CN105188271B - Addition process boss printed board manufacture craft - Google Patents
Addition process boss printed board manufacture craft Download PDFInfo
- Publication number
- CN105188271B CN105188271B CN201510559276.8A CN201510559276A CN105188271B CN 105188271 B CN105188271 B CN 105188271B CN 201510559276 A CN201510559276 A CN 201510559276A CN 105188271 B CN105188271 B CN 105188271B
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- CN
- China
- Prior art keywords
- addition process
- copper
- manufacture craft
- printed board
- metal bosses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a kind of addition process boss printed board manufacture craft, chooses base material first as insulated substrate；Then the insulated substrate cut successively, drilled, perforation, consent, returned heavy copper/plating and form copper-clad plate, i.e., plating one layer of layers of copper on two sides respectively up and down in the insulated substrate；Pattern transfer is carried out to the copper-clad plate again and etches/move back film obtaining the pcb board containing first step, metal bosses are set up using addition process on the first step of the pcb board containing first step.The technique is not only simple, easy management and control, and normal thick copper can be used to make, and greatly save cost.
Description
The application is application for a patent for invention number：201210013450.5 divisional application, the applying date of original application：2012-
01-17, invention and created name are addition process boss printed board manufacture crafts.
Technical field
The present invention relates to one kind to be related to field of acoustics, earphone or microphone predominantly on mobile phone, more particularly to one kind adds
Into method boss printed board manufacture craft.
Background technology
Electronic product is intended to miniaturization, multifunctional direction development, and this requires PCB product also will be constantly to miniature
Change, multifunction direction is developed.
At present, half-etching technique is typically used for boss printed board, i.e., the boss of needs is etched on thick copper, is belonged to
Subtractive process, its not only difficult control of complex process, and there is substantial amounts of copper to be wasted.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of addition process boss printed board manufacture craft, the technique is not only
Simply, easy management and control, and normal thick copper can be used to make, greatly save cost.
The present invention in order to solve its technical problem used by technical scheme be：A kind of addition process boss printed board makes work
Skill, base material is chosen first as insulated substrate；Then the insulated substrate cut successively, drilled, perforation, consent, being returned
Heavy copper/plating forms copper-clad plate, i.e., plates one layer of layers of copper on two sides respectively up and down in the insulated substrate；Again copper is covered to described
Plate carries out pattern transfer and etches/move back film and obtain the pcb board containing first step, in the pcb board containing first step
Metal bosses are set up using addition process on first step.
As a further improvement on the present invention, the mode that the addition process sets up metal bosses is point tin, spot welding and plating
One of.
As a further improvement on the present invention, described tin formula addition process is set up metal bosses and comprised the following steps：First
It need not be set up on the first step of the pcb board containing first step and block ring is added at metal bosses, then treated
Set up at metal bosses and produce metal bosses by the way of paste solder printing or wicking, finally remove block ring again.
As a further improvement on the present invention, the spot welded type addition process is set up metal bosses and comprised the following steps：First
The metal works for requiring shape, size and thickness are produced as needed, are then welded the metal works by the way of spot welding
The specified location on first step being connected on the pcb board containing first step can form the metal bosses.
As a further improvement on the present invention, the plating formula addition process is set up metal bosses and comprised the following steps：First
It need not be set up on the first step of the pcb board containing first step at metal bosses and produce figure with anti-plate material
Shape, coating then is thickeied at metal bosses to be set up by way of electrotinning or electro-coppering, forms the metal bosses,
Finally strip the plated material.
As a further improvement on the present invention, the first step is copper foil.
As a further improvement on the present invention, the thickness of the metal bosses is：0.01-0.50mm.
As a further improvement on the present invention, the thickness deviation of the metal bosses is ± 0.015mm.
The present invention is also provided a kind of addition process boss obtained using above-mentioned addition process boss printed board manufacture craft and printed
Making sheet.
