CN101198209A - Circuit board welding pad structure and manufacturing method thereof - Google Patents
Circuit board welding pad structure and manufacturing method thereof Download PDFInfo
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- CN101198209A CN101198209A CNA2006101633859A CN200610163385A CN101198209A CN 101198209 A CN101198209 A CN 101198209A CN A2006101633859 A CNA2006101633859 A CN A2006101633859A CN 200610163385 A CN200610163385 A CN 200610163385A CN 101198209 A CN101198209 A CN 101198209A
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Abstract
The invention relates to a circuit board welding pad structure and related manufacturing method, wherein the structure comprises a core layer, a welding pad arranged on the core layer and a welding resistant layer covered on the core layer and part of the welding pad; the welding resistant layer covered on part of the welding pad divides the welding pad into at least two sub-welding pad areas. With the circuit board welding pad structure, when electric conducting material arranged on the sub-welding pad areas is in electrical connection with an electronic component to carry out high-temperature reflow, air bubbles generated between the electronic component and the electric conducting material due to high temperature can be led to a gap formed by the welding resistant layer covered on part of the welding pad, the electric conducting material and the electronic component; therefore, the influence on the stability and quality of the electronic component due to insufficient welding fastness between a circuit board and the electronic component caused by air bubbles can be eliminated.
Description
Technical field
The present invention relates to a kind of board structure of circuit and manufacture method thereof, particularly a kind of structure and manufacture method thereof that is applied to the weld pad of circuit board.
Background technology
Along with the production of integrated circuits development of technology, the design and fabrication of electronic component continues the trend development towards granular, and because it possesses electronic circuit more extensive, high integration, so its product function is also more complete.
But, tradition is utilized plug-in type packaging technology (Pin Through HoleTechnology, PTHT) connect the electronic component of putting, because size can't further be dwindled, thereby take a large amount of space of circuit board, adding the plug-in type packaging technology needs every branch connecting pin position of corresponding each electronic component and implement boring on circuit board, complex procedures, and the actual space that takies the circuit board two sides of this electronic component pin influences the laying of other electron component and this position and the difficulty of increase electron circuit layout.Therefore, in the present electronic component assembling manufacture process, (Surface Mount Technology SMT), is assembled on the circuit board so that electronic component effectively to be provided to adopt surface mount technology in a large number.
Adopt the electronic component of surface mount technology (SMT), since its electricity connection end (as weld pad) be welded onto with electronic component with the one side circuit board on, thereby can can both assemble electronic component simultaneously on the circuit board two sides, than having the mode of in carrying circuit board, implementing boring in the plug-in type packaging technology now, significantly promote the space availability ratio of circuit board.In addition, because the electronic component volume of surface mount technology is less, than the electronic component of existing plug-in type packaging technology, the quantity that can be arranged on the circuit board is also comparatively intensive.Therefore in addition, the cost of the electronic component of surface mount technology is also more cheap, has risen to the main flow into assembling electronic component on printed circuit board (PCB), circuit board and the substrate now.
But along with the volume of electronic component continues granular, the application of surface mount technology also produces many problems and treats to solve.Electronic component with comparatively common chip diode or three polar bodys is an example, it includes body and a plurality of pin, wherein a side of the corresponding circuits plate of this body has the bigger solder side of an area (or weld pad), its size is generally greater than 3mm * 3mm, correspondingly, on this circuit board, be provided with equally in order to connect and put this electronic component and size and solder side corresponding pad, and the weld pad on this circuit board is the scolding tin of a monoblock tool large-size.When utilizing the SMT manufacture method to weld, no matter it has done plumbous manufacture method or has done unleaded manufacture method, when the size of the solder side of electronic component is bigger (when going up weld pad rough (very trickle concave surface is arranged) greater than 3mm * 3mm) or PCB, carry out passing through again after high temperature (about 215 ~ 235 degrees centigrade) reflow behind the paste solder printing, because of the welding contact-making surface area of the weld pad of this electronic component and this circuit board excessive, the gas permeability poor effect, promptly welding the gas that contact-making surface produced in welding process can't effectively be discharged outside to from inside, causes welding contact-making surface place will produce the bubble of big zone or a greater number.
In addition, this electronic component weld pad surface rough or be present in the impurity on this electronic component weld pad surface also can be caused after aforementioned high temperature reflow manufacture method, produces the bubble of big zone or a greater number in this welding contact-making surface place.
