CN104882531A - LED integrated light-emitting module group - Google Patents
LED integrated light-emitting module group Download PDFInfo
- Publication number
- CN104882531A CN104882531A CN201510310189.9A CN201510310189A CN104882531A CN 104882531 A CN104882531 A CN 104882531A CN 201510310189 A CN201510310189 A CN 201510310189A CN 104882531 A CN104882531 A CN 104882531A
- Authority
- CN
- China
- Prior art keywords
- led
- printed substrate
- emitting module
- integrated light
- nation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 41
- 239000003292 glue Substances 0.000 claims description 23
- 238000005538 encapsulation Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 238000010992 reflux Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed in the invention is an LED integrated light-emitting module group comprising a first printed circuit board. Bonding welding plates are arranged at the upper surface of the first printed circuit board and are connected with the first printed circuit board by bonding leads; and LED wafers are arranged on the bonding welding plates. A panel covering the LED wafers is arranged at the upper surface of the first printed circuit board; through holes matching the LED wafers are formed in the panel; and LED packaging adhesives for packaging the LED wafers are arranged in the through holes. With the module group, a phenomenon of module group deformation because of the influence of the high-temperature reflow soldering during the production process can be effectively avoided. The flatness and surface color of the module group are good; the productibility of the product is increased; and the reject ratio and cost of the product are reduced.
Description
Technical field
The present invention relates to illuminating module, particularly relate to a kind of LED integrated light-emitting module.
Background technology
So-called LED display, is a kind of flat-panel monitor, is made up of LED illuminating module little one by one.Existing Small Distance LED illuminating module actualizing technology is divided into two kinds, and a kind of is traditional surface mount technology, namely single packaged SMD lamp pearl successively array be mounted on enclose tin cream PCB (printed circuit board) on.Welded the combination realizing lamp pearl and PCB again by high temperature reflux, the change of being lighted each lamp pearl by conducting wire realizes its effect shown.Particularly in Small Distance module, to the density of lamp pearl array and the requirement of single volume higher.The principal elements such as its shortcoming is that the manufacturing process of single SMD lamp pearl is complicated, and difficulty is large, and cost is high, and the large and scrap cost of whole plate maintenance difficulty is high.
Another kind is exactly adopt so-called COB encapsulation technology (COB, chip On board, chip on board), namely redgreenblue bare chip conduction or non-conductive adhesive are directly sticked on PCB, then carry out the bonding of metal guide line on the pad of PCB, realize its conduction and connect.Its chips adopts exposed packaging technology, define for the fixed thin pad of both positive and negative polarity copper of LED wafer nation after copper thin-pass on PCB crosses the etch process of circuit, the thin pad of copper can make the pad that it binds metal guide line after the surface treatment such as gold-plated or silver-plated.Fixed by surface encapsulation glue again after having bound, light each luminescent wafer to realize the effect of its display finally by conducting wire.It is more that this COB encapsulation technology is applied to field of LED display technical problem at present, particularly in the application of Small Distance LED display.Its shortcoming one: because the encapsulated wafer assembly of LED module and electronic devices and components are all on same PCB, electronic devices and components need to weld through SMT high temperature reflux, its PCB is by then having distortion in varying degrees after high temperature, PCB after distortion not only can increase the difficulty of packaging technology, but also cause serious bad in assembling module that can be follow-up again, when being namely arranged on drain pan by the fixed copper post of module surrounding, the PCB of this module evening up by force is made owing to locking the dynamics of screw, therefore the wafer weld layer of part LED module can be caused, the factor such as rosin joint or bad connection between metal guide line and PCB pad.That therefore causes is bad higher; Its shortcoming two: because existing PCB bottom has all been covered with some electronic devices and components (resistance, electric capacity, various IC and connector), make nation determine bonding machine and directly heat the temperature heat skewness on PCB, cause obvious metal guide wire bonding effect different, thus also result in higher fraction defective; Its shortcoming three: in the process of encapsulation, should be dehumidified, dry the glue of fixed wafer, the glue of drying encapsulation all needs the temperature baking carrying out about 80 to 180 degrees Celsius, and the repeatedly baking in this production technology link can cause the surperficial order look generation color degradation in various degree of face shield.Cause the aberration occurred between module in various degree.The surface color consistency of whole product is poor, and technique controlling difficulty is large, cannot meet the requirement of product quality aspect.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of LED integrated light-emitting module, module distortion is there is under effectively can avoiding the impact in process of production because of high temperature reflux welding, the evenness of module is good, surface order look good, add the productibility of product, reduce fraction defective and the cost of product.
For solving the problems of the technologies described above, the present invention proposes a kind of LED integrated light-emitting module, comprise the first printed substrate, the upper surface of described first printed substrate is provided with nation and determines pad, described nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer;
The upper surface of described first printed substrate is provided with the panel be located in LED wafer, and described panel is provided with the through hole matched with LED wafer, is provided with the LED glue for packaged LED wafer in described through hole.
Further, described panel is bonded on the upper surface of the first printed substrate by adhesive.
Further, described adhesive is black glue or heatproof adhesive glue.