The beneficial effects of the invention are as follows：The addition process boss printed circuit board technology is hindered by micropore, high density buried via hole, welding resistance
The technologies such as stream, word choked flow, accurate control shape, high-accuracy tin, point tin highly are controlled, spot welding, figure thickness copper are electroplated, to reach
The figure for possessing different height is made according to different demands on PCB same surface, is a kind of collection SMD ports and feature PCB
Particularity product.It has advantages below：1. using the projection section of addition process boss fabrication techniques, can directly make
It is assembled to for SMD nested parts on electronic product, without installing other Assembly parts again；2. filled than traditional contact pin method
Match somebody with somebody, the preparation method is simpler, convenient, the making of processing procedure after especially facilitating, and from can be produced in batches with mechanization, carries significantly
The high producing efficiency of product；3. the product has a more preferable shield effectiveness, performance is relatively reliable；4. reduce the body of product
Product, embodies the characteristics of small, accurate；5. the product is cheaper than half-etching boss product price, technique is simpler,
It is easy to control.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is structure for covering copper plate schematic diagram of the present invention；
Fig. 3 is the pcb board structural representation of the present invention containing first step；
Fig. 4,5 are that of the present invention tin formula addition process sets up metal bosses process schematic；
Fig. 6 is that spot welded type addition process of the present invention sets up metal bosses process schematic；
Fig. 7,8 are that plating formula addition process of the present invention sets up metal bosses process schematic.
With reference to accompanying drawing, make the following instructions：
1 --- insulated substrate 2 --- layers of copper
3 --- first step 4 --- metal bosses
5 --- block ring 6 --- metal works
7 --- anti-plate material
Embodiment
A kind of addition process boss printed board manufacture craft, base material is chosen first as insulated substrate 1；Then to the insulation
Substrate is cut, drilled successively, perforation, consent, is returned heavy copper/plating and is formed copper-clad plate, i.e., the insulated substrate up and down
One layer of layers of copper 2 (as shown in Figure 2) is plated on two sides respectively；Pattern transfer is carried out to the copper-clad plate again and etches/move back film obtaining
Pcb board (as shown in Figure 3) containing first step 3, uses addition on the first step of the pcb board containing first step
Method sets up metal bosses 4.
Preferably, the mode that above-mentioned addition process sets up metal bosses is one of point tin, spot welding and plating.
Preferably, above-mentioned tin formula addition process is set up metal bosses and comprised the following steps：Contain First described first
It need not be set up at metal bosses on the first step of the pcb board of rank and add block ring 5 (as shown in Figure 4), then wait to set up
Metal bosses (as shown in Figure 5) are produced at metal bosses by the way of paste solder printing or wicking, finally remove block ring again
.
Preferably, above-mentioned spot welded type addition process is set up metal bosses and comprised the following steps：Producing as needed first will
The metal works 6 of shape, size and thickness are sought, then the metal works are welded to by the way of spot welding and described contain first
The specified location on first step on the pcb board of step can form the metal bosses (as shown in Figure 6).
Preferably, above-mentioned plating formula addition process is set up metal bosses and comprised the following steps：Contain First described first
It need not be set up on the first step of the pcb board of rank at metal bosses and produce figure (as shown in Figure 7) with anti-plate material 7,
Then coating is thickeied at metal bosses to be set up by way of electrotinning or electro-coppering, forms the metal bosses (such as
Shown in Fig. 8), finally strip the plated material.
Preferably, above-mentioned first step is copper foil.
Preferably, the thickness of above-mentioned metal bosses is：0.01-0.50mm.
Preferably, the thickness deviation of above-mentioned metal bosses is ± 0.015mm.
A kind of addition process boss printed board obtained using above-mentioned addition process boss printed board manufacture craft.