Moreover, if this soldering paste is the soldering paste of lead-free solder paste or high tin ratio, be high (about 240 ~ 260 degrees centigrade) then because of the more aforesaid temperature of reflow temperature in the unleaded or low plumbous manufacture method, and because of the soldering paste of the flowability of unleaded or low lead welding cream and leaded or high lead relatively low, bigger and more difficult discharge that when gases are heated, they expand is so cause above-mentioned air bubble problem more serious.
Brought forward is described, the bubble that those produced will directly have influence between electronic component and the circuit board stick together firmness and and circuit board between the conducting contact area of signal, influence the stability and the product quality of system, and if this circuit board is under the higher working temperature environment for a long time, aforesaid bubble causes part to wear out easily and/or comes off.In addition, when the size of corresponding pad is big more on the size of the solder side of aforementioned electronic element and the circuit board, then the welding contact-making surface of the two is also big more, cause the probability that produces bubble in the follow-up welding process big more, and also can be serious more by the caused circuit board defect degree of the bubble of this generation, the quality of the electronic component of circuit board also can be poor more.
Therefore, how to overcome the defective of above-mentioned prior art, and then provide a kind of circuit board welding pad structure that is solved above-mentioned prior art shortcoming, thereby under the prerequisite of manufacturing complexity that does not increase circuit board and cost, can improve its gas permeability and avoid producing bubble, and then the raising electronic component is soldered to the firmness of circuit board, strengthen the signal conduction of electronic component simultaneously and improve effectiveness, promote the stability and the product quality of circuit board, the real technical problem that needs to be resolved hurrily for present this area.
Summary of the invention
For solving the many disadvantages of aforementioned prior art, the invention provides a kind of circuit board welding pad structure and manufacture method thereof, can be under the prerequisite of manufacturing complexity that does not increase circuit board and cost, can improve its gas permeability and avoid producing bubble, and then the raising electronic component is soldered to the firmness of circuit board, strengthen the signal conduction of electronic component simultaneously and improve effectiveness, promote the stability and the product quality of circuit board.
Circuit board welding pad structure of the present invention mainly comprises: sandwich layer, be arranged at the weld pad on this sandwich layer, and be covered in the layer of refusing on this sandwich layer and the weld pad partly, wherein, the layer of refusing that is covered on the weld pad partly is divided at least two sub-weld pad zones with this weld pad.
In a kind of form of the present invention, this sub-weld pad zone is provided with electric conducting material.
In a kind of form of the present invention, this electric conducting material and electronic component electrically connect, and wherein, this height of refusing layer is lower than the height of this electric conducting material.
The manufacture method of aforementioned circuit board welding pad structure of the present invention may further comprise the steps: the sandwich layer of purchasing; On this sandwich layer, weld pad is set; And layer is refused in covering on this sandwich layer and weld pad partly, and wherein, the layer of refusing that is covered on the weld pad partly is divided at least two sub-weld pad zones with this weld pad.
In a kind of form of the present invention, also be included on this sub-weld pad zone electric conducting material is set.
In a kind of form of the present invention, comprise also making this electric conducting material and electronic component electrically connect that wherein, this height of refusing layer is lower than the height of this electric conducting material.
Than existing circuit board welding pad structure, by circuit board welding pad structure of the present invention, when electric conducting material on being arranged at this sub-weld pad zone and electronic component electric connection and the reflow of execution high temperature, can by be covered on the weld pad partly this refuse to form between layer, this electric conducting material and this electronic component between the crack, the bubble that Yin Gaowen produced between this electronic component and electric conducting material is imported this gap, thereby solve because of bubble causes circuit board and electronic component firm welding degree deficiency, and influence the problem of the stable and quality of electronic component.
Description of drawings
Fig. 1 a is the generalized section of circuit board welding pad structure of the present invention;
Fig. 1 b is the vertical view of circuit board welding pad structure of the present invention; And
Fig. 2 is for electrically connecting the generalized section of electronic component by aforementioned circuit board welding pad structure of the present invention; And
Fig. 3 a and Fig. 3 b are the application schematic diagram of second embodiment of circuit board welding pad structure of the present invention.
