CN214315745U - Integrated flexible printed circuit board - Google Patents
Integrated flexible printed circuit board Download PDFInfo
- Publication number
- CN214315745U CN214315745U CN202120260284.3U CN202120260284U CN214315745U CN 214315745 U CN214315745 U CN 214315745U CN 202120260284 U CN202120260284 U CN 202120260284U CN 214315745 U CN214315745 U CN 214315745U
- Authority
- CN
- China
- Prior art keywords
- flexible substrate
- pad
- rigid fixing
- flexible
- electronic component
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to an integrated flexible printed circuit board, including flexible substrate, the circuit layer, a plurality of pads and cover film, the circuit layer all sets up on one side of flexible substrate with the pad, the cover film covers on the circuit layer and is fixed with the laminating of flexible substrate, the position of counterpointing with the pad on the cover film is equipped with the opening, the pad is connected with the circuit layer, be used for welding same electronic component's a plurality of pads on be equipped with the rigid fixed frame that is used for installing electronic component, rigid fixed frame and flexible substrate fixed connection, electronic component sets up in the rigid fixed frame, electronic component's pin and a plurality of pads welded fastening; the rigid fixing frame fixes the electronic element and the area where the pad is located, and even if the flexible substrate is bent, the corresponding area can be guaranteed not to deform, so that the internal electronic element and the covering film around the pad cannot loosen due to stress generated when the flexible substrate is bent.
Description
Technical Field
The utility model relates to a flexible circuit board field specifically is an integrated flexible printed circuit board.
Background
A Flexible Printed Circuit Board (FPCB) is a Printed Circuit made of a Flexible insulating base material, and has many advantages that a rigid Printed Circuit Board does not have. For example, the FPCB can be freely bent, rolled, and folded, and can be arbitrarily arranged according to the spatial layout requirements. The FPCB can greatly reduce the volume of the electronic product and is suitable for the development of the electronic product towards high density, miniaturization and high reliability. Therefore, the FPCB is widely used in the fields or products of aerospace, military, mobile communication, laptop, computer peripheral, PDA, digital camera, etc.
However, since the flexible circuit board has flexibility, when the electronic component is soldered on the conductive circuit, the flexible circuit board is easily bent or deformed, and the surface-mounted electronic device is easily peeled off due to bending deformation of the flexible circuit board after being soldered and fixed; meanwhile, the cover film is arranged on the surface of the existing flexible circuit board to protect the circuit layer, but the bonding pad needs to be exposed, so that holes need to be punched at the corresponding position of the cover film to expose the bonding pad, after welding is finished, the cover film is soft in material, and the edge of the punching position of the cover film is prone to stress tilting and flanging in the bending process of the substrate.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to an integrated flexible printed circuit board, which can make the soldering of electronic components on the flexible printed circuit board more stable and prevent the flanging of the cover film.
The utility model discloses an integrated flexible printed circuit board, including flexible substrate, circuit layer, a plurality of pad and cover film, circuit layer and pad all set up on one side of flexible substrate, cover film cover on circuit layer and with flexible substrate laminating fixed, cover film on with the position of pad counterpoint be equipped with the opening, the pad is connected with circuit layer; a plurality of pads for welding the same electronic component are provided with rigid fixing frames for mounting the electronic component, the rigid fixing frames are fixedly connected with the flexible substrate, the electronic component is arranged in the rigid fixing frames, and pins of the electronic component are welded and fixed with the pads.
Further, the bottom of the rigid fixing frame is provided with a plurality of connecting columns, the connecting columns penetrate through the covering film and the flexible substrate to reach the other side of the flexible substrate, the corresponding positions of the other side of the flexible substrate are also provided with the rigid fixing frame, the rigid fixing frame is located on the two sides of the flexible substrate, and the rigid fixing frame is respectively welded and fixed with the two ends of the connecting columns.
Furthermore, the pre-buried setting of spliced pole is in the flexible substrate, the fixed frame of rigidity be equipped with a plurality of with the welding hole that the spliced pole corresponds.
Further, the width of the rigid fixing frame is larger than the diameter of the connecting column.
Furthermore, the top of the rigid fixing frame is provided with a plurality of flexible fixing sheets, and the flexible fixing sheets are bent and fix the electronic element positioned in the rigid fixing frame.
The utility model has the advantages that: the utility model discloses an integrated flexible printed circuit board, through the fixed frame of rigidity that sets up in the outside of a plurality of pads of welding electronic component, the fixed frame of rigidity is fixed electronic component and pad place region, even also can guarantee when flexible substrate is crooked that the corresponding region can not produce deformation to make the stress production pine that covers membrane around inside electronic component and the pad and can not produce when flexible substrate is crooked and take off.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for a person skilled in the art, other relevant drawings can be obtained from the drawings without inventive effort:
fig. 1 is a schematic structural diagram of the present invention.
The reference numbers are as follows: the flexible printed circuit board comprises a flexible substrate 1, a circuit layer 2, a bonding pad 3, a cover film 4, a rigid fixing frame 5, an electronic element 6, a connecting column 51 and a flexible fixing sheet 52.
Detailed Description
As shown in fig. 1: the integrated flexible printed circuit board comprises a flexible substrate 1, a circuit layer 2, a plurality of bonding pads 3 and a cover film 4, wherein the flexible substrate 1 is an insulated polyimide or polyester film and is a substrate, the circuit layer 2 is a copper foil bonded on the flexible substrate 1, the bonding pads 3 and the copper foil are integrally formed, the cover film 4 covers the circuit layer 2 and is fixedly attached to the flexible substrate 1, and an opening is formed in the position, aligned with the bonding pads 3, of the cover film 4; a plurality of pads 3 for welding same electronic component are equipped with the rigid fixed frame 5 that is used for installing electronic component, and rigid fixed frame 5 adopts the hard resin, and rigid fixed frame 5 and flexible base plate 1 fixed connection, electronic component set up in rigid fixed frame 5, and electronic component's pin and a plurality of pads 3 welded fastening.
The utility model discloses an integrated flexible printed circuit board, through the fixed frame 5 that sets up the rigidity in the outside of a plurality of pads 3 of welding electronic component, the fixed frame 5 of rigidity fixes electronic component and the regional of pad 3 place, even also can guarantee when flexible substrate 1 is crooked that the corresponding region can not produce deformation to make inside electronic component and the pad 3 cover the membrane 4 around can not take off because of the stress production pine that produces when flexible substrate 1 is crooked produces.
In the embodiment, the bottom of the rigid fixing frame 5 is provided with a plurality of connecting columns 51 which are also made of hard resin, the connecting columns 51 pass through the covering film 4 and the flexible substrate 1 to reach the other surface of the flexible substrate 1, the corresponding positions of the other surface of the substrate of the flexible substrate 1 are also provided with the rigid fixing frame 5, the rigid fixing frames 5 positioned on the two surfaces of the flexible substrate 1 are respectively welded and fixed with the two ends of the connecting columns 51, the connecting columns 51 are pre-embedded in the flexible substrate 1, the rigid fixing frame 5 is provided with a plurality of welding holes corresponding to the connecting columns 51, the welding holes of the rigid fixing frame 5 are sleeved on the connecting columns 51 during installation, and the rigid fixing frames 5 at the two ends of the connecting column 51 are pressed, after the rigid fixing frames 5 clamp and fix the covering film 4, the circuit layer 2 and the flexible substrate 1, and injecting molten resin into the welding hole, and after cooling, enabling the rigid fixing frame 5 to be conveniently and fixedly connected with the connecting column 51.
In this embodiment, the width of the rigid fixing frame 5 is greater than the diameter of the connecting column 51, and when the connecting column 51 is embedded in the flexible substrate 1, the two ends of the connecting column 51 need to pass through the covering film 4, so that the covering film 4 is perforated, in order to avoid the tilting and flanging of the covering film 4 at this position, the opening of the rigid fixing frame 5 needs to be covered by the rigid fixing frame 5 when the rigid fixing frame 5 is installed, and thus the tilting and flanging of the covering film 4 at this position is prevented.
In this embodiment, a plurality of flexible fixing pieces 52 are provided on the top of the rigid fixing frame 5, the flexible fixing pieces 52 are bent to fix the electronic component located in the rigid fixing frame 5, the flexible fixing pieces 52 are made of a metal material, one end of each flexible fixing piece 52 is embedded in the rigid fixing frame 5 made of a resin material, the other end is a movable end, and after welding is completed, the electronic component in the rigid fixing frame 5 can be further fixed by bending the flexible fixing pieces 52.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (5)
1. The utility model provides an integrated flexible printed circuit board, includes flexible substrate, circuit layer, a plurality of pad and covers the membrane, and the circuit layer all sets up in flexible substrate's one side with the pad, covers the membrane and covers on the circuit layer and fixed with the laminating of flexible substrate, covers the position that the membrane was counterpointed with the pad and is equipped with the opening, and the pad is connected its characterized in that with the circuit layer: a plurality of pads for welding the same electronic component are provided with rigid fixing frames for mounting the electronic component, the rigid fixing frames are fixedly connected with the flexible substrate, the electronic component is arranged in the rigid fixing frames, and pins of the electronic component are welded and fixed with the pads.
2. An integrated flexible printed circuit board according to claim 1, wherein: the bottom of the rigid fixing frame is provided with a plurality of connecting columns, the connecting columns penetrate through the covering film and the flexible substrate to reach the other side of the flexible substrate, the corresponding positions of the other side of the flexible substrate are also provided with the rigid fixing frame, the rigid fixing frame is located on the two sides of the flexible substrate, and the rigid fixing frame is respectively welded and fixed with the two ends of the connecting columns.
3. An integrated flexible printed circuit board according to claim 2, wherein: the spliced pole is pre-buried in the flexible base plate, the fixed frame of rigidity be equipped with a plurality of with the welding hole that the spliced pole corresponds.
4. An integrated flexible printed circuit board according to claim 2, wherein: the width of the rigid fixing frame is larger than the diameter of the connecting column.
5. An integrated flexible printed circuit board according to claim 1, wherein: the top of the rigid fixing frame is provided with a plurality of flexible fixing sheets, and the flexible fixing sheets are bent and fix the electronic element in the rigid fixing frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120260284.3U CN214315745U (en) | 2021-01-29 | 2021-01-29 | Integrated flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120260284.3U CN214315745U (en) | 2021-01-29 | 2021-01-29 | Integrated flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214315745U true CN214315745U (en) | 2021-09-28 |
Family
ID=77831444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120260284.3U Expired - Fee Related CN214315745U (en) | 2021-01-29 | 2021-01-29 | Integrated flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214315745U (en) |
-
2021
- 2021-01-29 CN CN202120260284.3U patent/CN214315745U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210928 Termination date: 20220129 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |