WO2021158041A1 - Cable module and method for manufacturing same - Google Patents

Cable module and method for manufacturing same Download PDF

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Publication number
WO2021158041A1
WO2021158041A1 PCT/KR2021/001493 KR2021001493W WO2021158041A1 WO 2021158041 A1 WO2021158041 A1 WO 2021158041A1 KR 2021001493 W KR2021001493 W KR 2021001493W WO 2021158041 A1 WO2021158041 A1 WO 2021158041A1
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WO
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Prior art keywords
ground
cover layer
magnetic layer
layer part
disposed
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PCT/KR2021/001493
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French (fr)
Korean (ko)
Inventor
양철용
박상용
김영태
김남일
이경호
Original Assignee
주식회사 이엠따블유
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Publication of WO2021158041A1 publication Critical patent/WO2021158041A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0861Flat or ribbon cables comprising one or more screens
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22Sheathing; Armouring; Screening; Applying other protective layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00Power cables
    • H01B9/02Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00Power cables
    • H01B9/02Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H01B9/028Power cables with screens or conductive layers, e.g. for avoiding large potential gradients with screen grounding means, e.g. drain wires

Definitions

  • the present invention relates to a cable module and a method for manufacturing the same, and more particularly, a flexible circuit board (FPCB) capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed; It relates to a cable module of Flexible Printed CircuitBoard) type and a method for manufacturing the same.
  • FPCB flexible circuit board
  • a coaxial cable having a transmission line therein is used for transmission of an internal electrical signal.
  • the coaxial cable had a limited use area due to its high cost.
  • the present invention is a cable module capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed, and a method for manufacturing the same provides
  • a flexible cable module capable of slimming a mobile terminal by implementing multiple lines in a limited space and a method for manufacturing the same are provided.
  • a base substrate made of an insulating material; a transmission unit disposed on one side of the base substrate; a first grounding unit disposed along the transmission unit at both ends of one side of the base substrate; the other side of the base substrate A second ground portion disposed at both ends to correspond to the first ground portion; A first magnetic layer portion disposed on the other side of the second ground portion; A first cover layer disposed on one side of the transmission unit and the first ground portion part; a second cover layer part disposed on the other side of the first magnetic layer part; a third ground part disposed on one side of the first cover layer part; and a fourth ground part disposed on the other side of the second cover layer part; It provides a cable module, including.
  • the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part may be connected through a via hole.
  • a second magnetic layer part is disposed on one side of the third ground part, a third cover layer part is disposed on one side of the second magnetic layer part, and a third magnetic layer part is disposed on the other side of the fourth ground part,
  • the third magnetic A fourth cover layer part may be disposed on the other side of the layerer.
  • a method for manufacturing a cable module comprising: disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side; Disposing a first magnetic layer portion on the other side; Forming a transfer portion and a first ground portion by etching the first metal layer; Forming an air gap by etching the second metal layer and the second magnetic layer portion; The transfer portion and disposing a first cover layer part on one side of the first ground part; arranging a second cover layer part on the other side of the first magnetic layer part; arranging a third ground part on one side of the first cover layer part; and arranging a fourth grounding part on the other side of the second cover layer part; including, providing a cable module manufacturing method.
  • the method may further include forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.
  • the method may further include disposing a fourth cover layer part on the other side of the third magnetic layer part.
  • the present invention it is possible to improve the electromagnetic wave shielding and noise shielding performance of the cable module by providing a magnetic layer on the opposite side where the transmission line is formed.
  • FIG. 1 is a schematic diagram of a cable module according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a cable module according to an embodiment of the present invention.
  • 3 and 4 are reference views for explaining a method of manufacturing a cable module according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a cable module 100 according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 .
  • the cable module 100 includes a base substrate 110 , a transmission unit 115 , a first grounding unit 113 , and a second grounding unit 117 . , a first magnetic layer part 121 , a first cover layer part 133 , a second cover layer part 131 , a third ground part 143 , and a fourth ground part 141 .
  • the cable module 100 is a process capable of manufacturing a circuit or cable having flexibility, such as a flexible printed circuit board (FPCB) process or a flat flexible cable (FFC) process is available.
  • FPCB flexible printed circuit board
  • FFC flat flexible cable
  • the base substrate 110 is formed of an insulating material, and may be formed of an insulating material that can be easily bent, such as polyimide, which is a raw material for a flexible printed circuit board.
  • the base substrate 110 may be formed of, in addition to polyimide, polyethylene phthalate (PET) and thermoplastic polyurethane (TPU).
  • the transmission unit 115 is a component for transmitting a signal, is disposed on one side of the base substrate 110 and may be made of a material having excellent electrical conductivity, such as copper (Cu).
  • the transmission unit 115 may be formed by etching a portion of the copper thin film layer, and may be formed in a strip line shape through an etching process.
  • 'one side' may mean 'lower side' in the drawing.
  • the first ground unit 113 may be disposed along the transmission unit 115 at both ends of one side of the base substrate 110 .
  • the first ground unit 113 is formed of the same copper (Cu) as the transmission unit 115 . It may be formed of the same conductive material, and may be formed together with the transmission unit 115 by etching the copper thin film. Specifically, a pair of air gaps 116 are formed through the etching process of the copper thin film, and the center portion
  • the transfer unit 115 is formed in the , and a pair of first ground units 113 may be formed on both sides of the base substrate 110 with the transfer unit 115 interposed therebetween.
  • the second ground unit 117 may be disposed at both ends of the other side of the base substrate 110 to correspond to the first ground unit 113 .
  • the second ground portion 117 may be formed of a conductive material such as copper (Cu) in the same manner as the first ground portion 113 , and may be formed to correspond to the first ground portion 113 by etching a copper thin film.
  • the cross section of the second grounding part 117 may be formed to be the same as that of the first grounding part 113 .
  • 'the other side' may mean 'upper side' in the drawing.
  • the first magnetic layer part 121 may be disposed on the other side of the second ground part 117 .
  • the first magnetic layer part 121 is for shielding electromagnetic waves, and may be any one of a magnetic Ni (nickel) or Mn (manganese)-based structure, and a Fe-Si-based metal having a magnetic permeability and capable of manufacturing a thin film. It may include a blowout core.
  • the first magnetic layer part 121 may be coated on the second ground part 117 in the form of a thin film.
  • the first magnetic layer part 121 After the first magnetic layer part 121 is deposited on the second ground part 117 , it may be etched together with the second ground part 117 , and an air gap 125 may be formed by the etching process.
  • the first magnetic layer part 121 is not necessarily etched together with the second ground part 117 , and after etching the second ground part 117 , the first magnetic layer having the same shape as the second ground part 117 . It is also possible for the portion 121 to be deposited.