Description of reference numerals
1 circuit board welding pad structure
10 sandwich layers
11 weld pads
12 refuse layer
13 sub-weld pad zones
14 electric conducting materials
15 electronic components
16 gaps
22 refuse layer
23 sub-weld pad zones
25 electronic components
250 solders side
251 windows
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the disclosed content of this specification.The present invention also can be implemented or be used by other different specific embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
First embodiment
See also Fig. 1 a, it is the generalized section of circuit board welding pad structure of the present invention.As shown in Figure 1a, circuit board welding pad structure 1 of the present invention comprises sandwich layer 10, weld pad 11 and refuses layer 12.
This sandwich layer 10 can be epoxy resin (Epoxy resin), policapram (Polyimide), cyanogen fat (Cyanate ester), glass fibre, bismaleimide/three nitrogen traps (BT, Bismaleimide triazine) or blending epoxy and glass fibre materials such as (FR5) constitutes.
Must supplementary notes, in the circuit board welding pad structure of reality, the surface of this weld pad 11 also is covered with and produces the anti oxidation layer (not shown) of oxidation in order to prevent this weld pad 11 from contacting with outside air.This anti oxidation layer can for example be by inert metal and/or organic membrane (OrganicSolderability Preservatives, OSP) formation.This inert metal can for example be gold, silver or tin etc.The mode that covers as for this anti oxidation layer then can be for example for being formed by process for treating surface such as existing surface coated.Because to be formed at these weld pad 11 lip-deep these anti oxidation layer structures is prior art, for avoiding the place of fuzzy this case technical characterictic, so do not give unnecessary details in a separate paper.
See also Fig. 2, it is for electrically connecting the generalized section of electronic component by aforementioned circuit board welding pad structure of the present invention.As shown in the figure, in present embodiment, also be provided with electric conducting material on these four sub-weld pad zones 13, this electric conducting material 14 can be for example for having the soldering paste of conductive effect; And electronic component 15, this electronic component 15 is to electrically connect by this electric conducting material 14 and circuit board welding pad structure 1 of the present invention.More specifically, connect when putting on this electric conducting material 14 in this electronic component 15, by high temperature reflow manufacture method, with this electronic component 15 by these electric conducting material 14 electrical being fixed on the circuit board welding pad structure 1 of the present invention.
Need specify, electric conducting material 14 on being arranged at this sub-weld pad zone 13 electrically connects and carries out in the process of high temperature reflow with electronic component 15, can refuse layer 12, this electric conducting material 14 and 15 formed gaps 16 of this electronic component by being covered on the weld pad 11 partly this, this electronic component 15 and 14 bubbles that Yin Gaowen produced of electric conducting material are imported this gap 16, thereby solve because of bubble causes circuit board and electronic component firm welding degree deficiency, and influence the problem of the stable and quality of electronic component.
In addition, consider that circuit board welding pad structure 1 of the present invention is in follow-up manufacture method, contact area when electrically connecting with electronic component 15 by electric conducting material 14 must make that electronic component 15 can be firm passes through this electric conducting material 14 and connects and place on the circuit board welding pad structure 1 of the present invention, so preferably, this this width of refusing layer 12 that is covered on the weld pad 11 partly is 0.45mm.But, in fact, can be adjusted because of the size of circuit board welding pad structure of the present invention and electronic component.
Second embodiment
Please together consult Fig. 2, Fig. 3 a and Fig. 3 b, it is the application schematic diagram of second embodiment of circuit board welding pad structure of the present invention.Shown in Fig. 3 a, the present embodiment and the first embodiment difference are that this electronic component 25 offers window 251 in order to the solder side 250 with these electric conducting material 14 electric connections, because the periphery of this window 251 is easier to produce bubble in high temperature reflow manufacture method.So shown in Fig. 3 b, on this weld pad 11, also be coated with this and refuse layer 22 corresponding to the position of this window 251, to form five sub-weld pad zones 23, refuse layer 22, this electric conducting material 14 and 251 formation of this window gap that can discharge bubble 16 as shown in Figure 2 in this.
In sum, by circuit board welding pad structure of the present invention, when electric conducting material on being arranged at this sub-weld pad zone and electronic component electric connection and the reflow of execution high temperature, can refuse formed gap between layer, this electric conducting material and this electronic component by being covered on the weld pad partly this, the bubble that Yin Gaowen produced between this electronic component and electric conducting material is imported this gap, thereby solve because of bubble causes circuit board and electronic component firm welding degree deficiency, and influence the problem of the stable and quality of electronic component.
