WO2010050896A1 - Insulated metal substrate and method of forming the same - Google Patents

Insulated metal substrate and method of forming the same Download PDF

Info

Publication number
WO2010050896A1
WO2010050896A1 PCT/SG2009/000017 SG2009000017W WO2010050896A1 WO 2010050896 A1 WO2010050896 A1 WO 2010050896A1 SG 2009000017 W SG2009000017 W SG 2009000017W WO 2010050896 A1 WO2010050896 A1 WO 2010050896A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal substrate
metal
insulated
recited
overlaying
Prior art date
Application number
PCT/SG2009/000017
Other languages
French (fr)
Inventor
Kai Fook Francis Wee
Original Assignee
Opulent Electronics International Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opulent Electronics International Pte Ltd filed Critical Opulent Electronics International Pte Ltd
Publication of WO2010050896A1 publication Critical patent/WO2010050896A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to insulated metal substrate suitable for use in metal clad printed circuit board (MCPCB), and method of forming the same.
  • MCPCB metal clad printed circuit board
  • PCB substrates are mainly formed of FR4 laminates (Flame Retardant Type 4) which consist of woven glass reinforced epoxy resin.
  • FR4 laminates Feme Retardant Type 4
  • the need for better thermal management becomes more crucial.
  • this proposal is a temporary one because with the increased demand for higher power density, the electronic power components will dissipate even more heat and as a consequence, more heat-sinks are needed.
  • the ability to achieve smaller form-factor products is much limited.
  • the mounting of electronic power components proves difficult and time-consuming because hand-assembly and soldering connections to individual boards are needed.
  • PCB consisting of insulated metal substrates are commonly termed MCPCB.
  • MCPCB insulated metal substrates
  • a typical insulated metal substrate comprises a base metal (typically aluminum), an electrically insulating layer disposed on the base metal, and an electrically conducting layer (typically copper foil) disposed on the electrically insulating layer.
  • the aluminum base, the electrically insulating layer, and the copper foil are laminated together to form the insulated metal substrate.
  • the insulated metal substrate is subsequently used in the fabrication of a MCPCB.
  • the MCPCB may be formed by conventional methods by finishing the copper foil such that it serves as a circuitry array and/or surface mounting pad (copper pad) for electronic power components. After the lamination of the layers, an indentation is created in the electrically insulating layer and the copper foil to expose the aluminum base that serves as a thermal path for adhering electronic power components.
  • the electronic power components such as light emitting devices or light emitting diodes (LEDs) are either mounted onto the copper pad or onto the aluminum base through an indentation in the electrically insulating layer and the copper foil, and the aluminum base delivers higher thermal dissipation characteristic than conventional FR4 PCB substrates.
  • LEDs light emitting devices or light emitting diodes
  • a glue interface such as epoxy adhesive is first disposed onto the copper pads or onto the aluminum base, followed by placing the LEDs onto the copper pads or onto the aluminum base. After the adhesive is thermally cured, the LEDs are adhered onto the copper pads or onto the base metal of the insulated metal substrate. The heat dissipated by the LEDs is transferred through the adhesive to copper pad or the base metal for subsequent dissipation.
  • the insulated metal substrate fabricated above provides a better thermal management than the convention PCB FR4 substrates.
  • the epoxy adhesive is expensive and has to be stored in sealed containers at temperatures below -18 0 C.
  • the thermal resistance of the epoxy adhesive will affect the overall performance of the electronic power components.
  • the adhesive layer should be as thin as possible for good thermal conductivity, but thick enough to ensure proper mechanical strength. Further, the coefficients of thermal expansion between the epoxy adhesive, electronic power component and the base metal are different.
  • an insulated metal substrate for use in metal clad printed circuit board.
  • the insulated metal substrate comprises a metal substrate, an electrically insulating layer disposed on the metal substrate, and an electrically conducting layer capable of interconnecting electronic power components such as LEDs, the electrically conducting layer disposed on the electrically insulating layer.
  • the metal substrate comprises a base metal and a dissimilar overlaying metal disposed on the base metal.
  • a method of forming an insulated metal substrate comprises the steps of providing a metal substrate comprising a base metal and a dissimilar overlaying metal disposed on the base metal, disposing an electrically insulating layer on the metal substrate, and disposing an electrically conducting layer on the electrically insulating layer.
  • the layers are being laminated together.
  • the electrically conducting layer is capable of interconnecting electronic power components such as LEDs.
  • FIGURE 1 is an illustration of a bare insulated metal substrate in accordance with an embodiment of the present invention.
