CN101304636A - Method for preparing flexibility printed circuit board using PET as base material - Google Patents
Method for preparing flexibility printed circuit board using PET as base material Download PDFInfo
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- CN101304636A CN101304636A CNA2007100744191A CN200710074419A CN101304636A CN 101304636 A CN101304636 A CN 101304636A CN A2007100744191 A CNA2007100744191 A CN A2007100744191A CN 200710074419 A CN200710074419 A CN 200710074419A CN 101304636 A CN101304636 A CN 101304636A
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Abstract
The invention relates to a method for manufacturing a flexible printed circuit board adopting PET as base materials. The method comprises following procedures: (1) the PET base material is cut into wanted size; (2) the PET base materials is provided with a locating hole; (3) after treatment, the PET base material is washed with water and dried; (4) the surface of the PET base material is printed with a silver paste conductive pattern; (5) after being printed with silver paste, a semi-finished product is put into an oven to be dried; (6) after being dried, the semi-finished product is printed with insulated ink; (7) and the insulated ink is solidified. The manufacturing method also comprises following procedures between the procedures (2) and (3): plasma gas is used for treating the surface of the PET base material to strengthen the surface energy and the absorptive capacity of the PET base material, which is applicable to the manufacture of multi-layer and/or the narrow-circuit flexible printed circuit board. So the application scope of the flexible printed circuit adopting PET as base materials is enlarged.
Description
Technical field
The present invention relates to a kind of manufacture method of flexibility printed circuit board, especially relating to a kind of is the manufacture method of the flexibility printed circuit board of base material with PET.
Background technology
Along with electronic product develops to high density, miniaturization, high reliability direction, support the printed substrate of electronic product also to develop to light, thin, gentle direction gradually.Advantages such as wherein flexible, folding with it, the three-dimensional wiring of flexibility printed circuit board (FPC), three dimensions interconnection obtain application more and more widely in electronic product, at a lot of local traditional rigidity printed substrates (PCB) that have been substituted.
In universal, the wiring board of flexibility printed circuit board (FPC) indication mainly is to be base material pressing Copper Foil as conductive layer through the made wiring board of concerned process steps processing with the PI film.With the cell phone type product is example, the wiring board that wherein is connected mainboard and display screen in liding machine and the slip lid machine just belongs to typical flex circuit application because flexible material (being generally polyimides PI) thus high flexural property can realize the dynamic turnover and the sliding function of mobile phone products.This type of is that the circuit of the flex circuit application of basic material is shaped and normally realizes with mask method with the PI film, with two-sided FPC product is example, and its main technique flow process is as follows: Copper Foil (comprising copper layer and PI rete) severing → boring → black hole → copper facing → laminating film → exposure → development → etching → paste epiphragma (PI film+glue-line) → pressing coverlay → gold-plated → open short-circuit detecting → sharp processing → visual examination → packing → shipment.Wherein circuit is shaped and realizes by laminating film → exposure → operations such as development → etching, that is to say unwanted copper on the copper layer of monoblock is etched away, and is formed with the conductive pattern of usefulness with remaining copper.The coverlay that circuit compresses based on the PI film after being shaped comes protection circuit, because the copper layer all is up and down the PI membrane material with high flexural property, final finished product also has very high Qu Xingneng.
Except above-mentioned be base material and the tectal high deflection FPC with the PI film, another is that the printed substrate of base material also can be called flexibility printed circuit board with the PET film, because the PET material is compared with the PI material and had very big price advantage but flexural property is poor, the existing replacement gradually with the PI film is the trend of base material and tectal flex circuit application to this type of wiring board in some low deflection requirement field.This type of FPC product and general PI film are that the difference of base material and tectal FPC product is; with the PET film is that base material has replaced expensive PI film; the silver of printing conductive is starched and is formed conductive pattern on the PET film; the printing dielectric ink realizes silver is starched the protection of conductive pattern to replace expensive PI class coverlay on silver slurry conductive pattern, greatly reduces the cost of FPC.
As can be seen from the above description, this type of is that the flexibility printed circuit board of base material mainly is to utilize presswork to finish the processing of entire product with PET, just involves the adhesion problem of a seal material (silver slurry) and dielectric ink and PET base material here.PET that is PETG are a kind of macromolecular polymers that terephthalic acid (TPA) and ethylene glycol polymerization reaction take place produce.Surface energy is low to be big characteristics of high polymer material, this of high polymer kind of characteristics make in printing operation seal material (silver slurry) and the adhesion of dielectric ink and PET film low, therefore, the flexibility printed circuit board that with PET is base material at present can only be made flexibility printed circuit board individual layer, circuit wide (bonded area that is conductive pattern and PET base material is big), uses very limited.
