AU5769300A - Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards - Google Patents
Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boardsInfo
- Publication number
- AU5769300A AU5769300A AU57693/00A AU5769300A AU5769300A AU 5769300 A AU5769300 A AU 5769300A AU 57693/00 A AU57693/00 A AU 57693/00A AU 5769300 A AU5769300 A AU 5769300A AU 5769300 A AU5769300 A AU 5769300A
- Authority
- AU
- Australia
- Prior art keywords
- circuit boards
- electrical characteristics
- signal traces
- layered circuit
- adjusting electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34313299A | 1999-06-29 | 1999-06-29 | |
US09343132 | 1999-06-29 | ||
PCT/US2000/017618 WO2001001453A2 (en) | 1999-06-29 | 2000-06-27 | Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5769300A true AU5769300A (en) | 2001-01-31 |
Family
ID=23344839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU57693/00A Abandoned AU5769300A (en) | 1999-06-29 | 2000-06-27 | Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU5769300A (en) |
WO (1) | WO2001001453A2 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6838954B2 (en) * | 2002-06-27 | 2005-01-04 | Harris Corporation | High efficiency quarter-wave transformer |
US6963259B2 (en) * | 2002-06-27 | 2005-11-08 | Harris Corporation | High efficiency resonant line |
US6794952B2 (en) * | 2002-06-27 | 2004-09-21 | Harris Corporation | High efficiency low pass filter |
US6737932B2 (en) * | 2002-06-27 | 2004-05-18 | Harris Corporation | Broadband impedance transformers |
US6741148B2 (en) * | 2002-06-27 | 2004-05-25 | Harris Corporation | High efficiency coupled line filters |
US6753814B2 (en) * | 2002-06-27 | 2004-06-22 | Harris Corporation | Dipole arrangements using dielectric substrates of meta-materials |
US6731244B2 (en) | 2002-06-27 | 2004-05-04 | Harris Corporation | High efficiency directional coupler |
US6727785B2 (en) * | 2002-06-27 | 2004-04-27 | Harris Corporation | High efficiency single port resonant line |
US6781486B2 (en) | 2002-06-27 | 2004-08-24 | Harris Corporation | High efficiency stepped impedance filter |
US6825743B2 (en) * | 2002-06-27 | 2004-11-30 | Harris Corporation | Substrate enhancement for improved signal characteristics on a discontinuous transmission line |
US6750740B2 (en) | 2002-06-27 | 2004-06-15 | Harris Corporation | High efficiency interdigital filters |
US6842140B2 (en) * | 2002-12-03 | 2005-01-11 | Harris Corporation | High efficiency slot fed microstrip patch antenna |
US6982671B2 (en) | 2003-02-25 | 2006-01-03 | Harris Corporation | Slot fed microstrip antenna having enhanced slot electromagnetic coupling |
US6995711B2 (en) | 2003-03-31 | 2006-02-07 | Harris Corporation | High efficiency crossed slot microstrip antenna |
US6791496B1 (en) * | 2003-03-31 | 2004-09-14 | Harris Corporation | High efficiency slot fed microstrip antenna having an improved stub |
US7006052B2 (en) | 2003-05-15 | 2006-02-28 | Harris Corporation | Passive magnetic radome |
US6975279B2 (en) | 2003-05-30 | 2005-12-13 | Harris Foundation | Efficient radome structures of variable geometry |
US6985118B2 (en) | 2003-07-07 | 2006-01-10 | Harris Corporation | Multi-band horn antenna using frequency selective surfaces |
US6992628B2 (en) | 2003-08-25 | 2006-01-31 | Harris Corporation | Antenna with dynamically variable operating band |
US7030834B2 (en) | 2003-09-03 | 2006-04-18 | Harris Corporation | Active magnetic radome |
US6990729B2 (en) | 2003-09-05 | 2006-01-31 | Harris Corporation | Method for forming an inductor |
US7088308B2 (en) | 2003-10-08 | 2006-08-08 | Harris Corporation | Feedback and control system for radomes |
US7196607B2 (en) | 2004-03-26 | 2007-03-27 | Harris Corporation | Embedded toroidal transformers in ceramic substrates |
US7186922B2 (en) * | 2004-04-28 | 2007-03-06 | Infineon Technologies Ag | Circuit board |
US7158005B2 (en) | 2005-02-10 | 2007-01-02 | Harris Corporation | Embedded toroidal inductor |
JP5559265B2 (en) | 2012-07-30 | 2014-07-23 | ファナック株式会社 | Power conversion device in which switching elements are connected in parallel and driven in parallel |
US20220270989A1 (en) * | 2021-02-24 | 2022-08-25 | Intel Corporation | Integrated circuit supports with microstrips |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0180974U (en) * | 1987-11-20 | 1989-05-30 | ||
US5604017A (en) * | 1990-04-12 | 1997-02-18 | Arlon, Inc. | Multi-dielectric laminates |
JP2500235B2 (en) * | 1991-02-07 | 1996-05-29 | 富士通株式会社 | Thin film circuit board and manufacturing method thereof |
JPH04352498A (en) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | Insulation paste for electromagnetic shield with high permeability |
JPH05206591A (en) * | 1992-01-28 | 1993-08-13 | Hitachi Ltd | Printed wiring board and manufacture thereof |
JPH05299792A (en) * | 1992-04-23 | 1993-11-12 | Nitto Denko Corp | High frequency circuit board |
JPH06132418A (en) * | 1992-10-14 | 1994-05-13 | Mitsubishi Electric Corp | High-frequency hybrid integrated circuit device |
US5450286A (en) * | 1992-12-04 | 1995-09-12 | Parlex Corporation | Printed circuit having a dielectric covercoat |
JPH06283907A (en) * | 1993-03-24 | 1994-10-07 | Nippon Chemicon Corp | Microstrip line |
JPH06283909A (en) * | 1993-03-24 | 1994-10-07 | Nippon Chemicon Corp | Circuit element for microstrip line |
JP2500783B2 (en) * | 1993-09-02 | 1996-05-29 | 日本電気株式会社 | Printed board |
JPH0878940A (en) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | Microstrip transmission line substrate, manufacture of the same and circuit module using the same |
JPH09260797A (en) * | 1996-03-22 | 1997-10-03 | Sony Corp | Wiring board |
-
2000
- 2000-06-27 AU AU57693/00A patent/AU5769300A/en not_active Abandoned
- 2000-06-27 WO PCT/US2000/017618 patent/WO2001001453A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2001001453A2 (en) | 2001-01-04 |
WO2001001453A3 (en) | 2001-07-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |