HUP9701377A3 - Case and method for mouting an ic chip onto a carrier board or similar - Google Patents
Case and method for mouting an ic chip onto a carrier board or similarInfo
- Publication number
- HUP9701377A3 HUP9701377A3 HU9701377A HUP9701377A HUP9701377A3 HU P9701377 A3 HUP9701377 A3 HU P9701377A3 HU 9701377 A HU9701377 A HU 9701377A HU P9701377 A HUP9701377 A HU P9701377A HU P9701377 A3 HUP9701377 A3 HU P9701377A3
- Authority
- HU
- Hungary
- Prior art keywords
- mouting
- similar
- case
- carrier board
- chip onto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/783,775 US6150716A (en) | 1995-01-25 | 1997-01-15 | Metal substrate having an IC chip and carrier mounting |
Publications (3)
Publication Number | Publication Date |
---|---|
HU9701377D0 HU9701377D0 (en) | 1997-10-28 |
HUP9701377A2 HUP9701377A2 (en) | 1998-08-28 |
HUP9701377A3 true HUP9701377A3 (en) | 2000-01-28 |
Family
ID=25130356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU9701377A HUP9701377A3 (en) | 1997-01-15 | 1997-08-11 | Case and method for mouting an ic chip onto a carrier board or similar |
Country Status (10)
Country | Link |
---|---|
JP (1) | JP2903013B2 (en) |
KR (1) | KR100259412B1 (en) |
CN (1) | CN1132243C (en) |
CZ (1) | CZ3498A3 (en) |
HU (1) | HUP9701377A3 (en) |
MY (1) | MY127468A (en) |
PL (1) | PL324177A1 (en) |
RU (1) | RU2191445C2 (en) |
SG (1) | SG60170A1 (en) |
TW (1) | TW473887B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2481754C1 (en) * | 2011-09-13 | 2013-05-10 | Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") | Printed circuit board on metal substrate and method of its manufacturing |
JP5912058B2 (en) | 2012-03-30 | 2016-04-27 | 株式会社フジクラ | Imaging module, imaging module with lens, endoscope, imaging module manufacturing method, flexible wiring board molding apparatus |
CN104882531A (en) * | 2015-06-08 | 2015-09-02 | 杨子龙 | LED integrated light-emitting module group |
CN113097162A (en) | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5390082A (en) * | 1992-07-06 | 1995-02-14 | International Business Machines, Corp. | Chip carrier with protective coating for circuitized surface |
US5635762A (en) * | 1993-05-18 | 1997-06-03 | U.S. Philips Corporation | Flip chip semiconductor device with dual purpose metallized ground conductor |
US5616958A (en) * | 1995-01-25 | 1997-04-01 | International Business Machines Corporation | Electronic package |
-
1997
- 1997-08-11 HU HU9701377A patent/HUP9701377A3/en unknown
- 1997-10-13 KR KR1019970052339A patent/KR100259412B1/en not_active IP Right Cessation
- 1997-12-12 MY MYPI97006030A patent/MY127468A/en unknown
- 1997-12-12 CN CN97125492A patent/CN1132243C/en not_active Expired - Fee Related
- 1997-12-15 SG SG1997004458A patent/SG60170A1/en unknown
-
1998
- 1998-01-06 TW TW087100113A patent/TW473887B/en not_active IP Right Cessation
- 1998-01-07 CZ CZ9834A patent/CZ3498A3/en unknown
- 1998-01-08 PL PL98324177A patent/PL324177A1/en unknown
- 1998-01-09 JP JP10003024A patent/JP2903013B2/en not_active Expired - Fee Related
- 1998-01-14 RU RU98101113/28A patent/RU2191445C2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CZ3498A3 (en) | 1998-11-11 |
JPH10209332A (en) | 1998-08-07 |
TW473887B (en) | 2002-01-21 |
HU9701377D0 (en) | 1997-10-28 |
HUP9701377A2 (en) | 1998-08-28 |
MY127468A (en) | 2006-12-29 |
KR19980070016A (en) | 1998-10-26 |
CN1132243C (en) | 2003-12-24 |
CN1188984A (en) | 1998-07-29 |
KR100259412B1 (en) | 2000-06-15 |
PL324177A1 (en) | 1998-07-20 |
SG60170A1 (en) | 1999-02-22 |
RU2191445C2 (en) | 2002-10-20 |
JP2903013B2 (en) | 1999-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HUP0003565A2 (en) | Chip card and method for communication between an external device and a chip card | |
IL133091A0 (en) | A system and method for packaging integrated circuits | |
GB2299423B (en) | IC Card | |
SG54977A1 (en) | Ic carrier | |
EP0693736A3 (en) | Board for IC card and manufacturing method therefor | |
EP0955603A4 (en) | Ic card and method of using ic card | |
TW354201U (en) | Electronic card holder | |
AU5139298A (en) | Ic card | |
GB2302216B (en) | IC card | |
SG71075A1 (en) | Method for packaging an integrated circuit | |
SG74017A1 (en) | Ic card ic card system and ic for ic card | |
AU5342698A (en) | Ic card | |
AU5342798A (en) | Non-contact ic card | |
SG74086A1 (en) | Carrier tape for electronic components | |
GB2279824B (en) | IC carrier | |
HK1018517A1 (en) | Reference circuit and method | |
EP0952525A4 (en) | Ic card | |
GB9709273D0 (en) | Electronic component arrangement and method | |
GB9402318D0 (en) | Ic carrier | |
HUP9701377A3 (en) | Case and method for mouting an ic chip onto a carrier board or similar | |
EP1020817A4 (en) | Method and apparatus for authenticating ic card | |
GB2305019B (en) | IC card | |
HK1015491A1 (en) | Reader for chip cards | |
HUP0004242A3 (en) | Portable data carrier and method for use thereof | |
EP1011302A4 (en) | Method and device for supplying electronic parts |