CN216650108U - Printed circuit mother board - Google Patents
Printed circuit mother board Download PDFInfo
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- CN216650108U CN216650108U CN202122822526.6U CN202122822526U CN216650108U CN 216650108 U CN216650108 U CN 216650108U CN 202122822526 U CN202122822526 U CN 202122822526U CN 216650108 U CN216650108 U CN 216650108U
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Abstract
A printed circuit mother board comprises a plurality of sub circuit boards which are connected with each other, each sub circuit board comprises a first installation part and a second installation part which are different in thickness, the first installation parts and the second installation parts are arranged at intervals, the first installation parts of two adjacent sub circuit boards are arranged adjacently, or the second installation parts of two adjacent sub circuit boards are arranged adjacently. The printed circuit motherboard can avoid the problems of assembly and welding elements, and is beneficial to improving the product quality.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a printed circuit motherboard.
Background
The existing printed circuit mother board comprises a plurality of mutually connected sub circuit boards, each sub circuit board comprises a head part and a tail part with different thicknesses, for example, the thickness of the head part is larger than that of the tail part, the head parts and the tail parts of two adjacent sub circuit boards are spliced to form a height difference between the two adjacent sub circuit boards, and in the ink printing process, because uncured ink has fluidity, the ink printed on the head parts can flow to the tail parts of the other adjacent sub circuit boards, so that the ink thickness of the tail parts is increased. Due to the inconsistent thickness of the head and tail of the sub-circuit board, the electronic components connected with the head and tail are welded insecurely, and the electronic components are welded in a faulty manner, so that the assembly of the sub-circuit board and the electronic equipment is affected.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a printed circuit motherboard, which can avoid the problems of assembling and soldering components, and is beneficial to improving the product quality.
A printed circuit mother board comprises a plurality of mutually connected sub circuit boards, wherein each sub circuit board comprises a first mounting part and a second mounting part which are different in thickness, the first mounting parts and the second mounting parts are arranged at intervals, the first mounting parts of two adjacent sub circuit boards are arranged adjacently, or the second mounting parts of two adjacent sub circuit boards are arranged adjacently.
In an embodiment of the present invention, the sub circuit board further includes a base portion, and the first mounting portion and the second mounting portion are connected to the base portion.
In an embodiment of the present invention, the base portion includes a first surface and a second surface opposite to each other, the first mounting portion includes a first support layer and a first conductive layer, the first support layer is connected to the first surface, the first conductive layer is connected to the first support layer, the second mounting portion includes a second support layer and a second conductive layer, the second support layer is connected to the first surface, and the second conductive layer is connected to the second support layer.
In an embodiment of the utility model, the first mounting portion further includes a third supporting layer and a third conductive layer, the third supporting layer is connected to the second surface, the third conductive layer is connected to the third supporting layer, the second mounting portion further includes a fourth supporting layer and a fourth conductive layer, the fourth supporting layer is connected to the second surface, and the fourth conductive layer is connected to the fourth supporting layer.
In an embodiment of the present invention, a thickness of the first support layer is different from a thickness of the second support layer, and a thickness of the third support layer is different from a thickness of the fourth support layer.
In an embodiment of the utility model, a thickness of the first supporting layer is equal to a thickness of the second supporting layer, a thickness of the third supporting layer is equal to a thickness of the fourth supporting layer, and the first mounting portion further includes a reinforcing plate connected to the first conductive layer or the third conductive layer.
In an embodiment of the present invention, the first mounting portion further includes a first ink layer and a third ink layer, the first ink layer covers the first conductive layer, the third ink layer covers the third conductive layer, or the first ink layer covers the first conductive layer, the third ink layer covers the stiffener, or the first ink layer covers the stiffener, and the third ink layer covers the third conductive layer; the second installation part further comprises a second ink layer and a fourth ink layer, the second ink layer covers the second conducting layer, and the fourth ink layer covers the fourth conducting layer.