The foregoing description only is illustrative principle of the present invention and function thereof, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention, claims are listed as the aforementioned.
Claims (12)
1. a circuit board welding pad structure is characterized in that, comprising:
Sandwich layer;
Weld pad is arranged on this sandwich layer; And
Refuse layer, be covered on this sandwich layer and the weld pad partly, wherein, the layer of refusing that is covered on the weld pad partly is divided at least two sub-weld pad zones with this weld pad.
2. circuit board welding pad structure according to claim 1 is characterized in that, this sub-weld pad zone is provided with electric conducting material.
3. circuit board welding pad structure according to claim 2 is characterized in that, this electric conducting material and electronic component electrically connect.
4. circuit board welding pad structure according to claim 3 is characterized in that this height of refusing layer is lower than the height of this electric conducting material.
5. circuit board welding pad structure according to claim 1 is characterized in that, this sandwich layer is epoxy resin, policapram, cyanogen fat, glass fibre, bismaleimide/three nitrogen traps or blending epoxy and glass fibre.
6. circuit board welding pad structure according to claim 1 is characterized in that this weld pad and this are refused interpass and also be covered with anti oxidation layer.
7. the manufacture method of a circuit board welding pad structure is characterized in that, may further comprise the steps:
The sandwich layer of purchasing;
On this sandwich layer, weld pad is set; And
Cover on this sandwich layer and weld pad partly and refuse layer, wherein, the layer of refusing that is covered on the weld pad partly is divided at least two sub-weld pad zones with this weld pad.
8. the manufacture method of circuit board welding pad structure according to claim 7 is characterized in that, also is included on this sub-weld pad zone electric conducting material is set.
9. the manufacture method of circuit board welding pad structure according to claim 8 is characterized in that, also comprises making this electric conducting material and electronic component electrically connect.
10. the manufacture method of circuit board welding pad structure according to claim 9 is characterized in that, this height of refusing layer is lower than the height of this electric conducting material.
11. the manufacture method of circuit board welding pad structure according to claim 7 is characterized in that, this sandwich layer is epoxy resin, policapram, cyanogen fat, glass fibre, bismaleimide/three nitrogen traps or blending epoxy and glass fibre.
12. the manufacture method of circuit board welding pad structure according to claim 7 is characterized in that, before the manufacture method step of layer is refused in covering on this sandwich layer and weld pad partly, also is included on this weld pad and covers anti oxidation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101633859A CN101198209A (en) | 2006-12-04 | 2006-12-04 | Circuit board welding pad structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101633859A CN101198209A (en) | 2006-12-04 | 2006-12-04 | Circuit board welding pad structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101198209A true CN101198209A (en) | 2008-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101633859A Pending CN101198209A (en) | 2006-12-04 | 2006-12-04 | Circuit board welding pad structure and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN101198209A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102843858A (en) * | 2012-07-30 | 2012-12-26 | 友达光电(厦门)有限公司 | Line base plate for fixedly providing semiconductor chip and manufacturing method thereof |
| CN106231789A (en) * | 2016-07-26 | 2016-12-14 | 努比亚技术有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN106817855A (en) * | 2017-03-02 | 2017-06-09 | 郑州云海信息技术有限公司 | A kind of GND pads of QFN encapsulation reduce the method for designing of welding bubble |
-
2006
- 2006-12-04 CN CNA2006101633859A patent/CN101198209A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102843858A (en) * | 2012-07-30 | 2012-12-26 | 友达光电(厦门)有限公司 | Line base plate for fixedly providing semiconductor chip and manufacturing method thereof |
| CN102843858B (en) * | 2012-07-30 | 2014-12-10 | 友达光电(厦门)有限公司 | Line base plate for fixedly providing semiconductor chip and manufacturing method thereof |
| CN106231789A (en) * | 2016-07-26 | 2016-12-14 | 努比亚技术有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN106817855A (en) * | 2017-03-02 | 2017-06-09 | 郑州云海信息技术有限公司 | A kind of GND pads of QFN encapsulation reduce the method for designing of welding bubble |
| CN106817855B (en) * | 2017-03-02 | 2019-03-12 | 郑州云海信息技术有限公司 | A kind of GND pad of QFN encapsulation reduces the design method of welding bubble |
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Open date: 20080611 |