CN203631462U - Patch type resettable fuse structure - Google Patents
Patch type resettable fuse structure Download PDFInfo
- Publication number
- CN203631462U CN203631462U CN201320775847.8U CN201320775847U CN203631462U CN 203631462 U CN203631462 U CN 203631462U CN 201320775847 U CN201320775847 U CN 201320775847U CN 203631462 U CN203631462 U CN 203631462U
- Authority
- CN
- China
- Prior art keywords
- electrode layer
- resettable fuse
- hole
- chip substrate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011889 copper foil Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000005530 etching Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 3
- 238000002360 preparation method Methods 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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- Fuses (AREA)
Abstract
The utility model provides a patch type resettable fuse structure, which comprises a chip substrate, a first electrode layer and a second electrode layer. The first electrode layer and the second electrode layer are arranged in the chip substrate and are opposite to each other in an up-and-down manner. The structure is characterized in that the two opposite sides of the chip substrate are respectively provided with one via hole. The upper and lower ends of each via hole are provided with a welding terminal respectively. The surfaces of the via holes are coated with copper foil conducted with the circuits of the welding terminals. According to the technical scheme of the utility model, the side hole ring-conduction mode for the layered circuit of a surface mount device (SMD) is adopted instead of the blind-hole conduction mode in the prior art, so that the preparation process of a printed circuit board (PCB) is simplified. Meanwhile, the preparation period of the PCB is shortened. The via holes are prepared through the inner-layer etching treatment, and a plurality of flake boards can be simultaneously subjected to the inner-layer etching treatment. Meanwhile, the entire treatment can be completed within 10 minutes. Therefore, the production efficiency is greatly improved.
Description
Technical field
The utility model relates to electronic product structure, is specifically related to a kind of structure of paster resettable fuse.
Background technology
Mini SMD components interiors of products circuit is realized the conducting between floor road through blind hole, blind hole is that SMD components connects top layer and internal layer and do not connect the via of justifying, size and depth requirements to hole relatively do, C02 laser-beam drilling machine (expensive device) and the electricity slurries of adopting, the additional processing procedure such as microetch guarantees the reliability of blind hole conducting more.And laser drilling can only be punched one by one, within general 40 minutes, just complete a slice, and may have local no marking, meanwhile, and due to thickness of slab inequality, the condition restriction such as energy attenuation, there is risk in the reliability that laser is beaten blind hole.
Utility model content
In order to address the above problem, the utility model designs a kind of structure of paster resettable fuse, can solution not needing to solve the conducting between SMD components internal circuit floor road in the situation that of beating blind hole, adopt following technical scheme.
A kind of structure of paster resettable fuse, comprise chip basal body and the 1st electrode layer opposing upper and lower and the 2nd electrode layer in chip basal body, it is characterized in that: respectively have the via of in the relative both sides of described chip basal body, be respectively solder terminal at the upper and lower two ends of described via, described via surface is covered with Copper Foil and described solder terminal circuit turn-on; The via of described the 1st electrode layer and a described wherein side is connected, and described the 1st electrode layer is realized circuit turn-on to described solder terminal through described via; The via of described the 2nd electrode layer and described wherein opposite side is connected, and described the 2nd electrode layer is realized circuit turn-on to described solder terminal through described via; Described via is the semicircle through hole of indent.
The utility model changes the blind hole conducting between SMD components floor road the conducting of into side opening ring, simplifies PCB processing procedure, shortens the processing procedure time, make this via by internal layer etching mode, internal layer etching can be carried out by multi-disc plate simultaneously, and can complete for 10 minutes, can significantly enhance productivity; Improve product conducting reliability simultaneously, any residual contamination can not be arranged at blind hole bottom, otherwise circuit turn-on is unstable, due to thickness of slab inequality, the condition restriction such as energy attenuation, there is risk in the reliability that laser is beaten blind hole, and side opening ring of the present utility model conducting is full through hole, there is no depth requirements, guarantee the stability of conducting between circuit layer.
Accompanying drawing explanation
Accompanying drawing 1 is end view of the present utility model.
Accompanying drawing 2 is vertical view of the present utility model.
Embodiment
A kind of structure of paster resettable fuse, comprise chip basal body 1 and the 1st electrode layer 2 opposing upper and lower and the 2nd electrode layer 3 in chip basal body, respectively there is the via 4 of in the relative both sides of described chip basal body 1, be respectively solder terminal 5 at the upper and lower two ends of described via, described via 4 surfaces are covered with Copper Foil 6 and described solder terminal 5 circuit turn-ons; The via 4 of described the 1st electrode layer 2 and a described wherein side is connected, and described the 1st electrode layer 2 is realized circuit turn-on to described solder terminal 5 through described via 4; The via 4 of described the 2nd electrode layer 3 and described wherein opposite side is connected, and described the 2nd electrode layer 3 is realized circuit turn-on to described solder terminal 5 through described via 4; The semicircle through hole that described via 5 is indent.
In this embodiment, blind hole is cancelled in conducting between interiors of products circuit layer, connect the solder terminal of one end by the via in outside, simplify PCB processing procedure, shorten the processing procedure time, make this via by internal layer etching mode, internal layer etching can be carried out by multi-disc plate simultaneously, and within 10 minutes, can complete, can significantly enhance productivity; Improve product conducting reliability simultaneously, any residual contamination can not be arranged at blind hole bottom, otherwise circuit turn-on is unstable, due to thickness of slab inequality, the condition restriction such as energy attenuation, there is risk in the reliability that laser is beaten blind hole, and side opening ring of the present utility model conducting is full through hole, there is no depth requirements, guarantee the stability of conducting between circuit layer.。
The structure of a kind of paster the resettable fuse above embodiment of the present invention being provided is described in detail, for one of ordinary skill in the art, according to the thinking of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (2)
1. the structure of a paster resettable fuse, comprise chip basal body and the 1st electrode layer opposing upper and lower and the 2nd electrode layer in chip basal body, it is characterized in that: respectively have the via of in the relative both sides of described chip basal body, be respectively solder terminal at the upper and lower two ends of described via, described via surface is covered with Copper Foil and described solder terminal circuit turn-on; The via of described the 1st electrode layer and a described wherein side is connected, and described the 1st electrode layer is realized circuit turn-on to described solder terminal through described via; The via of described the 2nd electrode layer and described wherein opposite side is connected, and described the 2nd electrode layer is realized circuit turn-on to described solder terminal through described via.
2. the structure of a kind of paster resettable fuse according to claim 1, is characterized in that: the semicircle through hole that described via is indent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775847.8U CN203631462U (en) | 2013-12-02 | 2013-12-02 | Patch type resettable fuse structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775847.8U CN203631462U (en) | 2013-12-02 | 2013-12-02 | Patch type resettable fuse structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631462U true CN203631462U (en) | 2014-06-04 |
Family
ID=50817914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320775847.8U Expired - Lifetime CN203631462U (en) | 2013-12-02 | 2013-12-02 | Patch type resettable fuse structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203631462U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020191522A1 (en) * | 2019-03-22 | 2020-10-01 | Littelfuse Electronics (Shanghai) Co., Ltd. | Ptc device including polyswitch |
-
2013
- 2013-12-02 CN CN201320775847.8U patent/CN203631462U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020191522A1 (en) * | 2019-03-22 | 2020-10-01 | Littelfuse Electronics (Shanghai) Co., Ltd. | Ptc device including polyswitch |
| US11854723B2 (en) | 2019-03-22 | 2023-12-26 | Littelfuse Electronics (Shanghai) Co., Ltd. | PTC device including polyswitch |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140604 |
|
| CX01 | Expiry of patent term |