CN109688716A - A kind of wiring board and its manufacture craft with Lamp cup - Google Patents
A kind of wiring board and its manufacture craft with Lamp cup Download PDFInfo
- Publication number
- CN109688716A CN109688716A CN201811564304.5A CN201811564304A CN109688716A CN 109688716 A CN109688716 A CN 109688716A CN 201811564304 A CN201811564304 A CN 201811564304A CN 109688716 A CN109688716 A CN 109688716A
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- China
- Prior art keywords
- lamp cup
- comp
- wiring board
- layer
- manufacture craft
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of wiring board and its manufacture craft with Lamp cup, is related to electronic circuit board production field；The technique includes forming the technique of firm Lamp cup in the circuit board, makees Lamp cup using layer-by-layer addition metal legal system, and the Lamp cup of multiple steps, step: the pre-treatment of S1, wiring board are formed by the layer-by-layer superposition of graphic plating layer；S2, superposed graph comp-0；S3, superposed graph comp-1；S4, superposed graph comp-2；The post-processing of S5, wiring board.The combination of the method energy wiring board and Lamp cup of layer-by-layer superposition plating figure layer provided by the invention is even closer, route is wrapped in the higher copper Lamp cup of thermal conductivity, heat loss through conduction is carried out by Lamp cup, the cyclic structure of Lamp cup increases effective heat dissipation area, multi-stage stairs structure in Lamp cup is able to achieve the aggregation of light, while the structure facilitates the installation of subsequent product.
Description
Technical field
The present invention relates to electronic circuit board production fields, more particularly to a kind of wiring board with Lamp cup and its production work
Skill.
Background technique
Circuit is miniaturized more in wiring board, intuitiveization, batch production and optimization electrical appliance layout for fixed circuit
It plays an important role, as electronic technology is in the gradually intensification of each application field, wiring board Highgrade integration becomes inexorable trend, line
Integrated and lamp the fever of road height, the problem that the heat dissipation of route is insufficient are all the more obvious；In addition, the one of wiring board and Lamp cup
Whole lamp is miniaturized more in body, but is detached from since the materials variances of the two is easy to cause in conjunction with bad.
Summary of the invention
It is an object of the invention to avoid shortcoming in the prior art and provide a kind of wiring board with Lamp cup and its
Manufacture craft can be improved the heat-sinking capability of route by the product that this method makes, while make between wiring board and Lamp cup
In conjunction with even closer.
The purpose of the present invention is achieved through the following technical solutions:
A kind of manufacture craft of wiring board with Lamp cup is provided, the technique including forming Lamp cup made of copper in the circuit board uses
Layer-by-layer addition metal legal system makees Lamp cup, and the Lamp cup of multiple steps, each figure are formed by the layer-by-layer superposition of graphic plating layer
The figure of shape electroplated layer is all different.
Preferably, comprising the following steps:
The pre-treatment of S1, wiring board；
S2, superposed graph comp-0 form wiring board；
S3, superposed graph comp-1 form the first order step of Lamp cup；
S4, superposed graph comp-2 form the second level step of Lamp cup；
The post-processing of S5, wiring board.
Preferably, in the step S1, comprising steps of
A1, prepare material；
A2, punching；
A3, metallization；
A4, flash, plating thickness are 5-8 μm.
Preferably, the step of metallizing in the A3 step has, and first sprays titanium ion in the circuit board, then spray copper ion, temperature
Degree is 200 DEG C -500 DEG C.
Preferably, in the step S2, comprising the following steps:
B1, COMP mask are three times；
The exposure of the face B2, COMP positive, uses figure comp-0；
B3, it is imaged using sodium carbonate liquor；
B4, microetch are twice；
B5, filling perforation；
B6, belt-sanding is used.
Preferably, in the filling perforation operation of the B5 step, using the liquid medicine containing copper to wiring board filling perforation, in the liquid medicine
The concentration of copper is greater than 200g/L, the content of acid is 45-55g/L, additive 5%-18%.
Preferably, in the step S3, comprising the following steps:
C101, COMP mask four times, welding mask is twice；
The exposure of the face C102, COMP positive, using figure comp-1, welding surface all exposes；
C201, COMP mask are three times；
The exposure of the face C202, COMP positive, using figure comp-1, welding surface all exposes；
C301, COMP mask are three times；
The exposure of the face C302, COMP positive, using figure comp-1, welding surface all exposes；
C4, microetch are twice；
C5, plating；Electroplated layer with a thickness of 350-450 μm.