  • the first cover layer part 133 may be disposed on one side of the transmission part 115 and the first ground part 113 .
  • the first cover layer part 133 may be formed of an insulating material, and may be disposed by being adhered to one side of the transmission part 115 and the first contact part.
  • the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 .
  • the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
  • the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
  • the transmission unit 115 is spaced apart from the base substrate 110 , the first cover layer unit 133 , the first ground unit 113 , and the first ground unit 113 and the transmission unit 115 are spaced apart from each other.
  • the shielding performance of electromagnetic waves and noise can be improved by sealing the air gap 116 that is arranged and formed, and disposing the first magnetic layer part 121 and another air gap 125 on the other side of the transmission part 115 . it can be
  • the second cover layer part 131 may be formed on the other side of the first magnetic layer part 121
  • the third ground part 143 may be formed on one side of the first cover layer part 133
  • a fourth ground portion 141 may be formed on the other side of the second cover layer portion 131 .
  • the second cover layer part 131 may be formed of the same insulating material as the first cover layer part 133 , and may be deposited by being adhered to the first magnetic layer part 121 .
  • the third ground part 143 and the fourth ground part 141 may be formed of a conductive material such as copper (Cu) or silver (Ag), and the first cover layer part 133 and the second cover layer part, respectively. It may be deposited by adhering to (131).
  • the cable module 100 may further include a via hole 147 .
  • the via hole 147 electrically connects the third ground portion 143 disposed in one direction of the base substrate 110 and the fourth ground portion 141 disposed in the other direction of the base substrate 110 .
  • the via hole 147 includes the base substrate 110 , the first ground part 113 , the first cover layer part 133 , the second ground part 117 , the first magnetic layer part 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
  • the cable module 100 further includes a second magnetic layer part 153 , a third cover layer part 163 , a third magnetic layer part 151 , and a fourth cover layer part 161 .
  • the second magnetic layer part 153 may be disposed on one side of the third ground part 143
  • the third cover layer part 163 may be disposed on one side of the second magnetic layer part 153
  • the three magnetic layer part 151 may be disposed on the other side of the fourth ground part 141
  • the fourth cover layer part 161 may be disposed on the other side of the third magnetic layer part 151 .
  • the material and method of forming the second magnetic layer part 153 and the third magnetic layer part 151 are the same as those of the first magnetic layer part 121, and a description thereof will be replaced with the previous description.
  • the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.
  • FIGS. 3 and 4 are reference views for explaining a method of manufacturing the cable module 100 according to another embodiment of the present invention.
  • the present invention includes the cable module 100 .
  • a method of manufacturing is provided.
  • the method of manufacturing the cable module 100 includes: disposing FCCL (S100), depositing a magnetic layer (S200), etching step (S300), disposing a cover layer (S400), disposing a metal layer It may include a step S500, a drilling step S600, a magnetic layer arrangement step S700, a cover layer arrangement step S800, and a punching step S900.
  • a flexible copper clad laminated film provided with metal layers (a first metal layer and a second metal layer) stacked on both sides of the base substrate 110 made of an insulating material that can be easily bent, such as polyimide, is positioned. (a of FIG. 4).
  • the metal layer may be made of a copper (Cu) material having high conductivity.
  • a first magnetic layer part 121 is laminated on the other side of the second metal layer laminated on the other side (upper surface in the drawing) of the disposed FCCL ( FIG. 4 b ).
  • the transfer part 115 and the first ground part 113 are formed by etching the first metal layer stacked on one side of the FCCL.
  • the second metal layer and the second magnetic layer part 153 are etched to form the air gap 125 .
  • a first cover layer unit 133 is laminated on one side of the transmission unit 115 and the first ground unit 113 , and a second cover layer unit 131 is laminated on the other side of the first magnetic layer unit 121 . (Fig. 4d).
  • a third ground part 143 is laminated on one side of the first cover layer part 133
  • a fourth ground part 141 is laminated on the other side of the second cover layer part 131 ( FIG. 4E ).
  • the stacked magnetic layer part and the cover layer part are the same as the magnetic layer part and the cover layer part described in the embodiment of the cable module 100, so the description of materials and properties will be replaced with the description of the previous embodiment.
  • the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 .
  • the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
  • the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
  • a via hole 147 is formed so that the first cover layer part 133 , the third ground part 143 , the second cover layer part 131 , and the fourth ground part 141 are connected ( FIG. 4F ).
  • the via hole 147 includes the base substrate 110 , the first ground portion 113 , the first cover layer portion 133 , the second ground portion 117 , the first magnetic layer portion 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
  • the via hole 147 includes a first cover layer part 133 disposed in one direction of the base substrate 110 , a third ground part 143 , and a second cover layer part disposed in the other direction of the base substrate 110 . 131 and the fourth ground unit 141 are electrically connected.
  • the second magnetic layer part 153 is stacked on one side of the third ground part 143
  • the third magnetic layer part 151 is stacked on the other side of the fourth ground part 141 ( FIG. 4 g ).
  • a third cover layer part 163 is laminated on one side of the second magnetic layer part 153
  • a fourth cover layer part 161 is laminated on the other side of the third magnetic layer part 151 ( FIG. 4 h).
  • the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.

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  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Conductors (AREA)

Abstract

The present invention relates to a cable module and a method for manufacturing same and, more specifically, to: a flexible printed circuit board (FPCB) type cable module which includes a magnetic layer at a side opposite to the side where a transmission line is formed, and thereby can improve electromagnetic wave and noise shielding performance; and a method for manufacturing same.

Description

케이블 모듈 및 이를 제조하기 위한 방법Cable module and method for manufacturing same
본 발명은 케이블 모듈 및 이를 제조하기 위한 방법에 관한 것으로,보다 상세하게는 전송 선로가 형성되는 반대측에 자성층을 구비하여 전자파 차폐 및 노이즈(noise)차폐 성능을 향상시킬 수 있는FPCB(연성 회로 기판, Flexible Printed CircuitBoard)type의 케이블 모듈 및 이를 제조하기 위한 방법에 관한 것이다.The present invention relates to a cable module and a method for manufacturing the same, and more particularly, a flexible circuit board (FPCB) capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed; It relates to a cable module of Flexible Printed CircuitBoard) type and a method for manufacturing the same.
종래에는 모바일 단말기에 있어서 내부의 전기적 신호의 전송을 위하여 전송 선로가 내부에 구비되는 동축케이블을 이용하였다. 그러나 동축케이블은 고비용으로 인해 사용영역에 제한이 있었다.Conventionally, in a mobile terminal, a coaxial cable having a transmission line therein is used for transmission of an internal electrical signal. However, the coaxial cable had a limited use area due to its high cost.