In an embodiment of the present invention, the base portion includes a flexible base layer, a first circuit layer, a second circuit layer, a first insulating layer, and a second insulating layer, the first circuit layer and the second circuit layer are connected to both surfaces of the flexible base layer so as to be disposed opposite to each other, the first insulating layer covers the first circuit layer, the second insulating layer covers the second circuit layer, the first support layer and the third support layer are connected to the first insulating layer, and the second support layer and the fourth support layer are connected to the second insulating layer.
In an embodiment of the present invention, the plurality of sub circuit boards are arranged in a matrix, and in the plurality of longitudinally arranged sub circuit boards, two adjacent sub circuit boards are symmetrically arranged, or the first mounting portions of two adjacent sub circuit boards are adjacently arranged, or the second mounting portions of two adjacent sub circuit boards are adjacently arranged; in the transversely arranged plurality of the sub circuit boards, two adjacent sub circuit boards are symmetrically arranged, or two adjacent sub circuit boards are adjacently arranged on the first installation parts, or two adjacent sub circuit boards are adjacently arranged on the second installation parts.
In an embodiment of the present invention, the printed circuit motherboard further includes a frame and a plurality of connection boards, the frame is disposed around a circumference of the plurality of sub circuit boards, and the sub circuit boards are connected to the frame and the adjacent two sub circuit boards through the connection boards.
The thicknesses of the first installation part and the second installation part of the printed circuit mother board are different, the first installation parts of the two adjacent sub circuit boards are adjacently arranged or the second installation parts of the two adjacent sub circuit boards are adjacently arranged, so the heights of the first installation parts and the second installation parts of the two adjacent sub circuit boards are consistent, when printing ink is printed on the printed circuit mother board, the ink cannot flow between the two adjacent sub circuit boards, and the first installation parts and the second installation parts of the sub circuit boards are arranged at intervals, so that the problems of assembly and component welding caused by the different thicknesses of the ink of the first installation parts and the second installation parts are avoided, and the product quality is improved.
Drawings
Fig. 1 is a schematic top view of a printed circuit motherboard according to a first embodiment of the present invention.
Fig. 2 is a schematic partial sectional view of a printed circuit motherboard according to a first embodiment of the present invention.
Fig. 3 is a schematic partial sectional view of a printed circuit motherboard according to a second embodiment of the present invention.
Fig. 4 is a schematic top view of a printed circuit motherboard according to a third embodiment of the utility model.
Detailed Description
The utility model provides a printed circuit motherboard.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to facilitate understanding of those skilled in the art, the present invention provides a specific implementation process of the technical solution provided by the present invention through the following embodiments.
First embodiment
Fig. 1 is a schematic top view and fig. 2 is a schematic partial cross-sectional view of a printed circuit mother board according to a first embodiment of the present invention, and as shown in fig. 1 and 2, the printed circuit mother board includes a plurality of sub circuit boards 20 connected to each other, each sub circuit board 20 includes a first mounting portion 21 and a second mounting portion 22 having different thicknesses, the first mounting portion 21 and the second mounting portion 22 are disposed at an interval, the first mounting portions 21 of two adjacent sub circuit boards 20 are disposed adjacent to each other, or the second mounting portions 22 of two adjacent sub circuit boards 20 are disposed adjacent to each other. In the present embodiment, the thickness of the first mounting portion 21 is greater than the thickness of the second mounting portion 22, or the thickness of the first mounting portion 21 is smaller than the thickness of the second mounting portion 22.
The thicknesses of the first installation part 21 and the second installation part 22 of the printed circuit mother board are different, the first installation parts 21 of the two adjacent sub circuit boards 20 are adjacently arranged, or the second installation parts 22 of the two adjacent sub circuit boards 20 are adjacently arranged, so the heights of the first installation parts 21 and the second installation parts 22 of the two adjacent sub circuit boards 20 are consistent, when printing ink is printed on the printed circuit mother board, the ink cannot flow between the two adjacent sub circuit boards 20, and because the first installation parts 21 and the second installation parts 22 of the sub circuit boards 20 are arranged at intervals, the ink cannot flow between the first installation parts 21 and the second installation parts 22 of the sub circuit boards 20, the problems of assembly and element welding caused by the different thicknesses of the ink of the first installation parts 21 and the second installation parts 22 are avoided, and the product quality is improved.