  • FIGURE 2 is an illustration of a bare insulated metal substrate with an indentation in accordance with a further embodiment of the present invention.
  • FIGURE 3 is an illustration of a insulated metal substrate with a surface- mounted LED in accordance with an embodiment of the present invention.
  • the invention relates to insulated metal substrate suitable for use in MCPCB 1 and method of forming the same.
  • a method of forming an insulated metal substrate 1 suitable for use in MCPCB comprising a metal substrate 10 is first provided.
  • the metal substrate 10 comprises a base metal 10a and a dissimilar overlaying metal 10b disposed on the base metal 10a.
  • An electrically insulating layer 12 is then disposed on the metal substrate 10.
  • An electrically conducting layer 14 capable of interconnecting electronic power components such as LEDs is subsequently disposed on the electrically insulating layer 12 to thereby form the insulated metal substrate 1.
  • the base metal 10a of the metal substrate 10 may be aluminum, copper, gold, palladium, tin, steel, or zinc. Other metallic elements or alloys apparent to a person skilled in the art are also possible.
  • the base metal 10a is aluminum.
  • the overlaying metal 10b of the metal substrate 10 may be aluminum, copper, gold, palladium, tin, steel, or zinc. Other metallic elements or alloys apparent to a person skilled in the art are also possible.
  • the overlaying metal 10b is copper. More preferably, the base metal 10a is aluminum and the overlaying metal 10b is copper.
  • the overlaying metal 10b is disposed on the base metal 10a by deposition techniques such as plating. Other techniques known to a person skilled in the art are also possible.
  • the electrically insulating layer 12 may be polyimide, epoxy, polytetrafluoroethylene (PTFE) or other polymers. Other dielectric materials apparent to a person skilled in the art are also possible.
  • the electrically insulating layer 12 is disposed on the metal substrate 10 by conventional deposition techniques.
  • the electrically conducting layer 14 may be copper, gold, silver, or tin. Other electrically conductive materials which are capable of interconnecting electronic power components apparent to a person skilled in the art are also possible.
  • the electrically conducting layer 14 is a copper foil.
  • the electrically conducting layer 14 is disposed on the electrically insulating layer 12 by deposition techniques such as lamination with the metal substrate 10 comprising the base metal 10a and the dissimilar overlaying metal 10b disposed on the base metal 10a. Other techniques known to a person skilled in the art are also possible.
  • an indentation 20 is formed in the electrically insulating layer 12 and the electrically conducting layer 14 to expose the overlaying metal 10b of the metal substrate 10.
  • the indentation 20 is formed by known techniques such as laser drilling, mechanical depth routing, or sandblasting.
  • the indentation 20 is formed by sandblasting the electrically insulating layer 12 and the electrically conducting layer 14 to expose the overlaying metal 10b of the metal substrate 10 since sandblasting provides good control of the depth of layers to be removed.
  • sandblasting technique reference is made to currently pending Singapore Patent Application No. 200800182-8 filed on 8 January 2008, whose description and drawings are hereby incorporated by reference.
  • sandblasting enables smooth and uniform surface of the overlaying metal 10b to be formed.
  • This smooth and uniform overlaying metal 10b surface allows surface-mountable LEDs to be seated flatly, and at the same time, creates a thermal path for heat to be dissipated from the LEDs to the base metal 10a. It is important that the base metal 10a is not exposed.
  • solder paste 22 is disposed within the indentation 20.
  • the solder paste may be tin alloy or other thermally conductive metallic materials known to a person skilled in the art.
  • solder paste 22 Following the deposition of the solder paste 22 in the indentation 20, a surface- mountable LED 24 is placed onto the solder paste 22. Heat treatment or reflow is subsequently carried out to melt the solder paste 22 so that the solder paste 22 forms an intermetallic phase with overlaying metal 10b. The solder paste 22 serves to adhere the LED 24 to the metal substrate 10 through the overlaying metal 10b.
  • the afore-described method of forming an insulated metal substrate enables surface-mountable components to be easily mounted onto it and provides several advantages over existing PCB substrates.
  • the solder paste being thermally conductive, improves the transfer of heat dissipated by the electronic power components to the metal substrate acting as a heat sink through the intermetallic phase formed between the solder paste and the overlaying metal.
  • coefficients of thermal expansion for metals are in the same order of magnitude, the effect of expansion and contraction between the metal substrate and the solder paste is minimized, thereby improving mechanical stability.
  • manufacturing cost is reduced with the elimination of use of expensive epoxy adhesive.
  • Surface-mounted technology is an established technology and is automated. Therefore, mass production of surface-mountable PCB is now made feasible with the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