또한, 5G가 상용화되어 모바일 단말기에 요구되는 안테나 수가 증가함에 따라 다중 선로의 필요성이 증대되는데,동축 케이블의 경우 제한된 모바일 단말기 크기에서 다중 선로의 구현이 어려운 문제가 있었다.In addition, as 5G is commercialized and the number of antennas required for mobile terminals increases, the need for multiple lines increases. In the case of a coaxial cable, it is difficult to implement multiple lines in a limited mobile terminal size.
이를 개선하기 위하여 임피던스 매칭 필름을 이용한 플렉서블 평판 케이블이 개발되었으나, 플렉서블 평판 케이블의 경우 동축케이블에 비해 비용은 저렴하나전자파의 차폐가 완벽하지 못하였고, 신호간 혼선이 발생을 하는 문제점이 있었다.In order to improve this, a flexible flat cable using an impedance matching film was developed, but in the case of a flexible flat cable, the cost is lower than that of a coaxial cable, but the shielding of electromagnetic waves was not perfect, and there was a problem that crosstalk between signals occurred.
구체적으로,평판 케이블의 전송 선로에 전기 신호가 인가되면 전자파 방해(EMI, electromagnetic wave interference) 및 노이즈(noise)가 발생하는데,종래 플렉서블 평판 케이블의 경우 이러한 전자파 및 노이즈의 차폐 성능이 충분하지 못한 문제가 있었다.Specifically, when an electric signal is applied to the transmission line of a flat cable, electromagnetic wave interference (EMI) and noise occur. In the case of a conventional flexible flat cable, the shielding performance of these electromagnetic waves and noise is insufficient. there was
따라서,모바일 단말기의 제한된 공간 내에서 다중 선로 구현이 가능하며,전자파 및 노이즈의 차폐 성능을 향상시켜 신호 전송 효율을 향상시킬 수 있는 FPCB type의 케이블 모듈의 개발이 필요하다.Therefore, it is necessary to develop an FPCB type cable module capable of realizing multiple lines within a limited space of a mobile terminal and improving signal transmission efficiency by improving the shielding performance of electromagnetic waves and noise.
이에 본 발명의 기술적 과제는 이러한 점에서 착안된 것으로, 본 발명은전송 선로가 형성되는 반대측에 자성층을 구비하여 전자파 차폐 및 노이즈(noise) 차폐 성능을 향상시킬 수 있는 케이블 모듈 및 이를 제조하기 위한 방법을 제공한다.Accordingly, the technical problem of the present invention was conceived in this regard, and the present invention is a cable module capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed, and a method for manufacturing the same provides
또한,제한된 공간 내에서 다중 선로 구현이 가능하여 모바일 단말기의 슬림(slim)화가 가능한 플렉서블(flexible) 케이블 모듈 및 이를 제조하기 위한 방법을 제공한다.In addition, a flexible cable module capable of slimming a mobile terminal by implementing multiple lines in a limited space and a method for manufacturing the same are provided.
본 발명의 일 실시 예에 따르면,절연 재질의 베이스 기판;상기 베이스 기판의 일측에 배치되는 전송부;상기 베이스 기판의 일측 양 단부에 상기 전송부를 따라 배치되는 제1 접지부;상기 베이스 기판의 타측 양 단부에 상기 제1접지부에 대응되도록 배치되는 제2접지부;상기 제2접지부의 타측에 배치되는 제1자성레이어부;상기 전송부 및 상기 제1접지부의 일측에 배치되는 제1커버 레이어부;상기 제1 자성 레이어부 타측에 배치되는 제2커버 레이어부;상기 제1 커버 레이어부 일측에 배치되는 제3 접지부;및 상기 제2커버 레이어부 타측에 배치되는 제4접지부;를 포함하는,케이블 모듈을 제공한다.According to an embodiment of the present invention, a base substrate made of an insulating material; a transmission unit disposed on one side of the base substrate; a first grounding unit disposed along the transmission unit at both ends of one side of the base substrate; the other side of the base substrate A second ground portion disposed at both ends to correspond to the first ground portion; A first magnetic layer portion disposed on the other side of the second ground portion; A first cover layer disposed on one side of the transmission unit and the first ground portion part; a second cover layer part disposed on the other side of the first magnetic layer part; a third ground part disposed on one side of the first cover layer part; and a fourth ground part disposed on the other side of the second cover layer part; It provides a cable module, including.
상기 제1커버 레이어부, 상기 제3접지부와 상기 제2커버 레이어부,상기 제4 접지부는 비아 홀(via hole)을 통해 연결될 수 있다.The first cover layer part, the third ground part, the second cover layer part, and the fourth ground part may be connected through a via hole.
상기 제3접지부의 일측에는 제2자성 레이어부가 배치되고,상기 제2자성 레이어부의 일측에는 제3커버 레이어부가 배치되고,상기 제4 접지부의 타측에는 제3자성 레이어부가 배치되며,상기 제3자성 레이어버의 타측에는 제4커버 레이어부가 배치될 수 있다.A second magnetic layer part is disposed on one side of the third ground part, a third cover layer part is disposed on one side of the second magnetic layer part, and a third magnetic layer part is disposed on the other side of the fourth ground part, The third magnetic A fourth cover layer part may be disposed on the other side of the layerer.
본 발명의 다른 실시예에 따르면제1항에 따른 케이블 모듈을 제조하는 방법에 관한 것으로서,일측에 제1금속층이 형성되고 타측에 제2금속층이 형성된 베이스 기판을 배치하는 단계;상기 제2금속층의 타측에 제1자성 레이어부를 배치하는 단계;상기 제1금속층을 에칭하여 전송부 및제1접지부를 형성하는 단계;상기 제2금속층 및 제2자성 레이어부를 에칭하여 에어 갭을 형성하는 단계;상기 전송부 및 상기 제1접지부의 일측에 제1커버 레이어부를 배치하는 단계;상기 제1자성 레이어부 타측에 제2커버 레이어부를 배치하는 단계;상기 제1커버 레이어부 일측에 제3 접지부를 배치하는 단계;및 상기 제2커버 레이어부 타측에 제4 접지부를 배치하는 단계;를 포함하는,케이블 모듈 제조 방법을 제공한다.According to another embodiment of the present invention, there is provided a method for manufacturing a cable module according to claim 1, comprising: disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side; Disposing a first magnetic layer portion on the other side; Forming a transfer portion and a first ground portion by etching the first metal layer; Forming an air gap by etching the second metal layer and the second magnetic layer portion; The transfer portion and disposing a first cover layer part on one side of the first ground part; arranging a second cover layer part on the other side of the first magnetic layer part; arranging a third ground part on one side of the first cover layer part; and arranging a fourth grounding part on the other side of the second cover layer part; including, providing a cable module manufacturing method.