Further, the lower surface of described first printed substrate is provided with electronics unit device assembly, and the lower surface of described first printed substrate is provided with the drain pan for being located on electronics unit device assembly.
Further, described electronics unit device assembly comprises the second printed substrate be arranged on the first printed substrate lower surface, and the second printed substrate is provided with electronic devices and components.
Further, described panel is carbon fiber board.
Further, described nation determines wire is gold thread or alloy wire or copper cash.
Further, described nation determines pad and is provided with Gold plated Layer or silver coating.
Further, the base material of described first printed substrate is FR4 or BT material.
Further, described LED glue is AB glue or encapsulation glue.
Technique scheme at least has following beneficial effect: the present invention adopts and is provided with nation at the upper surface of the first printed substrate and determines pad, and nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer; Be provided with the panel be located in LED wafer at the upper surface of the first printed substrate, panel is provided with the through hole matched with LED wafer, in through hole, be provided with the LED glue for packaged LED wafer, thus form LED lamp panel.Electronics unit device assembly is provided with various PCB and various electronic devices and components, form electronics unit device assembly, then assembly welding is in LED lamp panel after high temperature reflux welding.Thus avoid LED lamp panel to deform when high temperature reflux welds, the evenness of module is good, and surperficial order look good, adds the productibility of product, reduces fraction defective and the cost of product.
Accompanying drawing explanation
Fig. 1 is the structural blast figure of LED integrated light-emitting module of the present invention.
Fig. 2 is the enlarged drawing at A place in Fig. 1.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below in conjunction with accompanying drawing, the present invention is described further.
As shown in Figure 1 and Figure 2, LED integrated light-emitting module of the present invention comprises the first printed substrate 1, be provided with nation at the upper surface of the first printed substrate 1 and determine pad 2, nation is determined pad 2 and determine wire 3 by nation and be connected with the first printed substrate 1, nation determines pad 2 and is provided with LED wafer 4; Particularly, nation determines wire 3 is one in gold thread or alloy wire or copper cash; Nation determines pad 2 and is provided with Gold plated Layer or silver coating, increases nation and determines Joint Properties; The base material of the first printed substrate 1 is the one of FR4 or BT material.
The upper surface of the first printed substrate 1 is provided with the panel 5 be located in LED wafer 4, and panel 5 is provided with the through hole 51 matched with LED wafer 4, is provided with the LED glue 6 for packaged LED wafer 4 in through hole 51.Preferably, panel 5 is bonded on the upper surface of the first printed substrate 1 by adhesive 8, and particularly, adhesive 8 is the one in black glue or Special temperature resistant adhesive glue, and LED glue 6 is AB glue or special changeable colour encapsulation glue.
The lower surface of the first printed substrate 1 is provided with electronics unit device assembly 7, particularly, electronics unit device assembly 7 comprises the second printed substrate 71 be arranged on the first printed substrate 1 lower surface, second printed substrate 71 is provided with electronic devices and components 72, particularly, the base material of the second printed substrate 71 is pcb board or FPCB plate.
The lower surface of the first printed substrate 1 is also provided with the drain pan 9 for being located on electronics unit device assembly 7; drain pan 9 is metalwork; to the first printed substrate 1; namely fixation is played to LED lamp panel; the adjustment be convenient between module is fixed; LED lamp panel stress deformation is played a protective role, the effect of antinoise signal interference shielding is played to electronics unit device assembly 7 simultaneously.
To sum up, the present invention adopts and is provided with nation at the upper surface of the first printed substrate and determines pad, and nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer; Be provided with the panel be located in LED wafer at the upper surface of the first printed substrate, panel is provided with the through hole matched with LED wafer, in through hole, be provided with the LED glue for packaged LED wafer, thus form LED lamp panel.Electronics unit device assembly is provided with various PCB and various electronic devices and components, form electronics unit device assembly, then assembly welding is in LED lamp panel after high temperature reflux welding.Thus avoid LED lamp panel to deform when high temperature reflux welds, the evenness of module is good, and surperficial order look good, adds the productibility of product, reduces fraction defective and the cost of product.
The above is the specific embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some amendments, and these amendments are also considered as protection scope of the present invention.
Claims (10)
1. a LED integrated light-emitting module, it is characterized in that, comprise the first printed substrate, the upper surface of described first printed substrate is provided with nation and determines pad, described nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer;
The upper surface of described first printed substrate is provided with the panel be located in LED wafer, and described panel is provided with the through hole matched with LED wafer, is provided with the LED glue for packaged LED wafer in described through hole.
2. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described panel is bonded on the upper surface of the first printed substrate by adhesive.
3. LED integrated light-emitting module as claimed in claim 2, it is characterized in that, described adhesive is black glue or heatproof adhesive glue.
4. LED integrated light-emitting module as claimed in claim 1, is characterized in that, the lower surface of described first printed substrate is provided with electronics unit device assembly, and the lower surface of described first printed substrate is provided with the drain pan for being located on electronics unit device assembly.