Summary of the invention
In view of above-mentioned deficiency, what main purpose of the present invention was flexibility printed circuit board a kind of suitable manufacturing multilayer and/or that circuit is narrow is provided is the manufacture method of the flexibility printed circuit board of base material with PET.
The objective of the invention is to be achieved through the following technical solutions:
The present invention is a kind of to be the manufacture method of the flexibility printed circuit board of base material with PET, and its step comprises:
1. the PET base material cutting is become needed size;
2. on the PET base material, offer location hole;
3. the PET base material water after handling is cleaned, then oven dry;
4. at PET substrate surface printed silver slurry conductive pattern;
The semi-finished product that 5. will print the silver slurry are put into baking oven with the oven dry of silver slurry;
6. print dielectric ink in the surface of semi-finished of oven dry;
7. to the dielectric ink cured;
Wherein, step 2. and step further comprising the steps of between 3.: the PET substrate surface is handled the surface energy of REINFORCED PET base material and adsorption capacity with plasma gas.
As a kind of improvement of the present invention, wherein, the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 110～160 CF simultaneously respectively with the speed of 250～500cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1200～2000W.
As a kind of improvement of the present invention, wherein, the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 160 CF simultaneously respectively with the speed of 250cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1200W.
As a kind of improvement of the present invention, wherein, the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 110 CF simultaneously respectively with the speed of 500cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 2000W.
As a kind of improvement of the present invention, wherein, the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 135 CF simultaneously respectively with the speed of 300cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1600W.
As a kind of improvement of the present invention, wherein, also comprise in 2. in step and to offer via; Starch conductive pattern 4. described being meant at the two-face printing silver of PET base material of step, in printing, via is carried out grout with the silver slurry handle, make the silver on two sides starch the conductive pattern electric connection at PET substrate surface printed silver slurry conductive pattern.
As a kind of improvement of the present invention, wherein, also comprise in 2. in step and to offer via; 7. the back is further comprising the steps of in step:
8. at dielectric ink surface printing second layer silver slurry conductive pattern, in printing, via is carried out grout with the silver slurry handle, make every layer silver slurry conductive pattern electric connection;
The semi-finished product that 9. will print second layer silver slurry are put into baking oven with the oven dry of silver slurry;
10. print second layer dielectric ink in the surface of semi-finished of oven dry;
The invention has the advantages that, the present invention is a kind of to be the manufacture method of the flexibility printed circuit board of base material with PET, because before printed silver slurry conductive pattern, with plasma gas the PET substrate surface is handled, the surface energy of REINFORCED PET base material and adsorption capacity, make silver slurry conductive pattern and dielectric ink firm with combining of PET base material, be suitable for making the flexibility printed circuit board of multilayer and the narrow flexibility printed circuit board of circuit of silver slurry conductive pattern, having enlarged with PET is the range of application of the flexibility printed circuit board of base material.
Embodiment
The present invention is a kind of to be first embodiment of manufacture method of the flexibility printed circuit board of base material with PET, and its step comprises:
1. the PET base material cutting is become needed size;
2. on the PET base material, offer location hole;
3. with plasma gas the PET substrate surface is handled: the PET base material is put into plasma etcher, in the plasma etcher cavity, feed 135 CF simultaneously respectively with the speed of 300cc/min
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1600W, the surface energy of REINFORCED PET base material and adsorption capacity.
Because plasma gas is a kind of all or part of ionized gas state material, contain atomic group, not charged molecule, ion metastable state and excitation state, and the content of electronics, cation and anion about equally, and matter energy is higher, and easy and other materials play physics, chemical reaction.By radio freqnency generator, (vacuum degree≤0.2Torr) utilizes the energy of electric field will charge into mist (CF in the reaction cavity under the condition of vacuum
4+ O
2) ionization makes it to generate plasma gas.Bombard the pet sheet face to reach alligatoring pet sheet face with plasma gas, improve the purpose of surface energy.Plasma gas is divided into two aspects to the processing effect of pet sheet face: the first, and high energy particle carries out strong impact to the PET film can make the fluffing of PET film surface, becomes coarse, increases surface area; The second, the active oxygen atom in the plasma gas is a kind of strong oxidizer, can carry out oxidation to the alpha-carbon atom in the big molecule of PET, form carbonyl or carboxyl isopolarity group, after this structure had been arranged, PET film molecular polarity increased, and the adsorption capacity on surface significantly improves.
