TW200644745A - Printed wiring board and method for making same - Google Patents

Printed wiring board and method for making same

Info

Publication number
TW200644745A
TW200644745A TW095110501A TW95110501A TW200644745A TW 200644745 A TW200644745 A TW 200644745A TW 095110501 A TW095110501 A TW 095110501A TW 95110501 A TW95110501 A TW 95110501A TW 200644745 A TW200644745 A TW 200644745A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
silicon compound
organic silicon
wiring pattern
Prior art date
Application number
TW095110501A
Other languages
Chinese (zh)
Inventor
Yoshikazu Akashi
Tatsuo Kataoka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200644745A publication Critical patent/TW200644745A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

This invention provides a printed wiring board having a wiring pattern of conductive metal formed on the surface of an insulating film, characterized in that an organic silicon compound is adhered to the surface of the printed wiring board. The printed wiring board of this invention can be made by forming a wiring pattern of a desired shape on an insulating film by selectively etching a conductive metal layer formed through an adhesive agent layer, performing a plating treatment on the wiring pattern, and then performing a heating treatment under the presence of an organic silicon compound, and causing the organic silicon compound to adhere to the surface of the printed wiring board. According to the present invention, a dendrite shape growth of metal between the wiring patterns can be prevented from occurring and a short circuit between the wiring patterns because of migration will not occur easily even if a high voltage is applied thereon.
TW095110501A 2005-03-28 2006-03-27 Printed wiring board and method for making same TW200644745A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005092639A JP2006278524A (en) 2005-03-28 2005-03-28 Printed wiring board and its manufacturing method

Publications (1)

Publication Number Publication Date
TW200644745A true TW200644745A (en) 2006-12-16

Family

ID=37212999

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110501A TW200644745A (en) 2005-03-28 2006-03-27 Printed wiring board and method for making same

Country Status (3)

Country Link
JP (1) JP2006278524A (en)
KR (1) KR20060104918A (en)
TW (1) TW200644745A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7743494B2 (en) * 2008-01-11 2010-06-29 Ppg Industries Ohio, Inc. Process of fabricating a circuit board
KR102265272B1 (en) * 2014-11-04 2021-06-15 삼성전자주식회사 Pcb panel and washing machine having the same
JP2020183064A (en) * 2019-05-07 2020-11-12 東洋製罐グループホールディングス株式会社 Moisture barrier laminated film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311794A (en) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd Manufacture of flexible wiring board

Also Published As

Publication number Publication date
KR20060104918A (en) 2006-10-09
JP2006278524A (en) 2006-10-12

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