CN104105346B - A kind of manufacture method with bump pad printed board - Google Patents

Abstract

The present invention relates to a kind of manufacture method with bump pad printed board, comprise the following steps：First according to the circuit made in advance, printed wiring is produced on metal-based layer using etch process；Once sink copper after first time plating, etching, then to printed board, i.e., sink the thin copper of last layer in printing board surface；Then secondary pattern transfer is carried out, i.e., is come needing prominent pad to expose, other places are covered with dry film；Then graphic plating is carried out to exposing the pad come, thick thicken of copper of bump pad is arrived setting thickness；Finally carry out acid etching and produce bump pad.Compared with prior art, the present invention uses simple and feasible method, solve thes problems, such as that PCB pad heights and the local height of surrounding covering welding resistance are inconsistent, ensure that the uniformity of PCB surface.

Description

A kind of manufacture method with bump pad printed board

Technical field

The present invention relates to printed wiring board manufacture technology field, more particularly, to a kind of manufacture with bump pad printed board Method.

Background technology

Existing ordinary printed plate is mainly processed using etch process, i.e., first covers layers of copper on the insulating layer, then pass through erosion The method at quarter etches away unnecessary copper, forms required line pattern.As shown in figure 1, the pad 101 of printing board surface with The height of surrounding circuit is the same, and when circuit surface covers welding resistance 102, the height that will result in pad 101 is covered than surrounding Lid welding resistance 102 it is local low, this will cause in test process produce loose contact phenomenon.

The content of the invention

It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of band bump pad print The manufacture method of making sheet.

The purpose of the present invention can be achieved through the following technical solutions：

A kind of manufacture method with bump pad printed board, it is characterised in that comprise the following steps：

First according to the circuit made in advance, printed wiring is produced on metal-based layer using etch process；

Once sink copper after first time plating, etching, then to printed board, i.e., sink last layer in printing board surface Thin copper；

Then secondary pattern transfer is carried out, i.e., is come needing prominent pad to expose, other places are covered with dry film；

Then graphic plating is carried out to exposing the pad come, thick thicken of copper of bump pad is arrived setting thickness；

Finally carry out acid etching and produce bump pad.

The copper thickness of bump pad needs to meet following condition：Ensure bump pad and the height one at surrounding covering welding resistance Sample.

Compared with prior art, the present invention by simple and feasible method efficiently solve PCB bond pad surfaces height with The problem of place of surrounding covering welding resistance is highly inconsistent, ensure that the uniformity of PCB surface, has reached test request.

Brief description of the drawings

Fig. 1 is current common printed board pad and the structure diagram of welding resistance.

Indicated in figure as follows：101 be pad, and 102 be solder mask, and 103 be dielectric layer

Fig. 2 is the structure diagram with prominent copper point on pad of the present invention.

Indicated in figure as follows：201 be pad, and 202 be solder mask, and 203 be dielectric layer, and 204 be by second time electroplating processus aboralis The pad gone out

Embodiment

The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.

Embodiment

As shown in Fig. 2 a kind of manufacture method with bump pad printed board, comprises the following steps：

First according to the circuit that makes in advance, printed wiring is produced on metal-based layer using etch process, by the After once electroplating, etching, then once sink copper to printed board, i.e., sink the thin copper of last layer in PCB surface,

Then second of pattern transfer is carried out, i.e., is come needing prominent pad 201 to expose, other places are covered with dry film Lid,

Then graphic plating is carried out to exposing the pad 201 come, the copper thickness of bump pad 201 is thickeied to desired thickness Degree, that is, ensure bump pad 204 as 202 height at surrounding covering welding resistance,

Finally carry out acid etching and produce bump pad 204.

Claims (1)

1. a kind of manufacture method with bump pad printed board, it is characterised in that comprise the following steps：

First according to the circuit made in advance, printed wiring is produced on metal-based layer using etch process；

Once sink copper after first time plating, etching, then to printed board, i.e., it is thin to sink last layer in printing board surface Copper；

Then secondary pattern transfer is carried out, i.e., is come needing prominent pad to expose, other places are covered with dry film；

Then graphic plating is carried out to exposing the pad come, thick thicken of copper of bump pad is arrived setting thickness；

Finally carry out acid etching and produce bump pad；

The copper thickness of bump pad needs to meet following condition：Ensure bump pad as the height at surrounding covering welding resistance.