상기 제1커버 레이어부, 상기 제3접지부와 상기 제2커버 레이어부,상기 제4접지부가 연결되도록 비아 홀을 형성하는 단계를 더 포함할 수 있다.The method may further include forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.
상기 제3 접지부의 일측에 제2자성 레이어부를 배치하는 단계;상기 제4 접지부의 타측에 제3자성 레이어부를 배치하는 단계;상기 제2자성 레이어부의 일측에 제3커버 레이어부를 배치하는 단계;및 상기 제3자성 레이어부의 타측에 제4커버 레이어부를 배치하는 단계를 더 포함할 수 있다.arranging a second magnetic layer part on one side of the third ground part; arranging a third magnetic layer part on the other side of the fourth ground part; arranging a third cover layer part on one side of the second magnetic layer part; and The method may further include disposing a fourth cover layer part on the other side of the third magnetic layer part.
본 발명의 실시예에 따르면,전송 선로가 형성되는 반대측에 자성층을 구비하여 케이블 모듈의 전자파 차폐 및 노이즈(noise) 차폐 성능을 향상시킬 수 있다.According to an embodiment of the present invention, it is possible to improve the electromagnetic wave shielding and noise shielding performance of the cable module by providing a magnetic layer on the opposite side where the transmission line is formed.
또한,제한된 공간 내에서 다중 선로 구현이 가능하여 모바일 단말기의 슬림(slim)화가 가능한 플렉서블(flexible) 케이블 모듈을 제공할 수 있다.In addition, since it is possible to implement multiple lines within a limited space, it is possible to provide a flexible cable module capable of slimming a mobile terminal.
본 발명의 효과들은 이상에서 언급한 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.
아래에서 설명하는 본 출원의 바람직한 실시예의 상세한 설명뿐만 아니라 위에서 설명한 요약은 첨부된 도면과 관련해서 읽을 때에 더 잘 이해될 수 있을 것이다. 본 발명을 예시하기 위한 목적으로 도면에는 바람직한 실시예들이 도시되어 있다. 그러나, 본 출원은 도시된 정확한 배치와 수단에 한정되는 것이 아님을 이해해야 한다.The summary set forth above as well as the detailed description of the preferred embodiments of the present application set forth below may be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the invention, there are shown in the drawings preferred embodiments. It should be understood, however, that the present application is not limited to the precise arrangements and instrumentalities shown.
도1은본 발명의 일 실시예에 따른 케이블 모듈의 계략도이다.1 is a schematic diagram of a cable module according to an embodiment of the present invention;
도 2는 본 발명의 일 실시예에 따른 케이블 모듈의 단면도이다.2 is a cross-sectional view of a cable module according to an embodiment of the present invention.
도 3 및 도 4는 본 발명의 다른 실시예에 따른 케이블 모듈의 제조 방법을 설명하기 위한 참고도이다.3 and 4 are reference views for explaining a method of manufacturing a cable module according to another embodiment of the present invention.
이하 본 발명의 실시예에 대하여 첨부한 도면을 참조하여 상세하게 설명하기로 한다. 다만, 첨부된 도면은 본 발명의 내용을 보다 쉽게 개시하기 위하여 설명되는 것일 뿐, 본 발명의 범위가 첨부된 도면의 범위로 한정되는 것이 아님은 이 기술분야의 통상의 지식을 가진 자라면 용이하게 알 수 있을 것이다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described in order to more easily disclose the contents of the present invention, and the scope of the present invention is not limited to the scope of the accompanying drawings. you will know
그리고, 본 발명의 실시예를 설명함에 있어서, 동일 기능을 갖는 구성요소에 대해서는 동일 명칭 및 동일부호를 사용할 뿐 실질적으론 종래기술의 구성요소와 완전히 동일하지 않음을 미리 밝힌다.And, in describing the embodiment of the present invention, the same name and the same reference numerals are used for the components having the same function, and it is substantially not completely the same as the components of the prior art in advance.
또한, 본 출원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.In addition, the terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.
이하, 본 발명에 따른케이블 모듈 및 이를 제조하기 위한 방법을첨부한 도면을 참조하여 상세히 설명하기로 하며, 첨부한 도면을 참조하여 설명함에 있어서, 동일하거나 대응하는 구성 요소는 동일한 도면번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, the cable module according to the present invention and a method for manufacturing the same will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numbers, A redundant description thereof will be omitted.
도 1은본 발명의 일 실시예에 따른 케이블 모듈(100)의 계략도이고,도 2는 도 1의 Ⅱ-Ⅱ의 단면도이다.1 is a schematic diagram of a cable module 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 .
도 1 및 도 2를 참고하면,본 발명의 일 실시예에 따른 케이블 모듈(100)은 베이스 기판(110),전송부(115),제1 접지부(113),제2 접지부(117),제1 자성 레이어부(121),제1 커버 레이어부(133),제2 커버 레이어부(131),제3 접지부(143) 및 제4 접지부(141)를 포함할 수 있다.1 and 2 , the cable module 100 according to an embodiment of the present invention includes a base substrate 110 , a transmission unit 115 , a first grounding unit 113 , and a second grounding unit 117 . , a first magnetic layer part 121 , a first cover layer part 133 , a second cover layer part 131 , a third ground part 143 , and a fourth ground part 141 .
본 실시예에 따른 케이블 모듈(100)은 연성 인쇄회로기판(FPCB : Flexible Printed Circuit Board)공정이나 평면 연성 케이블(FFC : Flat Flexible Cable)공정과 같은 연성을 가지는 회로나 케이블을 제조할 수 있는 공정을 이용할 수 있다.The cable module 100 according to this embodiment is a process capable of manufacturing a circuit or cable having flexibility, such as a flexible printed circuit board (FPCB) process or a flat flexible cable (FFC) process is available.
구체적으로,베이스 기판(110)은 절연 재질로 형성되며,연성 인쇄회로 기판의 원단 소재가 되는 폴리이미드(polyimide)와 같이 쉽게 구부러질 수 있는절연성 재질로 이루어질 수 있다. 이때 베이스 기판(110)은 폴리이미드 외에,폴리에틸렌프탈레이트(PET; Polyethylene phthalate) 및 열가소성 폴리우레탄(TPU; Thermoplastic Poly Urethane)로 형성되는 것도 가능하다.Specifically, the base substrate 110 is formed of an insulating material, and may be formed of an insulating material that can be easily bent, such as polyimide, which is a raw material for a flexible printed circuit board. In this case, the base substrate 110 may be formed of, in addition to polyimide, polyethylene phthalate (PET) and thermoplastic polyurethane (TPU).
