CN107347230B - The preparation method of circuit board - Google Patents
The preparation method of circuit board Download PDFInfo
- Publication number
- CN107347230B CN107347230B CN201610295557.1A CN201610295557A CN107347230B CN 107347230 B CN107347230 B CN 107347230B CN 201610295557 A CN201610295557 A CN 201610295557A CN 107347230 B CN107347230 B CN 107347230B
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- China
- Prior art keywords
- layer
- cover film
- conductive circuit
- circuit layer
- exposure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of preparation method of circuit board, comprising: copper-clad base plate, including base and copper foil layer are provided；Conducting wire is etched in copper foil layer, to obtain conductive circuit layer；The first transparent cover film is covered on surface of the conductive circuit layer far from base, so that it is filled in conductive circuit layer and is formed by gap；Base is removed with exposed conductor lines layer, and covers photosensitive layer on the surface that conductive circuit layer is exposed, wherein photosensitive layer include and the first cover film for being filled in gap corresponding to first part and the second part in addition to first part；Using conductive circuit layer as light shield and egative film, development is exposed to remove second part with exposed conductor lines layer；Copper facing is in exposed conductive circuit layer to form copper plate；The first cover film that removing first part is filled in gap with exposure；And the second cover film is covered on copper plate, and make in conjunction with its first cover film with the exposure, to obtain the circuit board.
Description
Technical field
The present invention relates to a kind of preparation methods of circuit board.
Background technique
As the function of the portable electronic devices such as mobile phone is continuously increased, the circuit board also side towards diversification multi-class
To development.Although circuit board it is light, thin, short, small be future development trend, in some special dimensions (for example, electronic equipment is electric
The increase of source consumption causes power supply not to be able to satisfy the continuation of the journey requirement of electronic equipment, since rapid nitriding solves to a certain extent
Determine this problem, it is therefore desirable to which circuit board can meet the needs of large current charge), it is also desirable to circuit board has biggish copper thick
And lesser line width line-spacing.
Currently, lamina be usually by blanking, pressing dry film, exposure development, etching, pressing cover film and etc. preparation.
However, such preparation method can not be used to prepare the single layer of copper thickness larger (such as larger than 30 μm) due to the limitation of etch capabilities
Plate.
Summary of the invention
In view of this, the present invention provides a kind of circuit board that can be used in preparation and have larger copper thickness.
The present invention provides a kind of preparation method of circuit board, comprising: provides a copper-clad base plate comprising the base of an insulation
And it is formed in the copper foil layer in the substrate surface；Required conducting wire is etched in the copper foil layer, to obtain one
Conductive circuit layer；A first transparent cover film is covered on surface of the conductive circuit layer far from the base, covers this first
Epiphragma is filled in the conductive circuit layer and is formed by gap；The base is removed with the exposure conductive circuit layer, and in the conduction
A photosensitive layer is covered on the surface that line layer is exposed, wherein the photosensitive layer includes one first covering with what is be filled in the gap
First part corresponding to epiphragma and the second part in addition to the first part；Using the conductive circuit layer as light shield and bottom
Piece is exposed development to remove the second part of the photosensitive layer with the exposure conductive circuit layer；In the conducting wire of the exposure
Copper facing is on layer to form a copper plate corresponding with the conductive circuit layer；The first part of the photosensitive layer is removed to be filled in exposure
The first cover film in the gap；And one second cover film is covered on surface of the copper plate far from first cover film,
Make second cover film in conjunction with the first cover film of the exposure, to obtain the circuit board.
The present invention also provides a kind of preparation methods of circuit board, comprising: provides a copper foil layer；Wherein the one of the copper foil layer
A first transparent cover film is covered on surface；Required conducting wire is etched in the copper foil layer, to obtain a conduction
Line layer；A photosensitive layer is covered in the conductive circuit layer, so that the photosensitive layer is filled in the conductive circuit layer and is formed by gap
In, wherein the photosensitive layer include one with the conductive circuit layer be formed by first part corresponding to gap and except this first
Second part except part；Using the conductive circuit layer as light shield and egative film, development is exposed to remove the photosensitive layer
Second part is with the exposure conductive circuit layer；Copper facing is in the conductive circuit layer of the exposure to form one and the conductive circuit layer pair
The copper plate answered；The first part of the photosensitive layer is removed with the first cover film corresponding to the exposed and gap；And in the plating
One second cover film is covered on surface of the layers of copper far from first cover film, makes second cover film and the first covering of the exposure
Film combines, to obtain the circuit board.
The copper thickness of the circuit board prepared by preparation method of the invention is the thickness of the copper foil layer and the thickness of the copper plate
The sum of, since the thickness of the copper plate can be adjusted by the control copper facing time, the copper of the circuit board is thick controllable, that is, can
The thick biggish circuit board of copper is obtained according to specific requirements.
Detailed description of the invention
Fig. 1 is the cross-sectional view for the copper-clad base plate that a better embodiment of the invention provides.
Fig. 2 is that image transfer is carried out on double-sided copper-clad substrate shown in Fig. 1 to form the cross-sectional view after conductive circuit layer.
Fig. 3 is that the cross-sectional view after one first cover film is pressed in conductive circuit layer shown in Fig. 2.
Fig. 4 is the cross-sectional view covered after a photosensitive layer in conductive circuit layer shown in Fig. 3.
Fig. 5 is to remove part photosensitive layer shown in Fig. 4 with the cross-sectional view after exposed conductor lines layer.
Fig. 6 is the cross-sectional view shown in Fig. 5 in conductive circuit layer after formation copper plate.
Fig. 7 is by remaining photosensitive layer removing shown in fig. 6 with the cross-sectional view after the first cover film of expose portion.
Fig. 8 is the cross-sectional view that the circuit board obtained after the second cover film is covered on copper plate shown in Fig. 7.
Fig. 9 is the cross-sectional view for the copper foil layer that another embodiment of the present invention provides.
Figure 10 is the cross-sectional view covered after the first cover film on copper foil layer shown in Fig. 9.
Figure 11 is to carry out image transfer on copper foil layer shown in Fig. 10 to obtain the cross-sectional view after conductive circuit layer.
Figure 12 is that the cross-sectional view after photosensitive layer is covered in the conductive circuit layer shown in Figure 11.
Figure 13 is to remove part photosensitive layer shown in Figure 12 with the cross-sectional view after exposed conductor lines layer.
Figure 14 is that the cross-sectional view after copper plate is formed in the conductive circuit layer of exposure shown in Figure 13.
Figure 15 is the remaining photosensitive layer removing shown in Figure 14 with the cross-sectional view after the first cover film of exposure.
Main element symbol description
| Circuit board | 100 |
| Copper-clad base plate | 10 |
| Base | 11 |
| Copper foil layer | 12 |
| Conductive circuit layer | 120 |
| First cover film | 20 |
| First cementing layer | 21 |
| First coating | 22 |
| Photosensitive layer | 30 |
| First part | 31 |
| Second part | 32 |
| Copper plate | 40 |
| Second cover film | 50 |
| Second cementing layer | 51 |
| Second coating | 52 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Circuit board 100 provided by the invention and preparation method thereof is made furtherly below in conjunction with Fig. 1 ~ 15 and embodiment
It is bright.Wherein, the circuit board 100 can be rigid-flex combined board, High Density Integration plate and IC support plate.
Fig. 1 ~ 8 are please referred to, the preparation method for the circuit board 100 that a better embodiment of the invention provides includes following step
It is rapid:
Step 1, referring to Fig. 1, providing a copper-clad base plate 10.
The copper-clad base plate 10 includes a base 11 insulated and the copper foil layer 12 being formed on the surface of the base 11.
Wherein, the copper foil layer 12 with a thickness of a.The material of the base 11 can be selected from polyimides (polyimide, PI), be poly- to benzene two
Formic acid glycol ester (Polyethylene Terephthalate, PET) and polyethylene naphthalate
One of (Polyethylene Naphthalate, PEN) etc..
Step 2, referring to Fig. 2, required conducting wire is etched in the copper foil layer 12 using image transfer technology,
To obtain a conductive circuit layer 120.Wherein, the line width line-spacing of the conductive circuit layer 120 is respectively b and c.
Step 3, referring to Fig. 3, covering one transparent the on the surface of the conductive circuit layer 120 far from the base 11
One cover film 20, and first cover film 20 is pressed so that it, which flows and is filled in the conductive circuit layer 120, is formed by gap
In.
