SG161124A1 - Insulated metal substrate and method of forming the same - Google Patents
Insulated metal substrate and method of forming the sameInfo
- Publication number
- SG161124A1 SG161124A1 SG200808021-0A SG2008080210A SG161124A1 SG 161124 A1 SG161124 A1 SG 161124A1 SG 2008080210 A SG2008080210 A SG 2008080210A SG 161124 A1 SG161124 A1 SG 161124A1
- Authority
- SG
- Singapore
- Prior art keywords
- metal substrate
- metal
- forming
- insulated metal
- disposed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
An insulated metal substrate (1) for use in metal clad printed circuit board, the insulated metal substrate (1) comprises a metal substrate (10), an electrically insulating layer (12) disposed on the metal substrate (10), and an electrically conducting layer (14) capable of interconnecting electronic power components (24) such as light emitting devices or light emitting diodes (LEDs), the electrically conducting layer (14) disposed on the electrically insulating layer (12). The metal substrate (10) comprises a base metal (10a) and a dissimilar overlaying metal(10b) disposed on the base metal (10a). Method of forming the insulated metal substrate (1) is also provided.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200808021-0A SG161124A1 (en) | 2008-10-29 | 2008-10-29 | Insulated metal substrate and method of forming the same |
PCT/SG2009/000017 WO2010050896A1 (en) | 2008-10-29 | 2009-01-08 | Insulated metal substrate and method of forming the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200808021-0A SG161124A1 (en) | 2008-10-29 | 2008-10-29 | Insulated metal substrate and method of forming the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG161124A1 true SG161124A1 (en) | 2010-05-27 |
Family
ID=42129066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200808021-0A SG161124A1 (en) | 2008-10-29 | 2008-10-29 | Insulated metal substrate and method of forming the same |
Country Status (2)
Country | Link |
---|---|
SG (1) | SG161124A1 (en) |
WO (1) | WO2010050896A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2481754C1 (en) * | 2011-09-13 | 2013-05-10 | Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") | Printed circuit board on metal substrate and method of its manufacturing |
WO2015047974A2 (en) * | 2013-09-24 | 2015-04-02 | Cooper Technologies Company | Systems and methods for improving service life of circuit boards |
KR20150074421A (en) * | 2013-12-24 | 2015-07-02 | 엘지이노텍 주식회사 | printed circuit board AND LUMINOUS DEVICE |
CN109413848B (en) * | 2018-10-23 | 2020-04-21 | 胜宏科技(惠州)股份有限公司 | Method for processing copper-aluminum combined metal substrate |
CN210157469U (en) * | 2018-12-29 | 2020-03-17 | 广东生益科技股份有限公司 | Metal-based copper-clad laminate |
CN110225676A (en) * | 2019-04-23 | 2019-09-10 | 江苏迪飞达电子有限公司 | A kind of production technology of multiple layer metal substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175084B1 (en) * | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
DE19900603A1 (en) * | 1999-01-11 | 2000-07-13 | Bosch Gmbh Robert | Electronic semiconductor module |
US6165596A (en) * | 1999-10-14 | 2000-12-26 | Lucent Technologies, Inc. | Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components |
TWI340010B (en) * | 2006-08-04 | 2011-04-01 | Everlight Electronics Co Ltd | Circuit board with cooling functionality |
WO2008128016A2 (en) * | 2007-04-13 | 2008-10-23 | World Properties Inc. | Metal core circuit boards for light emitting diode applications and methods of manufacture thereof |
-
2008
- 2008-10-29 SG SG200808021-0A patent/SG161124A1/en unknown
-
2009
- 2009-01-08 WO PCT/SG2009/000017 patent/WO2010050896A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2010050896A1 (en) | 2010-05-06 |
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