4. the PET base material water after handling is cleaned, then oven dry;
5. printed silver is starched conductive pattern on PET base material one side surface;
The semi-finished product that 6. will print the silver slurry are put into baking oven with the oven dry of silver slurry;
7. on being printed on the surface of silver slurry one side, oven dry half-finished print dielectric ink;
8. to the dielectric ink cured;
9. at dielectric ink surface printing second layer silver slurry conductive pattern, in printing, the via on the dielectric ink is carried out grout with the silver slurry handle, make every layer of silver slurry conductive pattern electric connection;
The semi-finished product that 10. will print second layer silver slurry are put into baking oven with the oven dry of silver slurry;
Then, carry out punching molding, open the operation of subsequent handlings such as short-circuit detecting, visual examination, packing, warehouse-in.
With utilize that said method makes with PET be the flexibility printed circuit board of base material with traditional what make without the plasma gas processing method is that the flexibility printed circuit board of base material compares test with PET: randomly draw respectively 100 flexibility printed circuit boards that two kinds of methods are made, on flexibility printed circuit board, there is the position of dielectric ink to mark 100 lattices with hundred lattice cuttves, brush away the break flour at grid edge then with scrub-brush, 600 type adhesive tapes with 3M company are attached on these hundred grid again, adhesive tape need cover all grids, press...with one's finger and press the surface to make the residual air in adhesive tape the inside all be driven out of, leave standstill after several seconds, firmly tear up adhesive tape, observe the grid quantity that adhesive tape is torn off, by the adhesion of how much assessing dielectric ink and silver slurry conductive pattern and PET base material of number of squares.The mean value of test result sees Table one.
Randomly draw each 100 flexibility printed circuit board that two kinds of methods are made again, at 85 ° of c of high-temperature, kept 240 hours in the environment of high humility 85%, oven dry then, on flexibility printed circuit board, there is the position of dielectric ink to mark 100 lattices with hundred lattice cuttves, brush away the break flour at grid edge then with scrub-brush, 600 type adhesive tapes with 3M company are attached on these hundred grid again, adhesive tape need cover all grids, press...with one's finger and press the surface to make the residual air in adhesive tape the inside all be driven out of, leave standstill after several seconds, firmly tear up adhesive tape, observe the grid quantity that adhesive tape is torn off, by the adhesion of how much assessing dielectric ink and silver slurry conductive pattern and PET base material of number of squares.The mean value of test result sees Table one.
Drawing from table one, is the flexibility printed circuit board that the manufacture method of the flexibility printed circuit board of base material is made with PET with utilizing the present invention a kind of, and dielectric ink and silver slurry conductive pattern are firm with combining of PET base material.
Table one:
| Processing mode | The number of squares of being peeled off at normal temperatures | The number of squares that hot and humid back is peeled off |
| Through plasma treatment | 0/100 | 0/100 |
| Without plasma treatment | 40/100 | 60/100 |
The present invention is a kind of to be second embodiment of manufacture method of the flexibility printed circuit board of base material with PET, and its step comprises:
1. the PET base material cutting is become needed size;
2. on the PET base material, offer location hole and via;
3. with plasma gas the PET substrate surface is handled: the PET base material is put into plasma etcher, in the plasma etcher cavity, feed 160 CF simultaneously respectively with the speed of 250cc/min
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1200W, the surface energy of REINFORCED PET base material and adsorption capacity.
4. the PET base material water after handling is cleaned, then oven dry;
5. difference printed silver slurry conductive pattern on the surface of PET base material both sides in printing, carries out the grout processing to via with the silver slurry, is the silver slurry conductive pattern electric connection of PET base material both sides;
The semi-finished product that 6. will print the silver slurry are put into baking oven with the oven dry of silver slurry;
7. print dielectric ink respectively in half-finished both side surface that is printed on the silver slurry of oven dry;
8. to the dielectric ink cured;
Then, carry out punching molding, open the operation of subsequent handlings such as short-circuit detecting, visual examination, packing, warehouse-in.