Further, as shown in fig. 2, the sub circuit board 20 further includes a base portion 23, and the first mounting portion 21 and the second mounting portion 22 are connected to the base portion 23. In the present embodiment, the first mounting portion 21 and the second mounting portion 22 are connected to the base portion 23 at an interval, a portion of the base portion 23 not covered by the first mounting portion 21 and the second mounting portion 22 is bendable, and the sub circuit board 20 can be conveniently mounted in a mobile terminal or other electronic devices by bending the base portion 23 of the portion, which can save space.
Further, the base portion 23 includes a first surface 101 and a second surface 102 opposite to each other, the first mounting portion 21 includes a first support layer 211 and a first conductive layer 212, the first support layer 211 is attached to the first surface 101, the first conductive layer 212 is attached to the first support layer 211, the second mounting portion 22 includes a second support layer 221 and a second conductive layer 222, the second support layer 221 is attached to the first surface 101, and the second conductive layer 222 is attached to the second support layer 221. In the present embodiment, the first supporting layer 211 serves to insulate and support the first conductive layer 212, and the second supporting layer 221 serves to insulate and support the second conductive layer 222.
Further, the first support layer 211 and/or the second support layer 221 are prepregs (No Flow per; NFPP), which are made of epoxy resin and glass fiber, but not limited thereto.
Further, the first conductive layer 212 and/or the second conductive layer 222 are formed by etching using a metal material such as copper, silver, gold, etc., but not limited thereto.
Further, the first mounting part 21 further comprises a third supporting layer 213 connected to the second surface 102 and a third conductive layer 214 connected to the third supporting layer 213, the second mounting part 22 further comprises a fourth supporting layer 223 connected to the second surface 102 and a fourth conductive layer 224 connected to the fourth supporting layer 223, and the fourth conductive layer 224 is connected to the fourth supporting layer 223. In the present embodiment, the third supporting layer 213 serves to insulate and support the third conductive layer 214, and the fourth supporting layer 223 serves to insulate and support the fourth conductive layer 224.
Further, the third support layer 213 and/or the fourth support layer 223 are prepregs (No Flow per ag; NFPP), which are made of epoxy resin and glass fiber, but not limited thereto.
Further, the third conductive layer 214 and/or the fourth conductive layer 224 are formed by etching using a metal material such as copper, silver, gold, or the like, but not limited thereto.
Further, the thickness of the first support layer 211 is different from that of the second support layer 221, and the thickness of the third support layer 213 is different from that of the fourth support layer 223. In the present embodiment, the thickness of the first support layer 211 is greater than that of the second support layer 221, and the thickness of the first conductive layer 212 is equal to that of the second conductive layer 222; the thickness of the third support layer 213 is greater than the thickness of the fourth support layer 223, and the thickness of the third conductive layer 214 is equal to the thickness of the fourth conductive layer 224, as shown in fig. 2.
Further, the first supporting layer 211 is opposite to the third supporting layer 213, the thickness of the first supporting layer 211 is equal to that of the third supporting layer 213, and the thickness of the first conductive layer 212 is equal to that of the third conductive layer 214; the second support layer 221 is disposed opposite to the fourth support layer 223, the thickness of the second support layer 221 is equal to the thickness of the fourth support layer 223, and the thickness of the second conductive layer 222 is equal to the thickness of the fourth conductive layer 224. In the present embodiment, the areas of the first support layer 211 and the third support layer 213 are equal, the areas of the second support layer 221 and the fourth support layer 223 are equal, and the area of the first support layer 211 is larger than the area of the second support layer 221.
Further, the first mounting portion 21 further includes a first ink layer 215 and a third ink layer 216, the first ink layer 215 covers the first conductive layer 212, the third ink layer 216 covers the third conductive layer 214, the second mounting portion 22 further includes a second ink layer 225 and a fourth ink layer 226, the second ink layer 225 covers the second conductive layer 222, and the fourth ink layer 226 covers the fourth conductive layer 224. In this embodiment, the first ink layer 215, the second ink layer 225, the third ink layer 216, and the fourth ink layer 226 are used to protect the first conductive layer 212, the second conductive layer 222, the third conductive layer 214, and the fourth conductive layer 224, so as to prevent metal oxidation and improve reliability of the product.
