧之第二導電部22(其導電部22係為導電層3ι :侧 外露於傳輸訊號線30的部份），請同時參閱第七圖所示哥 该第二連接器本體21並設有容納有端子211之插槽212 以及一活動蓋213，該活動蓋213係樞設於第三連^器本 M326654 體21上，當活動蓋213向上翻轉 線30的第二導+ 瓜起時，可提供傳輸訊號 电部22插入該本體21容納有端子211的插 槽212内，當活動蓋人細于ZU的插 訊號線30的第二導：至定位時’可將傳輸 構成電性連接。 固疋在本__ 212内部並 田然，該第一、二連接裝置可以不同之 蓋連接器以及插板連接器，或該第二 八Η所,J分別為插板連接器以及掀蓋連接器，或如第 :圖所不’5亥第-連接裝置10可以為焊接連接，而第1 m 為接連接’其亦可以皆為相同之連接器形 i者μ㈣—連接震置可分別掀蓋連接器或插板連接器， 接、車桩十圖所不’該第一、二連接裝置10、20可以為焊 =接’或者均為壓接連接，隱可以達到電性連接之功M326654 VIII. New description: , [New technical field] ‘This creation relates to a high-speed digital position transmission system, especially a digital transmission system capable of having better characteristic impedance. [Prior Art] - Please refer to the LVDS signal transmission system as shown in the first figure. The signal communication between the liquid crystal display unit and the system host is very large and the frequency φ rate is very high. Therefore, at present, The high-frequency signal transmission system between the LCD interface A and the system board interface B is a low-voltage differential signal receiver (LVDS) with high overspeed 〇 4Gb/s), low power consumption and low electromagnetic radiation. Low Voltage Differential Signal)C is used as the signal transmission interface of the liquid crystal display interface A, and is connected via the signal transmission line (TransmissionLine) D, and the signal transmission interface on the system motherboard interface b, that is, the connector on the system motherboard interface B The socket B1, together form a signal connection, and together form a conventional LVDS signal transmission system. - However, according to the LVDS interface standard defined by ANSI-YUA-EIA-644-1995, the signal transmission line D used in the LVDS signal transmission system must use a signal transmission line with a characteristic impedance (Z.) of 1 〇〇 ± 5%. D, can match the circuit impedance (z) of the liquid crystal display interface A and the system motherboard interface B, and the LVDS signal transmission system must meet the conditions to reduce electromagnetic interference (EMI) and reduce Noise (n〇ise) interference, and correctly perform signal transmission between the LCD interface (or LVDS interface for short) A and the M326654 motherboard interface B, or avoid false actions; otherwise, the LCD interface A Signal transmission between the system board interface B and the system will cause signal reflection and noise interference, and cause signal loss, distortion and distortion. The signal transmission line D suitable for use in the conventional LVDS signal transmission system has a characteristic impedance (Z.) designed as a 100 Ω ±5% conventional cable (Wire Cable), and a flexible printed circuit board (FPC, Flexible Printed). Circuit) or Mini Coaxial Cable; etc.; however, the simple flat cable (FFC) is simpler in structure and lower in cost, because its characteristic impedance (Z.) value is about 130Ω. It does not meet the standard operating specifications of the LVDS signal transmission system, so it is not suitable for use in the conventional LVDS signal transmission system. [New content] The main purpose of this creation department is to provide a form of electronic line, optical line, Serial Advanced Technology Attachment (SATA), which can be applied by first and second connecting devices. A high-speed digital transmission system having a better characteristic impedance in the second interface. The 'two-speed digital transmission system includes at least: first and second connecting devices and a transmission signal line, and the first and second connecting devices are respectively disposed at the first Between the two interfaces and the transmission signal line, the transmission signal line includes: a conductive layer, a knife δ and a first and second insulating layer on both sides of the conductive layer, and a grounding plate, the conductive layer having a thickness of O.OUU surface The width is 〇2~〇.8_, and the thickness of the first and second insulating layers of M326654 is (Κ 04~0·3 mm. [Embodiment] The characteristics of this creation can be referred to the detailed description of the drawings and the examples. Obtaining a clear understanding. As shown in the second figure, the high-speed digital transmission system 1 is used in a transmission system between the first interface and the second interface 2, 3, and includes at least: first and second connections. 10, 20 and transmission signal line 30. The transmission signal line 30 includes: a conductive layer 31, first and second insulating layers 32, 33 and a ground plate 34, as shown in the third figure (A); wherein the conductive The first layer of the conductive layer 31 has a plurality of copper wires a arranged in parallel, and the thickness of the conductive layer 31 is 0. 