MY156961A - Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production - Google Patents

Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production

Info

Publication number
MY156961A
MY156961A MYPI20014947A MYPI20014947A MY156961A MY 156961 A MY156961 A MY 156961A MY PI20014947 A MYPI20014947 A MY PI20014947A MY PI20014947 A MYPI20014947 A MY PI20014947A MY 156961 A MY156961 A MY 156961A
Authority
MY
Malaysia
Prior art keywords
printed circuit
conductive layer
electrically conductive
underlying portions
metal layer
Prior art date
Application number
MYPI20014947A
Inventor
John A Andresakis
Original Assignee
Oak Mitsui Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oak Mitsui Inc filed Critical Oak Mitsui Inc
Publication of MY156961A publication Critical patent/MY156961A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

THE INVENTION RELATES TO THE MANUFACTURE OF PRINTED CIRCUIT BOARDS HAVING ENCHANCED ETCH UNIFORMITY AND RESOLUTION. THE PROCESS ELIMINATES THE NEED FOR A BLACK OXIDE TREATMENT TO IMPROVE ADHESION AND IMPROVES THE ABILITY TO OPTICALLY INSPECT THE PRINTED CIRCUIT BOARDS. THE PROCESS IS PERFORMED BY CONDUCTING STEPS (A) AND (B) IN EITHER ORDER: A) DEPOSITING A FIRST SURFACE OF AN ELECTRICALLY CONDUCTIVE LAYER ONTO A SUBSTRATE, WHICH ELECTRICALLY CONDUCTIVE LAYER HAS A ROUGHENED SECOND SURFACE OPPOSITE TO THE FIRST SURFACE; B) DEPOSITING A THIN METAL LAYER ONTO THE ROUGHENED SECOND SURFACE OF THE ELECTRICALLY CONDUCTIVE LAYER, WHICH METAL LAYER COMPRISES A MATERIAL HAVING A DIFFERENT ETCH RESISTANCE PROPERTY THAN THAT OF THE ELECTRICALLY CONDUCTIVE LAYER. THEREAFTER ONE DEPOSITS A PHOTORESIST ONTO THE METAL LAYER; IMAGEWISE EXPOSES AND DEVELOPS THE PHOTORESIST, THEREBY REVEALING UNDERLYING PORTIONS OF THE METAL LAYERS. THE ONE REMOVES THE REVEALED UNDERLYING PORTIONS OF THE METAL LAYER, THEREBY REVEALING UNDERLYING PORTIONS OF THE CONDUCTIVE LAYER AND REMOVES THE REVEALED UNDERLYING PORTIONS OF THE CONDUCTIVE LAYER, TO THEREBY PRODUCE A PRINTED CIRCUIT LAYER.
MYPI20014947A 2000-10-26 2001-10-25 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production MY156961A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69761400A 2000-10-26 2000-10-26

Publications (1)

Publication Number Publication Date
MY156961A true MY156961A (en) 2016-04-15

Family

ID=24801816

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20014947A MY156961A (en) 2000-10-26 2001-10-25 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production

Country Status (9)

Country Link
EP (1) EP1332653A1 (en)
JP (1) JP2004512698A (en)
KR (1) KR100899588B1 (en)
CN (1) CN1299546C (en)
AU (1) AU2002211790A1 (en)
CA (1) CA2426124A1 (en)
MY (1) MY156961A (en)
TW (1) TW592009B (en)
WO (1) WO2002035897A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703252B2 (en) * 2002-01-31 2004-03-09 Hewlett-Packard Development Company, L.P. Method of manufacturing an emitter
JP2005285946A (en) * 2004-03-29 2005-10-13 Nippon Mektron Ltd Manufacturing method of circuit board
CN100446640C (en) * 2004-09-09 2008-12-24 广东东硕科技有限公司 An after-treatment fluid for copper surface black oxidation
CN102265711B (en) 2008-12-26 2014-11-05 吉坤日矿日石金属株式会社 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
JP4955106B2 (en) 2008-12-26 2012-06-20 Ｊｘ日鉱日石金属株式会社 Rolled copper foil or electrolytic copper foil for electronic circuit and method for forming electronic circuit using these
CN102265712B (en) * 2008-12-26 2014-10-29 吉坤日矿日石金属株式会社 Method for forming electronic circuit
JP5935163B2 (en) * 2012-03-30 2016-06-15 ナガセケムテックス株式会社 Resist adhesion improver and copper wiring manufacturing method
JP7055049B2 (en) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards.
CN109693080B (en) * 2018-12-24 2020-12-29 江苏弘信华印电路科技有限公司 Burr-free milling process for rigid-flex printed circuit board
TWI781818B (en) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 Surface-treated copper foil and copper clad laminate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2009018B1 (en) * 1970-02-26 1971-04-15 Krause W Process for the production of printed circuit boards
DE2511189C2 (en) * 1975-03-14 1976-10-21 Heinz Bungard METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS
US4756795A (en) * 1986-10-31 1988-07-12 International Business Machines Corporation Raw card fabrication process with nickel overplate
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
JPH0728115B2 (en) * 1989-03-17 1995-03-29 株式会社日立製作所 Printed board and manufacturing method thereof
JPH0787270B2 (en) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 Copper foil for printed circuit and manufacturing method thereof
JPH0681172A (en) * 1992-09-01 1994-03-22 Hitachi Cable Ltd Formation of fine pattern
JP2762386B2 (en) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 Copper-clad laminates and printed wiring boards
JPH08222857A (en) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd Copper foil and high-density multilayered printed circuit board using the foil for its internal-layer circuit
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US5895581A (en) * 1997-04-03 1999-04-20 J.G. Systems Inc. Laser imaging of printed circuit patterns without using phototools
US5989727A (en) * 1998-03-04 1999-11-23 Circuit Foil U.S.A., Inc. Electrolytic copper foil having a modified shiny side
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions

Also Published As

Publication number Publication date
CA2426124A1 (en) 2002-05-02
KR20030044046A (en) 2003-06-02
KR100899588B1 (en) 2009-05-27
AU2002211790A1 (en) 2002-05-06
WO2002035897A1 (en) 2002-05-02
EP1332653A1 (en) 2003-08-06
CN1299546C (en) 2007-02-07
JP2004512698A (en) 2004-04-22
TW592009B (en) 2004-06-11
CN1483303A (en) 2004-03-17
WO2002035897A9 (en) 2003-02-20

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