An insulated metal substrate (1) for use in metal clad printed circuit board, the insulated metal substrate (1) comprises a metal substrate (10), an electrically insulating layer (12) disposed on the metal substrate (10), and an electrically conducting layer (14) capable of interconnecting electronic power components (24) such as light emitting devices or light emitting diodes (LEDs), the electrically conducting layer (14) disposed on the electrically insulating layer (12). The metal substrate (10) comprises a base metal (10a) and a dissimilar overlaying metal (10b) disposed on the base metal (10a). Method of forming the insulated metal substrate (1) is also provided.

Description

INSULATED METAL SUBSTRATE AND METHOD OF FORMING THE SAME
FIELD OF INVENTION
The invention relates to insulated metal substrate suitable for use in metal clad printed circuit board (MCPCB), and method of forming the same.
BACKGROUND TO THE INVENTION
The following discussion of the background to the invention is intended to facilitate an understanding of the present invention. However, it should be appreciated that the discussion is not an acknowledgment or admission that any of the material referred to was published, known or part of the common general knowledge in any jurisdiction as at the priority date of the application.
Conventional printed circuit board (PCB) substrates are mainly formed of FR4 laminates (Flame Retardant Type 4) which consist of woven glass reinforced epoxy resin. As the demand for higher power density and smaller form-factor products increases, the need for better thermal management becomes more crucial. While it has been proposed that the addition of heat-sinks to FR4 substrates help transfer heat dissipated by the mounted electronic power components, this proposal is a temporary one because with the increased demand for higher power density, the electronic power components will dissipate even more heat and as a consequence, more heat-sinks are needed. Furthermore, the ability to achieve smaller form-factor products is much limited. In addition, the mounting of electronic power components proves difficult and time-consuming because hand-assembly and soldering connections to individual boards are needed.
Insulated metal substrate technology is emerging as a solution for better thermal management and is replacing conventional PCB substrates. PCB consisting of insulated metal substrates are commonly termed MCPCB. At the same time, the evolution of automation-friendly, SMT-oriented (Surface Mounted Technologies) interconnect technologies is enabling efficient high volume production of reliable and cost-effective PCB assembly.
A typical insulated metal substrate comprises a base metal (typically aluminum), an electrically insulating layer disposed on the base metal, and an electrically conducting layer (typically copper foil) disposed on the electrically insulating layer. The aluminum base, the electrically insulating layer, and the copper foil are laminated together to form the insulated metal substrate. The insulated metal substrate is subsequently used in the fabrication of a MCPCB. The MCPCB may be formed by conventional methods by finishing the copper foil such that it serves as a circuitry array and/or surface mounting pad (copper pad) for electronic power components. After the lamination of the layers, an indentation is created in the electrically insulating layer and the copper foil to expose the aluminum base that serves as a thermal path for adhering electronic power components. The electronic power components, such as light emitting devices or light emitting diodes (LEDs), are either mounted onto the copper pad or onto the aluminum base through an indentation in the electrically insulating layer and the copper foil, and the aluminum base delivers higher thermal dissipation characteristic than conventional FR4 PCB substrates.
In order to mount LEDs onto the insulated metal substrate surface, a glue interface such as epoxy adhesive is first disposed onto the copper pads or onto the aluminum base, followed by placing the LEDs onto the copper pads or onto the aluminum base. After the adhesive is thermally cured, the LEDs are adhered onto the copper pads or onto the base metal of the insulated metal substrate. The heat dissipated by the LEDs is transferred through the adhesive to copper pad or the base metal for subsequent dissipation.