Preferably, in the step S4, comprising the following steps:
D1, COMP mask four times, welding mask is twice；
The exposure of the face D2, COMP positive, using figure comp-2, welding surface all exposes；
D3, it is imaged using sodium carbonate liquor；
D4, plating, plating thickness are 100-200 μm；
D5, belt-sanding is used.
Preferably, in the step S5, comprising the following steps:
E1, it carries out taking off film using sodium hydroxide solution；
E2, fast-etching is carried out using the mixed solution of hydrochloric acid and hydrogen peroxide；
E3, washing.
A kind of wiring board with Lamp cup made by above-mentioned manufacture craft, including wiring board and Lamp cup, the side of wiring board
Lamp cup equipped with box dam shape.
Beneficial effects of the present invention: a kind of manufacture craft of wiring board with Lamp cup of the invention is based on successively superposition plating
The combination of the method energy wiring board and Lamp cup of figure layer is even closer, is wrapped in route in the higher copper Lamp cup of thermal conductivity, leads to
It crosses Lamp cup and realizes heat loss through conduction, while this technique can make to form multistage platform on the inside of Lamp cup due to the graphic plating layer being layering
The structure of rank.
Further, Lamp cup made of manufacture craft of the invention has multi-stage stairs structure, and multi-stage stairs structure can be real
The aggregation of existing light, while the structure facilitates the installation of subsequent product.
Detailed description of the invention
Invention is described further using attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to the following drawings
Its attached drawing.
Fig. 1 is a kind of flow chart of the manufacture craft of wiring board with Lamp cup of the invention.
Fig. 2 is a kind of circuit board structure schematic diagram with Lamp cup of the invention.
Fig. 3 is a kind of cross-sectional view of wiring board with Lamp cup of the invention.
Including:
1. Lamp cup,
101. first order step,
102. second level step,
2. ceramic substrate,
3. wiring board.
Specific embodiment
The invention will be further described with the following Examples.
A kind of manufacture craft of wiring board with Lamp cup is provided, as shown in Figures 1 to 3, including on ceramic substrate 2 forms copper
The technique of the Lamp cup 1 of system makees Lamp cup 1 using layer-by-layer addition metal legal system, is formed by the layer-by-layer superposition of graphic plating layer multiple
The figure of the Lamp cup 1 of step, each graphic plating layer is all different.
Preferably, comprising the following steps:
The pre-treatment of S1, ceramic substrate 2；
S2, superposed graph comp-0 form wiring board 3；
S3, superposed graph comp-1 form the first order step 101 of Lamp cup；
S4, superposed graph comp-2 form the second level step 102 of Lamp cup；
The post-processing of S5, wiring board.
Preferably, in the step S1, comprising steps of
A1, prepare material；
A2, punching；
A3, metallization；
A4, flash, plating thickness are 5-8 μm.
Preferably, the step of metallizing in the A3 step has: titanium ion first sprayed on ceramics, then sprays copper ion, temperature
It is 200 DEG C -500 DEG C.Since the coefficient of expansion difference of ceramics and copper is big, the directly easy binding force of spray copper is bad, and the expansion of titanium
System falls between, and can improve binding force.
Preferably, in the step S2, comprising the following steps:
B1, COMP mask are three times；
The exposure of the face B2, COMP positive, uses figure comp-0；
B3, it is imaged using sodium carbonate liquor；
B4, microetch are twice；
B5, filling perforation；
B6, belt-sanding is used；To form wiring board 3 on ceramic substrate 2.
Preferably, in the filling perforation operation of the B5 step, using the liquid medicine containing copper to wiring board filling perforation, in the liquid medicine
The concentration of copper is greater than 200g/L, the content of acid is 45-55g/L, additive 5%-18%.
Preferably, in the step S3, comprising the following steps:
C101, COMP mask four times, welding mask is twice；
The exposure of the face C102, COMP positive, using figure comp-1, welding surface all exposes；
C201, COMP mask are three times；
The exposure of the face C202, COMP positive, using figure comp-1, welding surface all exposes；
C301, COMP mask are three times；
The exposure of the face C302, COMP positive, using figure comp-1, welding surface all exposes；
C4, microetch are twice；
C5, plating；Electroplated layer with a thickness of 350-450 μm；
By above-mentioned repeated pad pasting, exposure, progressive additive forms first order step 101 in assist side 3.
Preferably, in the step S4, comprising the following steps:
D1, COMP mask four times, welding mask is twice；
The exposure of the face D2, COMP positive, using figure comp-2, welding surface all exposes；
D3, it is imaged using sodium carbonate liquor；
D4, plating, plating thickness are 100-200 μm；
D5, belt-sanding is used；
By above-mentioned repeated pad pasting, exposure, second level step is formed in the top progressive additive of first order step 101
102, the internal diameter of second level step 102 is greater than the internal diameter of first order step 101, periphery and the second level platform of first order step 101
The periphery of rank 102 is concordant.
Preferably, in the step S5, comprising the following steps:
E1, it carries out taking off film using sodium hydroxide solution；
E2, fast-etching is carried out using the mixed solution of hydrochloric acid and hydrogen peroxide；
E3, washing.
A kind of wiring board with Lamp cup made by above-described embodiment manufacture craft, including wiring board 2 and Lamp cup 1, route
The side of plate 2 is equipped with the Lamp cup 1 of box dam shape, and Lamp cup 1 is able to achieve heat dissipation, optically focused and the installation for facilitating subsequent product.
A kind of method energy line of the manufacture craft of wiring board with Lamp cup of the present embodiment based on layer-by-layer superposition plating figure layer
The combination of road plate and Lamp cup is even closer, is wrapped in route in the higher copper Lamp cup of thermal conductivity, is realized and is conducted by Lamp cup
Heat dissipation, while this technique can make the structure that multi-stage stairs are formed on the inside of Lamp cup due to the graphic plating layer being layering.
Further, Lamp cup made of the manufacture craft of the present embodiment has multi-stage stairs structure, multi-stage stairs structure energy
Realize the aggregation of light, while the structure facilitates the installation of subsequent product.
The wiring board with Lamp cup of the present embodiment is suitable for placing small LED light.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (10)
1. a kind of manufacture craft of the wiring board with Lamp cup, which is characterized in that including forming Lamp cup made of copper in the circuit board
Technique makees Lamp cup using layer-by-layer addition metal legal system, and the Lamp cup of multiple steps is formed by the layer-by-layer superposition of graphic plating layer.
2. a kind of manufacture craft of wiring board with Lamp cup according to claim 1, which is characterized in that including following step
It is rapid:
The pre-treatment of S1, wiring board；
S2, superposed graph comp-0 form wiring board；
S3, superposed graph comp-1 form the first order step of Lamp cup；
S4, superposed graph comp-2 form the second level step of Lamp cup；
The post-processing of S5, wiring board.
3. a kind of manufacture craft of wiring board with Lamp cup according to claim 2, it is characterised in that: the step S1
In, comprising steps of
A1, prepare material；
A2, punching；
A3, metallization；
A4, flash, plating thickness are 5-8 μm.
4. a kind of manufacture craft of wiring board with Lamp cup according to claim 3, it is characterised in that: in the A3 step
The step of metallization, has, and first sprays titanium ion in the circuit board, then spray copper ion, and temperature is 200 DEG C -500 DEG C.
5. a kind of manufacture craft of wiring board with Lamp cup according to claim 2, it is characterised in that: the step S2
In, comprising the following steps:
B1, COMP mask are three times；
The exposure of the face B2, COMP positive, uses figure comp-0；
B3, it is imaged using sodium carbonate liquor；
B4, microetch are twice；
B5, filling perforation；
B6, belt-sanding is used.
6. a kind of manufacture craft of wiring board with Lamp cup according to claim 5, it is characterised in that: the B5 step
In filling perforation operation, using the liquid medicine containing copper to wiring board filling perforation, the concentration of copper is greater than the content of 200g/L, acid in the liquid medicine
For 45-55g/L, additive 5%-18%.
