CN205124121U - PCB circuit board - Google Patents
PCB circuit board Download PDFInfo
- Publication number
- CN205124121U CN205124121U CN201520966336.3U CN201520966336U CN205124121U CN 205124121 U CN205124121 U CN 205124121U CN 201520966336 U CN201520966336 U CN 201520966336U CN 205124121 U CN205124121 U CN 205124121U
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- China
- Prior art keywords
- layer
- conductive layer
- conducting
- heat
- line groove
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Abstract
The utility model discloses a PCB circuit board, including the base plate, the surface is provided with conducting layer I and conducting layer II, conducting layer I and II ground connection of conducting layer respectively about the base plate, all be provided with a plurality of circuit recesses on conducting layer I and the conducting layer II, the circuit recess is for leading to the groove, and the lower terminal surface of circuit recess be the upper surface of conducting layer I and conducting layer II, set up the conducting wire piece under the circuit recess on the terminal surface, be provided with the tectorial membrane layer on the circuit recess and on the piece of conducting wire, be provided with the wiring through post on the inner wall of circuit recess, wiring through post connecting conductive layer I and conducting layer II, the base plate includes the glass fiber board sheet layer, and the upper and lower surface of glass fiber board sheet layer is provided with insulating sheet layer, insulating sheet layer not with the contact of glass fiber board sheet layer be provided with the heat -conducting layer on the surface. The utility model has the advantages of prior art's drawback, the reasonable novelty of structural design can be overcome to it.
Description
Technical field
The utility model relates to a kind of PCB, belongs to field of circuit boards.
Background technology
Circuit board is different according to manufacture craft, can be divided into relief method and the large class of addition process two.Current board production mainly adopts relief method to produce, and not only complex process also can produce a large amount of waste water, seriously polluted; Further, along with circuit integration degree is more and more higher, subtractive process cannot reach requirement, even if use the base material of extra thin copper foil, when making fine-line, lateral erosion remains comparatively serious problem, and live width is difficult to reduce.For solving the problem, there is semi-additive process, having used more general in fine-line makes.But easily cause thickness of coating uneven in technique during galvanoplastic deposited copper; During difference etching, it is slow that alloy-layer removes speed, thus cause circuit lateral erosion, causes circuit to be out of shape; And if alloy-layer removal not exclusively also can cause circuit board short circuit.
Utility model content
For the deficiency that prior art exists, technical problem to be solved in the utility model is, provide a kind of PCB, shaping speed is fast, production efficiency is high, and live width can control narrower, is applicable to high accuracy circuit, be beneficial to the advantage of batch production, perfect heat-dissipating, long service life.
For solving the problems of the technologies described above, the technical scheme that the utility model is taked is, a kind of PCB, comprises substrate, and substrate upper and lower surface is respectively arranged with conductive layer I and conductive layer II, conductive layer I and conductive layer II ground connection; Described conductive layer I and conductive layer II are provided with some line groove, and line groove is groove, and the lower surface of line groove is the upper surface of conductive layer I and conductive layer II; Described line groove lower surface arranges conducting wire sheet, in line groove He on the sheet of conducting wire, is provided with coating layer; The inwall of described line groove is provided with wiring through post, wiring through post connecting conductive layer I and conductive layer II; Described substrate comprises glass mat flaggy, and the upper and lower surface of glass mat flaggy is provided with layer of insulation board, and the surface that layer of insulation board does not contact with glass mat flaggy is provided with heat-conducting layer; Described heat-conducting layer is polycrystalline graphite material, the surface contacted of heat-conducting layer is provided with the subsider of some even arrangements, is provided with heat-conducting silicone grease in subsider with layer of insulation board.
Optimize, above-mentioned PCB, the outer edge place of described heat-conducting layer is provided with some subsiders, is provided with titanium alloy coat in subsider.
Optimize, above-mentioned PCB, described conductive layer I and conductive layer II are closely knit tabular or pertusate netted.
Optimize, above-mentioned PCB, described conducting wire sheet is Copper Foil, aluminium foil or silver foil.
Optimize, above-mentioned PCB, the thickness of described conducting wire sheet is 1/3 of conductive layer I and conductive layer II thickness, and the thickness of heat-conducting layer is 1/5 of substrate thickness.
Optimize, above-mentioned PCB, described coating layer is liquid photosensitive glass fibre template coverlay or liquid photosensitive solder mask.
The utility model has the advantage of that it can overcome the drawback of prior art, reasonable in design is novel.By arranging line groove, accelerating rhythm of production, enhancing productivity, be beneficial to mass production, reduce the requirement to material, cost-saving; Do not need to use extra thin copper foil material, further reduction production cost, and the utility model can strict pilot thickness and uniformity, line-spacing can reach less spacing and due to the setting of line groove, its short circuit probability is reduced greatly, breach the shortcoming of existing line plate, be applicable to high accuracy circuit and use; Owing to adopting interlayer structure, add the peel strength between conducting wire and base material, be beneficial to the useful life of improving circuit board.By arranging subsider on heat-conducting plate, components and parts are directly dispelled the heat by subsider, thus greatly improve the integral heat sink effect of wiring board and strengthen the mechanical strength of circuit slab integral, the useful life of extension wire plate.The good heat conductivity of polycrystalline graphite coat, enhances the thermal conductivity of wiring board.Dimension scale in the technical scheme of the application, through actual verification, can ensure heat conductivility and the bulk strength of wiring board, can save material again.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Technical characterstic of the present utility model is set forth further below in conjunction with accompanying drawing and specific embodiment.