The insulated metal substrate fabricated above provides a better thermal management than the convention PCB FR4 substrates. However, the epoxy adhesive is expensive and has to be stored in sealed containers at temperatures below -180C. The thermal resistance of the epoxy adhesive will affect the overall performance of the electronic power components. In order to maximize the thermal conductivity of the epoxy adhesive, the adhesive layer should be as thin as possible for good thermal conductivity, but thick enough to ensure proper mechanical strength. Further, the coefficients of thermal expansion between the epoxy adhesive, electronic power component and the base metal are different. During operation, local temperature at the interface between the base metal and epoxy adhesive or at the interface between the epoxy adhesive and the electronic power component may possibly cause non-uniform expansion/contraction at the interface, thereby dislodging the bonding between the base metal and the epoxy adhesive or between the epoxy adhesive and the electronic power component, or both. Efficiency of the insulated metal substrate is therefore compromised.
It is desirable to provide an improved insulated metal substrate that overcomes, or at least alleviates, the above problems.
SUMMARY OF THE INVENTION
Throughout this document, unless otherwise indicated to the contrary, the terms "comprising", "consisting of, and the like, are to be construed as non-exhaustive, or in other words, as meaning "including, but not limited to". And when it is referred a second layer is disposed on a first layer, it is to be understood that the second layer is disposed such as to partially or fully cover the first layer.
In a first aspect of the present invention, there is provided an insulated metal substrate for use in metal clad printed circuit board. The insulated metal substrate comprises a metal substrate, an electrically insulating layer disposed on the metal substrate, and an electrically conducting layer capable of interconnecting electronic power components such as LEDs, the electrically conducting layer disposed on the electrically insulating layer. The metal substrate comprises a base metal and a dissimilar overlaying metal disposed on the base metal.
In a second aspect of the present invention, there is provided a method of forming an insulated metal substrate. The method comprises the steps of providing a metal substrate comprising a base metal and a dissimilar overlaying metal disposed on the base metal, disposing an electrically insulating layer on the metal substrate, and disposing an electrically conducting layer on the electrically insulating layer. The layers are being laminated together. The electrically conducting layer is capable of interconnecting electronic power components such as LEDs.
BRIEF DESCRIPTION OF THE DRAWINGS
In the figures, which illustrate, by way of example only, embodiments of the present invention,
FIGURE 1 is an illustration of a bare insulated metal substrate in accordance with an embodiment of the present invention.
FIGURE 2 is an illustration of a bare insulated metal substrate with an indentation in accordance with a further embodiment of the present invention.
FIGURE 3 is an illustration of a insulated metal substrate with a surface- mounted LED in accordance with an embodiment of the present invention.
DETAILED DESCRIPTION
The invention relates to insulated metal substrate suitable for use in MCPCB1 and method of forming the same.
In accordance with a first embodiment of the invention illustrated in Figure 1 , there is provided a method of forming an insulated metal substrate 1 suitable for use in MCPCB. A metal substrate 10 is first provided. The metal substrate 10 comprises a base metal 10a and a dissimilar overlaying metal 10b disposed on the base metal 10a. An electrically insulating layer 12 is then disposed on the metal substrate 10. An electrically conducting layer 14 capable of interconnecting electronic power components such as LEDs is subsequently disposed on the electrically insulating layer 12 to thereby form the insulated metal substrate 1.
The base metal 10a of the metal substrate 10 may be aluminum, copper, gold, palladium, tin, steel, or zinc. Other metallic elements or alloys apparent to a person skilled in the art are also possible. Preferably, the base metal 10a is aluminum.
The overlaying metal 10b of the metal substrate 10 may be aluminum, copper, gold, palladium, tin, steel, or zinc. Other metallic elements or alloys apparent to a person skilled in the art are also possible. Preferably, the overlaying metal 10b is copper. More preferably, the base metal 10a is aluminum and the overlaying metal 10b is copper.