전송부(115)는 신호를 전송하기 위한 구성으로서, 베이스 기판(110)의 일측에 배치되며 구리(Cu)와 같은 전기 전도성이 우수한 재질로 이루어질 수 있다.The transmission unit 115 is a component for transmitting a signal, is disposed on one side of the base substrate 110 and may be made of a material having excellent electrical conductivity, such as copper (Cu).
전송부(115)는 구리 박막층의 일부를 에칭하여 형성될 수 있으며,에칭 과정을 통해 스트립(strip) 선로 형상으로 형성될 수 있다.The transmission unit 115 may be formed by etching a portion of the copper thin film layer, and may be formed in a strip line shape through an etching process.
본 실시예에서 '일측'은 도면상 '하측'을 의미할 수 있다.In this embodiment, 'one side' may mean 'lower side' in the drawing.
제1 접지부(113)는 베이스 기판(110)의 일측 양 단부에 전송부(115)를 따라 배치될 수 있다.제1 접지부(113)는 전송부(115)와 동일한 구리(Cu)와 같은 전도성 재질로 형성될 수 있으며,구리 박막을 에칭함으로써 전송부(115)와 함께 형성될 수 있다.구체적으로,구리 박막의 에칭 과정을 통해 한 쌍의 에어 갭(116)이 형성되며,가운데 부분에 전송부(115)가 형성되며,전송부(115)를 사이에 두고 베이스 기판(110)의 양 측에 한 쌍의 제1 접지부(113)가 형성될 수 있다.The first ground unit 113 may be disposed along the transmission unit 115 at both ends of one side of the base substrate 110 . The first ground unit 113 is formed of the same copper (Cu) as the transmission unit 115 . It may be formed of the same conductive material, and may be formed together with the transmission unit 115 by etching the copper thin film. Specifically, a pair of air gaps 116 are formed through the etching process of the copper thin film, and the center portion The transfer unit 115 is formed in the , and a pair of first ground units 113 may be formed on both sides of the base substrate 110 with the transfer unit 115 interposed therebetween.
제2 접지부(117)는 베이스 기판(110)의 타측 양 단부에 제1 접지부(113)에 대응되도록 배치될 수 있다.The second ground unit 117 may be disposed at both ends of the other side of the base substrate 110 to correspond to the first ground unit 113 .
제2 접지부(117)는 제1 접지부(113)와 동일하게 구리(Cu)와 같은 전도성 재질로 형성될 수 있으며,구리 박막을 에칭함으로써 제1 접지부(113)에 대응되도록 형성될 수 있다.이때 제2 접지부(117)의 단면은 제1 접지부(113)와 동일하게 형성될 수 있다.The second ground portion 117 may be formed of a conductive material such as copper (Cu) in the same manner as the first ground portion 113 , and may be formed to correspond to the first ground portion 113 by etching a copper thin film. In this case, the cross section of the second grounding part 117 may be formed to be the same as that of the first grounding part 113 .
본 실시예에서 '타측'은 도면상 '상측'을 의미할 수 있다.In the present embodiment, 'the other side' may mean 'upper side' in the drawing.
제1 자성 레이어부(121)는 제2 접지부(117)의 타측에 배치될 수 있다.The first magnetic layer part 121 may be disposed on the other side of the second ground part 117 .
제1 자성 레이어부(121)는 전자파를 차폐하기 위한 것으로 자성을 갖는 Ni(니켈)또는 Mn(망간) 계열의 구조체 중 어느 하나 일 수 있으며,박막 제조가 가능하며 투자율을 가지는 Fe-Si계 금속분발코어를 포함할 수도 있다.The first magnetic layer part 121 is for shielding electromagnetic waves, and may be any one of a magnetic Ni (nickel) or Mn (manganese)-based structure, and a Fe-Si-based metal having a magnetic permeability and capable of manufacturing a thin film. It may include a blowout core.
제1 자성 레이어부(121)는 박막 형태로서 제2 접지부(117)에 점착되어 코팅 형성될 수 있다.The first magnetic layer part 121 may be coated on the second ground part 117 in the form of a thin film.
제1 자성 레이어부(121)는 제2 접지부(117)에 증착된 후 제2 접지부(117)와 함께 에칭될 수 있으며,에칭 과정에 의해 에어 갭(125)이 형성될 수 있다.After the first magnetic layer part 121 is deposited on the second ground part 117 , it may be etched together with the second ground part 117 , and an air gap 125 may be formed by the etching process.
다만,제1 자성 레이어부(121)는 제2 접지부(117)와 반드시 함께 에칭되는 것은 아니며,제2 접지부(117) 에칭 후 제2 접지부(117)와 동일한 형상의 제1 자성 레이어부(121)가 증착되는 것도 가능하다.However, the first magnetic layer part 121 is not necessarily etched together with the second ground part 117 , and after etching the second ground part 117 , the first magnetic layer having the same shape as the second ground part 117 . It is also possible for the portion 121 to be deposited.
제1 커버 레이어부(133)는 전송부(115) 및 제1 접지부(113)의 일측에 배치될 수 있다.The first cover layer part 133 may be disposed on one side of the transmission part 115 and the first ground part 113 .
제1 커버 레이어부(133)는 절연 재질로 형성될 수 있으며,전송부(115) 및 제1접촉부의 일측에 점착되어 배치될 수 있다.The first cover layer part 133 may be formed of an insulating material, and may be disposed by being adhered to one side of the transmission part 115 and the first contact part.
이와 같이 전송부(115)가 제1 접지부(113),베이스 기판(110),제1 커버 레이어부(133)에 의해 둘러 쌓이게 되어 절연 부재 및 접지 부재 내부에 매립되며,에어 갭(116) 사이에 위치하게 된다.이와 같은 구성에 의해 전송부(115)가 전기적 신호를 전송하며 외부로부터 유입되는 노이즈를 효과적으로 차폐하여 전송 효율을 향상시킬 수 있다.As described above, the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 . In this configuration, the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
또한,본 발명에 따르면 전송부(115)의 반대측에 제1 자성 레이어부(121) 및 에어 갭(125)를 구비하여 외부로부터 유입되거나 전송부(115)에 의해 발생하는 전자파를 효과적으로 차폐할 수 있다.In addition, according to the present invention, it is possible to effectively shield electromagnetic waves introduced from the outside or generated by the transmission unit 115 by providing the first magnetic layer unit 121 and the air gap 125 on the opposite side of the transmission unit 115 . there is.
