CN102316681A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN102316681A CN102316681A CN2010102138200A CN201010213820A CN102316681A CN 102316681 A CN102316681 A CN 102316681A CN 2010102138200 A CN2010102138200 A CN 2010102138200A CN 201010213820 A CN201010213820 A CN 201010213820A CN 102316681 A CN102316681 A CN 102316681A
- Authority
- CN
- China
- Prior art keywords
- circuit
- hole
- conductive pole
- terminal pad
- connection line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 claims abstract description 7
- 230000005611 electricity Effects 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019157 thiamine Nutrition 0.000 description 1
- 150000003544 thiamines Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102316681A true CN102316681A (en) | 2012-01-11 |
CN102316681B CN102316681B (en) | 2014-04-09 |
Family
ID=45429377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010213820.0A Expired - Fee Related CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102316681B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
CN110797183A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
CN113054087A (en) * | 2021-03-19 | 2021-06-29 | 幂光新材料科技(上海)有限公司 | LED lamp bead packaging mode and circuit structure for improving electro-optic conversion efficiency |
CN113225924A (en) * | 2021-05-10 | 2021-08-06 | 幂光新材料科技(上海)有限公司 | Manufacturing method of high-luminous-efficiency LED lamp |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101031982A (en) * | 2005-05-30 | 2007-09-05 | 住友电气工业株式会社 | Conductive paste and multilayer printed wiring board using same |
CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
CN101466205A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
-
2010
- 2010-06-30 CN CN201010213820.0A patent/CN102316681B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101031982A (en) * | 2005-05-30 | 2007-09-05 | 住友电气工业株式会社 | Conductive paste and multilayer printed wiring board using same |
CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
CN101466205A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
CN103582321B (en) * | 2012-07-19 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and preparation method thereof |
CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
CN110797183A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
CN110797183B (en) * | 2018-08-01 | 2021-10-19 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
CN113054087A (en) * | 2021-03-19 | 2021-06-29 | 幂光新材料科技(上海)有限公司 | LED lamp bead packaging mode and circuit structure for improving electro-optic conversion efficiency |
CN113225924A (en) * | 2021-05-10 | 2021-08-06 | 幂光新材料科技(上海)有限公司 | Manufacturing method of high-luminous-efficiency LED lamp |
WO2022236880A1 (en) * | 2021-05-10 | 2022-11-17 | 幂光新材料科技(上海)有限公司 | Manufacturing method for high-light efficiency led lamp |
Also Published As
Publication number | Publication date |
---|---|
CN102316681B (en) | 2014-04-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant before: Hongsheng Technology Co.,Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO Free format text: FORMER OWNER: FUKUI PRECISION ASSEMBLY (SHENZHEN) CO., LTD. Effective date: 20140903 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 066000 QINHUANGDAO, HEBEI PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140903 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170629 Address after: No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhen Ding Technology Co.,Ltd. Patentee before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 |