The overlaying metal 10b is disposed on the base metal 10a by deposition techniques such as plating. Other techniques known to a person skilled in the art are also possible.
The electrically insulating layer 12 may be polyimide, epoxy, polytetrafluoroethylene (PTFE) or other polymers. Other dielectric materials apparent to a person skilled in the art are also possible.
The electrically insulating layer 12 is disposed on the metal substrate 10 by conventional deposition techniques.
The electrically conducting layer 14 may be copper, gold, silver, or tin. Other electrically conductive materials which are capable of interconnecting electronic power components apparent to a person skilled in the art are also possible. Preferably, the electrically conducting layer 14 is a copper foil.
The electrically conducting layer 14 is disposed on the electrically insulating layer 12 by deposition techniques such as lamination with the metal substrate 10 comprising the base metal 10a and the dissimilar overlaying metal 10b disposed on the base metal 10a. Other techniques known to a person skilled in the art are also possible.
Referring to Figure 2, an indentation 20 is formed in the electrically insulating layer 12 and the electrically conducting layer 14 to expose the overlaying metal 10b of the metal substrate 10. The indentation 20 is formed by known techniques such as laser drilling, mechanical depth routing, or sandblasting. Preferably, the indentation 20 is formed by sandblasting the electrically insulating layer 12 and the electrically conducting layer 14 to expose the overlaying metal 10b of the metal substrate 10 since sandblasting provides good control of the depth of layers to be removed. For a more complete description of the sandblasting technique, reference is made to currently pending Singapore Patent Application No. 200800182-8 filed on 8 January 2008, whose description and drawings are hereby incorporated by reference. Further, sandblasting enables smooth and uniform surface of the overlaying metal 10b to be formed. This smooth and uniform overlaying metal 10b surface allows surface-mountable LEDs to be seated flatly, and at the same time, creates a thermal path for heat to be dissipated from the LEDs to the base metal 10a. It is important that the base metal 10a is not exposed.
Referring to Figure 3, after the formation of the indentation 20, a solder paste 22 is disposed within the indentation 20. The solder paste may be tin alloy or other thermally conductive metallic materials known to a person skilled in the art.
Following the deposition of the solder paste 22 in the indentation 20, a surface- mountable LED 24is placed onto the solder paste 22. Heat treatment or reflow is subsequently carried out to melt the solder paste 22 so that the solder paste 22 forms an intermetallic phase with overlaying metal 10b. The solder paste 22 serves to adhere the LED 24 to the metal substrate 10 through the overlaying metal 10b.
The afore-described method of forming an insulated metal substrate enables surface-mountable components to be easily mounted onto it and provides several advantages over existing PCB substrates. Firstly, the solder paste, being thermally conductive, improves the transfer of heat dissipated by the electronic power components to the metal substrate acting as a heat sink through the intermetallic phase formed between the solder paste and the overlaying metal. Further, since coefficients of thermal expansion for metals are in the same order of magnitude, the effect of expansion and contraction between the metal substrate and the solder paste is minimized, thereby improving mechanical stability. Also, manufacturing cost is reduced with the elimination of use of expensive epoxy adhesive. Surface-mounted technology is an established technology and is automated. Therefore, mass production of surface-mountable PCB is now made feasible with the present invention.
Although the foregoing invention has been described in some detail by way of illustration and example, and with regard to one or more embodiments, for the purposes of clarity of understanding, it is readily apparent to those of ordinary skill in the art in light of the teachings of this invention that certain changes, variations and modifications may be made thereto without departing from the spirit or scope of the invention as described in the appended claims.

