CN101616549B - Method for manufacturing single-side thick copper stepped plate by electroplating addition method - Google Patents
Method for manufacturing single-side thick copper stepped plate by electroplating addition method Download PDFInfo
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- CN101616549B CN101616549B CN2009101087995A CN200910108799A CN101616549B CN 101616549 B CN101616549 B CN 101616549B CN 2009101087995 A CN2009101087995 A CN 2009101087995A CN 200910108799 A CN200910108799 A CN 200910108799A CN 101616549 B CN101616549 B CN 101616549B
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Abstract
The invention relates to a method for manufacturing a single-side thick copper stepped plate by an electroplating addition method, which comprises steps 1. providing a sheet material preinstalled with a thick copper area and a thin copper area; drilling holes on the sheet material; electroplating copper on the holes; steps 2. covering the thick copper on the sheet material and a copper sheet area needing to be etched; electroplating the thin copper area; covering the thin copper area with nickel, thus forming an area protecting the thick copper; step 3. covering the thin copper area and a position to be etched with a dry film; exposing the thick copper pattern which is electroplated to form the thick copper step; step 4. electroplating nickel on the thick copper step; step 5. peeling off the dry film and carrying out the etching, thus leaving the thick copper step and the thin copper area; step 6. peeling off the nickel, thereby finishing the circuit of the thick copper surface, and then processing the circuit of the other surface. The method of the invention does not need to specially buy the sheet material; the edge of the manufactured thick copper step is smooth and regular, and the size of the pattern is accurate; and simultaneously, the method has simple manufacturing process; the height of the step and the thickness of the thin copper is easily controlled; via holes thereof can also be manufactured on the thin copper area, and white hole phenomenon does not exist.
Description
Technical field
The present invention relates to a kind of manufacture method of single-side thick copper stepped plate, relate in particular to a kind of method that the making single-side thick copper stepped plate is sent out in addition of electroplating that adopts.
Background technology
Along with the develop rapidly of electronic technology, the electronic product development trend of miniaturization has day by day caused also realizing that the printed circuit board (PCB) of different components connection and the substrate that semiconductor die package is used develop towards light, thin, short, little direction under the prerequisite that guarantees good electrical properties and hot property.In order to reach above requirement, the fine-line that size is littler, the high reliability conductive via that size is littler are two specification requirements must satisfying simultaneously.
Usually adopt subtractive process to carry out circuit in the prior art and make, promptly adopt in the development of thick Copper Foil limit mask and form resist pattern, remove exposed copper layer, go to obtain conductor fig behind the resist pattern by selective etch.The disadvantage of this method is, in etching process, and the down etched while of exposed copper layer, also can be toward side etching, under normal copper layer thickness required, etching was often excessive, the difficulty that causes circuit to form, thus limited subtractive process in the fine-line Applications in Fabrication.Person more very, this subtractive process is in the making manufacturing process of single-side thick copper stepped plate, and is because repeatedly the etching control difficulty is big, big to the lateral erosion two in Hou Tong district; Because edge, one-sided pallet rank is not slick and sly, dimension of picture also is difficult to control; In addition, the thick copper of Bao Tongqu is difficult to guarantee consistent, occurs the problem that the no copper in Bao Tong district reveals base material easily; When Bao Tongqu has guide hole, through hole can be etched into white hole with subtractive process; Other has, and this kind subtractive process is made one-sided stepped plate, needs the thick Copper Foil plate of special order single face, and its long flow path control difficult point is many, thereby cost of manufacture is higher.
Summary of the invention
The objective of the invention is to, a kind of method of manufacturing single-side thick copper stepped plate by electroplating addition is provided, this method adopts common sheet material to make, and does not need the spy to purchase sheet material, has greatly reduced production cost; And thick copper stepped edge-smoothing and rule that this method is made, dimension of picture is accurate; Simultaneously, this method manufacturing process is simple, and the thickness of shoulder height and Bao Tongqu is controlled easily, and its via can be made equally in the Bao Tong district, does not have white hole phenomenon.