7. a kind of manufacture craft of wiring board with Lamp cup according to claim 2, it is characterised in that: the step S3
In, comprising the following steps:
C101, COMP mask four times, welding mask is twice；
The exposure of the face C102, COMP positive, using figure comp-1, welding surface all exposes；
C201, COMP mask are three times；
The exposure of the face C202, COMP positive, using figure comp-1, welding surface all exposes；
C301, COMP mask are three times；
The exposure of the face C302, COMP positive, using figure comp-1, welding surface all exposes；
C4, microetch are twice；
C5, plating；Electroplated layer with a thickness of 350-450 μm.
8. a kind of manufacture craft of wiring board with Lamp cup according to claim 1, it is characterised in that: the step S4
In, comprising the following steps:
D1, COMP mask four times, welding mask is twice；
The exposure of the face D2, COMP positive, using figure comp-2, welding surface all exposes；
D3, it is imaged using sodium carbonate liquor；
D4, plating, plating thickness are 100-200 μm；
D5, belt-sanding is used.
9. a kind of manufacture craft of wiring board with Lamp cup according to claim 1, it is characterised in that: the step S5
In, comprising the following steps:
E1, it carries out taking off film using sodium hydroxide solution；
E2, fast-etching is carried out using the mixed solution of hydrochloric acid and hydrogen peroxide；
E3, washing.
10. a kind of wiring board with Lamp cup, including wiring board and Lamp cup, the side of wiring board is equipped with the Lamp cup of box dam shape, special
Sign is: the Lamp cup is by a kind of described in any item manufacture craft production of the wiring board with Lamp cup of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564304.5A CN109688716A (en) | 2018-12-20 | 2018-12-20 | A kind of wiring board and its manufacture craft with Lamp cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564304.5A CN109688716A (en) | 2018-12-20 | 2018-12-20 | A kind of wiring board and its manufacture craft with Lamp cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109688716A true CN109688716A (en) | 2019-04-26 |
Family
ID=66188013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811564304.5A Pending CN109688716A (en) | 2018-12-20 | 2018-12-20 | A kind of wiring board and its manufacture craft with Lamp cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109688716A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100193225A1 (en) * | 2009-02-02 | 2010-08-05 | Fujitsu Limited | Circuit board, method of manufacturing the same, and resistance element |
| CN201764421U (en) * | 2010-09-10 | 2011-03-16 | 广东中龙交通科技有限公司 | LED reflection cup |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| CN103209547A (en) * | 2012-01-17 | 2013-07-17 | 昆山华扬电子有限公司 | Process for manufacturing boss printed board by means of addition process |
| US20130236996A1 (en) * | 2012-03-06 | 2013-09-12 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led package struture and method for manufacturing leds using the led packange struture |
| CN203406333U (en) * | 2013-07-31 | 2014-01-22 | 李好 | LED packaging structure |
| CN104010444A (en) * | 2013-02-25 | 2014-08-27 | 北大方正集团有限公司 | Manufacturing method of step circuit, circuit board including step circuit and manufacturing method of circuit board |
| CN105992463A (en) * | 2015-03-06 | 2016-10-05 | 深南电路股份有限公司 | Method for manufacturing step circuit board and step circuit board |
-
2018
- 2018-12-20 CN CN201811564304.5A patent/CN109688716A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100193225A1 (en) * | 2009-02-02 | 2010-08-05 | Fujitsu Limited | Circuit board, method of manufacturing the same, and resistance element |
| CN201764421U (en) * | 2010-09-10 | 2011-03-16 | 广东中龙交通科技有限公司 | LED reflection cup |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| CN103209547A (en) * | 2012-01-17 | 2013-07-17 | 昆山华扬电子有限公司 | Process for manufacturing boss printed board by means of addition process |
| US20130236996A1 (en) * | 2012-03-06 | 2013-09-12 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led package struture and method for manufacturing leds using the led packange struture |
| CN104010444A (en) * | 2013-02-25 | 2014-08-27 | 北大方正集团有限公司 | Manufacturing method of step circuit, circuit board including step circuit and manufacturing method of circuit board |
| CN203406333U (en) * | 2013-07-31 | 2014-01-22 | 李好 | LED packaging structure |
| CN105992463A (en) * | 2015-03-06 | 2016-10-05 | 深南电路股份有限公司 | Method for manufacturing step circuit board and step circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |
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| RJ01 | Rejection of invention patent application after publication |