Further, the base portion 23 (FCCL) includes a Flexible base layer 231, a first circuit layer 232, a second circuit layer 233, a first insulating layer 234, and a second insulating layer 235, the first circuit layer 232 is connected to both surfaces of the Flexible base layer 231 opposite to the second circuit layer 233, the first insulating layer 234 covers the first circuit layer 232, the second insulating layer 235 covers the second circuit layer 233, the first support layer 211 and the third support layer 213 are connected to the first insulating layer 234, and the second support layer 221 and the fourth support layer 223 are connected to the second insulating layer 235. In the present embodiment, the first surface 101 of the base portion 23 is a surface of the first insulating layer 234 away from the first circuit layer 232; the second surface 102 of the base portion 23 is a surface of the second insulating layer 235 away from the second circuit layer 233; the first conductive layer 212 and the second conductive layer 222 are electrically connected to the first circuit layer 232, respectively, and the third conductive layer 214 and the fourth conductive layer 224 are electrically connected to the second circuit layer 233, respectively.
Further, the flexible base layer 231 has a good folding resistance, and is made of an insulating material such as a polyester film or a polyimide film, but not limited thereto.
Further, the first circuit layer 232 and/or the second circuit layer 233 are formed by etching using a metal material such as copper, silver, gold, or the like, but not limited thereto.
Further, the first insulating layer 234 and the second insulating layer 235 are used to insulate and protect the first circuit layer 232 and the second circuit layer 233, and polyimide (with a heat resistance temperature of 288 ℃ to 300 ℃) or a mylar (with a heat resistance temperature of about 105 ℃) is used for the first insulating layer 234 and/or the second insulating layer 235, but not limited thereto.
Further, the first mounting portion 21 is used for mounting a camera module (not shown), and the second mounting portion 22 is used for mounting a connector (not shown). In this embodiment, the camera module is electrically connected to the first conductive layer 212 or the third conductive layer 214, and the connector is electrically connected to the second conductive layer 222 or the fourth conductive layer 224, wherein the connector is used for connecting a motherboard of the mobile terminal.
Further, as shown in fig. 1, the plurality of sub circuit boards 20 are arranged in a matrix, two adjacent sub circuit boards 20 are symmetrically arranged in the plurality of longitudinally arranged sub circuit boards 20, and the first mounting portions 21 of two adjacent sub circuit boards 20 are adjacently arranged or the second mounting portions 22 of two adjacent sub circuit boards 20 are adjacently arranged in the plurality of transversely arranged sub circuit boards 20.
In another preferred embodiment, the plurality of sub circuit boards 20 are arranged in a matrix, and in the plurality of longitudinally arranged sub circuit boards 20, the first mounting portions 21 of two adjacent sub circuit boards 20 are disposed adjacently, or the second mounting portions 22 of two adjacent sub circuit boards 20 are disposed adjacently.
Further, as shown in fig. 1, the printed circuit mother board further includes a frame 10 and a plurality of connection boards 30, the frame 10 is disposed around the plurality of sub circuit boards 20, the sub circuit boards 20 and the frame 10 and two adjacent sub circuit boards 20 are connected by the connection boards 30, and each connection board 30 is cut to remove each sub circuit board 20 from the printed circuit mother board. In the present embodiment, the frame 10 has a rectangular shape, and the plurality of sub circuit boards 20 are arranged in a matrix along the length and width directions of the frame 10.
Second embodiment
Fig. 3 is a schematic partial sectional view of a printed circuit motherboard according to a second embodiment of the present invention, and as shown in fig. 3, the structure of the printed circuit motherboard according to the present embodiment is substantially the same as that of the printed circuit motherboard according to the first embodiment, except that the first mounting portion has a different structure.