또한,본 발명에 따르면 전송부(115)에는 자성 레이어부를 직접 증착시키지 않는데,차폐 성능을 향상시키기 위해 전송부(115)에 직접 자성 레이어부를 증착시키는 경우 저항이 증가하여 전송부(115)의 신호 손실이 증가됨으로써 전송 효율이 감소될 수 있기 때문이다.In addition, according to the present invention, the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
이와 같이 본 발명에 따르면 전송부(115)를 베이스 기판(110),제1 커버 레이어부(133),제1 접지부(113),제1 접지부(113)와 전송부(115)가 이격 배치되어 형성되는 에어 갭(116)에 의해 밀폐시키고,전송부(115)의 타측에 제1 자성 레이어부(121) 및 또 다른 에어 갭(125)을 배치시킴으로써 전자파 및 노이즈의 차폐 성능을 향상시킬 수 있는 것이다.As described above, according to the present invention, the transmission unit 115 is spaced apart from the base substrate 110 , the first cover layer unit 133 , the first ground unit 113 , and the first ground unit 113 and the transmission unit 115 are spaced apart from each other. The shielding performance of electromagnetic waves and noise can be improved by sealing the air gap 116 that is arranged and formed, and disposing the first magnetic layer part 121 and another air gap 125 on the other side of the transmission part 115 . it can be
이때,제1 자성 레이어부(121)의 타측에는 제2 커버 레이어부(131)가 형성될 수 있고,제1 커버 레이어부(133)의 일측에는 제3 접지부(143)가 형성될 수 있으며,제2 커버 레이어부(131)의 타측에는 제4 접지부(141)가 형성될 수 있다.In this case, the second cover layer part 131 may be formed on the other side of the first magnetic layer part 121 , and the third ground part 143 may be formed on one side of the first cover layer part 133 . , A fourth ground portion 141 may be formed on the other side of the second cover layer portion 131 .
제2 커버 레이어부(131)는 제1 커버 레이어부(133)와 동일하게 절연 재질로 형성될 수 있으며,제1 자성 레이어부(121)에 점착되어 증착될 수 있다.The second cover layer part 131 may be formed of the same insulating material as the first cover layer part 133 , and may be deposited by being adhered to the first magnetic layer part 121 .
제3 접지부(143) 및 제4 접지부(141)는 구리(Cu), 은(Ag)과 같은 전도성 재질로 형성될 수 있으며, 각각 제1 커버 레이어부(133) 및 제2 커버 레이어부(131)에 점착되어 증착될 수 있다.The third ground part 143 and the fourth ground part 141 may be formed of a conductive material such as copper (Cu) or silver (Ag), and the first cover layer part 133 and the second cover layer part, respectively. It may be deposited by adhering to (131).
한편,본 실시예에 따른 케이블 모듈(100)은 비아 홀(147)을 더 포함할 수 있다.Meanwhile, the cable module 100 according to the present embodiment may further include a via hole 147 .
비아 홀(147)은베이스 기판(110)의 일측 방향에 배치되는 제3 접지부(143)와 베이스 기판(110)의 타측 방향에 배치되는 제4 접지부(141)를 전기적으로 연결한다.The via hole 147 electrically connects the third ground portion 143 disposed in one direction of the base substrate 110 and the fourth ground portion 141 disposed in the other direction of the base substrate 110 .
비아 홀(147)은 베이스 기판(110),제1 접지부(113),제1 커버 레이어부(133),제2 접지부(117),제1 자성 레이어부(121),제2 커버 레이어부(131)를 드릴링(drilling)하여 원기둥 형상의 관통 홀을 형성함으로써 형성될 수 있다.The via hole 147 includes the base substrate 110 , the first ground part 113 , the first cover layer part 133 , the second ground part 117 , the first magnetic layer part 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
한편,본 실시예에 따른 케이블 모듈(100)은 제2 자성 레이어부(153),제3 커버 레이어부(163),제3 자성 레이어부(151),제4 커버 레이어부(161)를 더 포함할 수 있다.Meanwhile, the cable module 100 according to the present embodiment further includes a second magnetic layer part 153 , a third cover layer part 163 , a third magnetic layer part 151 , and a fourth cover layer part 161 . may include
제2 자성 레이어부(153)는 제3 접지부(143)의 일측에 배치되고,제3 커버 레이어부(163)는 제2 자성 레이어부(153)의 일측에 배치될 수 있다.또한,제3 자성 레이어부(151)는 제4 접지부(141)의 타측에 배치되고,제4 커버 레이어부(161)는 제3 자성 레이어부(151)의 타측에 배치될 수 있다.The second magnetic layer part 153 may be disposed on one side of the third ground part 143 , and the third cover layer part 163 may be disposed on one side of the second magnetic layer part 153 . The three magnetic layer part 151 may be disposed on the other side of the fourth ground part 141 , and the fourth cover layer part 161 may be disposed on the other side of the third magnetic layer part 151 .
제2 자성 레이어부(153) 및 제3 자성 레이어부(151)의 재질이나 형성 방법은 전술한 제1 자성 레이어부(121)와 동일하며 이에 관한 설명은 앞선 설명에 갈음하기로 한다.The material and method of forming the second magnetic layer part 153 and the third magnetic layer part 151 are the same as those of the first magnetic layer part 121, and a description thereof will be replaced with the previous description.
또한,제3 커버 레이어부(163) 및 제4 커버 레이어부(161)의 재질은 제1 커버 레이어부(133) 및 제2 커버 레이어부(131)와 동일하므로 이에 관한 설명 또한 앞선 설명에 갈음하기로 한다.In addition, since the material of the third cover layer part 163 and the fourth cover layer part 161 is the same as that of the first cover layer part 133 and the second cover layer part 131 , a description thereof is also replaced with the previous description. decide to do
본 실시예에 따르면,자성 레이어부 및 커버 레이어부를 추가로 적층시킴으로써 전자파 및 노이즈 차폐 효과를 더욱 향상시킬 수 있다.According to the present embodiment, the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.
한편,도 3 및 도 4는 본 발명의 다른 실시예에 따른 케이블 모듈(100)의 제조 방법을 설명하기 위한 참고도로서, 도 3 및 도 4를 참고하면,본 발명은 케이블 모듈(100)을 제조하는 방법을 제공한다.Meanwhile, FIGS. 3 and 4 are reference views for explaining a method of manufacturing the cable module 100 according to another embodiment of the present invention. Referring to FIGS. 3 and 4 , the present invention includes the cable module 100 . A method of manufacturing is provided.
본 실시예에 따른 케이블 모듈(100) 제조 방법은, FCCL을 배치하는 단계(S100),자성 레이어를 증착하는 단계(S200), 에칭 단계(S300), 커버 레이어 배치 단계(S400), 금속 레이어 배치 단계(S500), 드릴링(drilling) 단계(S600), 자성 레이어 배치 단계(S700), 커버 레이어 배치 단계(S800), 타발 단계(S900)를 포함할 수 있다.The method of manufacturing the cable module 100 according to the present embodiment includes: disposing FCCL (S100), depositing a magnetic layer (S200), etching step (S300), disposing a cover layer (S400), disposing a metal layer It may include a step S500, a drilling step S600, a magnetic layer arrangement step S700, a cover layer arrangement step S800, and a punching step S900.
이하에서는도4를 참고하여,케이블 모듈(100) 제조 방법을 구체적으로 설명하기로 한다.Hereinafter, a method of manufacturing the cable module 100 will be described in detail with reference to FIG. 4 .
폴리이미드(polyimide)와 같이 쉽게 구부러질 수 있는 절연 재질의 베이스 기판(110)의 양면에 금속층(제1금속층 및 제2금속층)이 적층된 상태로 제공되는 연성동박적층필름(FCCL)을 위치시킨다(도 4의 a).이때,금속층은 전도성이 높은 구리(Cu) 재질일 수 있다.A flexible copper clad laminated film (FCCL) provided with metal layers (a first metal layer and a second metal layer) stacked on both sides of the base substrate 110 made of an insulating material that can be easily bent, such as polyimide, is positioned. (a of FIG. 4). In this case, the metal layer may be made of a copper (Cu) material having high conductivity.
배치된 FCCL의 타측(도면상 상면)에 적층된 제2금속층 타측에 제1 자성 레이어부(121)를 적층시킨다(도 4의 b).A first magnetic layer part 121 is laminated on the other side of the second metal layer laminated on the other side (upper surface in the drawing) of the disposed FCCL ( FIG. 4 b ).
FCCL의 일측에 적층된 제1금속층을 에칭하여 전송부(115) 및 제1 접지부(113)를 형성한다.또한,제2금속층 및 제2 자성 레이어부(153)를 에칭하여 에어 갭(125)을 형성한다(도 4의 c).The transfer part 115 and the first ground part 113 are formed by etching the first metal layer stacked on one side of the FCCL. In addition, the second metal layer and the second magnetic layer part 153 are etched to form the air gap 125 . ) is formed (FIG. 4 c).
전송부(115) 및 제1 접지부(113)의 일측에 제1 커버 레이어부(133)를 적층시키고,제1 자성 레이어부(121)의 타측에 제2 커버 레이어부(131)를적층시킨다(도 4의 d). 또한,제1 커버 레이어부(133) 일측에 제3 접지부(143)를 적층시키고,제2 커버 레이어부(131) 타측에 제4 접지부(141)를 적층시킨다(도 4의 e).A first cover layer unit 133 is laminated on one side of the transmission unit 115 and the first ground unit 113 , and a second cover layer unit 131 is laminated on the other side of the first magnetic layer unit 121 . (Fig. 4d). In addition, a third ground part 143 is laminated on one side of the first cover layer part 133 , and a fourth ground part 141 is laminated on the other side of the second cover layer part 131 ( FIG. 4E ).
적층되는 자성 레이어부 및 커버 레이어부는 앞선 케이블 모듈(100)의 실시예에 기재된 자성 레이어부 및 커버 레이어부와 동일하므로 재질 및 성질에 관한 설명은 앞선 실시예의 설명에 갈음하기로 한다.The stacked magnetic layer part and the cover layer part are the same as the magnetic layer part and the cover layer part described in the embodiment of the cable module 100, so the description of materials and properties will be replaced with the description of the previous embodiment.
이와 같이 전송부(115)가 제1 접지부(113),베이스 기판(110),제1 커버 레이어부(133)에 의해 둘러 쌓이게 되어 절연 부재 및 접지 부재 내부에 매립되며,에어 갭(116) 사이에 위치하게 된다.이와 같은 구성에 의해 전송부(115)가 전기적 신호를 전송하며 외부로부터 유입되는 노이즈를 효과적으로 차폐하여 전송 효율을 향상시킬 수 있다.As described above, the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 . In this configuration, the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
또한,본 발명에 따르면 전송부(115)의 반대측에 제1 자성 레이어부(121) 및 에어 갭(125)를 구비하여 외부로부터 유입되거나 전송부(115)에 의해 발생하는 전자파를 효과적으로 차폐할 수 있다.In addition, according to the present invention, it is possible to effectively shield electromagnetic waves introduced from the outside or generated by the transmission unit 115 by providing the first magnetic layer unit 121 and the air gap 125 on the opposite side of the transmission unit 115 . there is.
또한,본 발명에 따르면 전송부(115)에는 자성 레이어부를 직접 증착시키지 않는데,차폐 성능을 향상시키기 위해 전송부(115)에 직접 자성 레이어부를 증착시키는 경우 저항이 증가하여 전송부(115)의 신호 손실이 증가됨으로써 전송 효율이 감소될 수 있기 때문이다.In addition, according to the present invention, the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
제1 커버 레이어부(133),제3 접지부(143)와 제2 커버 레이어부(131),제4 접지부(141)가 연결되도록 비아 홀(147)을 형성한다(도 4의 f). 비아 홀(147)은 베이스 기판(110), 제1 접지부(113), 제1 커버 레이어부(133), 제2 접지부(117), 제1 자성 레이어부(121), 제2 커버 레이어부(131)를 드릴링(drilling)하여 원기둥 형상의 관통 홀을 형성함으로써 형성될 수 있다.A via hole 147 is formed so that the first cover layer part 133 , the third ground part 143 , the second cover layer part 131 , and the fourth ground part 141 are connected ( FIG. 4F ). . The via hole 147 includes the base substrate 110 , the first ground portion 113 , the first cover layer portion 133 , the second ground portion 117 , the first magnetic layer portion 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
비아 홀(147)은 베이스 기판(110)의 일측 방향에 배치되는 제1 커버 레이어부(133), 제3 접지부(143)와 베이스 기판(110)의 타측 방향에 배치되는 제2 커버 레이어부(131)와 제4 접지부(141)를 전기적으로 연결한다.The via hole 147 includes a first cover layer part 133 disposed in one direction of the base substrate 110 , a third ground part 143 , and a second cover layer part disposed in the other direction of the base substrate 110 . 131 and the fourth ground unit 141 are electrically connected.
제3 접지부(143)의 일측에 제2 자성 레이어부(153)를 적층시키고,제4 접지부(141)의 타측에 제3 자성 레이어부(151)를 적층시킨다(도 4의 g). 다음으로,제2 자성 레이어부(153)의 일측에 제3 커버 레이어부(163)를 적층시키고,제3 자성 레이어부(151)의 타측에 제4 커버 레이어부(161)를 적층시킨다(도 4의 h).The second magnetic layer part 153 is stacked on one side of the third ground part 143 , and the third magnetic layer part 151 is stacked on the other side of the fourth ground part 141 ( FIG. 4 g ). Next, a third cover layer part 163 is laminated on one side of the second magnetic layer part 153 , and a fourth cover layer part 161 is laminated on the other side of the third magnetic layer part 151 ( FIG. 4 h).
본 실시예의 경우,자성 레이어부 및 커버 레이어부를 추가로 적층시킴으로써 전자파 및 노이즈 차폐 효과를 더욱 향상시킬 수 있다.In the present embodiment, the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.
이상과 같이 본 발명에 따른 바람직한 실시예를 살펴보았으며, 앞서 설명된 실시예 이외에도 본 발명이 그 취지나 범주에서 벗어남이 없이 다른 특정 형태로 구체화 될 수 있다는 사실은 해당 기술에 통상의 지식을 가진 이들에게는 자명한 것이다. 그러므로, 상술된 실시예는 제한적인 것이 아니라 예시적인 것으로 여겨져야 하고, 이에 따라 본 발명은 상술한 설명에 한정되지 않고 첨부된 청구항의 범주 및 그 동등 범위 내에서 변경될 수도 있다.As described above, preferred embodiments according to the present invention have been described, and the fact that the present invention can be embodied in other specific forms without departing from the spirit or scope of the present invention in addition to the above-described embodiments is understood by those of ordinary skill in the art. It is obvious to them. Therefore, the above-described embodiments are to be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

Claims (6)

  1. 절연 재질의 베이스 기판;an insulating base substrate;
    상기 베이스 기판의 일측에 배치되는 전송부;a transmission unit disposed on one side of the base substrate;
    상기 베이스 기판의 일측 양 단부에 상기 전송부를 따라 배치되는 제1 접지부;a first ground portion disposed along the transmission portion at both ends of one side of the base substrate;
    상기 베이스 기판의 타측 양 단부에 상기 제1접지부에 대응되도록 배치되는 제2접지부;a second ground portion disposed at both ends of the base substrate to correspond to the first ground portion;
    상기 제2접지부의 타측에 배치되는 제1자성레이어부;a first magnetic layer portion disposed on the other side of the second ground portion;
    상기 전송부 및 상기 제1접지부의 일측에 배치되는 제1커버 레이어부;a first cover layer part disposed on one side of the transmission part and the first ground part;
    상기 제1 자성 레이어부 타측에 배치되는 제2커버 레이어부;a second cover layer portion disposed on the other side of the first magnetic layer portion;
    상기 제1 커버 레이어부 일측에 배치되는 제3접지부;및A third ground portion disposed on one side of the first cover layer portion; And
    상기 제2커버 레이어부 타측에 배치되는 제4접지부;를 포함하는,케이블 모듈.Including, a cable module; a fourth ground portion disposed on the other side of the second cover layer portion.
  2. 제1항에 있어서,According to claim 1,
    상기 제1커버 레이어부,상기 제3접지부와 상기 제2커버 레이어부,상기 제4접지부는 비아 홀(via hole)을 통해 연결되는 것을 특징으로 하는,케이블 모듈.The first cover layer part, the third ground part, the second cover layer part, and the fourth ground part are connected through a via hole, the cable module.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 제3접지부의 일측에는 제2자성 레이어부가 배치되고,A second magnetic layer portion is disposed on one side of the third ground portion,
    상기 제2자성 레이어부의 일측에는 제3커버 레이어부가 배치되고,A third cover layer portion is disposed on one side of the second magnetic layer portion,
    상기 제4접지부의 타측에는 제3자성 레이어부가 배치되며,A third magnetic layer part is disposed on the other side of the fourth ground part,
    상기 제3자성 레이어버의 타측에는 제4커버 레이어부가 배치되는 것을 특징으로 하는, 케이블 모듈.A cable module, characterized in that a fourth cover layer portion is disposed on the other side of the third magnetic layer server.
  4. 제1항에 따른 케이블 모듈을 제조하는 방법에 관한 것으로서,It relates to a method for manufacturing the cable module according to claim 1,
    일측에 제1금속층이 형성되고 타측에 제2금속층이 형성된 베이스 기판을 배치하는 단계;disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side;
    상기 제2금속층의 타측에 제1자성 레이어부를 배치하는 단계;disposing a first magnetic layer part on the other side of the second metal layer;
    상기 제1금속층을 에칭하여 전송부 및제1접지부를 형성하는 단계;etching the first metal layer to form a transfer part and a first ground part;
    상기 제2금속층 및 제2자성 레이어부를 에칭하여 에어 갭을 형성하는 단계;forming an air gap by etching the second metal layer and the second magnetic layer;
    상기 전송부 및 상기 제1접지부의 일측에 제1커버 레이어부를 배치하는 단계;disposing a first cover layer part on one side of the transmission part and the first ground part;
    상기 제1자성 레이어부 타측에 제2커버 레이어부를 배치하는 단계;disposing a second cover layer part on the other side of the first magnetic layer part;
    상기 제1커버 레이어부 일측에 제3접지부를 배치하는 단계;및disposing a third grounding part on one side of the first cover layer part; and
    상기 제2커버 레이어부 타측에 제4접지부를 배치하는 단계;를 포함하는,케이블 모듈 제조 방법.Containing, cable module manufacturing method comprising; disposing a fourth ground portion on the other side of the second cover layer portion.
  5. 제4항에 있어서,5. The method of claim 4,
    상기 제1커버 레이어부, 상기 제3접지부와 상기 제2커버 레이어부,상기 제4접지부가 연결되도록 비아 홀을 형성하는 단계를 더 포함하는 것을 특징으로 하는,케이블 모듈 제조 방법.The method further comprising the step of forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 제3접지부의 일측에 제2자성 레이어부를 배치하는 단계;disposing a second magnetic layer part on one side of the third ground part;
    상기 제4접지부의 타측에 제3자성 레이어부를 배치하는 단계;disposing a third magnetic layer part on the other side of the fourth ground part;
    상기 제2자성 레이어부의 일측에 제3커버 레이어부를 배치하는 단계;및disposing a third cover layer part on one side of the second magnetic layer part; and
    상기 제3자성 레이어부의 타측에 제4커버 레이어부를 배치하는 단계를 더 포함하는 것을 특징으로 하는,케이블 모듈 제조 방법.The method further comprising the step of disposing a fourth cover layer portion on the other side of the third magnetic layer portion, Cable module manufacturing method.
PCT/KR2021/001493 2020-02-05 2021-02-04 Cable module and method for manufacturing same WO2021158041A1 (en)

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