To achieve these goals, the present invention proposes a kind of method of manufacturing single-side thick copper stepped plate by electroplating addition, comprise step 1, the sheet material that is preset with Hou Tong district and Bao Tongqu is provided, on this sheet material, hole, and this hole carried out electro-coppering, and the back is filled up the hole with resin, and copper facing covers the hole once more on the hole; Step 2 covers thick copper zone on the described sheet material and the copper sheet zone that need etch away, and electric nickel is carried out in thin copper zone, covers above-mentioned thin copper zone with nickel, forms the thin copper zone of protection; Step 3 on the above-mentioned steps basis, covers thin copper zone and position to be etched away with dry film, expose thick copper figure, and plating forms thick copper stepped then; Step 4, above-mentioned thick copper stepped on electronickelling; Step 5, the dry film that fades away carries out etching, stays thick copper stepped and thin copper zone; Step 6 is returned nickel, and the circuit of thick copper face is promptly finished, and then the another side circuit with respect to thick copper face is processed.
In the described step 1, hole on the end of described sheet material copper, this end copper thickness is HOZ.
Comprise in the described step 1: PP is carried out in the hole electroplate, carry out consent, the hole electro-coppering is finished the conducting effect in hole with resin.
In the described step 3, adopt thick dry film will approach copper zone and position to be etched away covers.
In the described step 3, repeat repeatedly to electroplate form thick copper stepped.
In the described step 4, carry out electric plated with nickel according to predetermined size.
The described thick copper stepped sheet material that is formed at is one-sided.
Beneficial effect of the present invention: adopt the method for manufacturing single-side thick copper stepped plate by electroplating addition provided by the invention, do not need the spy to purchase sheet material, common sheet material can be made, and has greatly reduced production cost; And thick copper stepped edge-smoothing and rule that this method is made, dimension of picture is accurate; Simultaneously, this method manufacturing process is simple, and the thickness of shoulder height and Bao Tongqu is controlled easily, and its via can be made equally in the Bao Tong district, does not have white hole phenomenon.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
Fig. 1 is the schematic flow sheet of the method for manufacturing single-side thick copper stepped plate by electroplating addition of the present invention.
Embodiment
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
As shown in Figure 1, be the schematic flow sheet of the method for manufacturing single-side thick copper stepped plate by electroplating addition of the present invention, this method comprises:
Step 1 provides the sheet material that is preset with Hou Tong district and Bao Tongqu, holes on this sheet material, and electro-coppering is carried out in this hole, and the back is filled up the hole with resin, and copper facing covers the hole once more on the hole.In this method manufacturing process, do not need the spy to purchase sheet material, adopt common sheet material to make, as a kind of selectivity embodiment, we select end copper thickness for use is the sheet material of HOZ, holes on this end copper.Then PP is carried out in the hole and electroplate, finish the conducting effect in hole, carry out consent with resin.Because have the staircase structural model of thick copper face, the making aspect need adopt the two sides circuit to do step by step.
In sum, adopt the method for manufacturing single-side thick copper stepped plate by electroplating addition provided by the invention, do not need the spy to purchase sheet material, common sheet material can be made, and has greatly reduced production cost; And thick copper stepped edge-smoothing and rule that this method is made, dimension of picture is accurate; Simultaneously, this method manufacturing process is simple, and the thickness of shoulder height and Bao Tongqu is controlled easily, and its via can be made equally in the Bao Tong district, does not have white hole phenomenon.
The above; it only is preferred embodiment of the present invention; for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these changes and distortion all should belong to the protection range of claim of the present invention according to the technical scheme and the technical conceive of this aspect.