The present invention is a kind of to be the 3rd embodiment of manufacture method of the flexibility printed circuit board of base material with PET, and its step comprises:
1. the PET base material cutting is become needed size;
2. on the PET base material, offer location hole and via;
3. with plasma gas the PET substrate surface is handled: the PET base material is put into plasma etcher, in the plasma etcher cavity, feed 110 CF simultaneously respectively with the speed of 500cc/min
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 2000W, the surface energy of REINFORCED PET base material and adsorption capacity.
4. the PET base material water after handling is cleaned, then oven dry;
5. difference printed silver slurry conductive pattern on the surface of PET base material both sides in printing, carries out the grout processing to via with the silver slurry, makes the silver slurry conductive pattern electric connection of PET base material both sides;
The semi-finished product that 6. will print the silver slurry are put into baking oven with the oven dry of silver slurry;
7. print dielectric ink respectively in half-finished both side surface that is printed on the silver slurry of oven dry;
8. to the dielectric ink cured;
9. at dielectric ink surface printing second layer silver slurry conductive pattern, in printing, via is carried out grout with the silver slurry handle, make every layer of silver slurry conductive pattern electric connection;
The semi-finished product that 10. will print second layer silver slurry are put into baking oven with the oven dry of silver slurry;
Then, carry out punching molding, open the operation of subsequent handlings such as short-circuit detecting, visual examination, packing, warehouse-in.
Utilizing the present invention a kind of is the flexibility printed circuit board that the manufacture method of the flexibility printed circuit board of base material is made with PET, because dielectric ink and silver slurry conductive pattern are firm with combining of PET base material, therefore be not limited to make individual layer, two-sided, double-deck flexibility printed circuit board, can make the flexibility printed circuit board of multilayer, also can make the narrow flexibility printed circuit board of circuit of silver slurry conductive pattern, having enlarged with PET is the range of application of the flexibility printed circuit board of base material.
Claims (7)
1. one kind is the manufacture method of the flexibility printed circuit board of base material with PET, and its step comprises:
1. the PET base material cutting is become needed size;
2. on the PET base material, offer location hole;
3. the PET base material water after handling is cleaned, then oven dry;
4. at PET substrate surface printed silver slurry conductive pattern;
The semi-finished product that 5. will print the silver slurry are put into baking oven with the oven dry of silver slurry;
6. print dielectric ink in the surface of semi-finished of oven dry;
7. to the dielectric ink cured;
It is characterized in that: step 2. and step further comprising the steps of between 3.: the PET substrate surface is handled the surface energy of REINFORCED PET base material and adsorption capacity with plasma gas.
2. as claimed in claim 1 a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 110～160 CF simultaneously respectively with the speed of 250～500cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1200～2000W.
3. as claimed in claim 1 a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 160 CF simultaneously respectively with the speed of 250cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1200W.
4. as claimed in claim 1 a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 110 CF simultaneously respectively with the speed of 500cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 2000W.
5. as claimed in claim 1 a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: the described PET substrate surface processing with plasma gas is meant: the PET base material is put into plasma etcher, feed 135 CF simultaneously respectively with the speed of 300cc/min in the plasma etcher cavity
4And O
2, plasma etcher is handled the PET substrate surface with the radio-frequency power of 1600W.
As in the claim 1 to 5 each described a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: also comprise in 2. in step and offer via; Starch conductive pattern 4. described being meant at the two-face printing silver of PET base material of step, in printing, via is carried out grout with the silver slurry handle, make the silver on two sides starch the conductive pattern electric connection at PET substrate surface printed silver slurry conductive pattern.
