CN202998646U - HDI printed circuit board - Google Patents
HDI printed circuit board Download PDFInfo
- Publication number
- CN202998646U CN202998646U CN 201220697597 CN201220697597U CN202998646U CN 202998646 U CN202998646 U CN 202998646U CN 201220697597 CN201220697597 CN 201220697597 CN 201220697597 U CN201220697597 U CN 201220697597U CN 202998646 U CN202998646 U CN 202998646U
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- circuit board
- semi
- copper foil
- layer
- blind hole
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Abstract
The utility model discloses an HDI circuit board and particularly relates to a plated copper layer structure of an HDI printed circuit board. The HDI printed circuit board comprises a circuit board body, semi-solidified layers, ester copper foil layers, and blind holes arranged in the circuit board body, wherein the semi-solidified layers are uniform in thickness and are arranged on the circuit board body, and the ester copper foil layer is arranged on the semi-solidified layers. With the HDI printed circuit board adopted, the board surface of the circuit board body can be ensured to be smooth, and the phenomenon of open circuit due to the existence of the blind holes can be avoided when the circuit board is press-molded.
Description
Technical field
The utility model discloses a kind of HDI circuit board, especially a kind of HDI printed circuit board plated copper layer structure.
Background technology
Printed circuit board (Printed Circuit Board is called for short PCB).Electronic product is to light, thin, short and smallization direction fast development, promoted printed circuit board to high accuracy, high density, the progress of graph thinning direction, high density interconnect (High Density Interconnect, HDI) technology is flourish under this background, be widely used in the IC encapsulation, computer and peripheral equipment thereof, the every field such as consumer electronics product, Aero-Space, military affairs.modern printed circuit board has just risen HDI (high density interconnect) technology, in order to pursue more function, need to be at the less more line of zone energy cloth, to reach better design effect, a large amount of blind holes that adopt in the circuit board plate body, these blind hole diameter approximately 50um to 125um, the degree of depth approximately 25um to 50um, radius-thickness ratio is about 2: 1 to 5: 1, in the blind hole electroplating process, the little current DC of general employing is electroplated, because the blind hole port area of printing board surface is areas of high current density, and be low current density areas in blind hole, regional in high current densities during electro-coppering, it is just thick that copper deposits, in low current density areas, it is just thin that copper deposits, copper can not well be filled out the plating blind hole, after the direct current electrode position blind hole is electroplated during the recycling pressing glue flow to fill up blind hole, to reach the smooth purpose of plate face, but because the blind hole aperture is less, during pressing glue hole, be difficult to guarantee that glue can fill up blind hole, plate bursting appears when causing reliability testing, leave very large hidden danger.
Denomination of invention having occurred subsequently is the HDI flexible electric circuit board, and application number is to be the patented technology scheme on April 26th, 2,011 201120127966 applyings date.The technical scheme of this patent is: a kind of HDI flexible electric circuit board, it is characterized in that: comprise the circuit board plate body, be arranged on the blind hole on the circuit board plate body and cover electrodeposited coating on blind hole, the electrodeposited coating thickness in the electrodeposited coating thickness of described blind hole mouth and blind hole is impartial.Because above-mentioned patented technology scheme does not arrange the semi-solid preparation layer, therefore, the fixing unstable of chip appearred, and the position that arranges due to blind hole, when causing the throttle circuit plate, make circuit that the phenomenon of open circuit occur.And then scrap circuit board.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides a kind of plate face of circuit board plate body smooth, and when having guaranteed the throttle circuit plate, can not cause because of the existence of blind hole that circuit is opened a way, the phenomenon of bubble etc.
For realizing above-mentioned technical purpose, the novel technical scheme of this use is:
A kind of HDI printed board, comprise circuit board plate body, semi-solid preparation layer, resin copper foil layer and be arranged on blind hole on the circuit board plate body, it is characterized in that: the even thickness of described semi-solid preparation layer and resin copper foil layer, described semi-solid preparation layer is arranged on the circuit board plate body, and described resin copper foil layer is arranged on the semi-solid preparation layer.
The utility model also comprises the circuit that is positioned on the resin copper foil layer, and described blind hole is positioned at the projected position of described circuit hollow out.