Claims (7)
1. the method for a manufacturing single-side thick copper stepped plate by electroplating addition is characterized in that, comprising:
Step 1 provides the sheet material that is preset with Hou Tong district and Bao Tongqu, holes on this sheet material, and electro-coppering is carried out in this hole, and the back is filled up the hole with resin, and copper facing covers the hole once more on the hole;
Step 2 covers thick copper zone on the described sheet material and the thin copper zone that need etch away, and electric nickel is carried out in thin copper zone, covers above-mentioned thin copper zone with nickel, forms the thin copper zone of protection;
Step 3 on the above-mentioned steps basis, covers thin copper zone and position to be etched away with dry film, expose thick copper figure, and plating forms thick copper stepped then;
Step 4, above-mentioned thick copper stepped on electronickelling;
Step 5, the dry film that fades away carries out etching, stays thick copper stepped and thin copper zone;
Step 6 is returned nickel, and the circuit of thick copper face is promptly finished, and then the another side circuit with respect to thick copper face is processed.
2. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 1 is characterized in that, in the described step 1, holes on the end of described sheet material copper, and this end copper thickness is HOZ.
3. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 1 is characterized in that, comprises in the described step 1: PP is carried out in the hole electroplate, carry out consent with resin, the hole electro-coppering is finished the conducting effect in hole.
4. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 1 is characterized in that, in the described step 3, adopts thick dry film will approach copper zone and position to be etched away covers.
5. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 1 is characterized in that, in the described step 3, repeat repeatedly to electroplate form thick copper stepped.
6. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 1 is characterized in that, in the described step 4, carries out electric plated with nickel according to predetermined size.
7. the method for manufacturing single-side thick copper stepped plate by electroplating addition as claimed in claim 5 is characterized in that, the described thick copper stepped sheet material that is formed at is one-sided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101087995A CN101616549B (en) | 2009-07-21 | 2009-07-21 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101087995A CN101616549B (en) | 2009-07-21 | 2009-07-21 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
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| CN101616549A CN101616549A (en) | 2009-12-30 |
| CN101616549B true CN101616549B (en) | 2011-01-05 |
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| CN2009101087995A Active CN101616549B (en) | 2009-07-21 | 2009-07-21 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036489B (en) * | 2010-11-26 | 2012-10-03 | 深南电路有限公司 | Method for processing high-precision PCB (Printed Circuit Board) with nonmetal and metal edges |
| CN103002660B (en) * | 2011-09-13 | 2016-06-15 | 深南电路有限公司 | A kind of wiring board and working method thereof |
| CN102510668B (en) * | 2011-11-08 | 2014-02-19 | 深圳市景旺电子股份有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN102651946B (en) * | 2012-04-05 | 2014-06-25 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN104047041B (en) * | 2013-03-15 | 2017-04-26 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN105578800B (en) * | 2014-10-08 | 2018-10-26 | 深南电路有限公司 | A kind of production method of circuit board |
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN105228357B (en) * | 2015-09-24 | 2017-12-01 | 广州杰赛科技股份有限公司 | A kind of preparation method of ladder wiring board |
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
| CN106879171A (en) * | 2017-03-07 | 2017-06-20 | 深南电路股份有限公司 | A kind of step conductive flexible circuit board and its processing method |
| CN110392488B (en) * | 2019-06-26 | 2020-10-27 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-frequency circuit board |
| WO2022126451A1 (en) * | 2020-12-16 | 2022-06-23 | 深南电路股份有限公司 | Localized thick copper structure processing method, localized thick copper circuit board, and processing method |
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| CN1047603A (en) * | 1990-07-07 | 1990-12-05 | 梁植林 | The manufacture method of printed substrate |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN201234401Y (en) * | 2008-01-14 | 2009-05-06 | 王勇铎 | Nickel partial electroplating printed circuit board |
| CN101460017A (en) * | 2007-12-11 | 2009-06-17 | 比亚迪股份有限公司 | Thru-hole electroplating method for printed circuit board |
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2009
- 2009-07-21 CN CN2009101087995A patent/CN101616549B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047603A (en) * | 1990-07-07 | 1990-12-05 | 梁植林 | The manufacture method of printed substrate |
| CN101460017A (en) * | 2007-12-11 | 2009-06-17 | 比亚迪股份有限公司 | Thru-hole electroplating method for printed circuit board |
| CN201234401Y (en) * | 2008-01-14 | 2009-05-06 | 王勇铎 | Nickel partial electroplating printed circuit board |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
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| CN101616549A (en) | 2009-12-30 |
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