Claims (4)
1. a kind of addition process boss printed board manufacture craft, base material is chosen first as insulated substrate (1)；Then to the insulation
Substrate is cut, drilled successively, perforation, consent, is returned heavy copper/plating and is formed copper-clad plate, i.e., the insulated substrate up and down
One layer of layers of copper (2) is plated on two sides respectively；Pattern transfer is carried out to the copper-clad plate again and etches/move back film obtaining containing First
The pcb board of rank (3), it is characterised in that：Gold is set up using addition process on the first step of the pcb board containing first step
Belong to boss (4)；The mode that the addition process sets up metal bosses is one of point tin, spot welding and plating；The spot welded type addition process
Metal bosses are set up to comprise the following steps：Produce the metal works (6) for requiring shape, size and thickness as needed first,
Then the finger being welded to the metal works by the way of spot welding on the first step on the pcb board containing first step
Positioning, which is put, can form the metal bosses.
2. addition process boss printed board manufacture craft according to claim 1, it is characterised in that：The first step is copper
Paper tinsel.
3. addition process boss printed board manufacture craft according to claim 1, it is characterised in that：The thickness of the metal bosses
Spend and be：0.01-0.50mm.
4. addition process boss printed board manufacture craft according to claim 3, it is characterised in that：The thickness of the metal bosses
Degree tolerance is ± 0.015mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559276.8A CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210013450.5A CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559276.8A CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210013450.5A Division CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105188271A CN105188271A (en) | 2015-12-23 |
| CN105188271B true CN105188271B (en) | 2017-12-05 |
Family
ID=48756586
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210013450.5A Active CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559276.8A Active CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559439.2A Active CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210013450.5A Active CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559439.2A Active CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN103209547B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835564A (en) * | 2017-10-19 | 2018-03-23 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
| CN109688716A (en) * | 2018-12-20 | 2019-04-26 | 广州陶积电电子科技有限公司 | A kind of wiring board and its manufacture craft with Lamp cup |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0545328A3 (en) * | 1991-11-29 | 1993-11-18 | Hitachi Chemical Co Ltd | Printed circuit board manufacturing process |
| JP2001111201A (en) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | Method of manufacturing wiring board and wiring board using the same |
| JP2003142803A (en) * | 2001-11-06 | 2003-05-16 | Toppan Printing Co Ltd | Manufacturing method for metal transfer plate and manufacturing method for multi-layered printed wiring board using the same |
| CN1465216A (en) * | 2001-05-31 | 2003-12-31 | 三井金属鉱业株式会社 | Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| JP2007096312A (en) * | 2005-09-27 | 2007-04-12 | Samsung Electro Mech Co Ltd | Manufacturing method of high-density printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026475A (en) * | 2000-07-07 | 2002-01-25 | Mitsui Mining & Smelting Co Ltd | Copper foil circuit with carrier foil, method of manufacturing printed wiring board, using the same, and printed wiring board |
| US7140103B2 (en) * | 2001-06-29 | 2006-11-28 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of high-density printed wiring board |
| US20040198044A1 (en) * | 2003-04-04 | 2004-10-07 | Sheng-Chuan Huang | Stacking photoresist image transferring method for fabricating a packaging substrate |
-
2012
- 2012-01-17 CN CN201210013450.5A patent/CN103209547B/en active Active
- 2012-01-17 CN CN201510559276.8A patent/CN105188271B/en active Active
- 2012-01-17 CN CN201510559439.2A patent/CN105282984B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0545328A3 (en) * | 1991-11-29 | 1993-11-18 | Hitachi Chemical Co Ltd | Printed circuit board manufacturing process |
| JP2001111201A (en) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | Method of manufacturing wiring board and wiring board using the same |
| CN1465216A (en) * | 2001-05-31 | 2003-12-31 | 三井金属鉱业株式会社 | Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| JP2003142803A (en) * | 2001-11-06 | 2003-05-16 | Toppan Printing Co Ltd | Manufacturing method for metal transfer plate and manufacturing method for multi-layered printed wiring board using the same |
| JP2007096312A (en) * | 2005-09-27 | 2007-04-12 | Samsung Electro Mech Co Ltd | Manufacturing method of high-density printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105282984A (en) | 2016-01-27 |
| CN103209547A (en) | 2013-07-17 |
| CN103209547B (en) | 2015-11-25 |
| CN105282984B (en) | 2018-08-31 |
| CN105188271A (en) | 2015-12-23 |
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