The utility model adopts the semi-solid preparation layer to claim again " P sheet ", it is one of main material during multi-layer sheet is produced, mainly formed by resin and reinforcing material, reinforcing material is divided into again the several types such as glass-fiber-fabric, paper substrate, composite material, and the prepreg (sticky piece) that the making multilayer printed board is used is to adopt glass-fiber-fabric to do reinforcing material mostly.Treated glass-fiber-fabric, resin adhesive liquid on dipping, then make resin enter the B stage and the sheeting made is called prepreg through heat treatment (preliminary drying), be one of main material during multi-layer sheet is produced.The prepreg that multi-layer sheet uses adopts glass fabric to do reinforcing material mostly, the upper resin adhesive liquid of treated glass fabric dipping, the sheeting of making through the heat treatment preliminary drying again is called prepreg, and it adds in heating, and depresses can be softening, can reaction solidify after cooling.Because glass fabric is different at the yarn number of share of stock of warp-wise, broadwise unit length, should be noted during shearing prepreg through broadwise, generally choose warp-wise (direction that glass fabric is curling) for producing the short side direction of plate, broadwise is for producing the long side direction of plate, to guarantee the smooth of plate face, prevent the plank rear torsional deformation that is heated.The main appearance requirement of multi-layer sheet prepreg used has: cloth cover should be smooth, without greasy dirt, free from smutting during, without exogenous impurity or other defect, crack-free and too much toner, but allowed micro-crack.In the pcb design process, if multiple-plate design just must be used prepreg.In the process of multi-layer sheet flight, it must be polished off in addition, could the definite circuit diagram of analyzing model.
Because the utility model adopts technique scheme, have following beneficial effect:
At first, the even thickness of semi-solid preparation layer and resin copper foil layer, for laser drilling provides advantage, certificates handling the accuracy of the degree of depth of blind hole;
Secondly, the resin copper foil layer is arranged on the semi-solid preparation layer, for the compacting multilayer circuit board provides the foundation, and has guaranteed the reliability of circuit board performance;
The 3rd, blind hole is arranged on the projected position of described circuit hollow out, when having guaranteed the throttle circuit plate, can not cause because of the existence of blind hole circuit that the phenomenon of open circuit occurs.
Description of drawings
Fig. 1 is structural representation of the present utility model.
In figure: 1, circuit board plate body 2, semi-solid preparation layer 3, resin copper foil layer
4, blind hole
Embodiment
A kind of HDI printed board, comprise circuit board plate body, semi-solid preparation layer, resin copper foil layer and be arranged on blind hole on the circuit board plate body, the even thickness of described semi-solid preparation layer and resin copper foil layer, described semi-solid preparation layer is arranged on the circuit board plate body, and described resin copper foil layer is arranged on the semi-solid preparation layer.
Embodiment 2
A kind of HDI printed board, comprise circuit board plate body, semi-solid preparation layer, resin copper foil layer and be arranged on blind hole on the circuit board plate body, the even thickness of described semi-solid preparation layer and resin copper foil layer, described semi-solid preparation layer is arranged on the circuit board plate body, and described resin copper foil layer is arranged on the semi-solid preparation layer.Also comprise the circuit that is positioned on the resin copper foil layer, described blind hole is positioned at the projected position of described circuit hollow out.
According to the execution mode of above-described embodiment 2, the upper and lower of circuit board plate body all can similarly arrange semi-solid preparation layer, resin copper foil layer.And, continue to set gradually the semi-solid preparation layer in the outside of resin copper foil layer and the resin copper foil layer can be realized the second-order circuit plate, so analogize, can realize in theory N rank circuit board.
Claims (2)
1. HDI printed board, comprise circuit board plate body (1), semi-solid preparation layer (2), resin copper foil layer (3) and be arranged on blind hole (4) on circuit board plate body (1), it is characterized in that: the even thickness of described semi-solid preparation layer (2) and resin copper foil layer (3), described semi-solid preparation layer (2) is arranged on circuit board plate body (1), and described resin copper foil layer (3) is arranged on semi-solid preparation layer (2).
2. a kind of HDI printed board according to claim 1 is characterized in that: also comprise the circuit that is positioned on resin copper foil layer (3), described blind hole (4) is positioned at the projected position of described circuit hollow out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220697597 CN202998646U (en) | 2012-12-17 | 2012-12-17 | HDI printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220697597 CN202998646U (en) | 2012-12-17 | 2012-12-17 | HDI printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998646U true CN202998646U (en) | 2013-06-12 |
Family
ID=48569767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220697597 Expired - Fee Related CN202998646U (en) | 2012-12-17 | 2012-12-17 | HDI printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998646U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636355A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Adhesive filling method for groove hole of metal substrate |
| TWI630854B (en) * | 2016-05-06 | 2018-07-21 | 鵬鼎科技股份有限公司 | Method for making circuit board |
-
2012
- 2012-12-17 CN CN 201220697597 patent/CN202998646U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636355A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Adhesive filling method for groove hole of metal substrate |
| TWI630854B (en) * | 2016-05-06 | 2018-07-21 | 鵬鼎科技股份有限公司 | Method for making circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20151217 |
|
| EXPY | Termination of patent right or utility model |