CN110072344A - A kind of production technology of PET circuit board - Google Patents
A kind of production technology of PET circuit board Download PDFInfo
- Publication number
- CN110072344A CN110072344A CN201910257099.6A CN201910257099A CN110072344A CN 110072344 A CN110072344 A CN 110072344A CN 201910257099 A CN201910257099 A CN 201910257099A CN 110072344 A CN110072344 A CN 110072344A
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- CN
- China
- Prior art keywords
- substrate
- circuit board
- circuit
- pet
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of production technologies of PET circuit board, have main steps that: baking are carried out to the substrate of PET circuit board, so that substrate is formed；Substrate is got into through-hole using laser drilling device, which is located at the position that the design circuit on two sides needs to be connected；The printing of circuit layer is carried out to the design circuit on substrate；Silver paste, silver paste and the design electrical contact for being located at through-hole both ends are poured into through-hole；After adopting the above scheme, PET circuit board is produced using production technology of the invention, the printing of circuit layer need to be only carried out by design circuit, and the design circuit on substrate two sides passes through the silver paste conducting in through-hole, it avoids and plated with copper is required to basic two sides, then carry out the processing of copper sheet etching again, it is clear that, PET circuit board is produced using the production technology, production cost is low.
Description
Technical field
The present invention relates to the technical fields of flexible circuit board, more particularly to a kind of production technology of PET circuit board.
Background technique
The production method of traditional PET circuit board is the electrochemical reaction by copper-plating technique, at one layer of deposited on substrates
Then in a certain temperature conditions metallic copper will etch medical fluid and uniformly spray by spray head and arrive the surface of metal cylinder, and do not have
Redox reaction occurs for the copper for etching resist protection, and unwanted copper is reacted away, and exposes substrate and handles using stripping
After shape route.
It will be apparent that first plating full metallic copper on substrate, then it is etched further according to designed lines, so that
The production cost of PET circuit board is high.
In view of this, the present inventor for above-mentioned PET circuit board production method design on do not attain improve caused by it is all
More missings and inconvenience, and deeply conceive, and actively research improvement has a fling at and develops and design the present invention.
Summary of the invention
The purpose of the present invention is to provide a kind of production technologies of PET circuit board, produce PET circuit using the production technology
Plate, production cost are low.
In order to achieve the above objectives, solution of the invention is:
A kind of production technology of PET circuit board comprising following steps:
Step 1: being carried out at baking to the substrate of PET circuit board, so that substrate is formed；
Step 2: getting through-hole for substrate using laser drilling device, what the design circuit which is located at two sides needed to be connected
Position；
Step 3: the printing of circuit layer is carried out to the design circuit on substrate；
Step 4: silver paste, silver paste and the design electrical contact for being located at through-hole both ends are poured into through-hole；
The production technology further includes step 5: the printing of carbon pulp layer is carried out to the design circuit on substrate.
After adopting the above scheme, PET circuit board is produced using production technology of the invention, only need to carries out electricity by design circuit
The printing of road floor, and the design circuit on substrate two sides is avoided and is both needed to basic two sides by the silver paste conducting in through-hole
Plated with copper is wanted, then carries out the processing of copper sheet etching again, it is clear that, PET circuit board, production are produced using the production technology
It is at low cost.
In addition, improving the electric conductivity of design circuit by the printing for carrying out carbon pulp layer to design circuit, and it is not easy oxygen
Change, also has the effect of antistripping.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the PET circuit board processed using present pre-ferred embodiments；
Fig. 2 is the cross-sectional view of A-A section in Fig. 1.
Specific embodiment
In order to further explain the technical solution of the present invention, being explained in detail below by specific embodiment the present invention
It states.
It as shown in Figure 1 to Figure 2, is a kind of preferred embodiment of the production technology of PET circuit board of the present invention comprising following
Step:
Step 1: being carried out at baking to the substrate 1 of PET circuit board, so that substrate 1 is formed；
Step 2: substrate 1 is got into through-hole 2 using laser drilling device, the design circuit which is located at two sides needs to be connected
Position；
Step 3: the printing of circuit layer 3 is carried out to the design circuit on substrate 1；
Step 4: silver paste, silver paste and the design electrical contact for being located at 2 both ends of through-hole are poured into Xiang Tongkong 2.
After adopting the above scheme, PET circuit board is produced using production technology of the invention, only need to carries out electricity by design circuit
The printing of road floor 3, and the design circuit on substrate two sides is avoided equal to basic two sides by the silver paste conducting in through-hole 2
Plated with copper is needed, then carries out the processing of copper sheet etching again, it is clear that, PET circuit board is produced using the production technology, it is raw
It produces at low cost.
Above-mentioned production technology further includes step 5: the printing of carbon pulp layer 4 is carried out to the design circuit on substrate 1.By right
The printing that circuit carries out carbon pulp layer 4 is designed, improves the electric conductivity of design circuit, and not oxidizable, also with antistripping
Effect.
Above-described embodiment and schema and non-limiting product form and style of the invention, any technical field it is common
The appropriate changes or modifications that technical staff does it all should be regarded as not departing from patent category of the invention.
Claims (2)
1. a kind of production technology of PET circuit board comprising following steps:
Step 1: being carried out at baking to the substrate of PET circuit board, so that substrate is formed；
Step 2: getting through-hole for substrate using laser drilling device, what the design circuit which is located at two sides needed to be connected
Position；
Step 3: the printing of circuit layer is carried out to the design circuit on substrate；
Step 4: silver paste, silver paste and the design electrical contact for being located at through-hole both ends are poured into through-hole.
2. a kind of production technology of PET circuit board as described in claim 1, it is characterised in that: the production technology further includes,
Step 5: the printing of carbon pulp layer is carried out to the design circuit on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910257099.6A CN110072344A (en) | 2019-04-01 | 2019-04-01 | A kind of production technology of PET circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910257099.6A CN110072344A (en) | 2019-04-01 | 2019-04-01 | A kind of production technology of PET circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110072344A true CN110072344A (en) | 2019-07-30 |
Family
ID=67366814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910257099.6A Pending CN110072344A (en) | 2019-04-01 | 2019-04-01 | A kind of production technology of PET circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110072344A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03171043A (en) * | 1989-11-30 | 1991-07-24 | Fuji Photo Film Co Ltd | Manufacture of multilayer printed circuit board |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
-
2019
- 2019-04-01 CN CN201910257099.6A patent/CN110072344A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03171043A (en) * | 1989-11-30 | 1991-07-24 | Fuji Photo Film Co Ltd | Manufacture of multilayer printed circuit board |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190730 |
|
| WD01 | Invention patent application deemed withdrawn after publication |