018~0. 1 丽, the width is 0·2~0·8 mm. The layer 32 is disposed on the side of the conductive layer 31. The first insulating layer 32 is made of PET and has a thickness of 0.04 mm to 0.3 mm. The second insulating layer 33 is a second insulating layer 33. The conductive layer 31 is disposed on the other side of the first insulating layer 32, and the second insulating layer 33 is made of polyethylene terephthalate (PET) or polyimide (polyimide). 0. 04~0·3 mm. The grounding plate 34 is disposed on the first insulating layer 32 or the second insulating layer 33 on the side or both sides of the grounding plate, as shown in the figure, which is provided in the second insulation The layer 33 may be a copper or aluminum plate relative to the other side of the conductive layer 31; the ground plate 34 may also be disposed on the first insulating layer 32 opposite to the conductive layer 31 M326654 Side, as shown in the third figure (B) and f ::==== = resistance to cold and heat characteristics 'and the characteristic impedance of the transmission signal line 3 人 the width of the conductive layer 31 of the human 1:= line 3° and The thickness is related to the thickness of the first and second insulating layers 32, 33 of the transmission heart line 30, and the characteristic impedance (5) of the transmission signal line 30 and the transmission signal line. The thickness of the two insulating layers 32, 33 is inversely proportional. The younger brother created the thickness of the conductive layer 3〇 to 〇〇18~〇, the width is 0.2~0.8 mm, and the first and second insulating layers 32, 33 are as strict as 〇.〇4~0.3 nun ' It is possible to form a transmission signal line 30 having a better characteristic 'two is 1 〇〇 Ω ± 5%, and the transmission signal line 3 〇 can be used as an electronic line, optical line, serial advanced technology attachment (SeHal Advanced Technology Attachment, below) Referred to as SATA), it can also be applied to signal transmission systems of LVDS, USB, SATA, ODD, RJ11, RJ45, and 1394. When the first interface and the second interface 2 and 3 are respectively between the liquid crystal display interface and the system motherboard interface, the first connection device 10 is disposed between the first interface 2 and the transmission signal line 30, and the first connection device 1〇 can be a flip cover connector, a card connector, a solder connection or a crimp connection. In the embodiment shown in the fourth figure, the first connection device 10 is a card connector, and the card connector is The first conductive body 12 disposed on the first interface 2 of the first interface 2 and the M326654 on the side of the transmission signal line 30 may be included (the conductive portion 12 is the conductive layer 31 - the side is exposed on the transmission signal line 30 And a second connector body 13 disposed on the first conductive portion 12, the first connector body 11 may be a low voltage differential signal receiver (LVDS), and the second connector body 13 is provided Covered on the outside of the body 13 and corresponding to the first conductive portion 12, the lower metal housing 131, 132, and the metal clip 133, please refer to the fifth figure, the metal clip 133 is worn. The side portion of the body 13 is in contact with the upper metal casing 131, the metal The fastener 133 is provided with a hook portion 1331 extending toward the front of the body 13 and a pressing portion 1332 opposite to the upper portion 1331 to be used when the second connector body 13 is inserted into the connector body 11 for positioning. The hook 1 1331 of the metal clip 133 forms a latching action with the π side of the first connector body [as shown in the sixth drawing (A)], and the hook portion 133 ι '' can be removed by pressing the pressing portion 1332 The first connector body 11 [shown in FIG. 6(B)] disengages the first and disconnector bodies 11, 13 from each other. The second connecting device 2 is disposed between the second interface 3 and the transmission signal line 30, and the second connecting device can be a flip cover connector, a plug connector, a solder connection or a crimp connection, such as In the embodiment shown in FIG. 4, the second connection device 20 is a cover connector, and the cover connector may include a third connector body 21 disposed on the second interface 3 and a signal line disposed on the transmission wheel. The second conductive portion 22 of the 30-side (the conductive portion 22 is a portion of the conductive layer 3ι: the side exposed to the transmission signal line 30), please also refer to the second connector body 21 shown in the seventh figure. There is a slot 212 for receiving the terminal 211 and a movable cover 213 which is pivotally