5. LED integrated light-emitting module as claimed in claim 4, is characterized in that, described electronics unit device assembly comprises the second printed substrate be arranged on the first printed substrate lower surface, and the second printed substrate is provided with electronic devices and components.
6. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described panel is carbon fiber board.
7. LED integrated light-emitting module as claimed in claim 1, is characterized in that, it is gold thread or alloy wire or copper cash that described nation determines wire.
8. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described nation determines pad and is provided with Gold plated Layer or silver coating.
9. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, the base material of described first printed substrate is FR4 or BT material.
10. LED integrated light-emitting module as claimed in claim 1, is characterized in that, described LED glue is AB glue or encapsulation glue.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510310189.9A CN104882531A (en) | 2015-06-08 | 2015-06-08 | LED integrated light-emitting module group |
| PCT/CN2015/091795 WO2016197496A1 (en) | 2015-06-08 | 2015-10-13 | Led integrated light-emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510310189.9A CN104882531A (en) | 2015-06-08 | 2015-06-08 | LED integrated light-emitting module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104882531A true CN104882531A (en) | 2015-09-02 |
Family
ID=53949942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510310189.9A Pending CN104882531A (en) | 2015-06-08 | 2015-06-08 | LED integrated light-emitting module group |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104882531A (en) |
| WO (1) | WO2016197496A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977365A (en) * | 2016-05-19 | 2016-09-28 | 北京大学东莞光电研究院 | COB LED packaging device and method |
| WO2016197496A1 (en) * | 2015-06-08 | 2016-12-15 | 唐刚 | Led integrated light-emitting module |
| CN106875982A (en) * | 2017-03-01 | 2017-06-20 | 深圳市佳鑫帆科技有限公司 | A kind of Medical Devices shell cambered surface transition connecting plate and its adhering method |
| WO2017206405A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳市奥蕾达科技有限公司 | Novel cob full-color led light-emitting panel and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107633779A (en) * | 2017-11-24 | 2018-01-26 | 山西高科华烨电子集团有限公司 | LED display based on COB technologies |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640012A (en) * | 2009-09-04 | 2010-02-03 | 北京巨数数字技术开发有限公司 | LED display module |
| CN102005446A (en) * | 2010-11-03 | 2011-04-06 | 熊周成 | Light-emitting diode (LED) packaging structure and LED luminescent display module |
| CN202523333U (en) * | 2012-03-15 | 2012-11-07 | 利亚德光电股份有限公司 | Light emitting diode (LED) display device |
| CN103972223A (en) * | 2013-04-16 | 2014-08-06 | 朱慧琴 | LED multi-cup integration COB light source and encapsulating method thereof |
| CN204696158U (en) * | 2015-06-08 | 2015-10-07 | 杨子龙 | A kind of LED integrated light-emitting module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3835942A1 (en) * | 1988-10-21 | 1990-04-26 | Telefunken Electronic Gmbh | AREA SPOTLIGHT |
| HUP9701377A3 (en) * | 1997-01-15 | 2000-01-28 | Ibm | Case and method for mouting an ic chip onto a carrier board or similar |
| CN101460007B (en) * | 2007-12-12 | 2011-03-23 | 扬智科技股份有限公司 | Circuit board |
| CN102522488A (en) * | 2011-12-22 | 2012-06-27 | 陈林 | Encapsulating structure for lighting LED lamp strip |
| CN104882531A (en) * | 2015-06-08 | 2015-09-02 | 杨子龙 | LED integrated light-emitting module group |
-
2015
- 2015-06-08 CN CN201510310189.9A patent/CN104882531A/en active Pending
- 2015-10-13 WO PCT/CN2015/091795 patent/WO2016197496A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640012A (en) * | 2009-09-04 | 2010-02-03 | 北京巨数数字技术开发有限公司 | LED display module |
| CN102005446A (en) * | 2010-11-03 | 2011-04-06 | 熊周成 | Light-emitting diode (LED) packaging structure and LED luminescent display module |
| CN202523333U (en) * | 2012-03-15 | 2012-11-07 | 利亚德光电股份有限公司 | Light emitting diode (LED) display device |
| CN103972223A (en) * | 2013-04-16 | 2014-08-06 | 朱慧琴 | LED multi-cup integration COB light source and encapsulating method thereof |
| CN204696158U (en) * | 2015-06-08 | 2015-10-07 | 杨子龙 | A kind of LED integrated light-emitting module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197496A1 (en) * | 2015-06-08 | 2016-12-15 | 唐刚 | Led integrated light-emitting module |
| CN105977365A (en) * | 2016-05-19 | 2016-09-28 | 北京大学东莞光电研究院 | COB LED packaging device and method |
| WO2017206405A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳市奥蕾达科技有限公司 | Novel cob full-color led light-emitting panel and manufacturing method thereof |
| CN106875982A (en) * | 2017-03-01 | 2017-06-20 | 深圳市佳鑫帆科技有限公司 | A kind of Medical Devices shell cambered surface transition connecting plate and its adhering method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016197496A1 (en) | 2016-12-15 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150902 |
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| RJ01 | Rejection of invention patent application after publication |