Specifically, as shown in fig. 3, the thickness of the first supporting layer 211 is equal to that of the second supporting layer 221, the thickness of the third supporting layer 213 is equal to that of the fourth supporting layer 223, and the first mounting portion 21 further includes a reinforcing plate 216 (the reinforcing plate 216 is defined as a first reinforcing plate), and the reinforcing plate 216 is connected to the first conductive layer 212 or the third conductive layer 214. Since the first mounting portion 21 is provided with the reinforcing plate 216, the second mounting portion 22 is not provided with the reinforcing plate 216, so that the thickness of the first mounting portion 21 is greater than that of the second mounting portion 22. In this embodiment, the first supporting layer 211 is opposite to the third supporting layer 213, the thickness of the first supporting layer 211 is equal to the thickness of the third supporting layer 213, and the thickness of the first conductive layer 212 is equal to the thickness of the third conductive layer 214; the second support layer 221 is disposed opposite to the fourth support layer 223, the thickness of the second support layer 221 is equal to the thickness of the fourth support layer 223, and the thickness of the second conductive layer 222 is equal to the thickness of the fourth conductive layer 224.
Further, the reinforcing plate 216 is a metal sheet, such as a steel sheet or an aluminum alloy sheet, and the reinforcing plate 216 is connected to the first conductive layer 212 or the third conductive layer 214 by using a conductive adhesive.
In another preferred embodiment, the thickness of the first supporting layer 211 is equal to that of the second supporting layer 221, the thickness of the third supporting layer 213 is equal to that of the fourth supporting layer 223, and the second mounting portion 22 further includes a second reinforcing plate connected to the second conductive layer 222 or the fourth conductive layer 224. Since the first mounting portion 21 is not provided with the second reinforcing plate, the second mounting portion 22 is provided with the second reinforcing plate so that the thickness of the first mounting portion 21 is smaller than that of the second mounting portion 22.
Further, the second reinforcing plate is a metal sheet, such as a steel sheet or an aluminum alloy sheet, and the second reinforcing plate is connected to the second conductive layer 222 or the fourth conductive layer 224 by using a conductive adhesive.
Third embodiment
Fig. 4 is a schematic top view of a printed circuit motherboard according to a third embodiment of the present invention, and as shown in fig. 4, the structure of the printed circuit motherboard according to the present embodiment is substantially the same as that of the printed circuit motherboard according to the first embodiment, but is different in the arrangement of the sub-circuit boards 20.
Specifically, as shown in fig. 4, the plurality of sub circuit boards 20 are arranged in a matrix, two adjacent sub circuit boards 20 are disposed in a vertically symmetrical manner in the plurality of longitudinally arranged sub circuit boards 20, and two adjacent sub circuit boards 20 are disposed in a horizontally symmetrical manner in the plurality of laterally arranged sub circuit boards 20. In the present embodiment, each sub circuit board 20 includes a first mounting portion 21 and a second mounting portion 22 having different thicknesses, the first mounting portion 21 and the second mounting portion 22 are disposed at an interval, the first mounting portions 21 of two adjacent sub circuit boards 20 are disposed adjacent to each other, or the second mounting portions 22 of two adjacent sub circuit boards 20 are disposed adjacent to each other, the thickness of the first mounting portion 21 is greater than that of the second mounting portion 22, or the thickness of the first mounting portion 21 is less than that of the second mounting portion 22.
The thickness of the first mounting part 21 and the second mounting part 22 of the printed circuit mother board is different, the first mounting parts 21 of the two adjacent sub circuit boards 20 are adjacently arranged, or the second mounting parts 22 of the two adjacent sub circuit boards 20 are adjacently arranged, so the heights of the first mounting parts 21 and the second mounting parts 22 of the two adjacent sub circuit boards 20 are consistent, when printing ink on the printed circuit mother board, the ink cannot flow between the two adjacent sub circuit boards 20, and because the first mounting parts 21 and the second mounting parts 22 of the sub circuit boards 20 are arranged at intervals, the ink cannot flow between the first mounting parts 21 and the second mounting parts 22 of the sub circuit boards 20, the problems of assembly and element welding caused by the different thicknesses of the ink of the first mounting parts 21 and the second mounting parts 22 are avoided, and the product quality is improved.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the utility model. The utility model is not described in detail in order to avoid unnecessary repetition.