disposed on the body M326654 body 21 of the third connector, when the movable cover 213 is turned upside down by the second guide + The transmission signal electrical portion 22 can be inserted into the slot 212 of the body 21 in which the terminal 211 is received. When the movable cover is thinner than the second guide of the ZU's interpolated line 30: to the positioning, the transmission can be electrically connected. . The solid state is in the interior of the __212, and the first and second connecting devices can be differently connected to the connector and the plug connector, or the second gossip, J is a plug connector and a cover connection respectively. , or as shown in the figure: Figure 5: The connection device 10 can be a solder connection, and the 1 m is a connection connection. It can also be the same connector shape i (4) - the connection can be separately 掀Cover connector or plug connector, connection, car pile ten figure does not 'the first and second connection devices 10, 20 can be welding = connection' or all crimp connection, hidden to achieve electrical connection
弟一介面2、3(液晶顯示介面和系統主機板介 第-、二連接裝置㈣(掀蓋連接= 插板連接器）構成電性連接，並由傳輸訊號線30構成二介 面間之訊號連接，以改善習有傳輸訊號線無法用為圓 訊號傳輸系統之缺失。 本創作之技術内容及技術特點巳揭示如上，然而熟来 ^技術之人士仍可能基於本創作之揭示而作各種不背^ 案創作精神之替換及修飾。因此，本創作之保護範圍應 不限於實施例所揭#，而應、包括纟種不背離本創作之^ 換及修飾，並為以下之申請專利範圍所涵蓋。 M326654 【圖式簡單說明】 第一圖係為習用液晶顯示器LCD介面與系統主機板介面之 間的LVDS訊號傳輸系統示意圖。 第二圖係為本創作中第一、二介面與高速數位傳輸系統之 結構示意圖。 第三圖（A)、（B)係為本創作中傳輸訊號線之剖面結構示意 圖。 第四圖係為本創作中高速數位傳輸系統之結構分解圖。 第五圖係為本創作中插板連接器之結構分解圖。 第六圖（A)、（B)係為本創作中插板連接器之剖面結構示意 圖。 第七圖係為本創作中掀蓋連接器之剖面結構示意圖。 第八圖係為本創作中第一、二介面與高速數位傳輸系統之 另一結構不意圖。 第九圖係為本創作中第一、二介面與高速數位傳輸系統之 再一結構示意圖。 【主要元件代表符號說明】 高速數位傳輸系統1 第一介面2 第二介面3 第一連接裝置10 第一連接器本體11 11 M326654 第一導電部12 第二連接器本體13 上金屬殼體131 下金屬殼體132 金屬卡扣件133 鉤部1331 按壓部1332 第二連接裝置20 第三連接器本體21 端子211 插槽212 活動蓋213 第二導電部22 傳輸訊號線30 導電層31 銅線aThe second interface of the second interface (3) (the liquid crystal display interface and the system main board, the first and second connection devices (4) (the cover connection = the plug connector) constitutes an electrical connection, and the transmission signal line 30 constitutes a signal connection between the two interfaces. In order to improve the lack of the transmission signal line, it is impossible to use it as a missing signal transmission system. The technical content and technical characteristics of this creation are disclosed above, but those who are familiar with the technology may still make various kinds based on the disclosure of this creation. The spirit of the creation of the case is replaced and modified. Therefore, the scope of protection of this creation should not be limited to the scope of the invention, but should include, and do not detract from, the modification and modification of the creation, and is covered by the following patent application. M326654 [Simple diagram of the diagram] The first diagram is a schematic diagram of the LVDS signal transmission system between the LCD interface of the conventional LCD and the motherboard interface of the system. The second diagram is the first, second interface and high-speed digital transmission system in the creation. Schematic diagram of the structure. The third diagram (A), (B) is a schematic diagram of the cross-sectional structure of the transmission signal line in the creation. The fourth picture is the high-speed digital transmission system in the creation. The fifth figure is the exploded view of the connector of the board in this creation. The sixth figure (A), (B) is the schematic diagram of the cross-sectional structure of the board connector in the creation. The cross-sectional structure of the cap connector in this creation. The eighth figure is the other structure of the first and second interfaces and the high-speed digital transmission system in this creation. The ninth picture is the first and second interfaces in this creation. A schematic diagram of another structure of the high-speed digital transmission system. [Description of main components and symbols] High-speed digital transmission system 1 First interface 2 Second interface 3 First connection device 10 First connector body 11 11 M326654 First conductive portion 12 Two connector body 13 upper metal housing 131 lower metal housing 132 metal snap member 133 hook portion 1331 pressing portion 1332 second connecting device 20 third connector body 21 terminal 211 slot 212 movable cover 213 second conductive portion 22 Transmission signal line 30 conductive layer 31 copper wire a
第一絕緣層32 第二絕緣層33 接地板34 液晶顯示器介面A 系統主機板介面B 連接器插座B1 低壓差分信號接收器C 訊號傳輸線DFirst insulating layer 32 Second insulating layer 33 Grounding plate 34 Liquid crystal display interface A System motherboard interface B Connector socket B1 Low voltage differential signal receiver C Signal transmission line D