It should be understood that first cover film 20 is in semi-cured state, it is therefore, flowable during the pressing process and fill
It is formed by gap in the conductive circuit layer 120.
In the present embodiment, which includes that one first cementing layer 21 and one first of lamination setting covers
Cap rock 22, first cementing layer 21 are covered in the conductive circuit layer 120 and are filled between the conductive circuit layer 120 is formed by
In gap, which is covered on the surface of the first cementing layer 21 far from the conductive circuit layer 120.
Step 4, referring to Fig. 4, removing the base 11 with the exposure conductive circuit layer 120, and in the conductive circuit layer
A photosensitive layer 30 is covered on 120 surfaces exposed.Wherein, which includes one and is filled in the conductive circuit layer 120
It is formed by first part 31 corresponding to the first cover film 20 in gap and second in addition to the first part 31
Divide 32.
In the present embodiment, the photosensitive layer 30 is a photo-polymerization type photosensitive dry film.
Step 5, referring to Fig. 5, being removed using exposure development technology should using conductive circuit layer 120 as light shield and egative film
The second part 32 of photosensitive layer 30 is with the exposure conductive circuit layer 120.
In the present embodiment, the light transmittance of first cover film 20 is greater than 90%.Preferably, first cover film 20
The material of first cementing layer 21 is common pure glue, and the material of the first coating 22 is polyethylene terephthalate, can
It is obtained by way of low temperature pressure transmission.
Specifically, by after the removal base 11 conductive circuit layer 120 and the first cover film 20 be placed in an exposure machine (figure
Do not show) in, keep first cover film 20 opposite with the ultraviolet source of the exposure machine, then control ultraviolet source towards this
One cover film, 20 emitting ultraviolet light.Since 20 light transmittance of the first cover film is higher and the conductive circuit layer 120 is opaque, because
This, in exposure, ultraviolet light, which only may pass through, is filled in the first cover film 20 that the conductive circuit layer 120 is formed by gap simultaneously
It exposes in the first part 31 of the photosensitive layer 30.It should be understood that photo-polymerization type photosensitive dry film is made of high-molecular compound,
In exposure, which can occur polymerization reaction under ultraviolet irradiation and be attached to first cover film 20.
In development, the second part 32 of polymerization reaction does not occur and is removed in the effect of developer, and occur polymerization reaction this
A part 31 is then retained.Further, since the conductive circuit layer 120 is opaque, and during exposure development, the conducting wire
Layer 120 can be used directly as light shield and egative film, pattern shift when being conducive to that route is avoided to process.
Step 6, referring to Fig. 6, copper facing is in the conductive circuit layer 120 of the exposure to form one and the conductive circuit layer
120 corresponding copper plates 40.
It is appreciated that the thickness f of the copper plate 40 can be adjusted by the control copper facing time.In addition, if the copper plate 40
In there are isolated areas, the isolated area can be connected by way of copper facing lead.
Step 7 is filled in the conductive circuit layer referring to Fig. 7, removing the first part 31 of the photosensitive layer 30 with exposure
120 are formed by the first cover film 20 in gap.
Step 8, referring to Fig. 8, one second covering of covering on the surface of the copper plate 40 far from first cover film 20
Film 50, and second cover film 50 is pressed so that it is combined with the first cover film 20 of the exposure, to obtain the circuit board
100。
It should be understood that second cover film 50 be in semi-cured state, during the pressing process flowing and with the exposure
First cover film 20 combines.
In the present embodiment, which includes that one second cementing layer 51 and one second of lamination setting covers
Cap rock 52, second cementing layer 51 are covered on the copper plate 40 and are filled on the first cover film 20 of the exposure, this second
Coating 52 is covered on the surface of the second cementing layer 51 far from the copper plate 40.Wherein, second cementing layer 51 and
The material of two coatings 52 can be identical or different with the material of first cementing layer 21 and the first coating 22 respectively.
Fig. 9 ~ 15 are please referred to, the preparation method for the circuit board 100 that another embodiment of the present invention provides includes the following steps:
Step 1, referring to Fig. 9, providing a copper foil layer 12.
Step 2, referring to Fig. 10, covering a first transparent cover film 20 on a wherein surface for the copper foil layer 12.
In the present embodiment, which includes that one first cementing layer 21 and one first of lamination setting covers
Cap rock 22, first cementing layer 21 are covered on the copper foil layer 12, and it is remote which is covered in first cementing layer 21
On surface from the copper foil layer 12.
Step 3 please refers to Figure 11, etches required conducting wire in the copper foil layer 12 using image transfer technology,
To obtain a conductive circuit layer 120.
Step 4 please refers to Figure 12, and a photosensitive layer 30 is covered in the conductive circuit layer 120, and presses the photosensitive layer 30
It is formed by gap so that it is filled in the conductive circuit layer 120.Wherein, which includes one and the conductive circuit layer
120 are formed by first part 31 corresponding to gap and the second part 32 in addition to the first part 31.
In the present embodiment, the photosensitive layer 30 is a photo-polymerization type photosensitive dry film.
It should be understood that the photosensitive layer 30 is in semi-cured state, flows during the pressing process and be filled in the conductor wire
Road floor 120 is formed by gap.
Step 5 please refers to Figure 13, using conductive circuit layer 120 as light shield and egative film, is removed using exposure development technology
The second part 32 of the photosensitive layer 30 is with the exposure conductive circuit layer 120.
Step 6 please refers to Figure 14, and copper facing is in the conductive circuit layer 120 of the exposure to form one and the conductive circuit layer
120 corresponding copper plates 40.
Step 7 please refers to Figure 15, removes the first part 31 of the photosensitive layer 30 with exposed and 120 institute of conductive circuit layer
First cover film 20 corresponding to the gap of formation.
Step 8 covers one second referring to Fig. 8 on the surface of the copper plate 40 far from first cover film 20
Cover film 50, and second cover film 50 is pressed so that it is combined with the first cover film 20 of the exposure, to obtain the circuit
Plate 100.
It is appreciated that since the preparation method of the embodiment does not need the base of removal copper-clad base plate, to can avoid
100 surface of circuit board generates gauffer and fracture.
The copper thickness of the above circuit board 100 is the thickness a(i.e. thickness of the conductive circuit layer 120 of the copper foil layer 12) and the plating
The sum of thickness f of layers of copper 40, since the thickness f of the copper plate 40 can be adjusted by the control copper facing time, the circuit board
100 copper is thick controllable, that is, the thick biggish circuit board 100 of copper can be obtained according to specific requirements.In addition, the thickness a of the copper foil layer 12
It can be selected according to etch capabilities, therefore can get the conductive circuit layer 120 with smaller line width b and smaller line-spacing c.
It is understood that above embodiments are only used to illustrate the present invention, it is not used as limitation of the invention.For this
For the those of ordinary skill in field, the various other changes and modifications made in accordance with the technical idea of the present invention, all
It falls within the scope of protection of the claims of the present invention.
Claims (9)
1. a kind of preparation method of circuit board, comprising:
There is provided a copper-clad base plate comprising the base of an insulation and the copper foil layer being formed in the substrate surface；
Required conducting wire is etched in the copper foil layer, to obtain a conductive circuit layer；
A first transparent cover film is covered on surface of the conductive circuit layer far from the base, fills first cover film
It is formed by gap in the conductive circuit layer；
The base is removed with the exposure conductive circuit layer, and covers a photosensitive layer on the surface that the conductive circuit layer is exposed,
Wherein, which includes one with first part corresponding to the first cover film for being filled in the gap and except this first
/ outer second part；
Towards the first cover film emitting ultraviolet light, using the conductive circuit layer as light shield and egative film, development is exposed to move
Except the second part of the photosensitive layer is with the exposure conductive circuit layer；
Copper facing is in the conductive circuit layer of the exposure to form a copper plate corresponding with the conductive circuit layer；
Remove the first cover film that the first part of the photosensitive layer is filled in the gap with exposure；And
On surface of the copper plate far from first cover film cover a second transparent cover film, make second cover film with
First cover film of the exposure combines, to obtain the circuit board.
2. the preparation method of circuit board as described in claim 1, which is characterized in that the material of the base be selected from polyimides,
One of polyethylene terephthalate and polyethylene naphthalate.
3. the preparation method of circuit board as described in claim 1, which is characterized in that first cover film includes what lamination was arranged
One first cementing layer and one first coating, first cementing layer are covered in the conductive circuit layer and are filled in the gap,
First coating is covered in first cementing layer far from the surface of the conductive circuit layer.