Claims

I CLAIM:
1. An insulated metal substrate (1) for use in metal clad printed circuit board, the insulated metal substrate (1) comprising:
- a metal substrate (10);
- an electrically insulating layer (12) disposed on the metal substrate; and
- an electrically conducting layer (14) capable of interconnecting electronic power components (24) such as light emitting devices or light emitting diodes (LEDs), the electrically conducting layer (14) disposed on the electrically insulating layer (12)
wherein the metal substrate (10) comprises a base metal (10a) and a dissimilar overlaying metal (10b) disposed on the base metal (10a).
2. The insulated metal substrate (1) recited in claim 1 , wherein the base metal (10a) is selected from the group consisting of aluminium, copper, gold, palladium, tin, steel, and zinc.
3. The insulated metal substrate (1) recited in claim 1 or 2, wherein the overlaying metal (10b) is selected from the group consisting of aluminium, copper, gold, palladium, tin, steel, and zinc.
4. The insulated metal substrate (1) recited in claim 2, wherein the base metal (10a) is aluminium.
5. The insulated metal substrate (1) recited in claim 3, wherein the overlaying metal (10b) is copper.
6. The insulated metal substrate (1) recited in claim 5, wherein the base metal (10a) is aluminium and the overlaying metal (10b) is copper.
7. The insulated metal substrate (1) recited in any preceding claim, wherein the electrically insulating (ayer (12) and the electrically conducting layer (14) comprise an indentation (20) for exposing the overlaying metal (10b) of the metal substrate (10).
8. The insulated metal substrate (1) recited in claim 7, further comprising a solder paste (22) disposed within the first via (20).
9. The insulated metal substrate (1) recited in claim 8, further comprising LED (24) mounted in the indentation (20).
10. A printed circuit board comprising the insulated metal substrate (1 ) recited in any preceding claim.
11. A method of forming an insulated metal substrate (1 ), the method comprising:
- providing a metal substrate (10) comprising a base metal (10a) and a dissimilar overlaying metal (10b) disposed on the base metal (10a);
- disposing an electrically insulating layer (12) on the metal substrate; and
- disposing an electrically conducting layer (14) on the electrically insulating layer (12), the electrically conducting layer (14) being capable of interconnecting electronic power components (24) such as light emitting devices or light emitting diodes (LEDs).
12. The method recited in claim 11 , wherein the step of providing the metal substrate (10) comprises plating the overlaying metal (10b) onto the base metal (10a).
13. The method recited in claim 11-12, further comprising forming an indentation (20) in the electrically insulating layer (12) and the electrically conducting layer (14) to expose the overlaying metal (10b) of the metal substrate (10).
14. The method recited in claim 13, further comprising disposing a solder paste (22) within the indentation (20).
15. The method recited in claim 13, further comprising mounting a LED (24) in the indentation (20).
16. The method recited in claim 15, further comprising reflowing the solder paste (22) within the indentation (20) by heat treatment to form an intermetallic phase with the overlaying metal (10b).
PCT/SG2009/000017 2008-10-29 2009-01-08 Insulated metal substrate and method of forming the same WO2010050896A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200808021-0A SG161124A1 (en) 2008-10-29 2008-10-29 Insulated metal substrate and method of forming the same
SG200808021-0 2008-10-29

Publications (1)

Publication Number Publication Date
WO2010050896A1 true WO2010050896A1 (en) 2010-05-06

Family

ID=42129066

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2009/000017 WO2010050896A1 (en) 2008-10-29 2009-01-08 Insulated metal substrate and method of forming the same

Country Status (2)