The utility model is a kind of PCB, comprises substrate, and substrate is glass mat material film, and substrate upper and lower surface is respectively arranged with conductive layer I 2 and conductive layer II 3, conductive layer I 2 and conductive layer II 3 ground connection; Described conductive layer I 2 and conductive layer II 3 are provided with some line groove 4, and line groove 4 is groove, and the lower surface of line groove 4 is the upper surface of conductive layer I 2 and conductive layer II 3; Described line groove 4 lower surface arranges conducting wire sheet 5, in line groove 4 He on the sheet of conducting wire, is provided with coating layer; The inwall of described line groove is provided with wiring through post 6, wiring through post 6 connecting conductive layer I 2 and conductive layer II 3; Described substrate 1 comprises glass mat flaggy 11, and the upper and lower surface of glass mat flaggy 11 is provided with layer of insulation board 12, and the surface that layer of insulation board 12 does not contact with glass mat flaggy 11 is provided with heat-conducting layer 13; Described heat-conducting layer 13 is polycrystalline graphite material, the surface contacted of heat-conducting layer 13 is provided with the subsider 14 of some even arrangements, is provided with heat-conducting silicone grease in subsider 14 with layer of insulation board 12.The outer edge place of heat-conducting layer 13 is provided with some subsiders 14, is provided with titanium alloy coat in subsider 14.Conductive layer I 2 and conductive layer II 3 are closely knit tabular or pertusate netted.Conducting wire sheet 5 is Copper Foil, aluminium foil or silver foil.The thickness of conducting wire sheet 5 is 1/3 of conductive layer I 2 and conductive layer II 3 thickness, and the thickness of heat-conducting layer 13 is 1/5 of substrate thickness.Coating layer is liquid photosensitive glass fibre template coverlay or liquid photosensitive solder mask.
The utility model has the advantage of that it can overcome the drawback of prior art, reasonable in design is novel.By arranging line groove, accelerating rhythm of production, enhancing productivity, be beneficial to mass production, reduce the requirement to material, cost-saving; Do not need to use extra thin copper foil material, further reduction production cost, and the utility model can strict pilot thickness and uniformity, line-spacing can reach less spacing and due to the setting of line groove, its short circuit probability is reduced greatly, breach the shortcoming of existing line plate, be applicable to high accuracy circuit and use; Owing to adopting interlayer structure, add the peel strength between conducting wire and base material, be beneficial to the useful life of improving circuit board.By arranging subsider on heat-conducting plate, components and parts are directly dispelled the heat by subsider, thus greatly improve the integral heat sink effect of wiring board and strengthen the mechanical strength of circuit slab integral, the useful life of extension wire plate.The good heat conductivity of polycrystalline graphite coat, enhances the thermal conductivity of wiring board.Dimension scale in the technical scheme of the application, through actual verification, can ensure heat conductivility and the bulk strength of wiring board, can save material again.
Certainly, above-mentioned explanation is not to restriction of the present utility model, and the utility model is also not limited to above-mentioned citing; those skilled in the art; in essential scope of the present utility model, the change made, remodeling, interpolation or replacement, all should belong to protection range of the present utility model.
Claims (6)
1. a PCB, is characterized in that: comprise substrate, and substrate upper and lower surface is respectively arranged with conductive layer I and conductive layer II, conductive layer I and conductive layer II ground connection; Described conductive layer I and conductive layer II are provided with some line groove, and line groove is groove, and the lower surface of line groove is the upper surface of conductive layer I and conductive layer II; Described line groove lower surface arranges conducting wire sheet, in line groove He on the sheet of conducting wire, is provided with coating layer; The inwall of described line groove is provided with wiring through post, wiring through post connecting conductive layer I and conductive layer II; Described substrate comprises glass mat flaggy, and the upper and lower surface of glass mat flaggy is provided with layer of insulation board, and the surface that layer of insulation board does not contact with glass mat flaggy is provided with heat-conducting layer; Described heat-conducting layer is polycrystalline graphite material, the surface contacted of heat-conducting layer is provided with the subsider of some even arrangements, is provided with heat-conducting silicone grease in subsider with layer of insulation board.
2. PCB according to claim 1, is characterized in that: the outer edge place of described heat-conducting layer is provided with some subsiders, is provided with titanium alloy coat in subsider.
3. PCB according to claim 2, is characterized in that: described conductive layer I and conductive layer II are closely knit tabular or pertusate netted.
4. PCB according to claim 3, is characterized in that: described conducting wire sheet is Copper Foil, aluminium foil or silver foil.
5. PCB according to claim 4, is characterized in that: the thickness of described conducting wire sheet is 1/3 of conductive layer I and conductive layer II thickness, and the thickness of heat-conducting layer is 1/5 of substrate thickness.
6. PCB according to claim 5, is characterized in that: described coating layer is liquid photosensitive glass fibre template coverlay or liquid photosensitive solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520966336.3U CN205124121U (en) | 2015-11-30 | 2015-11-30 | PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520966336.3U CN205124121U (en) | 2015-11-30 | 2015-11-30 | PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205124121U true CN205124121U (en) | 2016-03-30 |
Family
ID=55579685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520966336.3U Active CN205124121U (en) | 2015-11-30 | 2015-11-30 | PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205124121U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391369A (en) * | 2016-07-28 | 2018-08-10 | Oppo广东移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN111246662A (en) * | 2018-11-29 | 2020-06-05 | 欣兴电子股份有限公司 | Carrier plate structure and manufacturing method thereof |
-
2015
- 2015-11-30 CN CN201520966336.3U patent/CN205124121U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391369A (en) * | 2016-07-28 | 2018-08-10 | Oppo广东移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN108391369B (en) * | 2016-07-28 | 2019-07-23 | Oppo广东移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN111246662A (en) * | 2018-11-29 | 2020-06-05 | 欣兴电子股份有限公司 | Carrier plate structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |