AU2002211790A1 - Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production - Google Patents
Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board productionInfo
- Publication number
- AU2002211790A1 AU2002211790A1 AU2002211790A AU1179002A AU2002211790A1 AU 2002211790 A1 AU2002211790 A1 AU 2002211790A1 AU 2002211790 A AU2002211790 A AU 2002211790A AU 1179002 A AU1179002 A AU 1179002A AU 2002211790 A1 AU2002211790 A1 AU 2002211790A1
- Authority
- AU
- Australia
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- fine lines
- board production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69761400A | 2000-10-26 | 2000-10-26 | |
US09/697,614 | 2000-10-26 | ||
PCT/US2001/032400 WO2002035897A1 (en) | 2000-10-26 | 2001-10-17 | Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002211790A1 true AU2002211790A1 (en) | 2002-05-06 |
Family
ID=24801816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002211790A Abandoned AU2002211790A1 (en) | 2000-10-26 | 2001-10-17 | Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1332653A1 (en) |
JP (1) | JP2004512698A (en) |
KR (1) | KR100899588B1 (en) |
CN (1) | CN1299546C (en) |
AU (1) | AU2002211790A1 (en) |
CA (1) | CA2426124A1 (en) |
MY (1) | MY156961A (en) |
TW (1) | TW592009B (en) |
WO (1) | WO2002035897A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6703252B2 (en) * | 2002-01-31 | 2004-03-09 | Hewlett-Packard Development Company, L.P. | Method of manufacturing an emitter |
JP2005285946A (en) * | 2004-03-29 | 2005-10-13 | Nippon Mektron Ltd | Manufacturing method of circuit board |
CN100446640C (en) * | 2004-09-09 | 2008-12-24 | 广东东硕科技有限公司 | An after-treatment fluid for copper surface black oxidation |
US8580390B2 (en) | 2008-12-26 | 2013-11-12 | Jx Nippon Mining & Metals Corporation | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same |
JP4955105B2 (en) | 2008-12-26 | 2012-06-20 | Jx日鉱日石金属株式会社 | Rolled copper foil or electrolytic copper foil for electronic circuit and method for forming electronic circuit using these |
EP2373132A1 (en) | 2008-12-26 | 2011-10-05 | JX Nippon Mining & Metals Corporation | Method for forming electronic circuit |
JP5935163B2 (en) * | 2012-03-30 | 2016-06-15 | ナガセケムテックス株式会社 | Resist adhesion improver and copper wiring manufacturing method |
JP7055049B2 (en) * | 2017-03-31 | 2022-04-15 | Jx金属株式会社 | Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards. |
CN109693080B (en) * | 2018-12-24 | 2020-12-29 | 江苏弘信华印电路科技有限公司 | Burr-free milling process for rigid-flex printed circuit board |
TWI781818B (en) * | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | Surface-treated copper foil and copper clad laminate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2009018B1 (en) * | 1970-02-26 | 1971-04-15 | Krause W | Process for the production of printed circuit boards |
DE2511189C2 (en) * | 1975-03-14 | 1976-10-21 | Heinz Bungard | METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS |
US4756795A (en) * | 1986-10-31 | 1988-07-12 | International Business Machines Corporation | Raw card fabrication process with nickel overplate |
US4971894A (en) * | 1989-02-13 | 1990-11-20 | International Business Machines Corporation | Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer |
JPH0728115B2 (en) * | 1989-03-17 | 1995-03-29 | 株式会社日立製作所 | Printed board and manufacturing method thereof |
JPH0787270B2 (en) * | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | Copper foil for printed circuit and manufacturing method thereof |
JPH0681172A (en) * | 1992-09-01 | 1994-03-22 | Hitachi Cable Ltd | Formation of fine pattern |
JP2762386B2 (en) * | 1993-03-19 | 1998-06-04 | 三井金属鉱業株式会社 | Copper-clad laminates and printed wiring boards |
JPH08222857A (en) * | 1995-02-16 | 1996-08-30 | Mitsui Mining & Smelting Co Ltd | Copper foil and high-density multilayered printed circuit board using the foil for its internal-layer circuit |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
US5679230A (en) * | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US5895581A (en) * | 1997-04-03 | 1999-04-20 | J.G. Systems Inc. | Laser imaging of printed circuit patterns without using phototools |
US5989727A (en) * | 1998-03-04 | 1999-11-23 | Circuit Foil U.S.A., Inc. | Electrolytic copper foil having a modified shiny side |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
-
2001
- 2001-10-17 KR KR1020037005804A patent/KR100899588B1/en not_active IP Right Cessation
- 2001-10-17 JP JP2002538728A patent/JP2004512698A/en active Pending
- 2001-10-17 CN CNB018213170A patent/CN1299546C/en not_active Expired - Fee Related
- 2001-10-17 EP EP01979868A patent/EP1332653A1/en not_active Withdrawn
- 2001-10-17 CA CA002426124A patent/CA2426124A1/en not_active Abandoned
- 2001-10-17 WO PCT/US2001/032400 patent/WO2002035897A1/en active Application Filing
- 2001-10-17 AU AU2002211790A patent/AU2002211790A1/en not_active Abandoned
- 2001-10-25 TW TW090126408A patent/TW592009B/en not_active IP Right Cessation
- 2001-10-25 MY MYPI20014947A patent/MY156961A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2004512698A (en) | 2004-04-22 |
WO2002035897A9 (en) | 2003-02-20 |
CA2426124A1 (en) | 2002-05-02 |
CN1483303A (en) | 2004-03-17 |
TW592009B (en) | 2004-06-11 |
MY156961A (en) | 2016-04-15 |
CN1299546C (en) | 2007-02-07 |
EP1332653A1 (en) | 2003-08-06 |
KR100899588B1 (en) | 2009-05-27 |
KR20030044046A (en) | 2003-06-02 |
WO2002035897A1 (en) | 2002-05-02 |
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