Country Link
SG (1) SG161124A1 (en)
WO (1) WO2010050896A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (en) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Printed circuit board on metal substrate and method of its manufacturing
WO2015047974A3 (en) * 2013-09-24 2015-05-28 Cooper Technologies Company Systems and methods for improving service life of circuit boards
EP2890224A1 (en) * 2013-12-24 2015-07-01 LG Innotek Co., Ltd. Printed circuit board and light emitting device
CN109413848A (en) * 2018-10-23 2019-03-01 胜宏科技（惠州）股份有限公司 A kind of Cu and Al combination metal substrate processing method
CN110113880A (en) * 2018-12-29 2019-08-09 广东生益科技股份有限公司 Metal base copper-clad laminate and preparation method thereof
CN110225676A (en) * 2019-04-23 2019-09-10 江苏迪飞达电子有限公司 A kind of production technology of multiple layer metal substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165596A (en) * 1999-10-14 2000-12-26 Lucent Technologies, Inc. Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US6373705B1 (en) * 1999-01-11 2002-04-16 Robert Bosch Gmbh Electronic semiconductor module
US20080029881A1 (en) * 2006-08-04 2008-02-07 Chi-Hao Liang Circuit board with cooling function
WO2008128016A2 (en) * 2007-04-13 2008-10-23 World Properties Inc. Metal core circuit boards for light emitting diode applications and methods of manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US6373705B1 (en) * 1999-01-11 2002-04-16 Robert Bosch Gmbh Electronic semiconductor module
US6165596A (en) * 1999-10-14 2000-12-26 Lucent Technologies, Inc. Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components
US20080029881A1 (en) * 2006-08-04 2008-02-07 Chi-Hao Liang Circuit board with cooling function
WO2008128016A2 (en) * 2007-04-13 2008-10-23 World Properties Inc. Metal core circuit boards for light emitting diode applications and methods of manufacture thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (en) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Printed circuit board on metal substrate and method of its manufacturing
WO2015047974A3 (en) * 2013-09-24 2015-05-28 Cooper Technologies Company Systems and methods for improving service life of circuit boards
EP2890224A1 (en) * 2013-12-24 2015-07-01 LG Innotek Co., Ltd. Printed circuit board and light emitting device
US9241399B2 (en) 2013-12-24 2016-01-19 Lg Innotek Co., Ltd. Printed circuit board and light emitting device
CN109413848A (en) * 2018-10-23 2019-03-01 胜宏科技（惠州）股份有限公司 A kind of Cu and Al combination metal substrate processing method
CN109413848B (en) * 2018-10-23 2020-04-21 胜宏科技（惠州）股份有限公司 Method for processing copper-aluminum combined metal substrate
CN110113880A (en) * 2018-12-29 2019-08-09 广东生益科技股份有限公司 Metal base copper-clad laminate and preparation method thereof
CN110225676A (en) * 2019-04-23 2019-09-10 江苏迪飞达电子有限公司 A kind of production technology of multiple layer metal substrate

Also Published As

Publication number Publication date
SG161124A1 (en) 2010-05-27

Similar Documents

Publication Publication Date Title
US5081562A (en) Circuit board with high heat dissipations characteristic
JP5767338B2 (en) Electronic device, method for manufacturing the same, and printed circuit board including the electronic device
US9236547B2 (en) Two part flexible light emitting semiconductor device
US20070010086A1 (en) Circuit board with a through hole wire and manufacturing method thereof
EP1848924A2 (en) Led light module assembly
TWI435666B (en) Radiant heat circuit board and method for manufacturing the same
US20200335429A1 (en) Flexible printed circuit board and method of manufacturing flexible printed circuit board
EP2656700B1 (en) Circuit for a light emitting component and method of manufacturing the same
JP4992532B2 (en) Heat dissipation board and manufacturing method thereof
JP4127220B2 (en) Printed circuit board for LED mounting and manufacturing method thereof
WO2010050896A1 (en) Insulated metal substrate and method of forming the same
CN111132476A (en) Preparation method of double-sided circuit radiating substrate
CN208657154U (en) For being attached the flexible multilayer substrate of light-emitting semiconductor device
CN111527797A (en) Insulated circuit board and method for manufacturing insulated circuit board
CN111148353B (en) Preparation method of circuit board with copper-based heat sink
KR100923784B1 (en) Metal base circuit board superior in heat dissipation property and method of manufacturing the same
KR20120100303A (en) Printed circuit board, light emitting module having the same, lighting unit having the light emitting unit and method of manufacturing the light emitting mudule
US9241399B2 (en) Printed circuit board and light emitting device
US20120122278A1 (en) Method Of Manufacturing Semiconductor Package Board
JP6332330B2 (en) WIRING SUBSTRATE MANUFACTURING METHOD, LIGHT-EMITTING DEVICE MANUFACTURING METHOD USING SAME, WIRING SUBSTRATE, AND LIGHT-EMITTING DEVICE USING SAME
KR101172168B1 (en) The radiant heat circuit board and the method for manufacturing the same
KR101558894B1 (en) Led lamp manufacturing method using a high-efficiency thermal conductivity chip
JP2021190455A (en) Circuit board and manufacturing method thereof
JP2006100316A (en) Package for containing light emitting element
KR101197102B1 (en) Method of manufacturing a circuit board with improved heat dissipation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09823912

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09823912

Country of ref document: EP

Kind code of ref document: A1