4. the preparation method of circuit board as claimed in claim 3, which is characterized in that the material of first cementing layer is pure glue,
The material of first coating is polyethylene terephthalate.
5. the preparation method of circuit board as described in claim 1, which is characterized in that the photosensitive layer is that a photo-polymerization type is photosensitive
Dry film.
6. the preparation method of circuit board as described in claim 1, which is characterized in that the light transmittance of first cover film is greater than
90%.
7. the preparation method of circuit board as described in claim 1, which is characterized in that second cover film includes what lamination was arranged
One second cementing layer and one second coating, second cementing layer are covered on the copper plate and are filled in the first of the exposure
On cover film, which is covered in second cementing layer far from the surface of the copper plate.
8. the preparation method of circuit board as described in claim 1, which is characterized in that first cover film is flowed in pressing
And be filled in the conductive circuit layer and be formed by gap, first cover film of second cover film in pressing with the exposure
In conjunction with.
9. a kind of preparation method of circuit board, comprising:
One copper foil layer is provided；
A first transparent cover film is covered on a wherein surface for the copper foil layer；
Required conducting wire is etched in the copper foil layer, to obtain a conductive circuit layer；
A photosensitive layer is covered in the conductive circuit layer, so that the photosensitive layer is filled in the conductive circuit layer and is formed by gap,
Wherein, which includes one and the conductive circuit layer is formed by first part corresponding to gap and except the first part
Except second part；
Towards the first cover film emitting ultraviolet light, using the conductive circuit layer as light shield and egative film, development is exposed to move
Except the second part of the photosensitive layer is with the exposure conductive circuit layer；
Copper facing is in the conductive circuit layer of the exposure to form a copper plate corresponding with the conductive circuit layer；
The first part of the photosensitive layer is removed with the first cover film corresponding to the exposed and gap；And
One second cover film is covered on surface of the copper plate far from first cover film, makes second cover film and the exposure
The first cover film combine, to obtain the circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295557.1A CN107347230B (en) | 2016-05-06 | 2016-05-06 | The preparation method of circuit board |
| TW105114799A TWI630854B (en) | 2016-05-06 | 2016-05-13 | Method for making circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295557.1A CN107347230B (en) | 2016-05-06 | 2016-05-06 | The preparation method of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107347230A CN107347230A (en) | 2017-11-14 |
| CN107347230B true CN107347230B (en) | 2019-08-20 |
Family
ID=60253932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610295557.1A Active CN107347230B (en) | 2016-05-06 | 2016-05-06 | The preparation method of circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107347230B (en) |
| TW (1) | TWI630854B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111629527B (en) * | 2020-06-12 | 2023-07-04 | 东莞市龙谊电子科技有限公司 | Manufacturing method of flexible circuit board and flexible circuit board thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04294594A (en) * | 1991-03-25 | 1992-10-19 | Fujitsu Ltd | Method for forming wiring pattern of printed circuit board |
| CN102196668A (en) * | 2010-03-08 | 2011-09-21 | 宏恒胜电子科技（淮安）有限公司 | Method for manufacturing circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW592007B (en) * | 2003-10-17 | 2004-06-11 | Phoenix Prec Technology Corp | Build-up circuit board with conductive barrier structure and method for fabricating the same |
| JP6009300B2 (en) * | 2012-09-27 | 2016-10-19 | 新光電気工業株式会社 | Wiring board and manufacturing method thereof |
| CN202998646U (en) * | 2012-12-17 | 2013-06-12 | 四川深北电路科技有限公司 | HDI printed circuit board |
-
2016
- 2016-05-06 CN CN201610295557.1A patent/CN107347230B/en active Active
- 2016-05-13 TW TW105114799A patent/TWI630854B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04294594A (en) * | 1991-03-25 | 1992-10-19 | Fujitsu Ltd | Method for forming wiring pattern of printed circuit board |
| CN102196668A (en) * | 2010-03-08 | 2011-09-21 | 宏恒胜电子科技（淮安）有限公司 | Method for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107347230A (en) | 2017-11-14 |
| TWI630854B (en) | 2018-07-21 |
| TW201801582A (en) | 2018-01-01 |
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