As in the claim 1 to 5 each described a kind of be the manufacture method of the flexibility printed circuit board of base material with PET, it is characterized in that: also comprise in 2. in step and offer via; 7. the back is further comprising the steps of in step:
8. at dielectric ink surface printing second layer silver slurry conductive pattern, in printing, via is carried out grout with the silver slurry handle, make every layer silver slurry conductive pattern electric connection;
The semi-finished product that 9. will print second layer silver slurry are put into baking oven with the oven dry of silver slurry;
10. print second layer dielectric ink in the surface of semi-finished of oven dry;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710074419A CN100596257C (en) | 2007-05-11 | 2007-05-11 | Method for preparing flexibility printed circuit board using PET as base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710074419A CN100596257C (en) | 2007-05-11 | 2007-05-11 | Method for preparing flexibility printed circuit board using PET as base material |
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| Publication Number | Publication Date |
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| CN101304636A true CN101304636A (en) | 2008-11-12 |
| CN100596257C CN100596257C (en) | 2010-03-24 |
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| CN200710074419A Expired - Fee Related CN100596257C (en) | 2007-05-11 | 2007-05-11 | Method for preparing flexibility printed circuit board using PET as base material |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626665B (en) * | 2009-08-07 | 2011-01-26 | 奉化市东欣仪表有限公司 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
| CN102009049A (en) * | 2010-09-29 | 2011-04-13 | 卓盈微电子（昆山）有限公司 | Surface processing process for flexible circuit boards |
| CN102118918A (en) * | 2011-04-12 | 2011-07-06 | 中国计量学院 | Flexible transparent electronic circuit and preparation method thereof |
| CN102303464A (en) * | 2011-07-04 | 2012-01-04 | 昆山兴协和光电科技有限公司 | Full-automatic roll-type printing process of mobile keyboard circuit board and printing assembly |
| CN102316681A (en) * | 2010-06-30 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN102821555A (en) * | 2012-07-31 | 2012-12-12 | 悦虎电路(苏州)有限公司 | Processing technique of transparent insulating layer of multi-layer circuit board |
| CN104064859A (en) * | 2014-06-25 | 2014-09-24 | 周启塔 | Manufacturing process of flexible antenna board |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
| CN106681580A (en) * | 2017-02-06 | 2017-05-17 | 深圳市优苹科技有限公司 | Electromagnetic screen manufacturing method, electromagnetic screen and touch device |
| CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN110072344A (en) * | 2019-04-01 | 2019-07-30 | 捷卡（厦门）工业科技有限公司 | A kind of production technology of PET circuit board |
| CN112066868A (en) * | 2020-09-24 | 2020-12-11 | 西交利物浦大学 | Bending degree detection unit, device and method and wearable equipment |
| CN113267542A (en) * | 2021-04-22 | 2021-08-17 | 田丽雯 | Method for improving surface energy and reaction signal intensity of biosensor |
| CN114845474A (en) * | 2022-07-01 | 2022-08-02 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
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- 2007-05-11 CN CN200710074419A patent/CN100596257C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626665B (en) * | 2009-08-07 | 2011-01-26 | 奉化市东欣仪表有限公司 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
| CN102316681A (en) * | 2010-06-30 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN102316681B (en) * | 2010-06-30 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN102009049A (en) * | 2010-09-29 | 2011-04-13 | 卓盈微电子（昆山）有限公司 | Surface processing process for flexible circuit boards |
| CN102118918A (en) * | 2011-04-12 | 2011-07-06 | 中国计量学院 | Flexible transparent electronic circuit and preparation method thereof |
| CN102303464A (en) * | 2011-07-04 | 2012-01-04 | 昆山兴协和光电科技有限公司 | Full-automatic roll-type printing process of mobile keyboard circuit board and printing assembly |
| CN102821555A (en) * | 2012-07-31 | 2012-12-12 | 悦虎电路(苏州)有限公司 | Processing technique of transparent insulating layer of multi-layer circuit board |
| CN104064859A (en) * | 2014-06-25 | 2014-09-24 | 周启塔 | Manufacturing process of flexible antenna board |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
| CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN106681580A (en) * | 2017-02-06 | 2017-05-17 | 深圳市优苹科技有限公司 | Electromagnetic screen manufacturing method, electromagnetic screen and touch device |
| CN110072344A (en) * | 2019-04-01 | 2019-07-30 | 捷卡（厦门）工业科技有限公司 | A kind of production technology of PET circuit board |
| CN112066868A (en) * | 2020-09-24 | 2020-12-11 | 西交利物浦大学 | Bending degree detection unit, device and method and wearable equipment |
| CN113267542A (en) * | 2021-04-22 | 2021-08-17 | 田丽雯 | Method for improving surface energy and reaction signal intensity of biosensor |
| CN114845474A (en) * | 2022-07-01 | 2022-08-02 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
| CN114845474B (en) * | 2022-07-01 | 2022-09-16 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
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| CN100596257C (en) | 2010-03-24 |
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Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Method for preparing flexibility printed circuit board using PET as base material License type: Exclusive license Record date: 20080504 |
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Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Effective date of registration: 20201203 Address after: No.33, Zhoujia Xindai, Chuangxin village, Xilai Town, Jingjiang City, Taizhou City, Jiangsu Province, 214500 Patentee after: Jingjiang Jiehua Network Technology Co., Ltd Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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