RU2011137749A - PCB ON METAL SUBSTRATE AND METHOD FOR ITS MANUFACTURE - Google Patents
PCB ON METAL SUBSTRATE AND METHOD FOR ITS MANUFACTURE Download PDFInfo
- Publication number
- RU2011137749A RU2011137749A RU2011137749/07A RU2011137749A RU2011137749A RU 2011137749 A RU2011137749 A RU 2011137749A RU 2011137749/07 A RU2011137749/07 A RU 2011137749/07A RU 2011137749 A RU2011137749 A RU 2011137749A RU 2011137749 A RU2011137749 A RU 2011137749A
- Authority
- RU
- Russia
- Prior art keywords
- metal substrate
- circuit board
- printed circuit
- layer
- dielectric
- Prior art date
Links
Abstract
1. Печатная плата на металлической подложке, содержащая плакированное основание, токопроводящий слой, диэлектрик, расположенный между токопроводящим слоем и слоем плакировочного материала, отличающаяся тем, что диэлектрик фольгирован с двух сторон, а между слоем плакировочного материала и диэлектриком расположен слой припоя.2. Печатная плата на металлической подложке по п.1, отличающаяся тем, что диэлектрик выполнен из гибкого полимера.3. Печатная плата на металлической подложке по п.2, отличающаяся тем, что в металлической подложке выполнены сквозные отверстия.4. Способ изготовления печатной платы на металлической подложке, включающий изготовление заготовки металлической подложки с плакировочным слоем, изготовление заготовки печатной платы из фольгированного с двух сторон диэлектрика с последующим нанесением топологического рисунка на токопроводящий слой печатной платы, ее травление и облуживание, отличающийся тем, что одновременно с облуживанием печатной платы облуживают плакировочный слой металлической подложки, после чего заготовку печатной платы припаивают к заготовке металлической подложки.1. A printed circuit board on a metal substrate containing a clad base, a conductive layer, a dielectric located between the conductive layer and the layer of cladding material, characterized in that the dielectric is foil on both sides, and a solder layer is located between the layer of cladding material and the dielectric. 2. A printed circuit board on a metal substrate according to claim 1, characterized in that the dielectric is made of a flexible polymer. A printed circuit board on a metal substrate according to claim 2, characterized in that through holes are made in the metal substrate. A method of manufacturing a printed circuit board on a metal substrate, comprising manufacturing a blank of a metal substrate with a cladding layer, manufacturing a blank of a printed circuit board from a dielectric foil on both sides, followed by applying a topological drawing to the conductive layer of the printed circuit board, etching and tinning, characterized in that simultaneously with tinning the printed circuit board tin plating layer of the metal substrate, after which the workpiece of the printed circuit board is soldered to the workpiece metal odlozhki.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2011137749/07A RU2481754C1 (en) | 2011-09-13 | 2011-09-13 | Printed circuit board on metal substrate and method of its manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2011137749/07A RU2481754C1 (en) | 2011-09-13 | 2011-09-13 | Printed circuit board on metal substrate and method of its manufacturing |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2011137749A true RU2011137749A (en) | 2013-03-20 |
RU2481754C1 RU2481754C1 (en) | 2013-05-10 |
Family
ID=48789635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2011137749/07A RU2481754C1 (en) | 2011-09-13 | 2011-09-13 | Printed circuit board on metal substrate and method of its manufacturing |
Country Status (1)
Country | Link |
---|---|
RU (1) | RU2481754C1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015047974A2 (en) * | 2013-09-24 | 2015-04-02 | Cooper Technologies Company | Systems and methods for improving service life of circuit boards |
RU2602599C2 (en) * | 2014-12-08 | 2016-11-20 | Акционерное общество "Концерн радиостроения "Вега" | Method of making multilayer printed circuit boards on heat-removing substrate |
RU2630680C2 (en) * | 2015-09-21 | 2017-09-12 | Акционерное общество "Концерн "Моринформсистема - Агат" | Strong multilayer printed board, containing low-cutting control circuits |
US10064276B2 (en) * | 2015-10-21 | 2018-08-28 | Adventive Ipbank | 3D bendable printed circuit board with redundant interconnections |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU1716925C (en) * | 1990-01-12 | 1995-01-09 | Производственное объединение "Изотоп" | Process of manufacture of metal-ceramic package for integrated circuit |
KR0141229B1 (en) * | 1993-09-22 | 1998-07-15 | 김광호 | Local hardening method for package soldering |
RU2078487C1 (en) * | 1995-05-31 | 1997-04-27 | Вячеслав Вениаминович Салтыков | METHOD FOR PRODUCING MULTILAYER PRINTED CIRCUIT BOARDS |
HUP9701377A3 (en) * | 1997-01-15 | 2000-01-28 | Ibm | Case and method for mouting an ic chip onto a carrier board or similar |
EP1056321B1 (en) * | 1999-05-28 | 2007-11-14 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic substrate circuit and its manufacturing process |
SG161124A1 (en) * | 2008-10-29 | 2010-05-27 | Opulent Electronics Internat P | Insulated metal substrate and method of forming the same |
US8415004B2 (en) * | 2009-11-12 | 2013-04-09 | Taiflex Scientific Co., Ltd. | Low thermal-impedance insulated metal substrate and method for manufacturing the same |
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2011
- 2011-09-13 RU RU2011137749/07A patent/RU2481754C1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
RU2481754C1 (en) | 2013-05-10 |
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Legal Events
Date | Code | Title | Description |
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MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20190914 |