RU2008125209A - METHOD FOR MAKING PRINTED CIRCUIT BOARDS WITH INTEGRATED RESISTORS - Google Patents
METHOD FOR MAKING PRINTED CIRCUIT BOARDS WITH INTEGRATED RESISTORS Download PDFInfo
- Publication number
- RU2008125209A RU2008125209A RU2008125209/09A RU2008125209A RU2008125209A RU 2008125209 A RU2008125209 A RU 2008125209A RU 2008125209/09 A RU2008125209/09 A RU 2008125209/09A RU 2008125209 A RU2008125209 A RU 2008125209A RU 2008125209 A RU2008125209 A RU 2008125209A
- Authority
- RU
- Russia
- Prior art keywords
- conductive layer
- resistors
- photomask
- built
- applying
- Prior art date
Links
Abstract
1. Способ изготовления печатных плат с встроенными резисторами, основанный на использовании металлической пластины в качестве основания печатной платы и последующем покрытии поверхности платы и стенок отверстия изоляционным слоем, заполнении отверстий резистивной пастой, нанесении токопроводящего слоя на поверхность платы и стенки монтажных отверстий и формировании проводящего рисунка схемы, отличающийся тем, что в качестве изоляционного слоя используют нитрид алюминия, встроенные резисторы размещают в отверстиях с нанесенным изоляционным слоем из нитрида алюминия на стенках отверстий, а токопроводящий слой наносят также на торцы встроенных резисторов. ! 2. Способ по п.1, отличающийся тем, что формирование проводящего рисунка схемы осуществляют путем нанесения фотомаски, избирательного гальванического усиления толщины проводящего слоя, избирательного осаждения защитного металлорезиста, удаления фотомаски и травления проводящего слоя с пробельных мест. ! 3. Способ по п.1, отличающийся тем, что формирование проводящего рисунка схемы осуществляют путем гальванического усиления толщины всего проводящего слоя, нанесения фотомаски на контактные площадки, проводники и места расположения торцев встроенных резисторов, вытравливания проводящего слоя с пробельных мест, удаления фотомаски, нанесения защитной паяльной маски и облуживания контактных площадок и стенок монтажных отверстий.1. A method of manufacturing printed circuit boards with built-in resistors, based on the use of a metal plate as the base of the printed circuit board and subsequent coating of the surface of the board and hole walls with an insulating layer, filling the holes with resistive paste, applying a conductive layer to the surface of the board and wall of the mounting holes and forming a conductive pattern circuits, characterized in that aluminum nitride is used as the insulating layer, built-in resistors are placed in the holes with the insulated an aluminum nitride layer on the walls of the holes, and a conductive layer is also applied to the ends of the built-in resistors. ! 2. The method according to claim 1, characterized in that the formation of the conductive pattern of the circuit is carried out by applying a photomask, selective galvanic amplification of the thickness of the conductive layer, selective deposition of a protective metal resist, removal of the photomask and etching of the conductive layer from the gap places. ! 3. The method according to claim 1, characterized in that the formation of the conductive pattern of the circuit is carried out by galvanically enhancing the thickness of the entire conductive layer, applying a photomask to the contact pads, conductors and the location of the ends of the built-in resistors, etching the conductive layer from whitespace, removing the photomask, applying protective solder mask and tinning of contact pads and walls of mounting holes.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2008125209/09A RU2386225C2 (en) | 2008-06-23 | 2008-06-23 | Method of making printed circuit boards with built-in resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2008125209/09A RU2386225C2 (en) | 2008-06-23 | 2008-06-23 | Method of making printed circuit boards with built-in resistors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2008125209A true RU2008125209A (en) | 2009-12-27 |
| RU2386225C2 RU2386225C2 (en) | 2010-04-10 |
Family
ID=41642501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2008125209/09A RU2386225C2 (en) | 2008-06-23 | 2008-06-23 | Method of making printed circuit boards with built-in resistors |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2386225C2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2477029C2 (en) * | 2011-01-12 | 2013-02-27 | Евгений Васильевич Савлев | Method for manufacturing printed circuit boards for light diodes |
| RU2543518C1 (en) * | 2013-10-03 | 2015-03-10 | Общество с ограниченной ответственностью "Компания РМТ"(ООО"РМТ") | Method of production of double-sided printed board |
| RU2765105C1 (en) * | 2021-01-25 | 2022-01-25 | Акционерное общество «Информационные спутниковые системы» имени академика М.Ф.Решетнёва» | Method for manufacturing high-frequency printed circuit boards |
-
2008
- 2008-06-23 RU RU2008125209/09A patent/RU2386225C2/en active
Also Published As
| Publication number | Publication date |
|---|---|
| RU2386225C2 (en) | 2010-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200731898A (en) | Circuit board structure and method for fabricating the same | |
| TW200721927A (en) | Method for making a circuit board, and circuit board | |
| TW200520110A (en) | Printed wiring board, its preparation and circuit device | |
| FI20020190A0 (en) | A method for immersing a component in a substrate and forming a contact | |
| JP2008263125A5 (en) | ||
| TW200601921A (en) | Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon | |
| DE602005005105D1 (en) | Method for producing a double-sided printed circuit board | |
| TW200746968A (en) | Method for fabricating electrical connecting structure of circuit board | |
| US8735728B2 (en) | Printed circuit board with fins | |
| EP1619719A3 (en) | Method of manufacturing a wiring board including electroplating | |
| RU2008125209A (en) | METHOD FOR MAKING PRINTED CIRCUIT BOARDS WITH INTEGRATED RESISTORS | |
| JP2006100631A (en) | Wiring board and its manufacturing method | |
| TW200802766A (en) | Substrate strip and substrate structure and method for manufacturing the same | |
| TW200640311A (en) | A method of manufacturing a film printed circuit board | |
| US20110094788A1 (en) | Printed circuit board with insulating areas | |
| TW200610461A (en) | Method of manufacturing double-sided printed circuit board | |
| MY156961A (en) | Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production | |
| MY138599A (en) | Printed circuit boards having integrated inductor cores | |
| TW200644745A (en) | Printed wiring board and method for making same | |
| CN102045952B (en) | Manufacturing method for circuit board insulating protective layer | |
| TW200802765A (en) | Substrate structure and method for manufacturing the same | |
| JP2006222304A5 (en) | ||
| CN104105346B (en) | A kind of manufacture method with bump pad printed board | |
| JP2016500133A (en) | Electrical component and method for manufacturing electrical component | |
| KR100999515B1 (en) | Manufacturing method of printed circuit board |