Claims (10)
1. The utility model provides a printed circuit mother board which characterized in that, includes a plurality of interconnect's daughter circuit board, each the daughter circuit board includes first installation department and the second installation department that thickness is different, first installation department with second installation department interval sets up, adjacent two daughter circuit board first installation department sets up adjacently, perhaps adjacent two daughter circuit board the second installation department sets up adjacently.
2. A printed circuit motherboard according to claim 1 wherein said daughter circuit board further comprises a base portion, said first mounting portion and said second mounting portion being connected to said base portion.
3. A printed circuit motherboard according to claim 2 wherein the base portion comprises opposed first and second surfaces, the first mounting portion comprises a first support layer and a first conductive layer, the first support layer being attached to the first surface, the first conductive layer being attached to the first support layer, the second mounting portion comprises a second support layer and a second conductive layer, the second support layer being attached to the first surface, the second conductive layer being attached to the second support layer.
4. A printed circuit motherboard according to claim 3 wherein the first mounting section further comprises a third support layer and a third conductive layer, the third support layer being attached to the second surface, the third conductive layer being attached to the third support layer, the second mounting section further comprises a fourth support layer and a fourth conductive layer, the fourth support layer being attached to the second surface, the fourth conductive layer being attached to the fourth support layer.
5. A motherboard according to claim 4, characterised in that the thickness of the first support layer is different from the thickness of the second support layer and the thickness of the third support layer is different from the thickness of the fourth support layer.
6. A motherboard according to claim 4, characterised in that the thickness of the first support layer is equal to the thickness of the second support layer, the thickness of the third support layer is equal to the thickness of the fourth support layer, the first mounting portion further comprising a stiffening plate connected to the first conductive layer or the third conductive layer.
7. The printed circuit motherboard of claim 6, wherein the first mounting portion further comprises a first ink layer and a third ink layer, the first ink layer covering the first conductive layer, the third ink layer covering the third conductive layer, or the first ink layer covering the first conductive layer, the third ink layer covering the stiffener, or the first ink layer covering the stiffener, the third ink layer covering the third conductive layer; the second installation part further comprises a second ink layer and a fourth ink layer, the second ink layer covers the second conducting layer, and the fourth ink layer covers the fourth conducting layer.
8. A printed circuit motherboard according to claim 4 wherein the base section comprises a flexible base layer, a first circuit layer, a second circuit layer, a first insulating layer and a second insulating layer, the first circuit layer being attached to both surfaces of the flexible base layer in an opposed relationship to the second circuit layer, the first insulating layer covering the first circuit layer, the second insulating layer covering the second circuit layer, the first support layer and the third support layer being attached to the first insulating layer, the second support layer and the fourth support layer being attached to the second insulating layer.
9. A printed circuit mother board according to claim 1, wherein a plurality of the sub circuit boards are arranged in a matrix, and among the plurality of the longitudinally arranged sub circuit boards, adjacent two of the sub circuit boards are symmetrically arranged, or adjacent two of the first mounting portions of the sub circuit boards, or adjacent two of the second mounting portions of the sub circuit boards; in the transversely arranged plurality of the sub circuit boards, two adjacent sub circuit boards are symmetrically arranged, or two adjacent sub circuit boards are adjacently arranged on the first installation parts, or two adjacent sub circuit boards are adjacently arranged on the second installation parts.
10. A motherboard according to claim 9, further comprising a frame and a plurality of connection boards, the frame being disposed around the periphery of a plurality of said daughter boards, the daughter boards being connected to the frame and to adjacent ones of said daughter boards by said connection boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122822526.6U CN216650108U (en) | 2021-11-17 | 2021-11-17 | Printed circuit mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122822526.6U CN216650108U (en) | 2021-11-17 | 2021-11-17 | Printed circuit mother board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216650108U true CN216650108U (en) | 2022-05-31 |
Family
ID=81735706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122822526.6U Active CN216650108U (en) | 2021-11-17 | 2021-11-17 | Printed circuit mother board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216650108U (en) |
-
2021
- 2021-11-17 CN CN202122822526.6U patent/CN216650108U/en active Active
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